Method and device for detecting internal electrical faults of a coil printed circuit board

Abstract

The application provides a coil printed circuit board internal electrical fault detection method and device. The coil printed circuit board comprises at least one coil group connected in parallel. The method comprises the following steps for each coil group: inputting a first given test signal to the input end of the coil group; receiving a first response output signal of the first given test signal output by the output end of the coil group; comparing the first response output signal with a first standard response signal corresponding to the coil group to determine a first deviation index between the two signals; and determining whether an electrical fault occurs inside the coil group based on the first deviation index. By analyzing the change of the response output signal of the coil group under the given test signal, it is determined whether an electrical fault occurs inside the coil group, and the electrical fault determination accuracy is improved.

Description

Technical Field

[0001] This application relates to the field of short-circuit testing technology for coil printed circuit boards, and in particular to a method and apparatus for detecting internal electrical faults in coil printed circuit boards. Background Technology

[0002] A coil printed circuit board (PCB) is a type of printed circuit board that uses etched copper foil to form coil structures. Its circuitry is primarily wire-wound, replacing traditional copper wire coils to achieve electrical functions. For example, coil paths are etched onto the PCB copper foil, and multi-layer or double-sided wiring is connected using vias and other structures to create coil structures with specific electromagnetic properties. Typically, coil PCB designs enhance electromagnetic characteristics through wire-wound circuitry. At least one coil is placed on the same plane of the PCB, and vias connect the coils across different layers. Coils connected between layers are grouped into the same coil group, and each coil group eventually converges at a common point, creating a network of interconnected coils.

[0003] A coil printed circuit board can consist of at least one coil group. When the coil printed circuit board is working, a certain current (e.g., 30A) needs to pass through the coil. If there is a short circuit within the same coil group, its electromagnetic performance will not meet the required value. If there are multiple coil groups, there will be a certain operating voltage (e.g., 300V) between different coils. If there is a short circuit within a single coil group, it will cause an imbalance in the electromagnetic field provided by different coil groups. If there is a short circuit between different coil groups, it will cause the printed circuit board to burn out. Therefore, before shipping, it is necessary to identify whether the coil printed circuit board has electrical faults (including short circuits and poor insulation) and reject coil printed circuit boards with electrical faults to avoid problems in the application terminal. Existing short circuit detection methods for coil printed circuit boards generally include open and short circuit tests, four-wire resistance tests, withstand voltage tests, and inductance tests.

[0004] The methods provided by the aforementioned existing technologies either determine the short circuit condition by measuring resistance or by measuring the insulation of the coil group. However, since each coil group on the coil printed circuit board contains a large number of coils and forms a single coil network, the impact of a short circuit on the overall coil (including the impact on insulation and resistance) is very small. When there are a large number of coils in a coil group, the methods provided by the existing technologies can only roughly screen products. Products with particularly serious problems can be screened out, but the insulation of different coil groups cannot be effectively detected. In other words, electrical faults on the coil printed circuit board cannot be effectively determined. Summary of the Invention

[0005] In view of this, the purpose of this application is to provide at least one method and apparatus for detecting internal electrical faults in coil printed circuit boards. By analyzing the changes in the response output signal of the coil group under a given test signal, it is possible to effectively determine whether an electrical fault has occurred in the coil group and improve the accuracy of short circuit detection.

[0006] This application mainly includes the following aspects: In a first aspect, embodiments of this application provide a method for detecting internal electrical faults in a coil printed circuit board. The coil printed circuit board includes at least one coil group, each coil group being formed by connecting multiple printed coils on the same or different layers. The output terminals of each coil group are connected together, and the coil groups are connected in parallel. For the coil printed circuit board under test, the method includes: for each coil group, performing the following processing: inputting a given test signal to the input terminal of the coil group; receiving a first response output signal output from the output terminal of the coil group in response to the given test signal; comparing the first response output signal with a first standard response signal corresponding to the coil group to determine a first deviation index between the two signals; and determining whether an electrical fault has occurred inside the coil group based on the first deviation index.

[0007] In one possible implementation, the given test signal is an oscillatingly decaying sinusoidal pulse voltage signal.

[0008] In one possible implementation, the first deviation index between the first response output signal and the first standard response signal corresponding to each coil group is determined by: calculating the definite integral difference between the first response output signal and the first standard response signal of the coil group over a specified time; calculating the percentage between the definite integral difference and the definite integral of the first standard response signal over the specified time; and using the percentage as the first deviation index between the first response output signal and the first standard response signal of the coil group.

[0009] In one possible implementation, whether a short circuit has occurred inside each coil group is determined by: determining whether a first deviation index corresponding to the coil group is less than or equal to a preset deviation threshold; if the first deviation index is less than or equal to the preset deviation threshold, it is determined that no short circuit has occurred inside the coil group; if the first deviation index is greater than the preset deviation threshold, it is determined that an electrical fault has occurred inside the coil group.

[0010] In one possible implementation, when the coil printed circuit board includes multiple coil groups, the method further includes: dividing the multiple coil groups into pairs to obtain multiple test objects; for each test object, performing the following processing: inputting a given test signal to the input terminal of one of the coil groups in the test object; receiving a second response output signal for the given test signal from the input terminal of the other coil group in the test object; comparing the second response output signal with a second standard response signal corresponding to the test object to determine a second deviation index between the two signals; and determining, based on the second deviation index, whether an electrical fault has occurred between the two coil groups corresponding to the test object.

[0011] In one possible implementation, the first given test signal input to the coil group and the first standard test signal to which the first standard response signal corresponding to the coil group belong are completely identical in frequency, phase, and amplitude; the second given test signal input to the test object and the second standard test signal to which the second standard response signal corresponding to the test object belong are completely identical in frequency, phase, and amplitude.

[0012] Secondly, embodiments of this application also provide a device for detecting the internal electrical properties of a coil printed circuit board. The coil printed circuit board includes at least one coil group, each coil group being formed by connecting multiple printed coils on the same or different layers. The output terminals of each coil group are connected together, and the coil groups are connected in parallel. For the coil printed circuit board under test, the device includes: a first signal input module for inputting a first given test signal to the input terminal of each coil group; a first signal receiving module for receiving a first response output signal from the output terminal of each coil group in response to the first given test signal; a first signal comparison module for comparing the first response output signal with a first standard response signal corresponding to each coil group to determine a first deviation index between the two signals; and a first determination module for determining, based on the first deviation index, whether an electrical fault has occurred inside each coil group.

[0013] In one possible implementation, when the coil printed circuit board includes multiple coil groups, the device further includes: a dividing module for dividing the multiple coil groups into pairs to obtain multiple test objects; a second signal input module for inputting a second given test signal to the input terminal of one of the coil groups in each test object; a second signal receiving module for receiving a second response output signal in response to the second given test signal from the input terminal of another coil group in each test object; a second signal comparison module for comparing the second response output signal with a second standard response signal corresponding to the test object for each test object to determine a second deviation index between the two signals; and a second determination module for determining, based on the second deviation index, whether an electrical fault has occurred between the two coil groups corresponding to the test object for each test object.

[0014] Thirdly, embodiments of this application also provide an electronic device, including: a processor, a memory, and a bus. The memory stores machine-readable instructions executable by the processor. When the electronic device is running, the processor and the memory communicate via the bus. The machine-readable instructions are executed by the processor to perform the steps of the method for detecting internal electrical faults of a coil printed circuit board in the first aspect or any possible implementation of the first aspect.

[0015] Fourthly, embodiments of this application also provide a computer-readable storage medium storing a computer program, which, when executed by a processor, performs the steps of the method for detecting internal electrical faults in a coil printed circuit board as described in the first aspect or any possible implementation of the first aspect.

[0016] This application provides a method and apparatus for detecting internal electrical faults in a coil printed circuit board. The coil printed circuit board includes at least one coil group, each coil group being formed by connecting multiple printed coils on the same or different layers. The output terminals of each coil group are connected together, and the coil groups are connected in parallel. The method includes: for each coil group, performing the following processing: inputting a first given test signal to the input terminal of the coil group; receiving a first response output signal from the output terminal of the coil group in response to the first given test signal; comparing the first response output signal with a first standard response signal corresponding to the coil group to determine a first deviation index between the two signals; and determining whether an electrical fault has occurred inside the coil group based on the first deviation index. By analyzing the changes in the response output signal of the coil group under a given short test signal, the method effectively determines whether there is an electrical fault within the coil group, improving the accuracy of electrical fault detection.

[0017] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This illustration shows a schematic diagram corresponding to a printed coil provided in an embodiment of this application; Figure 2 This paper shows a schematic diagram of a coil printed circuit board according to an embodiment of this application; Figure 3 This document illustrates one of the flowcharts for a method of detecting internal electrical faults on a coil printed circuit board according to an embodiment of this application. Figure 4 This illustration shows a waveform diagram provided in an embodiment of this application; Figure 5 The second flowchart illustrates a method for detecting internal electrical faults in a coil printed circuit board according to an embodiment of this application. Figure 6 This illustration shows one of the functional block diagrams of a detection device for internal electrical faults of a coil printed circuit board according to an embodiment of this application; Figure 7 This is a second functional block diagram of a detection device for internal electrical faults of a coil printed circuit board provided in an embodiment of this application; Figure 8 A schematic diagram of the structure of an electronic device provided in an embodiment of this application is shown. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. It should be understood that the drawings in this application are for illustrative and descriptive purposes only and are not intended to limit the scope of protection of this application. Furthermore, it should be understood that the schematic drawings are not drawn to scale. The flowcharts used in this application illustrate operations implemented according to some embodiments of this application. It should be understood that the operations in the flowcharts may not be implemented in sequence, and steps without logical contextual relationships may be reversed or implemented simultaneously. In addition, those skilled in the art, guided by the content of this application, may add one or more other operations to the flowcharts, or remove one or more operations from the flowcharts.

[0021] Furthermore, the described embodiments are merely some, not all, of the embodiments of this application. The components of the embodiments of this application described and illustrated herein can typically be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0022] Please see Figure 1 , Figure 1 A schematic diagram corresponding to a printed coil provided in an embodiment of this application is shown. Please refer to... Figure 2 , Figure 2 This diagram illustrates a schematic of a coil printed circuit board according to an embodiment of this application. Typically, coil printed circuit boards are designed to improve electromagnetic characteristics through circuit winding, such as... Figures 1-2 As shown, the coil printed circuit board is divided into 24 layers from L1 to L24. Each layer has multiple printed coils F1 arranged on a plane. F2 is a printed coil formed by two F1 coils wrapped together. The printed coils F on different planes are connected to each other through vias. Layers L1 to L9 form coil group A, layers L9 to L16 form coil group B, and layers L17 to L24 form coil group C. The output terminals of each coil group eventually converge at point N. The input terminal of coil group A is INA, the input terminal of coil group B is INB, and the input terminal of coil group C is INC, so that all the printed coils are connected in series to form a network. The entire coil printed circuit board belongs to the same network. In order to increase the current that can pass through and thus improve the electromagnetic strength, coil groups A, B, and C are designed in parallel.

[0023] The aforementioned coil printed circuit board needs to carry a large current (e.g., 30A) in the circuit. If there are multiple coil groups, there will be a certain operating voltage (e.g., 300V) between different coils. If there is an electrical fault in a single coil group, it will cause an imbalance in the electromagnetic field provided by different coil groups. If there is an electrical fault between different coil groups, it will cause the printed circuit board to burn out. Therefore, it is necessary to identify whether there are electrical faults (including short circuits and poor insulation) in the coil printed circuit board before shipment, and to reject coil printed circuit boards with electrical faults to avoid problems in the application terminal.

[0024] Existing technologies for detecting electrical faults in coil printed circuit boards generally include open / short circuit testing, four-wire resistance testing, withstand voltage testing, and inductance testing. Specifically: Open and short circuit tests are mainly used to measure the continuity and insulation performance of the coil printed circuit board. Since all the circuits on the coil printed circuit board belong to a network, a local short circuit or open circuit will not cause the continuity of the entire coil printed circuit board to be abnormal. That is, a short circuit in the middle of the coil printed circuit board cannot be detected. Therefore, open and short circuit tests cannot effectively detect short circuits in the above-mentioned coil printed circuit board.

[0025] The four-wire resistance test mainly measures the conduction resistance of the coil. In actual PCB manufacturing, the influence of line width and copper thickness can reach 10%. Since there are many coils on the coil printed circuit board, a short circuit in a single coil within the same coil group has a very limited impact on the overall resistance. Therefore, the four-wire resistance test cannot effectively detect short circuits within the coil printed circuit board. However, this method can be used to detect very serious short circuit problems (such as hard short circuits between coil groups, where the resistance at the short circuit point is within 10Ω).

[0026] Withstand voltage testing is mainly used to measure the insulation performance of coil printed circuit boards. However, since conventional withstand voltage testing equipment can only measure between mutually insulated conductors, it cannot effectively test designs like coil printed circuit boards where all networks are connected together.

[0027] Inductance testing works by measuring the inductance of the coil printed circuit board to determine the short circuit condition. Theoretically, inductance testing can measure the short circuit condition of a single printed coil. However, since there are many printed coils on the coil printed circuit board, the inductance effect caused by a short circuit in a single coil is easily ignored when placed among a large number of printed coils. Therefore, inductance testing cannot effectively detect the short circuit condition within the coil printed circuit board.

[0028] Based on this, embodiments of this application provide a method and apparatus for detecting internal electrical faults on a coil printed circuit board. By analyzing the changes in the response output signal of the coil group under a given test signal, it is possible to effectively determine whether an electrical fault has occurred within the coil group, thereby improving the accuracy of electrical fault detection. Specifically, as follows: Please see Figure 3 , Figure 3 This document illustrates one of the flowcharts for a method of detecting internal electrical faults on a coil printed circuit board according to an embodiment of this application. Figure 3 As shown in the embodiments of this application, the method for a printed circuit board containing a coil under test includes the following steps: S100. For each coil group, input a first given test signal to the input terminal of that coil group.

[0029] S200: For each coil group, receive the first response output signal output from the output terminal of that coil group in response to the first given test signal.

[0030] S300. For each coil group, the first response output signal is compared with the first standard response signal corresponding to that coil group to determine the first deviation index between the two signals.

[0031] S400. For each coil group, based on the first deviation index, determine whether an electrical fault has occurred inside the coil group.

[0032] In specific implementation, steps S100 to S400 provide a detection strategy for determining whether an electrical fault has occurred within a single coil group. In this application, electrical faults include short circuits and poor insulation. Figure 2 Taking coil group A as an example, in step S100, a first given short-circuit signal is input to the input terminal INA of coil group A. Specifically, the first given test signal is a sinusoidal pulse voltage signal with oscillating decay. The pulse voltage corresponding to the first given test signal is jointly determined by the output device of the first given test signal and the withstand voltage of the coil printed circuit board. For example, if the withstand voltage of the coil printed circuit board is 3000V and the rated output pulse voltage of the output device of the first given test signal is also 4000V, then the upper limit of the pulse voltage corresponding to the first given test signal is 3000V.

[0033] In step S200, after the first given test signal is input to coil group A, the output terminal of coil group A is received ( Figure 2 The first response output signal (N-terminal) is output in response to the first given test signal.

[0034] In this application, before performing step S100, for each coil printed circuit board of different models, a coil printed circuit board that has not experienced a short circuit is selected from the coil printed circuit boards of that model as the standard coil printed circuit board corresponding to that model. For each coil group in the standard coil printed circuit board, the first standard response signal of the coil group under the corresponding first standard test signal is collected. The coil groups on the coil printed circuit board may be different, so the first standard test signal used by each coil group is also different. In this application, the first standard response signal of each coil group in the standard coil printed circuit board under the corresponding first standard test signal is saved to the reference file corresponding to the coil printed circuit board of that model that was created in advance.

[0035] Therefore, in step S300, a reference file corresponding to the printed circuit board model of the coil under test is first retrieved, and the first standard response signal corresponding to coil group A is extracted from the reference file. The first response output signal output from the output terminal of coil group A is compared with the first standard response signal corresponding to coil group A to determine the first deviation index between the two signals.

[0036] Please see Figure 4 , Figure 4 A waveform diagram provided in an embodiment of this application is shown. Figure 4 As shown, P1 represents the first response output signal of coil group A, and PO represents the first standard response signal corresponding to coil group A.

[0037] For the printed circuit board of the coil under test, if there is an electrical fault in the coil group after a given test signal is input to coil group A, the reactance signal of the printed circuit board of the coil under test will change, thereby causing the signal waveform output by the output terminal (i.e., N terminal) of coil group A to change. That is, the phase and period of the output of coil group A will change. Based on this, this application compares the first response output signal output by the output terminal of coil group A with the corresponding first standard response signal to determine whether there is an electrical fault in coil group A.

[0038] In a preferred embodiment, taking coil group A as an example, step S300 further includes: Calculate the definite integral difference between the first response output signal corresponding to coil group A and the first standard response signal corresponding to coil group A within a specified time (for example, the specified time can be selected from the waveform acquisition start time to the waveform zeroing time). Calculate the percentage between the definite integral difference corresponding to coil group A and the definite integral of the first standard response signal within the specified time. Use the percentage as the first deviation index between the first response output signal of coil group A and the first standard response signal.

[0039] like Figure 4 As shown, the definite integral of the first response output signal P1 corresponding to coil group A is the first area formed between the first response output signal P1 and the coordinate axis, and the definite integral of the first standard response signal PO corresponding to coil group A is the second area formed between the first standard response signal PO and the coordinate axis. The definite integral difference corresponding to coil group A, that is, the difference between the first area and the second area corresponding to coil group A, is... ,but: First deviation index =

[0040] In step S400, taking coil group A as an example, it includes: Determine whether the first deviation index corresponding to coil group A is less than or equal to a preset deviation threshold. If the first deviation index is less than or equal to the preset deviation threshold, it is determined that no electrical fault has occurred inside coil group A. If the first deviation index is greater than the preset deviation threshold, it is determined that an electrical fault has occurred inside coil group A.

[0041] In a preferred embodiment, the preset deviation threshold is set according to the actual situation, and no specific limitation is made here.

[0042] The above methods primarily target the identification of internal electrical faults within coil groups. However, they also address situations where the printed coil board includes multiple parallel coil groups (e.g.,...). Figure 2 The diagram includes coil groups A, B, and C. Electrical faults between coil groups should also be considered; for this information, please refer to [link to relevant documentation]. Figure 5 , Figure 5 This is a second flowchart illustrating a method for detecting internal electrical faults on a coil printed circuit board according to an embodiment of this application. Figure 5 As shown, for the printed circuit board of the coil under test, the method provided in this application embodiment further includes: S500 divides multiple coil groups into pairs to obtain multiple test objects.

[0043] S510. For each test object, input a second given test signal to the input terminal of one of the coil groups in the test object.

[0044] S520. For each test object, receive a second response output signal in response to a second given test signal from the input of another coil group in the test object.

[0045] S530. For each test object, compare the second response output signal with the second standard response signal corresponding to the test object to determine the second deviation index between the two signals.

[0046] S540. For each test object, based on the second deviation index, determine whether an electrical fault has occurred between the two coil groups corresponding to the test object.

[0047] In one specific embodiment, before executing step S100, for each model of standard coil printed circuit board, for each test object in the standard coil printed circuit board, the second standard response signal of the test object under the corresponding second standard test signal is collected. The coil groups on the coil printed circuit board may be different, so the second standard test signal used by each test object is also different. In this application, the second standard response signal of each test object in the standard coil printed circuit board under the corresponding second standard test signal is saved to the reference file corresponding to the coil printed circuit board of the model in advance.

[0048] like Figure 2 As shown, steps S500 to S540 can determine whether an electrical fault occurs between coil group A and coil group B, between coil group A and coil group C, and between coil group B and coil group C. In this application, the method of determining the electrical fault in steps S530 to S540 is similar to the method described in steps S300 to S400 above, and will not be elaborated further here.

[0049] In a preferred embodiment, the first given test signal input to the coil group and the first standard test signal to which the first standard response signal corresponding to the coil group belong are completely consistent in frequency, phase, and amplitude; the second given test signal input to the test object and the second standard test signal to which the second standard response signal corresponding to the test object belong are completely consistent in frequency, phase, and amplitude.

[0050] In this application, if an electrical fault exists within any coil group and / or between any two coil groups on the printed circuit board of the coil under test, the short circuit test of the printed circuit board of the coil under test is determined to be unqualified. Based on the same application concept, this application also provides a detection device for internal electrical faults of coil printed circuit boards, which corresponds to the detection method for internal electrical faults of coil printed circuit boards provided in the above embodiments. Since the principle of the device in this application is similar to the detection method for internal electrical faults of coil printed circuit boards in the above embodiments of this application, the implementation of the device can refer to the implementation of the method, and the repeated parts will not be described again.

[0051] Please see Figure 6 , Figure 6 This diagram illustrates one of the functional block diagrams of a detection device for internal electrical faults on a coil printed circuit board according to an embodiment of this application. Please refer to... Figure 7 , Figure 7 This is a second functional block diagram of a detection device for internal electrical faults of a coil printed circuit board provided in an embodiment of this application.

[0052] like Figure 6 and Figure 7 As shown, the device includes: The first signal input module 600 is used to input a first given test signal to the input terminal of each coil group; The first signal receiving module 610 is used to receive, for each coil group, a first response output signal output from the output terminal of that coil group in response to a first given test signal; The first signal comparison module 620 is used to compare the first response output signal with the first standard response signal corresponding to the coil group for each coil group, and determine the first deviation index between the two signals. The first determination module 630 is used to determine, for each coil group, whether an electrical fault has occurred inside the coil group based on the first deviation index.

[0053] Preferably, when the printed circuit board of the coil under test includes multiple coil groups, the device further includes: The dividing module 640 is used to divide multiple coil groups into pairs to obtain multiple test objects; The second signal input module 650 is used to input a second given test signal to the input terminal of one of the coil groups in the test object for each test object; The second signal receiving module 660 is used to receive a second response output signal for a second given test signal from the input terminal of another coil group in the test object for each test object. The second signal comparison module 670 is used to compare the second response output signal with the second standard response signal corresponding to the test object for each test object, and determine the second deviation index between the two signals. The second determination module 680 is used to determine, based on the second deviation index, whether an electrical fault has occurred between the two coil groups corresponding to each test object.

[0054] Preferably, the first given test signal and the second given test signal are oscillating attenuated sinusoidal pulse voltage signals.

[0055] Preferably, the first signal comparison module 620 is further configured to: calculate the definite integral difference between the first response output signal corresponding to the coil group and the first standard response signal corresponding to the coil group within a specified time, calculate the percentage between the definite integral difference corresponding to the coil group and the definite integral of the first standard response signal within a specified time, and use the percentage as the first deviation index between the first response output signal and the first standard response signal of the coil group.

[0056] Preferably, the first short-circuit condition determination module 630 is further configured to: determine whether the first deviation index corresponding to the coil group is less than or equal to a preset deviation threshold; if the first deviation index is less than or equal to the preset deviation threshold, it is determined that no electrical fault has occurred inside the coil group; if the first deviation index is greater than the preset deviation threshold, it is determined that an electrical fault has occurred inside the coil group.

[0057] Preferably, the first given test signal input to the coil group and the first standard test signal to which the first standard response signal corresponding to the coil group belongs are completely consistent in frequency, phase, and amplitude; the second given test signal input to the test object and the second standard test signal to which the second standard response signal corresponding to the test object belongs are completely consistent in frequency, phase, and amplitude.

[0058] Based on the same application concept, please refer to Figure 8 , Figure 8 A schematic diagram of the structure of an electronic device provided in an embodiment of this application is shown. For example... Figure 8As shown, the electronic device 70 includes a processor 701, a memory 702, and a bus 703. The memory 702 stores machine-readable instructions that can be executed by the processor 701. When the electronic device 70 is running, the processor 701 and the memory 702 communicate through the bus 703. The machine-readable instructions are executed by the processor 701 to perform the steps of the detection method for internal electrical faults of the coil printed circuit board provided in any of the above embodiments.

[0059] Based on the same concept, this application also provides a computer-readable storage medium storing a computer program, which, when run by a processor, executes the steps of the method for detecting internal electrical faults in a coil printed circuit board provided in the above embodiments.

[0060] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems and devices described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. In the several embodiments provided in this application, it should be understood that the disclosed systems, devices, and methods can be implemented in other ways. The device embodiments described above are merely illustrative. For example, the division of units is only a logical functional division; in actual implementation, there may be other division methods. Furthermore, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Another point is that the displayed or discussed mutual coupling or direct coupling or communication connection may be through some communication interfaces; the indirect coupling or communication connection of devices or units may be electrical, mechanical, or other forms.

[0061] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0062] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0063] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a processor-executable, non-volatile, computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0064] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for detecting internal electrical faults on a coil printed circuit board, characterized in that, The coil printed circuit board includes at least one coil group, each coil group being formed by connecting multiple printed coils on the same or different layers. The output terminals of each coil group are connected together, and the coil groups are connected in parallel. For the printed circuit board of the coil under test, the method includes: For each coil group, perform the following processing: Input a first given test signal to the input terminal of the coil group; Receive the first response output signal output from the output terminal of the coil group in response to the first given test signal; The first response output signal is compared with the first standard response signal corresponding to the coil group to determine the first deviation index between the two signals. Based on the first deviation index, determine whether an electrical fault has occurred inside the coil group; The first deviation index between the first response output signal and the first standard response signal corresponding to each coil group is determined in the following manner: Calculate the definite integral difference between the first response output signal corresponding to the coil group and the first standard response signal corresponding to the coil group within a specified time. Calculate the percentage between the definite integral difference corresponding to the coil group and the definite integral of the first standard response signal within a specified time. The percentage is used as the first deviation index between the first response output signal and the first standard response signal of the coil group.

2. The method according to claim 1, characterized in that, The first given test signal is an oscillating and decaying sinusoidal pulse voltage signal.

3. The method according to claim 1, characterized in that, The following methods can be used to determine whether an electrical fault has occurred within each coil group: Determine whether the first deviation index corresponding to the coil group is less than or equal to the preset deviation threshold; If the first deviation index is less than or equal to the preset deviation threshold, it is determined that no electrical fault has occurred inside the coil group; If the first deviation index is greater than the preset deviation threshold, it is determined that an electrical fault has occurred inside the coil group.

4. The method according to claim 1, characterized in that, When the coil printed circuit board includes multiple coil groups, the method further includes: The multiple coil groups are divided into pairs to obtain multiple test objects; For each test object, perform the following processing: A second given test signal is input to the input terminal of one of the coil groups in the test object; Receive a second response output signal in response to a second given test signal from the input of another coil group in the test object; The second response output signal is compared with the second standard response signal corresponding to the test object to determine the second deviation index between the two signals; Based on the second deviation index, it is determined whether an electrical fault has occurred between the two coil groups corresponding to the test object.

5. The method according to claim 4, characterized in that, The first given test signal of the input coil group is completely consistent with the first standard test signal of the first standard response signal corresponding to the coil group in terms of frequency, phase and amplitude. The second given test signal input to the test object is completely consistent with the second standard test signal to which the second standard response signal corresponding to the test object belongs in terms of frequency, phase, and amplitude.

6. A device for detecting internal electrical faults on a coil printed circuit board, characterized in that, The coil printed circuit board includes at least one coil group, each coil group being formed by connecting multiple printed coils on the same or different layers. The output terminals of each coil group are connected together, and the coil groups are connected in parallel. Specifically, for the printed circuit board of the coil under test, the device includes: The first signal input module is used to input a first given test signal to the input terminal of each coil group; The first signal receiving module is used to receive, for each coil group, a first response output signal output from the output terminal of that coil group in response to a first given test signal; The first signal comparison module is used to compare the first response output signal with the first standard response signal corresponding to the coil group for each coil group, and determine the first deviation index between the two signals. The first determination module is used to determine, for each coil group, whether an electrical fault has occurred inside the coil group based on the first deviation index. The first signal comparison module is further configured to determine a first deviation index between the first response output signal and the first standard response signal corresponding to each coil group in the following manner: Calculate the definite integral difference between the first response output signal corresponding to the coil group and the first standard response signal corresponding to the coil group within a specified time. Calculate the percentage between the definite integral difference corresponding to the coil group and the definite integral of the first standard response signal within a specified time. The percentage is used as the first deviation index between the first response output signal and the first standard response signal of the coil group.

7. The apparatus according to claim 6, characterized in that, When the coil printed circuit board includes multiple coil groups The device further includes: The partitioning module is used to divide the multiple coil groups into pairs to obtain multiple test objects; The second signal input module is used to input a second given test signal to the input terminal of one of the coil groups in each test object; The second signal receiving module is used to receive a second response output signal for a second given test signal from the input terminal of another coil group in the test object for each test object. The second signal comparison module is used to compare the second response output signal with the second standard response signal corresponding to the test object for each test object, and determine the second deviation index between the two signals. The second determination module is used to determine, for each test object, whether an electrical fault has occurred between the two coil groups corresponding to that test object, based on the second deviation index.

8. An electronic device, characterized in that, include: The device includes a processor, a memory, and a bus. The memory stores machine-readable instructions executable by the processor. When the electronic device is running, the processor communicates with the memory via the bus. The machine-readable instructions are executed by the processor to perform the steps of the method for detecting internal electrical faults in a coil printed circuit board as described in any one of claims 1 to 5.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, performs the steps of the method for detecting internal electrical faults in a coil printed circuit board as described in any one of claims 1 to 5.

Images