A pogo pin test socket for testing filters and a de-embedding method

Abstract

The application relates to the technical field of test sockets, and particularly discloses a spring needle type test socket for testing a filter and a de-embedding method, which comprises a clamp cover assembly used for pressing a chip to a test state during chip testing, a needle mounting plate used for mounting spring needles, a needle hole arranged in the interior of the needle mounting plate, and a copper block arranged in the interior of the needle mounting plate and used for being connected with the chip and a test PCB respectively, and the test PCB. The application provides a socket structure with small spacing, high isolation and low coupling, which is favorable for improving an out-of-band suppression index of chip testing and improving test accuracy of the chip tested through the test socket. The application provides a stacking structure for describing a test clamp, which is used for describing features of a test socket. By using the stacking structure, a performance feature 2Xthru of the test socket structure in a chip testing process can be obtained, and a de-embedding method can be used to remove features of the test socket or more accurate test parameters can be obtained.

Description

Technical Field

[0001] This invention belongs to the field of test socket technology, specifically relating to a spring pin type test socket for testing filters and a method for removing the embedded pin. Background Technology

[0002] Filters are widely used in mobile communications, baseband, and radar components. With technological advancements, their size is becoming increasingly miniaturized, such as in packages like 1109, 1411, and 1612 (corresponding to a length of 1.1mm * width of 0.9mm, and so on). The pin spacing for input, output, and ground / NC is also correspondingly smaller, reaching 200-300um. Test sockets or fixtures need to maintain basic contact with the test instruments. Simultaneously, as filter frequencies increase, they become more sensitive to damage and parasitic effects on test fixtures. Smaller ground pins can result in higher parasitic ground inductance, leading to poor out-of-band rejection. Small-pitch filter testing solutions typically employ test sockets and test carriers. The test socket contains contact conductors that mate with the filter pins, and the test carrier has fan-out traces corresponding to the pins. A TRL (Tracking Reduction) calibrator is usually fabricated on or separately on the test carrier to characterize the traces, such as loss, impedance, and parasitic parameters, facilitating subsequent de-embedding of the traces. However, while this method is suitable for surface-mount filters, it only removes traces up to the pin side for test socket applications, failing to remove the characteristics of the test socket itself. Furthermore, most surface-mount microstrip lines used in the market have test sockets whose structure easily couples with the test carrier. Therefore, in addition to the aforementioned drawbacks of de-embedding, the TRL calibrator's characterization of the differences caused by surface-mount coupling further reduces the accuracy of de-embedding. To address the issue of the aforementioned test sockets failing to remove corresponding features, another method on the market utilizes elastic conductors, such as conductive cloth, gold wire conductive cloth, and conductive adhesive, which have extremely short conductor lengths. Their short electrical length allows for greater bandwidth support, and it's generally assumed that the interconnecting conductor has a lower impact. However, their lifespan is shorter, only 1 / 5 that of ordinary spring pins, resulting in poor mass production performance. Similarly, to ensure grounding inductance while maintaining impedance matching and high isolation requirements for the signal channel, another type of test socket uses a coaxial metal frame design. However, even with a small pitch (200um-300um), based on typical empirical probe diameter values ​​of (200um-50um) / 2.31=64um, probe lifespan will be significantly reduced. Furthermore, the metal frame is prone to coupling with the traces or pads on the test substrate, causing abnormal electromagnetic signal transmission. A typical example is the formation of a large capacitive load in the coupling area, and in some cases, the formation of a resonant cavity. Summary of the Invention

[0003] The purpose of this invention is to provide a spring-loaded test socket for testing filters and a method for removing the embedded part, so as to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: A spring-loaded test socket for testing filters, comprising: The clamping cover assembly is used to press the chip into the test state during chip testing to achieve a stable contact effect. A pin mounting plate is used to mount spring pins. The pin mounting plate has pin holes inside for mounting and fixing the spring pins. The pin mounting plate is also provided with a placement slot for mounting chips. The pin mounting plate is also provided with a copper block inside for connecting to the chip and the test PCB board respectively. The test PCB board is used to connect to the chip under test via copper blocks for testing.

[0005] Preferably, the needle loading plate includes an upper needle loading plate and a lower needle loading plate. Both the upper and lower needle loading plates have needle holes for installing spring needles. Both the upper and lower needle loading plates have copper blocks inside. The upper and lower needle loading plates are installed together, which also allows the two sets of copper blocks to be stacked together. The copper blocks are designed with an I-shaped structure, so that the grooves on both sides facilitate the passage of spring needles. They can also be designed with irregular shapes.

[0006] Preferably, the two ends of the two sets of copper blocks protrude from the interior of the corresponding upper and lower mounting plates, respectively, and can be 0.05mm higher than the upper and lower mounting plates, respectively, so that under the test conditions and considering the processing tolerance, the copper blocks can make preferential contact with the chip and the test PCB board respectively.

[0007] Preferably, the interior of each of the two sets of copper blocks is provided with a spring pin connected to the grounding pad of the chip. That is, the spring pin penetrates the interior of each of the two sets of copper blocks and effectively isolates the signal by surrounding the spring pin.

[0008] Preferably, the interior of the two sets of copper blocks is further provided with multiple sets of spring pins, which are all connected to the test PCB board to ensure stable contact between the copper blocks and the test PCB board, thereby achieving a stable connection.

[0009] Preferably, spring pins are also provided on both sides of the two sets of copper blocks, and the two sets of copper blocks, the spring pins, the upper mounting plate and the lower mounting plate form a 50Ω impedance-matched radio frequency channel.

[0010] Preferably, the clamp cover assembly includes a locking block. Further, the clamp cover assembly is a common clamp cover in the prior art, which will not be described in detail here. Both sides of the upper needle plate are provided with locking slots that cooperate with the locking block, so as to cooperate with the locking block of the clamp cover assembly to press the chip down to the test state and achieve a stable contact effect. The needle loading plate and the test PCB are connected by a threaded bolt, that is, both the needle loading plate and the test PCB have screw holes, so that the needle loading plate and the test PCB can be installed to form a whole.

[0011] Preferably, the clamping cover assembly includes an upper needle plate, a lower needle plate, and a test PCB board. The upper needle plate, the lower needle plate, and the test PCB board have the same structure as the upper needle plate, the lower needle plate, and the test PCB board, respectively, and are arranged in a mirror image. This is to accurately describe the coupling characteristics between the needle mounting part and the test carrier board, and to describe the influence of electromagnetic waves on the transmission of electromagnetic waves along the spring needle conductor and the supporting medium material. That is, to ensure that the upper probe head and the lower probe head are in contact, thereby forming a path file from the RF connector and RF trace of the upper test PCB board to the probes of the upper lower needle plate and the upper needle plate, and the probes of the lower upper needle plate and the lower needle plate to the RF traces and RF connectors of the test PCB board, which is defined as a 2xthru file describing the test socket and RF trace. The test PCB board, the lower needle plate, the upper needle plate, the upper needle plate, the lower needle plate, and the test PCB board are connected by threaded bolts. That is, the clamp cover assembly is provided with screw holes on the upper needle plate, the lower needle plate, and the test PCB board to install the clamp cover assembly with the needle plate and the test PCB board to form a whole.

[0012] Preferably, a method for removing the embedding of a spring-loaded test socket for a test filter includes the following steps: S1. Use the spring pin test socket of the test filter to test the filter and obtain the s2p files of the IN port and OUT port; S2. The stacking structure of the pin-loading fixture and PCB fixture described in the measured channel is used to obtain the s2p file, which is described as 2xthru; S3. Import the measured S2P file of the filter into AFR (Keysight Technologies Commercial Software Module) to embed it in the software; S4. Use AFR (Keysight Technologies Commercial Software Module) to import the s2p file describing 2xthru for channel description using the de-embedding function of the software. S5. Perform deembedding on the filter's s2p and view or export the deembedding results using AFR deembedding software; S6. Obtain accurate filter chip s-parameters.

[0013] 19. Compared with the prior art, the beneficial effects of the present invention are: 1. This invention provides a small-pitch, high-isolation, low-coupling socket structure, which is beneficial to improving the out-of-band rejection index of chip testing and improving the testing accuracy of chips through the test socket; 2. The present invention provides a stacked structure for describing test fixtures, used to describe the characteristics of test sockets. Using this stacked structure, it is possible to obtain the performance characteristics 2Xthru of the test socket structure during chip testing, which facilitates the removal of test socket features or more accurate test parameters using de-embedding methods. 3. This invention provides a de-embedding method, which combines a stacked structure to obtain accurate test characteristics of a filter. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of the present invention; Figure 2 This is an exploded view of Embodiment 1 of the present invention; Figure 3 This is a schematic diagram of the installation of the copper block according to Embodiment 1 of the present invention; Figure 4 This is an enlarged schematic diagram of the copper block of the present invention; Figure 5 This is a schematic diagram of the installation of the spring pin of the present invention; Figure 6 This is a schematic diagram of the internal structure of the copper block of the present invention; Figure 7 This is a schematic diagram of the overall structure of Embodiment 2 of the present invention; Figure 8 This is an exploded view of Embodiment 2 of the present invention; Figure 9 This is a schematic diagram comparing the return loss of the test socket with out-of-band suppression enhancement according to the present invention; Figure 10 This is a schematic diagram comparing the insertion loss of the test socket after it has been removed from the embedded zone according to the present invention. Figure 11 This is a schematic diagram comparing the in-band return loss after the test socket of the present invention is removed from the embedding process; In the diagram: 10. Clamp and cover assembly; 20. Needle loading plate; 21. Upper needle loading plate; 22. Lower needle loading plate; 30. Test the PCB board; 40. Copper block; 41. Spring needle one; 42. Spring needle two; 41. Spring needle three. Detailed Implementation

[0015] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0016] Example 1: Please see Figures 1-6 As shown, a spring-loaded test socket for a test filter includes: The clamping cover assembly 10 is used to press the chip into the test state during chip testing to achieve stable contact. The pin mounting plate 20 is used to mount spring pins. The pin mounting plate 20 has pin holes inside for mounting and fixing spring pins. The pin mounting plate 20 also has a placement slot for mounting chips. The pin mounting plate 20 also has a copper block 40 inside for connecting to the chip and the test PCB board 30 respectively. The test PCB board 30 is used to connect to the chip under test via the copper block 40 for testing.

[0017] refer to Figures 1-6 As shown, the needle loading plate 20 includes an upper needle loading plate 21 and a lower needle loading plate 22. Both the upper needle loading plate 21 and the lower needle loading plate 22 have needle holes for installing spring needles. Both the upper needle loading plate 21 and the lower needle loading plate 22 have copper blocks 40 inside. The upper needle loading plate 21 and the lower needle loading plate 22 are installed together, which also makes the two sets of copper blocks 40 stacked together. The copper blocks 40 are set in an I-shaped structure, so that the grooves on both sides are conducive to the passage of spring needles. They can also be set in an irregular shape.

[0018] refer to Figures 1-6 As shown, the two ends of the two sets of copper blocks 40 protrude from the interior of the corresponding upper needle plate 21 and lower needle plate 22, respectively, and can be 0.05mm higher than the upper needle plate 21 and lower needle plate 22, respectively, so that under the test conditions and considering the processing tolerance, the copper blocks 40 can make priority contact with the chip and the test PCB board 30 respectively.

[0019] refer to Figures 1-6 As shown, the two sets of copper blocks 40 are equipped with spring pins 41 that are connected to the grounding pads of the chip. The spring pins 41 pass through the interior of the two sets of copper blocks 40 respectively, and the signals are effectively isolated by surrounding the spring pins 41.

[0020] refer to Figures 1-6As shown, the two sets of copper blocks 40 are also equipped with multiple sets of spring pins 42 inside. All sets of spring pins 42 are connected to the test PCB board 30 to ensure stable contact between the copper blocks 40 and the test PCB board 30, thereby achieving a stable connection.

[0021] refer to Figures 1-6 As shown, spring needles 43 are also provided on both sides of the two sets of copper blocks 40. The two sets of copper blocks 40, spring needles 43, and upper needle plate 21 and lower needle plate 22 form a 50Ω impedance-matched radio frequency channel.

[0022] Furthermore, the contact features of the I-shaped copper block 40 with the test PCB 30 should not affect the features at the PAD of the 50-ohm test PCB 30. If the microstrip line of the test PCB 30D contacts the copper block 40, the edge distance of the copper block 40 should be greater than the edge distance of the signal-side grounding area; otherwise, capacitive loads may be generated, affecting the impedance matching of the test PCB 30. This is Example 1. In Example 1, the PCB uses surface microstrip lines. In the contact area between the undermount pin board 22 and the test PCB 30, apart from the dielectric necessary to support the probe, the undermount pin board 22 should avoid the surface microstrip RF trace direction. Its width should be greater than the grounding width, and its height should ensure at least 3 * the avoidance height of the dielectric layer below the RF wiring layer.

[0023] Test PCB3 uses VIA in PAD technology (a type of PCB pad technology where the via is filled with resin). The pads are connected to spring pins 41 and 43 as solder pads. The RF traces are routed to the back of test PCB30 via VIA in PAD, away from the test socket side. Similarly, irregularly shaped copper blocks should be kept away from the reverse pad dimensions to prevent them from affecting the quality of the solder pads themselves.

[0024] The test PCB 30 has multiple grounding vias distributed along the grounding area along the trace direction to connect the grounding copper foils of the upper and lower layers. Similarly, dense grounding vias are distributed between the signal pads, which helps to reduce crosstalk between signal lines of the test PCB 30 and enhance its channel suppression capability.

[0025] refer to Figures 1-6 As shown, the clamp cover assembly 10 includes a locking block. Furthermore, the clamp cover assembly 10 is a common clamp cover in the prior art, which will not be described in detail here. Both sides of the upper needle plate 21 are provided with locking slots that cooperate with the locking block, so as to cooperate with the locking block of the clamp cover assembly 10 to press the chip down to the test state and achieve a stable contact effect. The needle mounting plate 20 and the test PCB board 30 are connected by a threaded bolt, that is, both the needle mounting plate 20 and the test PCB board 30 are provided with screw holes to install the needle mounting plate 20 and the test PCB board 30 into a whole.

[0026] It should be noted that: the description is for testing the RF connector to RF trace probe to probe RF trace test PCB 30 RF connector, and the heat dissipation parameter file for both ports is defined as 2Xthru. This is a description specifically for de-embedding operation, and is a general description that can be found online.

[0027] Note that the de-embedding implementation logic is to remove the features brought by the test PCB board 30 traces and upper and lower pin plates and probes as described above. The described 2Xthru is two identical features. The AFR software uses 2xthru to remove the parameters of the test chip on the fixture side, so as to obtain accurate parameters. Alternatively, as described later, the 2xthru can be separated into two fixture files by software. These fixture files describe the features of the test PCB board 30 and the probes of the upper and lower pin plates 21 and 22. Then, the ADS software is used for data post-processing and de-embedding to obtain accurate chip parameters.

[0028] The description of the 2xthru file below is the same as above.

[0029] Example 2: Please see Figures 4-8 As shown, a spring-loaded test socket for a test filter includes: The clamping cover assembly 10 is used to press the chip into the test state during chip testing to achieve stable contact. The pin mounting plate 20 is used to mount spring pins. The pin mounting plate 20 has pin holes inside for mounting and fixing spring pins. The pin mounting plate 20 also has a placement slot for mounting chips. The pin mounting plate 20 also has a copper block 40 inside for connecting to the chip and the test PCB board 30 respectively. The test PCB board 30 is used to connect to the chip under test via the copper block 40 for testing.

[0030] refer to Figures 4-8 As shown, the needle loading plate 20 includes an upper needle loading plate 21 and a lower needle loading plate 22. Both the upper needle loading plate 21 and the lower needle loading plate 22 have needle holes for installing spring needles. Both the upper needle loading plate 21 and the lower needle loading plate 22 have copper blocks 40 inside. The upper needle loading plate 21 and the lower needle loading plate 22 are installed together, which also makes the two sets of copper blocks 40 stacked together. The copper blocks 40 are set in an I-shaped structure, so that the grooves on both sides are conducive to the passage of spring needles. They can also be set in an irregular shape.

[0031] refer to Figures 4-8As shown, the two ends of the two sets of copper blocks 40 protrude from the interior of the corresponding upper needle plate 21 and lower needle plate 22, respectively, and can be 0.05mm higher than the upper needle plate 21 and lower needle plate 22, respectively, so that under the test conditions and considering the processing tolerance, the copper blocks 40 can make priority contact with the chip and the test PCB board 30 respectively.

[0032] refer to Figures 4-8 As shown, the two sets of copper blocks 40 are equipped with spring pins 41 that are connected to the grounding pads of the chip. The spring pins 41 pass through the interior of the two sets of copper blocks 40 respectively, and the signals are effectively isolated by surrounding the spring pins 41.

[0033] refer to Figures 4-8 As shown, the two sets of copper blocks 40 are also equipped with multiple sets of spring pins 42 inside. All sets of spring pins 42 are connected to the test PCB board 30 to ensure stable contact between the copper blocks 40 and the test PCB board 30, thereby achieving a stable connection.

[0034] refer to Figures 4-8 As shown, spring needles 43 are also provided on both sides of the two sets of copper blocks 40. The two sets of copper blocks 40, spring needles 43, and upper needle plate 21 and lower needle plate 22 form a 50Ω impedance-matched radio frequency channel.

[0035] refer to Figures 4-8 As shown, the clamping cover assembly 10 includes an upper needle plate, a lower needle plate, and a test PCB board. The upper needle plate, lower needle plate, and test PCB board have the same structure as the upper needle plate 21, lower needle plate 22, and test PCB board 30, respectively, and are arranged in a mirror image. This is to accurately describe the coupling characteristics between the needle mounting part and the test carrier board, and at the same time describe the influence of the electromagnetic wave transmission along the spring needle conductor on the supporting medium material. That is, to ensure that the upper probe head and the lower probe head are in contact, thereby forming a path file from the RF connector and RF trace of the upper test PCB board 1 to the probes of the upper lower needle plate 1 and upper needle plate 1, and the probes of the lower upper needle plate 21 and lower needle plate 22 to the RF trace and RF connector of the test PCB board 30, which is defined as a 2xthru file describing the test socket and RF trace. The test PCB board 1, lower needle plate 1, upper needle plate 1, upper needle plate 21, lower needle plate 22 and test PCB board 30 are connected by threaded bolts. That is, the clamp cover assembly 10 and the upper needle plate 21, lower needle plate 22 and test PCB board 30 are all provided with screw holes, so as to install the clamp cover assembly 10 with the needle plate 20 and the test PCB board 30 to form a whole.

[0036] Furthermore, the dimensions of the needle carrier of the clamping cover assembly 10 should be consistent with those of the needle plate 22 under the test fixture, in order to accurately describe the coupling characteristics between the needle part and the test carrier plate, and at the same time describe the influence of the electromagnetic wave transmission along the spring needle conductor on the support medium material.

[0037] Example 3: Please see Figures 1-8 As shown, a method for de-embedding a spring-loaded test socket for a test filter includes the following steps: S1. Use the spring pin test socket of the test filter to test the filter and obtain the s2p file (two-port dispersion parameter file) of the IN port and OUT port. S2. The stacking structure of the pin-loading fixture and PCB fixture described in the measured channel is used to obtain the s2p file, which is described as 2xthru; S3. Import the measured S2P file of the filter into AFR (Keysight Technologies Commercial Software Module) to embed it in the software; S4. Use AFR (Keysight Technologies Commercial Software Module) to import the s2p file describing 2xthru for channel description using the de-embedding function of the software. S5. Perform deembedding on the filter's s2p and view or export the deembedding results using AFR deembedding software; S6. Obtain accurate filter chip s-parameters.

[0038] Furthermore, S5 can be replaced with AFR, which can separate the description behavior of 2xthru-1s2p or 2xthru-2s2p fixtures that describe the 2xthru s2p files. The separated S2P file data can describe the characteristics of the test PCB board 30, upper and lower pin boards, and probe structure of the test socket scheme. Then, the S2P described by the fixture and the S2P measured by the filter chip can be imported into ADS software (Dextech Commercial Software).

[0039] Experiment 1 is as follows: Figure 9 As shown: Red line: Standard chip; Blue line: Low isolation, high parasites, standard solution; Black line: High isolation solution for irregularly shaped copper blocks; Vertical axis: unit dB; Horizontal axis: unit GHz; The results are as follows: the black line is similar to the red line, while the blue line shows a significant increase after 8GHz due to external suppression; it is also relatively large within 2GHz.

[0040]

[0041] Compared with the conventional solution, the irregular copper block isolation solution reduces the out-of-band rejection deviation from the standard chip at low frequency (1.6GHz) from 19.5% to 8.7%, and at high frequency from 30.8% to 7.7%.

[0042] Experiments 2 and 3 are as follows: Figure 10 and Figure 11 As shown: Red line: Standard chip; Green line: Test the chip after the socket is embedded; The results are as follows: Figure 10 In-band return loss after de-embedding: High consistency <10%.

[0043]

[0044] Figure 11 In-band insertion loss after de-embedding: High consistency <10%.

[0045]

[0046] 1. This invention provides a small-pitch, high-isolation, low-coupling socket structure, which is beneficial to improving the out-of-band rejection index of chip testing and improving the testing accuracy of chips through the test socket; 2. The present invention provides a stacked structure for describing test fixtures, used to describe the characteristics of test sockets. Using this stacked structure, it is possible to obtain the performance characteristics 2Xthru of the test socket structure during chip testing, which facilitates the removal of test socket features or more accurate test parameters using de-embedding methods. 3. This invention provides a de-embedding method, which combines a stacked structure to obtain accurate test characteristics of a filter.

[0047] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A spring-loaded pin test socket for testing filters, characterized in that, include: The clamp cover assembly (10) is used to press the chip into the test state during chip testing; The needle mounting plate (20) is used to install spring needles. The needle mounting plate (20) has needle holes inside for installing and fixing spring needles. The needle mounting plate (20) is also provided with a placement slot for installing chips. The needle mounting plate (20) is also provided with a copper block (40) inside for connecting to the chip and the test PCB board (30) respectively. The test PCB board (30) is used to connect to the chip under test via the copper block (40) for testing; The needle loading plate (20) includes an upper needle loading plate (21) and a lower needle loading plate (22). The upper needle loading plate (21) and the lower needle loading plate (22) are both provided with needle holes for installing spring needles. The upper needle loading plate (21) and the lower needle loading plate (22) are both provided with copper blocks (40). The copper block (40) is configured with an I-shaped structure; The two ends of the two sets of copper blocks (40) protrude from the interior of the corresponding upper needle plate (21) and lower needle plate (22); The two sets of copper blocks (40) are provided with spring pins (41) that are connected to the grounding pads of the chip. The two sets of copper blocks (40) are also provided with multiple sets of spring pins (42), and the multiple sets of spring pins (42) are all connected to the test PCB board (30); Two sets of copper blocks (40) are also provided with spring needles (43) on both sides. The two sets of copper blocks (40), the spring needles (43) and the upper needle plate (21) together with the lower needle plate (22) form a 50Ω impedance-matched radio frequency channel. The clamping cover assembly (10) includes an upper needle plate, a lower needle plate, and a test PCB board. The upper needle plate, the lower needle plate, and the test PCB board have the same structure as the upper needle plate (21), the lower needle plate (22), and the test PCB board (30), respectively, and are arranged in a mirror image.

2. The spring-loaded test socket for a test filter according to claim 1, characterized in that: The clamp cover assembly (10) includes a locking block, and the upper needle plate (21) has locking slots on both sides that cooperate with the locking block; The needle loading plate (20) and the test PCB board (30) are threaded together by mounting bolts.

3. The spring-loaded test socket for a test filter according to claim 2, characterized in that: The test PCB board 1, the lower needle plate 1, the upper needle plate 1, the upper needle plate (21), the lower needle plate (22) and the test PCB board (30) are connected by threaded bolts.

4. The method for removing the embedding of a spring-loaded test socket for a test filter according to claim 3, characterized in that: Includes the following steps: S1. Use the spring pin test socket of the test filter to test the filter and obtain the s2p files of the IN port and OUT port; S2. The stacking structure of the pin-loading fixture and PCB fixture described in the measured channel is used to obtain the s2p file, which is described as 2xthru; S3. Import the measured S2P file of the filter into the AFR de-embedding software; S4. Use the de-embedding function of AFR de-embedding software to import the s2p file describing 2xthru for channel description; S5. Perform deembedding on the filter's s2p and view or export the deembedding results using AFR deembedding software; S6. Obtain accurate filter chip s-parameters.

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