Transparent fee control comprehensive electric energy meter box
The transparent prepaid integrated energy meter box solves the problems of unstable installation and unstable data transmission of traditional energy meters through the plug-in structure of positioning parts and connecting seats and modular design, thus achieving high reliability and low cost of energy metering management.
CN120999434BActive Publication Date: 2026-05-22ZHEJIANG TIANSHUN GLASS FIBER REINFORCED PLASTIC
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ZHEJIANG TIANSHUN GLASS FIBER REINFORCED PLASTIC
- Filing Date
- 2025-08-12
- Publication Date
- 2026-05-22
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Figure CN120999434B_ABST
Abstract
The application discloses a transparent fee control comprehensive electric energy meter box, which comprises an outer shell body, the outer shell body comprises a bottom and a transparent cover part, the bottom is formed by PC / ABS or PC / ASA gold-containing plastic injection molding, the transparent cover part is formed by PC injection molding, positioning pieces are distributed on the back of the outer shell body, a main control module, a metering module, a rate switching module, a prepayment management module and a communication module are integrated inside, a connecting seat is inserted with the outer shell body, anti-skid connecting pieces are slidably connected on both sides, a lifting seat and a fixed plug-in part are arranged in the anti-skid connecting pieces, the fixed plug-in part is driven by extruded elastic pieces to form stable insertion with the positioning pieces, tool-free quick installation is realized, supporting pieces are rotationally connected to the front lower part of the connecting seat, the upper surface is elastically attached to the lower surface of the outer shell body through arc-shaped elastic pieces, the deformation of the outer shell body caused by gravity is avoided, external impact is buffered through the deformation of the arc-shaped elastic pieces, multiple modules are integrated in height, the traditional separate chips and external module combination are replaced, compatibility problems are eliminated, and hardware cost is reduced.
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