PCB board glue pressing equipment and method

Abstract

The application provides a PCB board glue pressing equipment and method, which is used for gluing and pressing of a PCB board with terminals, and comprises a support positioning mechanism, a pressing mechanism and a support assembly, wherein the support positioning mechanism comprises a base frame, two first positioning components, a second positioning component and the support assembly; the pressing mechanism comprises a mounting frame and a pressing component, and the pressing component comprises an elastic pressing block and is slidably connected to the mounting frame in a third direction. In the application, the support assembly can avoid the terminals of the PCB board to be processed, so that the gluing surface of the PCB board is always horizontally arranged; the first positioning component and the second positioning component can position the PCB board to be processed from different directions, so that the cooperation accuracy with external gluing equipment is improved. The pressing mechanism can elastically press the horizontal PCB board, so that the gluing stability between the board and the glue is improved, and the air bubbles in the glue are discharged through extrusion, so that the gluing quality is significantly improved.

Description

Technical Field

[0001] This invention relates to the field of pressure holding technology, specifically to a PCB board adhesive pressing device and method. Background Technology

[0002] In the field of PCB (Printed Circuit Board) processing, yellow adhesive (high-temperature resistant tape or insulating adhesive layer) is often applied to the side of the board without terminals to assist in subsequent processes such as foam bonding. However, the general-purpose adhesive application equipment currently used has significant technical defects, resulting in problems such as insufficient adhesive application accuracy and residual air bubbles, which seriously affect the processing quality and reliability of PCBs.

[0003] General-purpose adhesive applicator uses a standardized clamping structure and is not designed to adapt to the distribution characteristics of PCB board terminals. When the PCB board is placed on the machine's workbench, the thickness difference between the terminal area and the non-terminal area makes it difficult to guarantee the stability of the board during clamping and fixing. At the same time, the terminals of the PCB board are usually distributed on the edge of the board or in specific functional areas. Existing equipment cannot adjust the pressure holding strategy according to the terminal position. If pressure is forcibly applied to areas with dense terminals, it will cause the terminals to deform or the solder joints to fall off. In areas without terminals, due to the lack of targeted pressure holding, the air between the adhesive and the board cannot be fully discharged, which not only affects the insulation performance, but may also cause the adhesive to fall off due to gas expansion in high-temperature environments.

[0004] Furthermore, the pressure-holding modules of general-purpose equipment are mostly flat pressure plate structures, applying uniform pressure to both terminal and non-terminal areas, which can easily lead to terminal damage. Simultaneously, the rate of residual air bubbles in non-terminal areas remains high. Poor adhesion of the adhesive directly causes soldering defects. The adhesive in the bubble area vaporizes at the high soldering temperature, potentially contaminating the solder pads, causing cold solder joints, and also leading to insulation failure. The insulation resistance at the bubble area decreases, posing a risk of breakdown under high voltage conditions and reducing reliability. In thermal cycling tests, the detachment rate of adhesive with air bubbles is significantly higher than that in areas without air bubbles.

[0005] In summary, existing general-purpose adhesive application equipment lacks PCB board compatibility, resulting in insufficient positioning accuracy and defects in the pressure holding process. This has become a technical bottleneck restricting the quality of PCB board processing. There is an urgent need to develop a special equipment and process for applying yellow adhesive to PCB boards based on terminal position recognition. Through technological innovations such as dynamic positioning and zoned pressure holding, high-precision adhesive application and bubble-free bonding can be achieved to meet the manufacturing needs of high-end PCB boards. Summary of the Invention

[0006] Therefore, the technical problem to be solved by the present invention is to overcome the problem that the accuracy and adhesion of applying yellow glue to PCB boards in the prior art need to be improved, and to provide a PCB board adhesive pressing device and method.

[0007] To solve the above-mentioned technical problems, the present invention provides a PCB board adhesive pressing device for applying adhesive and maintaining pressure on PCB boards with terminals. The device includes a support and positioning mechanism, comprising a base frame, two first positioning components, a second positioning component, and a support component. The support component is disposed on the top of the base frame, and the PCB board to be processed is disposed on the support component. Each support component has a positioning groove on opposite sides in a first direction, and a terminal clearance groove on one side in the first direction. The terminals of the PCB board to be processed are embedded in the terminal clearance groove to ensure that the adhesive-applied surface of the PCB board is horizontal. The two first positioning components are connected to the base frame and are positioned opposite each other in the first direction. The configuration includes a first positioning component comprising a first positioning element, and a second positioning component connected to the base frame, which includes a second positioning element located on one side of the support component in a second direction. Both first positioning elements and the second positioning element can move toward / away from the support component to position / release the PCB board to be processed. The two first positioning elements can be respectively inserted into the two positioning slots. A pressure holding mechanism is provided on one side of the support positioning mechanism and includes a mounting frame and a pressure holding component. The pressure holding component includes an elastic pressure block, which can be slidably connected to the mounting frame in a third direction to drive the elastic pressure block to move up and down above the support component.

[0008] In one embodiment of the present invention, the support assembly includes a support base plate, a support top plate, and a detection sensor. The bottom of the support base plate is connected to the base frame, and the support top plate is connected to the upper surface of the support base plate. The upper surface of the support base plate is provided with a mounting groove, and the detection sensor is embedded in the mounting groove. The support top plate is provided with a detection hole, which communicates with the mounting groove to expose the working end of the detection sensor.

[0009] In one embodiment of the present invention, the supporting top plate is provided with a plurality of supporting columns and at least one positioning pin, the plurality of supporting columns are arranged on the upper surface of the supporting top plate, and the positioning pin can be inserted into the positioning hole of the PCB board to be processed.

[0010] In one embodiment of the present invention, the base frame includes a first support plate, a second support plate, and a support frame. The first support plate and the support frame are both connected inside the base frame. The support frame is disposed above the first support plate and spaced apart from the first support plate. The second support plate is connected to the outside of the base frame, and the second positioning component is disposed on the second support plate.

[0011] In one embodiment of the present invention, the first positioning component includes a first driver and a first horizontal module. The first driver is supported on the first support plate, the first horizontal module is disposed on the support frame, and the first positioning member is slidably connected to the first horizontal module and connected to the working end of the first driver.

[0012] In one embodiment of the present invention, the first positioning member includes a first slide block, two first pushing members and two first buffer members. The first slide block is slidably connected to the first horizontal module. The two first pushing members are respectively connected to the first slide block and disposed on both sides of the first slide block along the second direction. The two first buffer members are respectively connected to the side of the two first pushing members facing the support component.

[0013] In one embodiment of the present invention, the second positioning component includes a fixed plate, a second driver, and a second horizontal module. The fixed plate is connected to the base frame, the second driver is disposed on the fixed plate, the second horizontal module is disposed inside the fixed plate and extends along the second direction, and the second positioning member is slidably connected to the second horizontal module.

[0014] In one embodiment of the present invention, the second positioning member includes a second slide block, two second pushers and two second buffers. The second slide block is slidably connected to the second horizontal module. The two second pushers are respectively connected to the second slide block and disposed on both sides of the second slide block along the first direction. The two second buffers are respectively connected to the side of the two second pushers facing the support assembly.

[0015] In one embodiment of the present invention, the pressure holding mechanism further includes a lifting module and a lifting slide. The lifting module is disposed on the mounting frame and extends in a third direction. One side of the lifting slide is slidably connected to the lifting module, and the other side is connected to the pressure holding assembly.

[0016] In one embodiment of the present invention, the pressure holding assembly further includes a connecting frame, a mounting block, and a pressure sensor. The connecting frame is connected to the lifting slide, the mounting block is disposed at one end of the connecting frame facing the support assembly, the elastic pressure block is connected to the mounting block, and the pressure sensor is disposed between the mounting block and the elastic pressure block.

[0017] In one embodiment of the present invention, the pressure-holding mechanism further includes a limiting component, which is disposed between the mounting block and the mounting frame. The limiting component includes a fixing member, a guide rod, a buffer plate, and a limiting pin. The fixing member is connected to the mounting frame. The guide rod extends in a third direction, with one end passing through and connected to the fixing member, and the other end connected to the buffer plate. The buffer plate is located between the elastic pressure block and the mounting frame. The limiting pin is disposed in the middle of the fixing member and extends toward the buffer plate.

[0018] In one embodiment of the present invention, the pressure holding mechanism further includes a control mechanism, and the support positioning mechanism and the pressure holding mechanism are respectively connected to the control mechanism.

[0019] This invention also provides a PCB board adhesive pressing method, which uses the aforementioned PCB board adhesive pressing equipment to perform adhesive pressing processing on the PCB board, comprising: Step S1, placing the PCB board to be processed on a support assembly, wherein the terminals of the PCB board to be processed pass through the terminal clearance groove of the support assembly to make the adhesive-to-be-applied surface of the PCB board to be processed horizontal; Step S2, moving the first positioning assembly and the second positioning assembly to position the PCB board to be processed from the first direction and the second direction; Step S3, applying adhesive to the adhesive-to-be-applied surface of the PCB board to be processed, and then using a pressure holding mechanism to perform a first pressing of the adhesive-to-be-applied surface of the PCB board to be processed to improve the connection strength between the adhesive and the PCB board to be processed; Step S4, peeling off the adhesive film, and then using a pressure holding mechanism to perform a second pressing of the adhesive-to-be-applied surface of the PCB board to be processed to remove air bubbles between the adhesive and the PCB board to be processed.

[0020] The technical solution of the present invention has the following advantages compared with the prior art:

[0021] The PCB board adhesive bonding equipment and method of this invention uses a support and positioning mechanism to support and position the PCB board to be processed. The support component can avoid the terminals of the PCB board to ensure that the adhesive surface of the PCB board is always horizontal. The first and second positioning components can position the PCB board to be processed from different directions, thereby improving the accuracy of its cooperation with external adhesive bonding equipment. The pressure holding mechanism can elastically press the horizontal PCB board, thereby improving the adhesion stability between the board and the adhesive, and expelling air bubbles from the adhesive, thus significantly improving the adhesive bonding quality. Compared with conventional adhesive bonding technologies, this application has significant advantages such as compatibility with cavities, wide applicability, improved adhesive bonding quality and efficiency, and reduced defect rate, and has broad application prospects in the industry. Attached Figure Description

[0022] To make the content of this invention easier to understand, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0023] Figure 1 This is a three-dimensional structural schematic diagram of the PCB board adhesive bonding equipment in a preferred embodiment of the present invention;

[0024] Figure 2 yes Figure 1 A three-dimensional structural diagram of the support and positioning mechanism in the PCB board adhesive bonding equipment shown.

[0025] Figure 3 yes Figure 1 A three-dimensional structural diagram of the support and positioning mechanism in the PCB board adhesive bonding equipment shown from another perspective.

[0026] Figure 4 yes Figure 1 A three-dimensional structural diagram of part of the support and positioning mechanism in the PCB board adhesive bonding equipment shown;

[0027] Figure 5 yes Figure 1 A three-dimensional structural diagram of the pressure holding mechanism in the PCB board lamination equipment shown;

[0028] Figure 6 yes Figure 5 Enlarged structural diagram at point A in the middle.

[0029] Explanation of reference numerals in the accompanying drawings: 100, Support and positioning mechanism; 110, Base frame; 111, First support plate; 112, Second support plate; 113, Support frame; 120, First positioning assembly; 121, First driver; 122, First horizontal module; 123, First positioning element; 1231, First slide; 1232, First pushing element; 1233, First buffer element; 130, Second positioning assembly; 131, Fixed plate; 132, Second driver; 133, Second horizontal module; 134, Second positioning element; 1341, Second slide; 1342, Second pushing element; 1343, Second buffer element; 140, Support Support assembly; 141, Support base plate; 1411, Mounting slot; 142, Support top plate; 1421, Detection hole; 1422, Support column; 1423, Positioning pin; 1424, Positioning slot; 143, Terminal clearance slot; 144, Detection sensor; 200, Pressure holding mechanism; 210, Mounting bracket; 220, Lifting module; 230, Lifting slide; 240, Pressure holding assembly; 241, Connecting bracket; 242, Mounting block; 243, Elastic pressure block; 250, Limiting assembly; 251, Fixing component; 252, Guide rod; 253, Buffer plate; 254, Limiting pin; X, First direction; Y, Second direction; Z, Third direction. Detailed Implementation

[0030] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0031] Example 1:

[0032] See Figure 1 As shown, this embodiment provides a PCB board pressing device for applying adhesive and maintaining pressure on PCB boards with terminals. It includes a support and positioning mechanism 100, which comprises a base frame 110, two first positioning components 120, a second positioning component 130, and a support component 140. The support component 140 is disposed on the top of the base frame 110, and the PCB board to be processed is disposed on the support component 140. The support component 140 has a positioning groove 1424 on each opposite side in the first direction X, and a terminal clearance groove 143 on one side in the first direction X. The terminals of the PCB board to be processed are embedded in the terminal clearance groove 143 to make the adhesive-applied surface of the PCB board horizontal. The two first positioning components 120 are connected to the base frame 110 and are arranged opposite each other along the first direction X. Any of the first positioning components... Component 120 includes a first positioning element 123, and a second positioning component 130 connected to the base frame 110, which includes a second positioning element 134 located on one side of the support component 140 in the second direction Y. Both first positioning elements 123 and the second positioning element 134 can move toward / away from the support component 140 to position / release the PCB board to be processed. The two first positioning elements 123 can be respectively inserted into the two positioning slots 1424. A pressure holding mechanism 200 is disposed on one side of the support positioning mechanism 100. It includes a mounting frame 210 and a pressure holding component 240. The pressure holding component 240 includes an elastic pressure block 243. The pressure holding component 240 can be slidably connected to the mounting frame 210 in the third direction Z to drive the elastic pressure block 243 to move up and down above the support component 140.

[0033] The PCB board adhesive bonding equipment described in this embodiment uses a support and positioning mechanism 100 to support and position the PCB board to be processed. The support component 140 can avoid the terminals of the PCB board to ensure that the adhesive surface of the PCB board is always horizontal. The first positioning component 120 and the second positioning component 130 can position the PCB board to be processed from different directions, thereby improving the accuracy of its cooperation with external adhesive bonding equipment. The pressure holding mechanism 200 can elastically press the horizontal PCB board, thereby improving the bonding stability between the board and the adhesive, and expelling air bubbles inside the adhesive through extrusion, thus significantly improving the adhesive bonding quality. Compared with conventional adhesive bonding technologies at present, this application has significant advantages such as compatibility with cavities, wide applicability, improved adhesive bonding quality and efficiency for PCB boards, and reduced defect rate, and has broad application prospects in the industry.

[0034] It should be noted that, for ease of description, in this embodiment, the moving direction of the first positioning component 120 is defined as the first direction X, the moving direction of the second positioning component 130 is defined as the second direction Y, and the height direction of the device is defined as the third direction Z. The first direction X, the second direction Y, and the third direction Z are arranged perpendicularly to each other, and the first direction X and the second direction Y are located in the same plane.

[0035] See Figure 2 and Figure 3 As shown, in this embodiment, the base frame 110 serves as the basic framework supporting the positioning mechanism 100, providing stable support for the entire mechanism. It is the core carrier connecting the first positioning component 120, the second positioning component 130, and the support component 140, bearing the weight of the PCB board to be processed and each component.

[0036] Specifically, the base frame 110 includes a first support plate 111, a second support plate 112, and a support frame 113. The first support plate 111 and the support frame 113 are both connected inside the base frame 110. The support frame 113 is disposed above the first support plate 111 and spaced apart from the first support plate 111. The second support plate 112 is connected outside the base frame 110, and the second positioning component 130 is disposed on the second support plate 112. Specifically, in this embodiment, some of the first positioning components 120 are supported on the first support plate 111, while the remaining first positioning components 120 are supported and connected to the support frame 113. Furthermore, the central control structure design of the support frame 113 enables the interconnection of the various structures within the first positioning components 120, thereby reducing the overall volume of the support positioning mechanism 100 through a reasonable layout. Similarly, the second support plate 112 is connected to the outside of the base frame 110 and primarily undertakes the installation and fixing of the second positioning component 130, thus achieving a reasonable layout between the first positioning components 120 and the second positioning component 130. (See also...) Figures 2 to 4 As shown, in this embodiment, the support component 140 is disposed on the top of the base frame 110, which is used to directly support the PCB board to be processed.

[0037] Furthermore, a positioning groove 1424 is provided on each of the opposite sides in the first direction X. These two positioning grooves 1424 are used in conjunction with the first positioning member 123 in the first positioning component 120 to limit the PCB board in the horizontal direction.

[0038] Specifically, when the PCB board is placed on the support assembly 140, the first positioning member 123 can pass through the positioning groove 1424 to restrict the movement of the PCB board in the first direction X, thereby achieving initial positioning of the PCB board. Furthermore, the support assembly 140 has a terminal clearance groove 143 on one side in the first direction X, a design specifically for PCB boards with terminals. Since the presence of PCB board terminals affects the horizontal placement of the board, the terminal clearance groove 143 allows the terminals of the PCB board to be processed to be embedded therein, preventing interference between the terminals and the support assembly 140. In this way, regardless of the layout and height of the PCB board terminals, the adhesive-bearing surface of the PCB board to be processed can be kept horizontal, providing a flat processing reference surface for subsequent adhesive application and pressure holding processes, effectively avoiding adhesive offset and uneven pressure holding caused by board tilting.

[0039] In this embodiment, the support assembly 140 includes a support base plate 141, a support top plate 142, and a detection sensor 144. The bottom of the support base plate 141 is connected to the base frame 110, and the support top plate 142 is connected to the upper surface of the support base plate 141. The upper surface of the support base plate 141 is provided with a mounting groove 1411, and the detection sensor 144 is embedded in the mounting groove 1411. The support top plate 142 is provided with a detection hole 1421, which communicates with the mounting groove 1411 to expose the working end of the detection sensor 144. Designing the support assembly 140 as two detachably connectable plates improves its flexibility for maintenance and disassembly. Simultaneously, it allows the company to provide a corresponding installation connection structure for the installation and layout of the detection sensor 144.

[0040] Specifically, in this embodiment, the support base plate 141 is bolted to the base frame 110 to ensure that it will not loosen or shift during equipment operation. Meanwhile, the upper surface of the support base plate 141 is provided with a mounting groove 1411 for embedding the detection sensor 144, providing installation space and protection for the sensor 144, enabling it to stably perform its detection function. The support top plate 142 is connected to the upper surface of the support base plate 141 and has a detection hole 1421 that communicates with the mounting groove 1411 on the support base plate 141. Its function is to expose the working end of the detection sensor 144, allowing the sensor 144 to directly interact with the PCB board placed on the support top plate 142 to determine whether there is material to be processed on the support assembly 140. Specifically, the presence of the support top plate 142 not only protects the detection sensor 144 from external impacts or damage but also provides some limiting and support for the PCB board, ensuring that the PCB board maintains a stable position during detection and processing. In different implementations, the detection sensor 144 may be of various types, such as photoelectric sensor and pressure sensor, and the present invention does not impose specific limitations on it.

[0041] Furthermore, in this embodiment, the supporting top plate 142 is provided with multiple supporting columns 1422 and at least one positioning pin 1423. The multiple supporting columns 1422 are arranged on the upper surface of the supporting top plate 142, and the positioning pin 1423 can pass through the positioning hole of the PCB board to be processed. The multiple supporting columns 1422 are in direct contact with the PCB board, providing multi-point support for the PCB board and dispersing the pressure generated by the PCB board and the pressure holding mechanism 200 above it during the pressing process, thus preventing the PCB board from deforming or being damaged due to excessive local stress. The positioning pin 1423 can restrict the degree of freedom of movement and rotation of the PCB board, ensuring that the position of the PCB board on the supporting top plate 142 is accurate.

[0042] See Figure 4As shown, the first positioning component 120 in this embodiment includes a first driver 121 and a first horizontal module 122. The first driver 121 is supported on the first support plate 111, and the first horizontal module 122 is disposed on the support frame 113. The first positioning member 123 is slidably connected to the first horizontal module 122 and connected to the working end of the first driver 121. Specifically, the first positioning member 123 includes a first slide block 1231, two first push members 1232, and two first buffer members 1233. The first slide block 1231 is slidably connected to the first horizontal module 122. The two first push members 1232 are respectively connected to the first slide block 1231 and disposed on both sides of the first slide block 1231 along the second direction Y. The two first buffer members 1233 are respectively connected to the side of the two first push members 1232 facing the support component 140. The first driver 121 is preferably a cylinder, and the first buffer member 1233 is preferably elastic rubber.

[0043] Correspondingly, the second positioning component 130 includes a fixed plate 131, a second driver 132, and a second horizontal module 133. The fixed plate 131 is connected to the base frame 110. The second driver 132 is disposed on the fixed plate 131. The second horizontal module 133 is disposed inside the fixed plate 131 and extends along the second direction Y. The second positioning member 134 is slidably connected to the second horizontal module 133. The second positioning member 134 includes a second slide block 1341, two second push members 1342, and two second buffer members 1343. The second slide block 1341 is slidably connected to the second horizontal module 133. The two second push members 1342 are respectively connected to the second slide block 1341 and are disposed on both sides of the second slide block 1341 along the first direction X. The two second buffer members 1343 are respectively connected to the side of the two second push members 1342 facing the support component 140.

[0044] The first positioning component 120 limits the PCB board to be processed in the first direction X, and the second positioning component limits the PCB board to be processed in the second direction Y. This improves the accuracy of the cooperation between the PCB board and the external adhesive applicator in the horizontal direction, ensuring the accuracy of the adhesive application position and the precision of the subsequent adhesive pressing.

[0045] See Figure 5As shown, the pressure-holding mechanism 200 in this embodiment is used to perform pressure bonding on the PCB board after adhesive application. The mounting bracket 210 serves as a support structure for the pressure-holding mechanism 200 and is fixedly disposed on one side of the support positioning mechanism 100, providing a basic platform for the installation and movement of the pressure-holding assembly 240. Further, the pressure-holding mechanism 200 in this embodiment includes a lifting module 220 and a lifting slide 230. The lifting module 220 is disposed on the mounting bracket 210 and extends along the third direction Z. One side of the lifting slide 230 is slidably connected to the lifting module 220, and the other side is connected to the pressure-holding assembly 240. This achieves a sliding connection structure for the elastic pressure block 243.

[0046] Furthermore, the pressure-holding assembly 240 also includes a connecting frame 241, a mounting block 242, and a pressure sensor. The connecting frame 241 is connected to the lifting slide 230. The mounting block 242 is located at one end of the connecting frame 241 facing the support assembly 140. The elastic pressure block 243 is connected to the mounting block 242. The pressure sensor is located between the mounting block 242 and the elastic pressure block 243. The connecting frame 241, which is connected to the lifting slide 230, is a key connecting component for the lifting movement of the pressure-holding assembly 240. The through-type design of the connecting frame 241 allows it to slide smoothly along the guide rail or slide groove of the lifting slide 230 in the vertical direction (third direction Z), driving the mounting block 242, pressure sensor, and elastic pressure block 243 to perform precise lifting movements. This ensures that the elastic pressure block 243 can accurately reach the predetermined position on the PCB board surface to be glued, providing a stable motion foundation for the pressing operation. Mounting block 242 is located at the end of connecting frame 241 facing support assembly 140. It ensures the secure mounting of elastic pressure block 243 and pressure sensor. On one hand, mounting block 242 provides a reliable mounting surface for elastic pressure block 243, ensuring it will not shift or fall off during pressing. On the other hand, mounting block 242 provides mounting space for pressure sensor, enabling it to accurately measure the pressure between elastic pressure block 243 and the PCB board. Pressure sensor, located between mounting block 242 and elastic pressure block 243, can monitor the pressure applied by elastic pressure block 243 during PCB board pressing in real time and convert the pressure signal into an electrical signal, transmitting it to the equipment's control system.

[0047] In addition, see Figure 6As shown, the pressure-holding mechanism 200 in this embodiment further includes a limiting component 250. The limiting component 250 is disposed between the mounting block 242 and the mounting frame 210. It includes a fixing member 251, a guide rod 252, a buffer plate 253, and a limiting pin 254. The fixing member 251 is connected to the mounting frame 210. The guide rod 252 extends in the third direction Z, with one end passing through and connected to the fixing member 251, and the other end connected to the buffer plate 253. The buffer plate 253 is located between the elastic pressure block 243 and the mounting frame 210. The limiting pin 254 is disposed in the middle of the fixing member 251 and extends toward the buffer plate 253. Among them, the fastener 251 ensures that it will not loosen during the operation of the equipment, and guarantees that the relative position between the entire limit assembly 250 and the mounting bracket 210 is fixed, providing a stable foundation for the normal operation of components such as the guide rod 252 and the limit pin 254, so that the pressure holding assembly 240 can always maintain the correct direction and position of movement during the lifting process.

[0048] The guide rod 252 provides guidance for the buffer plate 253 and the connected pressure-holding assembly 240, ensuring that the pressure-holding assembly 240 can move precisely in the vertical direction under the drive of the lifting carriage 230, avoiding deviation or swaying. The buffer plate 253 is located between the elastic pressure block 243 and the mounting bracket 210. When the pressure-holding assembly 240 approaches the PCB board during descent, the buffer plate 253 can contact the support assembly 140 or other components above the PCB board in advance, absorbing part of the impact force through its own elastic deformation, preventing the elastic pressure block 243 from directly impacting the PCB board with a large impact force, thereby preventing the PCB board from being damaged by excessive instantaneous impact force. The limiting pin 254 is located in the middle of the fixing member 251 and extends towards the buffer plate 253. It can limit the descent stroke of the pressure-holding assembly 240, preventing the elastic pressure block 243 from excessively pressing down and damaging the PCB board.

[0049] Furthermore, the pressure-holding mechanism 200 in this embodiment also includes a control mechanism, and the support and positioning mechanism 100 and the pressure-holding mechanism 200 are respectively connected to the control mechanism. In actual production and processing, operators can use the control mechanism to adjust the above structure in real time, thereby improving the flexibility of the equipment. Parameters can also be preset through the control mechanism, thereby improving the automation level of the equipment.

[0050] Example 2:

[0051] This embodiment provides a PCB board pressing method, which uses the PCB board pressing equipment described in Embodiment 1 to perform pressing processing on the PCB board, including:

[0052] Step S1: Place the PCB board to be processed on the support assembly 140, wherein the terminals of the PCB board to be processed are inserted into the terminal clearance groove 143 of the support assembly 140 so that the adhesive surface of the PCB board to be processed is horizontal.

[0053] Step S2: Move the first positioning component 120 and the second positioning component 130 to push and position the PCB board to be processed from the first direction X and the second direction Y; Step S3: Apply adhesive to the adhesive surface of the PCB board to be processed, and then use the pressure holding mechanism 200 to press the adhesive surface of the PCB board to be processed for the first time to improve the connection strength with the PCB board to be processed.

[0054] Step S4: Peel off the film from the adhesive, and then use the pressure holding mechanism 200 to apply the adhesive to the PCB board to be processed a second time to remove air bubbles between the adhesive and the PCB board.

[0055] In summary, the PCB board adhesive bonding equipment and method of this invention uses a support and positioning mechanism 100 to support and position the PCB board to be processed. The support component 140 can avoid the terminals of the PCB board to ensure that the adhesive surface of the PCB board is always horizontal. The first positioning component 120 and the second positioning component 130 can position the PCB board to be processed from different directions, thereby improving the accuracy of its cooperation with external adhesive bonding equipment. The pressure holding mechanism 200 can elastically press the horizontal PCB board, thereby improving the bonding stability between the board and the adhesive, and expelling air bubbles from the adhesive, thus significantly improving the adhesive bonding quality. Compared with conventional adhesive bonding technologies at present, this application has significant advantages such as compatibility with cavities, wide applicability, improved adhesive bonding quality and efficiency for PCB boards, and reduced defect rate, and has broad application prospects in the industry.

[0056] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A PCB board adhesive bonding device, characterized in that: A tool for applying adhesive and applying pressure to PCBs with terminals, comprising: A support positioning mechanism includes a base frame, two first positioning components, a second positioning component, and a support component. The support component is disposed on the top of the base frame, and the PCB board to be processed is disposed on the support component. The support component has a positioning groove on each of its opposite sides in a first direction, and a terminal clearance groove on one side of the support component in the first direction. The terminals of the PCB board to be processed are embedded in the terminal clearance groove so that the adhesive surface of the PCB board to be processed is horizontal. The two first positioning components are connected to the base frame and are disposed opposite to each other in a first direction. Each first positioning component includes a first positioning element. The second positioning component is connected to the base frame and includes a second positioning element located on one side of the support component in a second direction. Both first positioning elements and the second positioning element can move toward / away from the support component to position / release the PCB board to be processed. The two first positioning elements can be respectively inserted into the two positioning grooves. A pressure-holding mechanism is disposed on one side of the support and positioning mechanism. It includes a mounting frame, a pressure-holding component, a lifting module, and a lifting slide. The pressure-holding component includes an elastic pressure block, which is slidably connected to the mounting frame in a third direction to drive the elastic pressure block to move up and down above the support component. The lifting module is disposed on the mounting frame and extends in a third direction. One side of the lifting slide is slidably connected to the lifting module, and the other side is connected to the pressure-holding component. The pressure-holding component also includes a connecting frame, a mounting block, and a pressure sensor. The connecting frame passes through and connects to the lifting slide, and the mounting block is disposed on... The connecting frame faces one end of the support assembly. The elastic pressure block is connected to the mounting block. The pressure sensor is disposed between the mounting block and the elastic pressure block. The pressure holding mechanism also includes a limiting component, which is disposed between the mounting block and the mounting frame. The limiting component includes a fixing member, a guide rod, a buffer plate, and a limiting pin. The fixing member is connected to the mounting frame. The guide rod extends in a third direction, with one end passing through and connected to the fixing member, and the other end connected to the buffer plate. The buffer plate is located between the elastic pressure block and the mounting frame. The limiting pin is disposed in the middle of the fixing member and extends toward the buffer plate.

2. The PCB board adhesive bonding equipment according to claim 1, characterized in that: The support assembly includes a support base plate, a support top plate, and a detection sensor. The bottom of the support base plate is connected to the base frame, and the support top plate is connected to the upper surface of the support base plate. The upper surface of the support base plate is provided with a mounting groove, and the detection sensor is embedded in the mounting groove. The support top plate is provided with a detection hole, which communicates with the mounting groove to expose the working end of the detection sensor.

3. The PCB board adhesive bonding equipment according to claim 2, characterized in that: The support top plate is provided with multiple support columns and at least one positioning pin. The multiple support columns are arranged on the upper surface of the support top plate, and the positioning pin can be inserted into the positioning hole of the PCB board to be processed.

4. The PCB board adhesive bonding equipment according to claim 1, characterized in that: The base frame includes a first support plate, a second support plate, and a support frame. The first support plate and the support frame are both connected inside the base frame. The support frame is disposed above the first support plate and spaced apart from the first support plate. The second support plate is connected to the outside of the base frame. The second positioning component is disposed on the second support plate.

5. The PCB board adhesive bonding equipment according to claim 4, characterized in that: The first positioning component includes a first driver and a first horizontal module. The first driver is supported on the first support plate, the first horizontal module is disposed on the support frame, and the first positioning member is slidably connected to the first horizontal module and connected to the working end of the first driver.

6. The PCB board adhesive bonding equipment according to claim 5, characterized in that: The first positioning component includes a first slide block, two first pushers, and two first buffers. The first slide block is slidably connected to the first horizontal module. The two first pushers are respectively connected to the first slide block and are disposed on both sides of the first slide block along the second direction. The two first buffers are respectively connected to the side of the two first pushers facing the support component.

7. The PCB board adhesive bonding equipment according to claim 1, characterized in that: The second positioning component includes a fixed plate, a second driver, and a second horizontal module. The fixed plate is connected to the base frame, the second driver is disposed on the fixed plate, the second horizontal module is disposed inside the fixed plate and extends along the second direction, and the second positioning member is slidably connected to the second horizontal module.

8. The PCB board adhesive bonding equipment according to claim 7, characterized in that: The second positioning component includes a second slide block, two second pushers, and two second buffers. The second slide block is slidably connected to the second horizontal module. The two second pushers are respectively connected to the second slide block and are disposed on both sides of the second slide block along the first direction. The two second buffers are respectively connected to the side of the two second pushers facing the support component.

9. The PCB board adhesive bonding equipment according to claim 1, characterized in that: The pressure-holding mechanism also includes a control mechanism, and the support positioning mechanism and the pressure-holding mechanism are respectively connected to the control mechanism.

10. A method for applying adhesive to a PCB board, characterized in that: The PCB board lamination equipment according to any one of claims 1 to 9 is used to perform lamination processing on the PCB board, which includes: Step S1: Place the PCB board to be processed on the support assembly, wherein the terminals of the PCB board to be processed are inserted into the terminal clearance groove of the support assembly so that the adhesive surface of the PCB board to be processed is horizontal. Step S2: Move the first positioning component and the second positioning component to position the PCB board to be processed from the first direction and the second direction; Step S3: Apply adhesive to the adhesive-bearing surface of the PCB board to be processed, and then use a pressure holding mechanism to press the adhesive-bearing surface of the PCB board to be processed for the first time to improve the connection strength between the adhesive-bearing surface and the PCB board to be processed. Step S4: Peel off the film from the adhesive, and then use a pressure holding mechanism to apply the adhesive to the PCB board to be processed a second time to remove air bubbles between the adhesive and the PCB board.

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