Multi-tap transmission line system and method thereof

Abstract

This document describes various embodiments of a multi-tap transmission line. The multi-tap transmission line may include: a first end and at least one second end; the transmission line having a corresponding characteristic impedance value (Zc); the first end having a corresponding first-end impedance, which is the same as the characteristic impedance; the at least one second end having a corresponding at least one second-end impedance, which is the same as the characteristic impedance; and at least two tap circuits connected to the transmission line, wherein each tap circuit includes a tap port, and wherein each tap port has a corresponding tap impedance value (Zo). The characteristic impedance value Zc is lower than, and in some cases substantially lower than, the tap impedance value Zo.

Description

[0001] Cross-reference to related applications

[0002] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 458,967, filed April 13, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The various embodiments described herein generally relate to waveguides and methods for connectivity in networks for wireless terminals. Background Technology

[0004] Figure 1A This diagram illustrates multiple devices or nodes communicating wirelessly using conventional methods known in the prior art. Multiple devices, such as a high-throughput Wi-Fi transceiver 101, communicate with each other via a wireless network 102. However, communicating via wireless network 102 can introduce several limitations and disadvantages. Some of these limitations and disadvantages may include propagation variations, spectrum availability, interference, and potential attacks from network threats.

[0005] On the other hand, while high-throughput peripheral component interconnect (PCIe) or other baseband serial communications, such as Ethernet LANs, are more robust and less susceptible to the limitations and damaging factors seen in wireless networks, they can only operate in point-to-point communication mode. This requires data exchange and a lot of cabling, leading to significant problems related to interconnect design, manufacturing, and installation costs.

[0006] Therefore, an improved solution is needed that addresses the shortcomings of wireless networks such as Wi-Fi and baseband data exchange networks such as PCIe, while retaining the advantages of these technologies, especially for high node density networks. Summary of the Invention

[0007] In at least one aspect, a multi-tap transmission line is provided. In at least one embodiment, the multi-tap transmission line includes: a first end and at least one second end; the transmission line has a corresponding characteristic impedance value (Zc); the first end has a corresponding first end impedance, which is the same as the characteristic impedance; the at least one second end has a corresponding at least one second end impedance, which is the same as the characteristic impedance; at least two tap circuits connected to the transmission line; wherein each tap circuit includes a tap port, wherein each tap port has a corresponding tap impedance value (Zo); and the characteristic impedance value Zc is less than each tap impedance value Zo.

[0008] In at least one embodiment, for each tap circuit, the multi-tap transmission line further includes: a first resistive element corresponding to a first port of the tap circuit and having a corresponding first resistance value; and a second resistive element corresponding to a second port of the tap circuit and having a second resistance value, the first resistance value and the second resistance value being substantially equal to the series resistance value (Rs); a corresponding tap device connected to the corresponding tap port; and a tap resistive element corresponding to the tap port, the tap resistive element having a tap resistance value (Rt); wherein the first resistive element, the second resistive element and the tap resistive element are connected at the connection point in a T-shaped configuration.

[0009] In at least one embodiment, the tapped device is selected from the group consisting of: an output RF transmitter, an input RF receiver, a combined input and output RF transceiver, an RC transceiver, multiple RF transceivers, a test port of a vector network analyzer (VNA), a test port of a time domain reflectometer (TDR) analyzer, a tap of another multi-tap transmission line, any RF device, and a terminal.

[0010] In at least one embodiment, when the tapped device is connected to a multi-tap transmission line, the first-terminal impedance and the second-terminal impedance remain matched with the transmission line.

[0011] In at least one embodiment, the transmission line includes a splitter configuration, and the at least one second end includes two second ends. In at least one embodiment, the multi-tap transmission line is implemented as a rigid printed circuit board. In at least one embodiment, the multi-tap transmission line is implemented as a discrete flexible printed circuit board. In at least one embodiment, the multi-tap transmission line employs a flexible printed circuit board configured with self-adhesive tape. In at least one embodiment, the multi-tap transmission line is configured as a branched configuration.

[0012] In at least one embodiment, the multi-tap transmission line operates under at least one of the following conditions: tap device disconnection, short circuit, or damage. In these embodiments, the multi-tap transmission line operates together with the remaining tap devices.

[0013] In at least one embodiment, the first resistive element and the second resistive element have corresponding series resistance values ​​of approximately 0 ohms.

[0014] In at least one aspect, a method for optimizing a multi-tap transmission line is provided. In at least one embodiment, the method includes: determining an optimal characteristic impedance value (Zc) for each corresponding tap impedance value (Zo) and the total number of tap ports in the transmission line; and determining a series resistance value (Rs) and a tap resistance value (Rt) based on the optimal characteristic impedance value (Zc) to minimize the loss between the first tap circuit and the last tap circuit.

[0015] In at least one embodiment, determining the optimal characteristic impedance value (Zc) includes: selecting candidate impedance values ​​from a range of values ​​between 0 and terminal impedance values; for each candidate impedance value: determining the worst-case insertion loss between the first tap circuit and the last tap circuit based on the candidate impedance value and the tap impedance value corresponding to the tap port, the worst-case insertion loss being determined based on determining the longitudinal insertion loss and the lateral insertion loss according to the following formula:

[0016] TTLN[dB]=TIL(1)+LIL(2)+LIL(3)+...+LIL(j)+...LIL(N-1)+TIL(N), Where LIL is the longitudinal insertion loss value determined according to the following formula:

[0017] LIL(j)=20LOG10(1-Zc / 2Zo(j)) , where j represents the range of tap index values, from 2 to (N-1), and N represents the total number of tap ports; where TIL is the lateral insertion loss value determined according to the following formula: TIL(j) = 10LOG10(Zc / 4Zo(j)), Where j is 1 or N, the optimal characteristic impedance value (Zc) is determined based on the candidate impedance value that minimizes the worst-case insertion loss.

[0018] In at least one embodiment, the series resistance value (Rs) is determined according to the following formula: Where Zo(j) is the tap impedance value of tap port j; j is the range of values ​​representing the tap index, ranging from 1 to N, where N represents the total number of tap ports; Zc is the optimal characteristic impedance value.

[0019] In at least one embodiment, the tap resistance value (Rt) is determined according to the following formula: Where Zo(j) is the tap impedance value of tap port j; j represents the range of tap index values, from 1 to N, where N represents the total number of tap ports; Zc is the optimal characteristic impedance value.

[0020] In at least one embodiment, the method further includes selecting an alternative characteristic impedance value (Zc) from a range between -30% and +30% of the optimal characteristic impedance value.

[0021] In at least one embodiment, the optimal characteristic impedance value (Zc) is determined by graphical analysis in the following manner:

[0022] The loss function, which is a function of the candidate impedance value, is plotted according to the following formula:

[0023] TTLN[Zc]=TIL(1)+LIL(2)+LIL(3)+...+LIL(j)+...LIL(N-1)+TIL(N) ;as well as

[0024] The optimal characteristic impedance value is selected based on the candidate impedance value corresponding to the minimum value of the loss function.

[0025] In at least one aspect, a multi-tap transmission line for use in a motorized vehicle is provided.

[0026] In at least one embodiment, the multi-tap transmission line includes: a first end and at least one second end; the transmission line having a corresponding characteristic impedance value (Zc); the first end having a corresponding first end impedance, which is the same as the characteristic impedance; the at least one second end having a corresponding at least one second end impedance, which is the same as the characteristic impedance; at least two tap circuits connected to the transmission line; wherein each tap circuit includes a tap port, wherein each tap port has a corresponding tap impedance value (Zo); and wherein the characteristic impedance value Zc is less than the individual tap impedance values ​​Zo. In at least one embodiment, for each tap circuit, the multi-tap transmission line further includes: a first resistive element corresponding to a first port of the tap circuit and having a corresponding first resistance value; and a second resistive element corresponding to a second port of the tap circuit and having a second resistance value, the first resistance value and the second resistance value being substantially equal to the series resistance value (Rs); a corresponding tap device connected to the corresponding tap port; and a tap resistive element corresponding to the tap port, the tap resistive element having a tap resistance value (Rt); wherein the first resistive element, the second resistive element and the tap resistive element are connected at the connection point in a T-shaped configuration.

[0027] In at least one embodiment, the multi-tap transmission line further includes at least 24 tap devices. In at least one embodiment, the tap devices are selected from the group consisting of vehicle sensors, engine control units (ECUs), gateways, and AI nodes. In at least one embodiment, the multi-tap transmission line is configured as a flexible printed circuit board with self-adhesive tape. In at least one embodiment, the multi-tap transmission line further includes an auxiliary multi-tap transmission line to provide redundancy. In at least one embodiment, the tap devices are switched from the multi-tap transmission line to the auxiliary multi-tap transmission line.

[0028] In at least one aspect, a multi-tap transmission line for a remotely operated vehicle (ROV) is provided. In at least one embodiment, the tapping devices are selected from the group consisting of ROV sensors, ROV engine control units (ECUs), ROV gateways, and ROV AI nodes. In at least one embodiment, the multi-tap transmission line is configured in a branched configuration. In at least one embodiment, the multi-tap transmission line includes a resistive power divider to branch the multi-tap transmission line into multiple lines.

[0029] In at least one aspect, a multi-tap transmission line for a server rack is provided. In at least one embodiment, the tapping device is a server.

[0030] In at least one aspect, a multi-tap transmission line is provided for use in an inter-chip architecture involving multiple processor chips. In at least one embodiment, the multi-tap transmission line is located outside the multiple processor chips and connected to nodes within the multiple processor chips. In at least one aspect, the multi-tap transmission line is implemented as a rigid printed circuit board. In at least one aspect, the multi-tap transmission line is implemented as a discrete flexible printed circuit board. In at least one aspect, the multi-tap transmission line is implemented as at least one of: a chip silicon substrate, a die, and an interposer. Attached Figure Description

[0031] To better understand the various embodiments described herein and to more clearly show how these various embodiments can be implemented in practice, reference will be made to the accompanying drawings by way of example, which illustrate at least one exemplary embodiment and will now be described therein. The drawings are not intended to limit the scope of the teachings herein.

[0032] Figure 1A This is a schematic diagram illustrating multiple devices communicating wirelessly with each other using conventional methods known in the prior art;

[0033] Figure 1B This is a schematic diagram illustrating, according to an embodiment, that multiple devices communicate with each other using a multi-tap transmission line;

[0034] Figure 2 This is a block diagram of an embodiment of a multi-tap transmission line;

[0035] Figure 3 This is a block diagram of an embodiment of a branch multi-tap transmission line;

[0036] Figure 4 This is a schematic diagram of an embodiment of the taps of a multi-tap transmission line;

[0037] Figure 5 This is a schematic diagram of an embodiment of a multi-tap transmission line;

[0038] Figure 6 This is a graph showing the dependence of tap resistance (Rt) and series resistance (Rs) on the characteristic impedance (Zc) of a multi-tap transmission line.

[0039] Figure 7 This is a graph showing the dependence of longitudinal insertion loss (LIL) and lateral insertion loss (TIL) on the characteristic impedance (Zc) of a multi-tap transmission line;

[0040] Figure 8 This is a graph showing the dependence of worst-case insertion loss (TTLN) on the characteristic impedance (Zc) of a multi-tap transmission line and the number of taps N of the transmission line;

[0041] Figure 9This is a graph showing the dependence of worst-case insertion loss (TTLN) on the characteristic impedance (Zc) of a multi-tap transmission line and the number of taps N of the transmission line;

[0042] Figure 10 This is a graph showing the frequency dependence of S1-24 for four sample cases;

[0043] Figure 11 This is a plot showing the frequency dependence of SL-L for four sample cases;

[0044] Figure 12 This is a front perspective view of an embodiment of a rack-mountable planar multi-tap transmission line;

[0045] Figure 13 yes Figure 12 Rear perspective view of an embodiment in which a rack can be mounted a planar multi-tap transmission line;

[0046] Figure 14 It is a laminated structure used to manufacture printed circuit boards;

[0047] Figure 15 It is a rear perspective view of the taps of a planar multi-tap transmission line;

[0048] Figure 16 yes Figure 15 A front perspective view of the features on the outer layer of the tap and the via structure;

[0049] Figure 17 yes Figure 15 A magnified view of details in 230B;

[0050] Figure 18 yes Figure 15 A magnified view of the active conductivity characteristics of the tap in the image;

[0051] Figure 19 yes Figure 18 A magnified view of the details in 230D;

[0052] Figure 20 yes Figure 18 A magnified view of the details of the winning bidder, 230E;

[0053] Figure 21 yes Figure 15 A schematic diagram of the tap model in the diagram;

[0054] Figure 22 yes Figure 21 A graph of the S-parameters of the model in the image;

[0055] Figure 23 yes Figure 13 A schematic diagram of a planar multi-tap transmission line model;

[0056] Figure 24 It is shown Figure 23 A plot showing the frequency dependence of the S-parameters of the model in the image;

[0057] Figure 25 This is a schematic diagram of a multi-tap transmission line on the backplane;

[0058] Figure 26 This is a perspective view of an embodiment of a coaxial multi-tap transmission line;

[0059] Figure 27 yes Figure 26 A magnified view of the details in the 300A;

[0060] Figure 28 This is a perspective view of an embodiment of a coaxial stack, which includes a coaxial tap, two coaxial supports, and a coaxial terminal.

[0061] Figure 29 yes Figure 28 A decomposed diagram of the coaxial stack;

[0062] Figure 30 This is the front perspective view of the coaxial tap;

[0063] Figure 31 yes Figure 30 A magnified view of detail 321A;

[0064] Figure 32 yes Figure 30 A magnified view of the active conductivity feature of the coaxial tap on the PCB.

[0065] Figure 33 yes Figure 32 Rear view of the PCB active conductivity feature of the coaxial tap;

[0066] Figure 34 yes Figure 33 A magnified view of the details of the winning designation 321B;

[0067] Figure 35 yes Figure 30 A front perspective view of the PCB conductive features of the coaxial tap in the image;

[0068] Figure 36 yes Figure 35 Rear view of the PCB conductive features of the coaxial tap in the image;

[0069] Figure 37 This is a front perspective view of the coaxial terminal;

[0070] Figure 38 yes Figure 37 Rear view of the coaxial terminal;

[0071] Figure 39 yes Figure 37 A perspective view of the PCB conductive features of the coaxial terminals in the diagram;

[0072] Figure 40 yes Figure 38 A magnified view of the details in the 330C;

[0073] Figure 41 This is a top perspective view of an embodiment of the coaxial connector adapter;

[0074] Figure 42 yes Figure 41 A bottom view of an embodiment of a coaxial connector adapter;

[0075] Figure 43 yes Figure 41 An exploded view of an embodiment of the coaxial connector adapter;

[0076] Figure 44 yes Figure 41 An exploded view of an embodiment of the coaxial connector adapter;

[0077] Figure 45 A schematic diagram of a coaxial tap model;

[0078] Figure 46 It is shown Figure 45 A plot showing the frequency dependence of the S-parameters of the model in the image;

[0079] Figure 47 This is a schematic diagram of a coaxial multi-tap transmission line model;

[0080] Figure 48 It is shown Figure 47 A plot showing the frequency dependence of the S-parameters of the model in the image;

[0081] Figure 49 This is a schematic diagram showing a frequency division multiple access tapped device, a time division multiple access tapped device, and a combined tapped device;

[0082] Figure 50 This is a schematic diagram illustrating a redundant multi-tap transmission line system;

[0083] Figure 51 This is a schematic diagram illustrating the bridging of a multi-tap transmission line;

[0084] Figure 52 This is a schematic diagram showing a multi-tap transmission line with narrowband connectors and taps;

[0085] Figure 53 This is a schematic diagram of a multi-tap transmission line system suitable for automotive use cases;

[0086] Figure 54This is a schematic diagram illustrating a branched multi-tap transmission line system suitable for use cases with unmanned aerial vehicles (UAVs).

[0087] Figure 55 This is a schematic diagram of a power divider used in the branching structure of a multi-tap transmission line;

[0088] Figure 56 This is a schematic diagram of a multi-tap transmission line system suitable for server rack use cases;

[0089] Figure 57 This is a detailed explanation. Figure 56 A schematic diagram of a multi-tap transmission line connected to a 5622;

[0090] Figure 58 This is a simplified diagram of a three-layer AI network; and

[0091] Figure 59 yes Figure 58 The diagram illustrates an AI network with multiple tapped transmission lines. Detailed Implementation

[0092] Various devices or processes will be described below to provide examples of embodiments of each claimed invention. No embodiment described below is intended to limit any claimed invention, and any claimed invention may encompass a process or device different from those described below. A claimed invention is not limited to a device or process having all the features of any of the devices or processes described below, or features common to multiple or all of the devices or processes described below. The devices or processes described below may not be embodiments of any claimed invention. Any invention disclosed in the devices or processes described below but not claimed in this document may be the subject of another protective document, such as a continuation patent application, and the applicant, inventor, or owner does not intend to waive, abandon, or publicly offer any such invention by disclosing it in this document.

[0093] Furthermore, it should be understood that, for the sake of simplicity and clarity, reference numerals may be repeated in the accompanying drawings to indicate corresponding or similar elements where deemed appropriate. In addition, numerous specific details are set forth herein to provide a comprehensive understanding of the embodiments described herein. However, it will be understood by those skilled in the art that the embodiments described herein can be practiced without these specific details. In other instances, well-known methods, procedures, and components have not been described in detail so as not to obscure the embodiments described herein. Furthermore, these descriptions should not be construed as limiting the scope of the embodiments described herein.

[0094] The following detailed description is merely illustrative in nature and is not intended to limit the embodiments of this application or their uses. As used herein, the terms "exemplary" or "illustrative" mean "serving as an example, instance, or illustration." Any implementation described herein as "exemplary" or "illustrative" should not necessarily be construed as preferred or superior to other implementations. All implementations described below are exemplary implementations provided to enable those skilled in the art to practice this disclosure and are not intended to limit the scope of the appended claims. Furthermore, there is no intention to be bound by any express or implied theory presented in the foregoing technical field, background art, summary of the invention, or subsequent detailed description.

[0095] It should also be noted that the terms “connected” or “linked” as used herein may have a variety of different meanings depending on the context in which they are used. For example, the terms “connected” or “linked” can have mechanical, electrical, or communication meanings. For example, as used herein, the terms “connected” or “linked” can indicate that two elements or devices can be directly connected to each other, or connected to each other via one or more intermediate elements or devices through electrical elements, electrical signals, optical signals, or mechanical elements, depending on the specific context.

[0096] It should also be noted that, as used herein, the word “and / or” is intended to indicate either or including sexual connotations. That is, “X and / or Y” is intended, for example, to mean either X or Y, or both X and Y. As another example, “X, Y and / or Z” is intended to mean either X or Y or Z, or any combination thereof.

[0097] It should be noted that degree terms such as “basically,” “about,” and “roughly” used in this article refer to a reasonable amount of deviation from the modified term so that the final result is not significantly altered. For example, these degree terms can also be understood to include a deviation from the modified term, such as 1%, 2%, 5%, or 10%, if that deviation does not negate the meaning of the modified term.

[0098] Furthermore, the description of numerical ranges expressed as endpoints in this document includes all numbers and fractions within that range (e.g., 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.90, 4, and 5). It should also be understood that all numbers and fractions should be modified by the word “about,” which indicates that the cited number may vary by a certain amount, such as 1%, 2%, 5%, or 10%, without significant change in the final result.

[0099] Throughout this specification, references to “an embodiment,” “an embodiment,” “at least one embodiment,” or “some embodiments” mean that one or more particular features, structures, or characteristics can be combined in any suitable manner in one or more embodiments, unless otherwise specified as not combinable or as alternatives.

[0100] Similarly, throughout the specification and appended claims, the term "communication," such as in "communication path," "communication link," and variations like "communication-linked," is generally used to refer to any engineering arrangement used to transmit and / or exchange information. Examples of communication paths include, but are not limited to, conductive paths (e.g., conductive wires, physiological signal conduction), electromagnetic radiation paths (e.g., radio waves, optical signals, etc.), or any combination thereof. Examples of communication links include, but are not limited to, electrical links, magnetic links, radio links, optical links, or any combination thereof.

[0101] A portion of the exemplary embodiments of the systems, devices, or methods described in this document may be implemented in a combination of hardware or software. For example, portions of the embodiments described herein may be implemented at least in part using one or more computer programs that execute on one or more programmable devices, the programmable devices including at least one processing element and at least one data storage element (including volatile memory and / or non-volatile memory). These devices may also have at least one input device (e.g., keyboard, mouse, touchscreen, input pin, input port, etc.) for providing at least one input, such as an input signal, and at least one output device (e.g., display screen, printer, radio, output port, output pin, etc.) for providing at least one output, such as an output signal, depending on the nature of the device.

[0102] It should also be noted that some elements used to implement at least a portion of the embodiments described herein may be implemented by software written in a high-level procedural language, such as object-oriented programming. The program code may be written in C, C++, or any other suitable programming language and may include modules or classes, as is known to those skilled in object-oriented programming. Alternatively or otherwise, some of these software-implemented elements may be written in assembly language, machine language, or firmware as needed.

[0103] At least some of the software programs used to implement at least one of the embodiments described herein may be stored on a storage medium or device readable by a general-purpose or special-purpose programmable device. When read by a programmable device, which may also be referred to as a computing device, the software program code configures the programmable device to operate in a new, specific, and predetermined manner to perform at least one of the methods described herein.

[0104] Furthermore, at least some of the programs associated with the systems and methods of the embodiments described herein may be distributed in a computer program product comprising a computer-readable medium carrying computer-usable instructions, such as program code, for one or more processors. The program code may be pre-installed and embedded during manufacturing, and / or may be installed later as an update to an already deployed computing system. This medium may be provided in various forms, including non-transitory forms, such as, but not limited to, one or more floppy disks, optical disks, magnetic tapes, memory chips, and magnetic and electronic storage devices. In alternative embodiments, the medium may be transient in nature, such as, but not limited to, wired transmission, satellite transmission, internet transmission (e.g., download), media, digital and analog signals, etc. The computer-usable instructions may also be in various formats, including compiled code and uncompiled code.

[0105] Any module, unit, component, server, computer, terminal, or computing device described herein that executes software instructions according to the teachings herein may include or otherwise access computer-readable media, such as storage media, computer storage media, or data storage devices (removable and / or non-removable), such as disks, optical discs, or magnetic tapes. Computer storage media may include volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information, such as computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include RAM, ROM, EEPROM, flash memory or other storage technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage devices, magnetic tape cassettes, magnetic tape, disk storage devices or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible by an application, module, or both. Any such computer storage media may be part of a device, or may be accessible to or connected to a device.

[0106] It should be noted that the term "connection" used in this article means that two elements can be directly connected to each other or connected to each other through one or more intermediate elements.

[0107] The following wording and semantic descriptions are provided in the context of the various embodiments disclosed herein:

[0108] (1) The terms wireless and radio frequency (RF) are used interchangeably.

[0109] (2) The RF transceiver is the front end of the RF terminal.

[0110] (3) Terminal is short for data terminal.

[0111] (4) A tapped device is a device connected to a tapped port; an RF terminal is a subclass of a tapped device.

[0112] (5) Wi-Fi is a representative wireless technology that supports multi-point connections.

[0113] (6) PCIe (Serial Bus (PCI Express)) is a representative technology for wired point-to-point connections.

[0114] (7) MTL is an abbreviation for "Multi-tap Transmission Line".

[0115] (8) PMTL is an abbreviation for Planar Multi-Tap Transmission Line.

[0116] (9) bPMTL is an abbreviation for backplane planar multi-tap transmission line.

[0117] (10) CMTL is an abbreviation for Coaxial Multi-Tap Transmission Line.

[0118] (11) In the schematic diagram, the string in square brackets, such as [Rs] or [Zc], represents the value of the parameter of that particular circuit element.

[0119] (12) LAN is an abbreviation for Local Area Network.

[0120] (13) TRX is an abbreviation for transceiver.

[0121] (14) AI is an abbreviation for Artificial Intelligence.

[0122] Currently, methods for establishing communication connections between one device and another in a system with multiple such devices can be achieved using wireless or wired network technologies, such as Wi-Fi links and PCIe links. Wireless links, such as Wi-Fi links, provide the ability to connect a large number of devices or nodes in multi-point networks, but may be limited by certain drawbacks, such as propagation variations, spectrum availability, interference, and potential attacks from network threats. On the other hand, wired baseband communication systems, such as PCIe or Ethernet links, offer high throughput, but their connectivity is limited by their point-to-point physical links, requiring data switches and excessive cabling.

[0123] In one experiment, the performance of PCIe and Wi-Fi data links was compared. For this experiment, both data links used the same 8GHz medium. The 8GHz frequency limit is defined by the performance of printed circuit cards and connectors currently available for 16Gbps PCIe transmission. Note that 8GHz is the Nyquist frequency of a 16Gbps NRZ (non-return-to-zero) signal, reflecting the sinusoidal frequency required to transmit binary sequences (10101…) at the maximum data rate of 16Gbps. Furthermore, the 8GHz limit is consistent with the maximum frequency of 7.125GHz used by Wi-Fi-7 transceivers. For this experiment, a point-to-point transmission line with a bandwidth of 8GHz was constructed, equipped with either Wi-Fi or PCIe transceivers at both ends. For the purposes of this experiment, line impedance and mode were ignored.

[0124] Using this 8GHz transmission line, it was found that PCIe transmits (1) 16GBps using a regular PCIe transceiver, or (2) 32Gbps using a PCIe transceiver modified to use PAM4 modulation (a technique introduced for PCIe-6).

[0125] On the same transmission line, WiFi-7 was found to: (1) transmit 46Gbps through a 320MHz channel using a single ordinary transceiver at each endpoint; (2) transmit 138Gbps using three combined ordinary transceivers at each endpoint, using all 3x320MHz channels available in WiFi-7; or (3) transmit 1150Gbps using 25 combined modified transceivers at each endpoint, using 25x320MHz channels, wherein these transceivers are modified to use the entire 8GHz spectrum because they are no longer subject to the spectrum limitations imposed when operating in true wireless mode.

[0126] Based on this experiment, it can be concluded that Wi-Fi technology offers better transmission line usage and provides a competitive alternative to PCIe.

[0127] To balance the advantages and disadvantages of Wi-Fi and PCIe technologies, a multi-tap transmission line is proposed and disclosed in several embodiments herein. This multi-tap transmission line replaces air as the propagation medium for wireless terminals, thereby eliminating common limitations and interference factors in wireless communication, such as propagation variations, spectrum availability, interference, or potential attacks. Furthermore, this multi-tap transmission line also possesses the reliability of a wired link. Therefore, the multi-tap transmission line disclosed herein provides the advantage of multi-point connectivity for wireless transceivers.

[0128] like Figure 1BAs shown, this document provides a multi-tap transmission line capable of communicatively connecting multiple devices. The multi-tap transmission line 100 provides a propagation medium 103 that reduces limitations and interference common in wireless communication, while introducing the flexibility of multi-point connections similar to wireless transceivers and the reliability of wired links. This multi-tap transmission line can utilize waveguides and taps to provide a broadband RF transmission line to connect multiple RF terminal devices and create a data network that the terminal devices can use to communicate. In at least one embodiment, an optimized broadband RF multi-tap transmission line is provided, wherein the transmission line can be coupled to multiple RF terminals to create a data network. The transmission line can be constructed as a series termination including resistive elements and tap circuitry of the transmission line.

[0129] This document also provides a method for optimizing multi-tap transmission lines. In at least one embodiment, this method for optimizing multi-tap transmission lines is used to determine the characteristic impedance of the multi-tap transmission line and the values ​​of the resistive elements of the tap circuit. The method for optimizing the impedance and resistive elements of the transmission line can be based on the impedance of the tapping device and the number of taps in the line.

[0130] This document also provides various configurations of multi-tap transmission lines. In at least one embodiment, the multi-tap transmission line is implemented in a planar structure using a stripline or microstrip waveguide. The planar multi-tap transmission line using a stripline or microstrip waveguide can be fabricated on a printed circuit board or other planar substrate. Furthermore, a monolithic embodiment can also be implemented using rigid-flex PCB technology.

[0131] In at least one embodiment, the multi-tap transmission lines are implemented as a backplane arrangement of multiple planar multi-tap transmission lines. In one example, the multiple multi-tap transmission lines in the backplane arrangement reuse or reuse PCIe connectors, backplanes, and plug-in cards, as described herein according to at least one embodiment.

[0132] In another embodiment, the multi-tap transmission line is implemented using a coaxial construction that utilizes a coaxial waveguide implemented by a coaxial support and a coaxial structure in a printed circuit board. In some cases, this multibody implementation can provide an easily reconfigurable structure suitable for stackable computers.

[0133] This document also provides various use cases for multi-tap transmission lines. In at least one embodiment, the multi-tap transmission line is implemented in a mobile vehicle. In another embodiment, the multi-tap transmission line is implemented in a remotely operated vehicle (ROV). In still other embodiments, the multi-tap transmission line is implemented in a server rack. In yet another embodiment, the multi-tap transmission line is implemented in a processor chip.

[0134] Multi-tap transmission line (MTL)

[0135] Now to Figure 2 Referring to the diagram is a high-level block diagram of a multi-tap transmission line 200 according to one embodiment. In the illustrated embodiment, the multi-tap transmission line 200 is terminated at both ends with termination points 402. As shown, the transmission line is terminated at a first end 402a and a second end 402b. As shown below, the transmission line can branch to multiple termination points and therefore has multiple second ends.

[0136] In the illustrated embodiment, the transmission line has a corresponding characteristic impedance value Zc. The two ends of the transmission line have corresponding first and second terminal impedances. In the optimized transmission line, the first and second terminal impedances have the same value as the characteristic impedance value Zc of the transmission line. This provides the advantage of mitigating or eliminating the reflection of signal 405 back to the transmission line.

[0137] The transmission line serves as a communication medium between multiple tapped devices (TD) 411 connected to the multi-tap transmission line via multiple tapped ports (T) 403 (indexed as 1 to N). The tapping circuit, including the tapped ports 403 and the tapped devices 411, is shown as reference numeral 400. Each tapped port 403 is characterized by a tap impedance value of Zo.

[0138] In the various embodiments disclosed herein, the characteristic impedance value Zc is lower than the individual tap impedance value Zo, and in some cases, it is significantly lower than the individual tap impedance value Zo.

[0139] In the optimized transmission line, when the tap device 411 is connected to the multi-tap transmission line 200, the first-terminal impedance and the second-terminal impedance remain matched with the transmission line impedance. This matching of the first-terminal impedance and the second-terminal impedance with the transmission line impedance eliminates wave reflections at the ends of the line.

[0140] Tap device 411 may take the form of: RF transmitter output, RF receiver input, combined input and output of RF transceiver, combined stream of one or more RF transceivers, test port of vector network analyzer (VNA), test port of time domain reflectometer (TDR) analyzer, termination point, tap of another multi-tap transmission line and / or any RF device.

[0141] Figure 3 A block diagram of a branch of a multi-tap transmission line 300 according to another embodiment of this disclosure is shown. In this embodiment, a power divider 416 (PS) having the same characteristic impedance value Zc as the multi-tap transmission line is used to construct various network topologies. Figure 3In the embodiment shown, there are two termination points for the second end, such as a first second end 402b and another second end 402c. The power divider configuration can include any number of branches 416 in the transmission line, such as 2, 3, 4, 5, 6...N, where N is any positive integer.

[0142] In another embodiment, the multi-tap transmission line may have a plurality of first ends 402a. Similarly, in yet another embodiment, the multi-tap transmission line may have a plurality of branches, wherein the first transmission line 401a branches into a plurality of lines 401b and 401c, and at least one of the plurality of lines 401b and / or 401c further branches into a plurality of ends.

[0143] Although Figure 3 The diagram shows a 3-port power divider 416, but it should be understood that any N-point power divider can be used to enable N branches of a transmission line. Any such embodiment of a transmission line may be performance-limited due to the conventional power loss at each divider.

[0144] In some cases, multi-tap transmission lines can be implemented as rigid printed circuit boards. In other cases, multi-tap transmission lines can be implemented as discrete flexible printed circuit boards. Multi-tap transmission lines can also be implemented as flexible printed circuit boards with self-adhesive tape.

[0145] Similarly, multi-tap transmission lines can be implemented as branched structures, for example in... Figure 3 and Figure 55 As shown. In Figure 3 The image shows an example of a branched configuration with a 3-port power divider in the middle. Figure 55 The image shows an example of a branched configuration with a 4-port power divider in the middle.

[0146] In one embodiment, the transmission line is shielded such that the transmission "hot" wire is sandwiched between two ground planes. The shielding configuration is equivalent to the stripline configuration described herein.

[0147] For clarity, the stripline embodiment refers to a shielded transmission line sandwiched between two ground / shielding layers. The microstrip line embodiment refers to an unshielded line where the transmission line is located above and exposed above the ground layer, having a substrate construction. In one embodiment, the entire substrate may be shielded with some care to shield the MTL at an "outer" level.

[0148] Now to Figure 4For reference, the figure shows a schematic diagram of a tapped circuit 400 according to an example. As shown, the tapped circuit 400 includes a left port (L) 430a and a right port (R) 430b. The left port 430a is connected to a first transmission line 401a. The first transmission line 401a is connected to a first resistive element 435a, which is connected to a second resistive element 435b. The second resistive element 435b is connected to a second transmission line 401b, which is connected to the right port 430b. A tapped resistive element 436 is connected to the common point between the first resistive element 435a and the second resistive element 435b. As shown, the three resistive elements are connected in a T-shaped configuration. The first and second resistive elements are also referred to herein as series resistive elements.

[0149] In the illustrated embodiment, each transmission line has a characteristic impedance value Zc. Each of the first resistive element 435a and the second resistive element 435b has the same or substantially the same resistance value. Tapped resistive element 436 has a tapped resistance value Rt. Tapped resistive element 436 is connected to tapped port 403.

[0150] Figure 5 A schematic diagram of one embodiment of a multi-tap transmission line 500 is provided. The multi-tap transmission line 500 includes a first end 502a, illustrated as the left port L, connected to a resistive element (R) with a resistance value of Zc. L )534 termination. The multi-tap transmission line 500 also has a second end 502b, which is illustrated as the right port R, connected to a resistive element (R) with a resistance value of Zc. R )536 termination. The figure also shows N cascaded tap circuits 400, for example Figure 4 As shown, each tap circuit 400 is connected to a corresponding external tap device 511 via a corresponding tap port 503. Tap port 503 is similar to... Figure 4 Tap port 403. Left port (L) 530a is similar. Figure 4 The left port 430a and the right port (R) 530b are similar. Figure 4 The right port (R)430b.

[0151] like Figure 5 As shown, tapped devices 511 are connected to multi-tap transmission lines 500 at corresponding tap ports via corresponding tap lines 504. In one embodiment, if one of the tapped devices 511 is disconnected, cut off, short-circuited, or damaged, or otherwise not connected to the multi-tap transmission line, the multi-tap transmission line can still operate with the remaining tapped devices 511. Similarly, in some other embodiments, if tap line 504 is disconnected, cut off, short-circuited, or damaged, the multi-tap transmission line continues to operate with the remaining tapped devices 511 and tap line 504.

[0152] Optimization methods

[0153] This document provides a method for optimizing multi-tap transmission lines. In at least one embodiment, the multi-tap transmission line is optimized, for example... Figure 4 and Figure 5 The method shown for multi-tap transmission lines is used to determine the characteristic impedance value Zc of the multi-tap transmission line and the resistance values ​​of each resistive element in the tap circuit 400. In such an embodiment, the method for optimizing the impedance and resistive elements of the transmission line is based on the tap impedance value (Zo) of the tapping device 511 and the number of tap ports N connected to the multi-tap transmission line.

[0154] In at least one embodiment, the method of optimizing a multi-tap transmission line includes determining a tap impedance value (Zo) associated with each tap device, such as tap device 511. In one embodiment, the tap impedance value (Zo) is a given data value. The input data can be obtained from the tap device manufacturer or the system designer and can be selected to optimize system performance. In various embodiments, the tap impedance value Zo is typically about 50 ohms.

[0155] The method also includes determining the total number of tapped ports connected to the transmission line. Next, the method includes determining the optimal characteristic impedance value (Zc) for the multi-tap transmission line. Determining the optimal characteristic impedance involves determining a characteristic impedance value Zc that minimizes the insertion loss between the first tap and the last tap. As described below, the Zc value is typically low, and in some cases, much lower than the tap impedance value Zo.

[0156] Furthermore, the method includes determining, for example, the optimal characteristic impedance value (Zc) based on the determined value. Figure 4 The series resistance (Rs) and tap resistance (Rt) of each resistive element at the tap port of the tap circuit 400 are determined. The characteristic impedance (Zc) is determined such that the loss between the first tap circuit and the last tap circuit connected to the transmission line is minimized.

[0157] In some embodiments, determining the optimal characteristic impedance value (Zc) includes selecting a candidate characteristic impedance value (Zc'), wherein the candidate impedance value is selected from a range of values ​​between 0 and the terminal impedance value. The terminal impedance value is less than the tap impedance value (Zo) associated with the tapped device. The method further includes: for each candidate impedance value, determining the worst-case insertion loss between the first tap circuit and the last tap circuit based on the candidate impedance value (Zc') and the tap impedance value (Zo) corresponding to the tap port. In some cases, the worst-case insertion loss is determined based on determining the longitudinal insertion loss and the lateral insertion loss according to the following equation. The optimal characteristic impedance value (Zc) is based on the candidate impedance value (Zc') that minimizes the worst-case insertion loss.

[0158] TTLN[dB]=TIL(1)+LIL(2)+LIL(3)+...+LIL(j)+...LIL(N-1)+TIL(N)… (1)

[0159] TTLN represents the worst-case insertion loss between the first tap circuit (1) and the last tap circuit (N).

[0160] In equation (1), LIL represents the longitudinal insertion loss value determined according to the following equation:

[0161] (2)

[0162] Where j represents the range of tap index values, from 2 to (N-1), N represents the total number of tap ports, and PR and PT represent, for example, the maximum power conditions at the left and right ports of the first terminal 502a and the second terminal 502b, respectively.

[0163] In equation (1), TIL is the lateral insertion loss value determined according to the following formula: , where j is 1 or N…(3)

[0164] Where PT and PR represent the maximum power conditions of the corresponding tap port and right port, respectively, and the corresponding tap port and right port are, for example, tap port 503 and the second terminal 502b.

[0165] In at least one embodiment, the series resistance value (Rs) corresponding to the first and second resistor taps in the tap circuit, such as the first resistor element 435a and the second resistor element 435b, is determined according to the following equation. …(4)

[0166] Where Zo(j) is the tap impedance value of tap port j; j represents the range of tap index values, from 1 to N, where N represents the total number of tap ports; and Zc is the optimal characteristic impedance value.

[0167] In at least one embodiment, for example Figure 4 The tap resistance value (Rt) of the third resistor element of the tap resistor element 436 is determined according to the following equation.

[0168] …(5)

[0169] Where Zo(j) is the tap impedance value of tap port j; j represents the range of tap index values, from 1 to N, where N represents the total number of tap ports; and Zc is the optimal characteristic impedance value.

[0170] As mentioned above, equations (4) and (5) are derived based on the maximum power transfer conditions on the left port L, the right port R, and the tapped port T.

[0171] In at least one embodiment, the alternative characteristic impedance value (Zc) is selected from a range between -30% and +30% of the optimal characteristic impedance value. In some other cases, the alternative characteristic impedance value (Zc) is selected from a range between approximately -30% and +30% of the optimal characteristic impedance value. Depending on the scenario in which the multi-tap transmission line optimized according to the method herein is used, the range of the selected characteristic impedance value may be -35% to +35%, -40% to +40% of the optimal characteristic impedance value, or some other range.

[0172] In at least one embodiment, the optimal characteristic impedance value (Zc) is determined by graphical analysis, such as, for example, by plotting the loss function as a function of the candidate impedance values ​​according to equation (1). The optimal characteristic impedance value is based on the candidate impedance value corresponding to the minimum value of the loss function of equation (1).

[0173] In this embodiment, the first step of the method includes determining, for example, Zc and Zo as functions of Zc and Zo under the condition of maximizing power transfer on all ports. Figure 5 The series resistance value (Rs) and tap resistance value (Rt) of the tap circuit 400 in the reference are shown. Figure 5 The first end 502a and the second end 502b are each connected to Zc, and the port T end is connected to Zo. For simplicity, the transmission line ML has zero length. In this embodiment, the series resistance value (Rs) is determined according to equation (6), which is a simplified version of equation (4); the tap resistance value (Rt) is determined according to equation (7), which is a simplified version of equation (5).

[0174] …(6)

[0175] …(7)

[0176] Next Figure 6 A reference is provided to illustrate the graphical analysis and determination of the optimal tap resistance (Rt) and series resistance (Rs) based on the characteristic impedance (Zc) of a multi-tap transmission line. Figure 6 Figure 600 illustrates the tapped resistance value (Rt) 602 and the series resistance value (Rs) 606 as a function of the characteristic impedance value (Zc) 604. In this embodiment, for example, the first step involves calculating the values ​​of Rt and Rs using equations (6) and (7). In this embodiment, a tapped impedance value Zo = 50 ohms is used because 50 ohms is the impedance value used by most RF transceivers, but any suitable tapped impedance value Zo can be used. The resulting equations for Rs and Rt are then plotted in Figure 600 as a function of the characteristic impedance value Zc.

[0177] In the second step of this method, for the same number of taps and under the same conditions, the longitudinal insertion loss (LIL) between the first terminal port (L port) and the last terminal port (R port) is determined using equation (8). The lateral insertion loss (TIL) between the tap 503 (T port) and the last terminal port (R port) can be determined using equation (9) as a function of the characteristic impedance value Zc and the tap impedance value Zo. Equations (8) and (9) are simplified forms of equations (2) and (3), respectively. Any suitable tap impedance value Zo can be used, such as, but not limited to, 25 ohms, 50 ohms, 75 ohms, etc.

[0178] LIL[dB]=20LOG10(1Zc / 2Zo)…(8)

[0179] TIL[dB]=10LOG10(Zc / 4Zo)…(9)

[0180] PL, PR, and PT represent the power at the corresponding L, R, and T ports.

[0181] like Figure 7 As shown, the LIL and TIL functions can be graphically analyzed by plotting function graphs. Figure 7 The first figure 702 and the second figure 706 show TIL and LIL as functions of characteristic impedance (Zc) 704 for a tap impedance value (Zo) of 50 ohms.

[0182] In the third step of determining the optimal characteristic impedance, LIL and TIL can be applied. Figure 5 A schematic diagram of a multi-tap transmission line is provided to determine the insertion loss between two tap ports, as shown in equation (10).

[0183] TTL[dB]=kLIL+2TIL…(10)

[0184] In some cases, k is a positive integer greater than 2, representing the number of taps between the ports being tested.

[0185] In subsequent steps, equation (11) can be used for... Figure 5 The worst-case insertion loss is determined for a multi-tap transmission line with N taps between port T1 and port TN. Equation (11) is a specific case of equation (1), where the tap impedance value of all taps is Zo.

[0186] TTLN[dB]=(N-2)LIL+2TIL…(11)

[0187] Figure 8The graph 800 shows the worst-case insertion loss (TTLN) 802 of a multi-tap transmission line based on the characteristic impedance value (Zc) 804 for multiple N values, ranging from 4 taps to 64 taps, where N is the number of taps in the transmission line.

[0188] Figure 9 Figure 900 shows the worst-case insertion loss (TTLN) 902 of a multi-tap transmission line based on the characteristic impedance value (Zc) 904 for multiple N values, ranging from 4 taps to 512 taps, where N is the number of taps in the transmission line.

[0189] exist Figure 8 and Figure 9 In the diagrams, the TTLN is calculated based on Zc for multiple N values. For example, a Zo value of 50 ohms can be used, but any tap impedance value can be used. Analyze Figures 800 and 900 to determine the minimum insertion loss for each TTLN plot. For example, this can be done by marking the minimum loss point with an x, as shown below. Figure 8 and Figure 9 As shown in the figure, this operation is performed graphically. Alternatively, the minimum insertion loss for each TTLN graph can be determined using any suitable method that locates global or local maxima or minima. Although Figure 8 and Figure 9 The curve is based on equation (11), where all taps have the same tap impedance value (Zo), but to understand, Figure 8 and Figure 9 The curve can be generated for other scenarios where multiple taps have different corresponding tap impedance values ​​(Zo).

[0190] Several methods can be used to find global or local extrema of a function. One method can include derivative testing, which sets the function's derivative to zero and then uses a second derivative test to determine whether each critical point corresponds to a local minimum, a local maximum, or neither. Another method can include graphical analysis, which involves plotting the function to obtain visual indications of where the extrema might be located. Yet another method can include optimization techniques, where a quantity can be maximized or minimized, for example, by using Lagrange multipliers.

[0191] like Figure 8 and Figure 9 As shown, for N=8, the insertion loss caused by replacing the optimal characteristic impedance value (Zc) with a typical 50-ohm characteristic impedance can be determined as: Figure 8The insertion loss difference between points 810 and 808 is approximately 15 dB. To be more certain, it is worth noting that if a characteristic impedance value of 50 ohms (Zc) is used instead of the optimal characteristic impedance value of 14 ohms (Zc), the insertion loss is an additional attenuation determined by the following formula: TTLN (at point 810) – TTLN (at point 808) = 47 dB – 31 dB (approximately) = 15 cB (approximately).

[0192] The optimal characteristic impedance value (Zc) is determined by identifying the point where the insertion loss is minimized, or is at its global maximum or minimum. In this example, the loss is minimized when the characteristic impedance value Zc is approximately 14 ohms. Figure 8 Point 808 is shown in the diagram. Therefore, in the example with 8 taps, the optimal characteristic impedance value Zc is determined to be approximately 14 ohms. It should be noted that an alternative characteristic impedance value (Zc) can also be selected from a range, such as between -30% and +30% of the optimal characteristic impedance value. Alternative characteristic impedance values ​​can also produce multi-tap transmission lines with multiple devices; although the insertion loss may be greater than in the case of selecting the optimal characteristic impedance value Zc.

[0193] In another example, for the specific case of N=24 taps and Zo=50 ohms, this can be achieved through the methods described above, such as analytical methods or based on... Figure 9 From the diagram, the optimal characteristic impedance value Zc is determined to be approximately 4.3 ohms. For Zc = 4.3 ohms, the optimal series resistance value Rs can be determined to be approximately 0.094 ohms; the tap resistance value Rt can be determined according to... Figure 6 The figure in the diagram is determined to be approximately 47.8 ohms by using equations 4 and 5 or equations 6 and 7. Therefore, for a multi-tap transmission line with 24 taps and an impedance value of Zo = 50 ohms per tap, the optimal solution for {Zc, Rs, Rt} can be determined as {4.3 ohms, 0.094 ohms, 47.8 ohms}.

[0194] Table 1 below provides examples of some optimal solutions for {Zc,Rs,Rt} of a multi-tap transmission line with N taps, where the tap impedance value Zo ranges from 25 ohms, 50 ohms, and 75 ohms.

[0195] Table 1:

[0196]

[0197] It should be noted that alternative resistance values ​​for Rs and Rt can also be selected from a range between -30% and +30% of the optimal resistance values, as these alternative resistance values ​​can create multi-tap transmission lines for multiple devices.

[0198] While it might be more convenient to operate all tapped devices at the same tap impedance value Zo, the multi-tap transmission lines disclosed herein can operate with different tap impedance values ​​(Zo). In such cases, the resistive elements of the corresponding tap circuit for a specific tap impedance value (Zo) need to be calculated based on the equations described above. In this case, a common characteristic impedance value (Zc) is used for the entire multi-tap transmission line.

[0199] In some embodiments, the multi-tap transmission line model can be further refined by taking into account the actual delay and loss of the ML transmission line for each tap circuit. For example, in such embodiments, the multi-tap transmission lines disclosed herein, such as... Figure 4 or Figure 5 The transmission line shown can be implemented as a stripline with a relative constant dielectric constant (DK) of 3.74 and a dielectric loss factor (DF) of various values. For a characteristic impedance of 4.3 ohms, the linewidth between the two ground planes is 3.6 mm, and for a total tap pitch of 18 mm, the length of each ML is chosen to be 9 mm. The number of taps in this multi-tap transmission line model is set to N=24. The construction and geometry of the transmission line can also be optimized based on the number of taps.

[0200] To illustrate how to determine actual delay and loss, this paper analyzes four scenarios as examples. These four examples are as follows, including but not limited to: (A) extremely low loss, DF=0.001, and Rs=0.094 ohms; (B) extremely low loss, DF=0.001, and Rs=0; (C) low loss, DF=0.01, and Rs=0; and (D) high loss, DF=0.02, and Rs=0.

[0201] Figure 10 Figure 1000 shows the frequency dependence of the insertion loss S124 between tap T1 and tap T24 for the multi-tap transmission line described above in cases (A), (B), (C), and (D). Figure A is denoted by reference number 1014. Figure B is denoted by reference number 1012. Figure C is denoted by reference number 1016, and Figure D is denoted by reference number 1018. Figures A through D represent the insertion loss 1002 as a function of frequency 1004 in different scenarios.

[0202] As shown in graph 1000, the insertion loss in graph A 1014 is similar to that previously derived from equations (8) to (11) or from... Figure 9The calculated TTLN values ​​are consistent with those in the figure. Comparison points can be obtained at very low frequencies because Figure A shows a slight downward slope due to the non-zero dissipation factor. Figures 1012(B), 1016(C), and 1018(D) each show peaks of 1011, 1015, and 1017 at approximately 4.3 GHz, respectively, due to a deviation from the theoretical Rs=0.094 ohms to Rs=0, resulting in wave reflections on the repeating structure formed by 18 mm equidistant taps. As expected, no peaks are observed in Figure A1014 due to the absence of reflections. As expected, Figure B1012 shows the lowest insertion loss, while the difference between Figure B1012 and Figure A1014 provides a measure of the insertion loss loss caused by the series resistive elements. Figure D1018 shows the expected highest insertion loss, due to the highest dielectric loss, and points to the limitations of the overall performance of multi-tap transmission lines. Figure C1016 illustrates an acceptable trade-off between insertion loss on a high-quality FR4 grade printed circuit board (PCB) and eliminating series resistive elements from the tap circuit, as Figures C1016 and A1014 intersect at approximately 3.5 GHz, roughly midway through the target frequency range. Therefore, it may be advantageous to simulate the effect of series resistive elements using the inherent PCB insertion loss resulting from the combination of dielectric and electrical losses.

[0203] Figure 11 Figure 1100 shows the frequency dependence of the return loss SLL for the four cases (A), (B), (C), and (D) described above. This return loss is a measure of the standing wave ratio along a multi-tap transmission line and is used as a comparative measure of radiated emissions or immunity to external interference among these four cases. Figure A is denoted by reference numeral 1114. Figure B is denoted by reference numeral 1112. Figure C is denoted by reference numeral 1116, and Figure D is denoted by reference numeral 1118. Figures A through D represent the return loss 1102 as a function of frequency 1104 in different scenarios.

[0204] Figures B 1112, C 1116, and D 1118 show that at approximately 4.3 GHz, the wave reflects off the repeating structure formed by 18 mm equidistant taps due to a deviation of Rs=0 from the theoretical Rs=0.094 Ohm, resulting in significant oscillation. Figure A 1114 shows a much smaller oscillation, and the oscillation can be further reduced with higher precision of Rs and Rt. The oscillation at 4.3 GHz can be reduced by decreasing the number of taps or extending the length of the ML line to use different values, thereby reducing their cumulative impact on the overall quality (Q) factor of the entire multi-tap transmission line.

[0205] If the pitch of the tapped structure changes from the current 18 mm value, the oscillation at 4.3 GHz will change in frequency, thus increasing its frequency if the pitch decreases. The oscillation at 4.3 GHz repeats across the entire spectrum with a period of 4.3 GHz, and the next oscillation is observed at 8.6 GHz, but is not visible in the figure. Small ripples with approximately six peaks across a 1 GHz frequency span are observed in all figures, varying in amplitude, and are generated by wave reflections over the entire 24 x 18 mm length of the multi-tap line. As expected, the highest ripple is observed in Figure B1112 due to its worst matching. The lowest value of this ripple observed in Figure D1118 is a result of higher insertion loss, which gradually reduces the amplitude of the reflected wave. In other words, the higher insertion loss of the multi-tap transmission line may have some advantage in minimizing reflections.

[0206] Planar multi-tap transmission line PTML

[0207] Figures 12 to 20 A planar multi-tap transmission line (PMTL) according to an embodiment is shown.

[0208] like Figures 12-13 As shown, the PMTL consists of a front panel 222 with multiple mounting holes 221. Multiple tap connectors 223 are mounted to the front panel using multiple nuts 225. Figure 15 Figure 20 As shown in detail, the PMTL includes ground planes 237 and 238, via structures 239A, 239B and 239C, tap connector center pin 230B3 of tap connector 223, tap pin pad 233 surrounded by gap 230B2, transmission stripline 232, terminating resistor element 230D3, ground terminating pad 230D1, terminating microvia group 230D2, pad 230D1, tap resistor element 230E1, tap stripline 230E3, tap pad 230E2 and tap microvia group 230E4.

[0209] The PMTL in this embodiment can be used in a server rack environment. In this use case, tap connector 223 connects the PMTL to the Wi-Fi connector of the server in the rack via a coaxial cable.

[0210] refer to Figure 14The diagram illustrates a stacked structure 210 for manufacturing a printed circuit board. The stacked structure 210 includes a first copper layer (L1) 1402, a first core layer (C) 1410, a second copper layer (L2) 1404, an insulating layer (PP) 1412, a third copper layer (L3) 1406, a second core layer (C) 1414, and a fourth copper layer (L4) 1408. A via type (V14) 1420 is included between the first copper layer (L1) 1402 and the layer (L4) 1408, and a microvia type (V12) 1422 is included between the first copper layer (L1) 1402 and the second copper layer (L2) 1404.

[0211] In one example, the first copper layer 1402 is 35 micrometers thick, and the first core layer 1410 is made of FR408HR material with a thickness of approximately 0.089 millimeters, a dielectric constant (DK) of approximately 3.74, and a dielectric loss factor (DF) of approximately 0.009. The first core layer 1410 can be manufactured by Isola Group or other similar suppliers. The second copper layer 1404 is approximately 18 micrometers thick and incorporates an embedded 25-ohm resistive thin-film layer, such as a thin-film layer manufactured by Quantic Ticer, Quantic Ohmega, or other suppliers. The insulating layer 1412 consists of a prepreg (PP) and core board stack, its thickness adjusted for a total PCB thickness of 1.6 millimeters, and is made of the same FR408HR material type used for the first core layer 1410. The third copper layer 1406 is an empty (etched) copper layer. The empty copper layer 1406 retains the symmetry of the stack structure required for convenient manufacturing. The second core layer 1414 may have the same structure as the first core layer 1410. Secondly, the fourth copper layer (L4) 1408 may have the same thickness as layer 1402.

[0212] It is understandable that various modifications are typically made during 210-based PCB manufacturing to accommodate local process capabilities and material availability. These modifications need to be compatible with the geometry and parameters of the PMTL described herein. However, non-essential PCB layers used in PCB manufacturing are not shown here; such as plating, solder mask, or screen-printed layers, but can be implemented in accordance with commonly used methods.

[0213] Now go to Figures 15 to 20 These figures provide various embodiments of taps for planar multi-tap transmission lines. Figure 15 A rear perspective view of tap 1500 of a planar multi-tap transmission line is provided. Figure 16 Provided Figure 15 Front perspective view of the feature 1600 and via structure on the outer layer of the tap. Figure 17 Provided Figure 15 Enlarged view of 230B in detail, 1700. Figure 18 Provided Figure 15 Magnified view 1800 of the active conductivity characteristics of the center tap. Figure 19 Provided Figure 18 1900 magnified view of the 230D in detail. Figure 20 Provided Figure 18 A magnified view of the details marked 230E in 2000.

[0214] In at least one embodiment, the transmission stripline 232 is located on the second copper layer L2 1404 and is fabricated with a controlled impedance of Zc = 4.3 ohms and a nominal width of 3.6 mm, referencing ground plane 238 on the first copper layer L1 1402 and ground plane 237 on the fourth copper layer L4 1408. In such embodiments, the terminating resistor element 230D3 can be constructed similarly to the left and right ends of the entire transmission stripline 232 and can be achieved by sequential etching on a thin-film resistor layer of 25 ohms per square, which is embedded in the second copper layer L2 1404 and has the same width and 0.62 mm length as the transmission stripline 232 for a final resistance of 4.3 ohms.

[0215] The terminating pad 230D1 is constructed on the second copper layer L2 1404, with the same width as the transmission strip 232 and the terminating resistor element 230D3, and the latter is connected to the ground plane 238 on the first copper layer L1 1402 through the low impedance of the terminating microvia group 230D2.

[0216] Via structures 239A and 239B use V1-4 1420 type vias, which are constructed with holes of approximately 0.16 mm in diameter, pads of 0.55 mm, and a distance of approximately 1 mm between the pads. They connect the ground plane 237 on the fourth copper layer L4 1408 and the ground plane 238 on the first copper layer L1 1402 to form a shielding cage around the transmission line.

[0217] The microvias used in the terminal microvia group 230D2 and the tap microvia group 230E4 are of type V12 1422, with holes of approximately 0.1 mm. The landing pads on the first copper layer L1 1402 are 0.35 mm, and the landing pads on the second copper layer L2 1404 are 0.325 mm.

[0218] The tapped resistor element 230E1 is achieved by sequential etching on a thin-film resistor layer with a cross-sectional area of ​​25 ohms, in which a second copper layer L2 1404 is embedded, and has a finished length of 0.733 mm and a width of 0.383 mm for a final resistance of 47.8 ohms.

[0219] The tap strip 230E3 is implemented with a controlled impedance of 50 ohms on the second copper layer L2 1404 to match the impedance of the tap connector 223, and has a nominal width of 0.125 mm and an approximate length of 1.6 mm. Minimizing the length of the tap strip may be beneficial.

[0220] The tap pad 230E2 has a width of approximately 0.35 mm and a length of approximately 0.8 mm, and is matched with the tap microvia assembly 230E4.

[0221] Tap resistor element 230E1 is connected to transmission stripline 232 and implemented as close as possible to transmission stripline 232, and its other end is connected to tap stripline 230E3, tap stripline 230E3 is further connected to tap pad 230E2, and tap pad 230E2 is further connected to tap pin pad 233 through tap via group 230E4.

[0222] The gap 230B2 has an optimal opening of 0.5 mm around the tap pin pad 233. The tap connector center pin 230B3, tap pin pad 233, gap 230B2, tap microvia group 230E4, tap pad 230E2, ground plane 238 on the first copper layer L1 1402, ground plane 237 on the fourth copper layer L4 1408, and via structure 239C between the ground plane 238 on the first copper layer L1 1402 and the ground plane 237 on the fourth copper layer L4 1408, which spans the tap stripline 230E3 on the second copper layer L2 1404, form a critical transition from the coaxial waveguide of the tap connector 223 to the tap stripline 230E3.

[0223] Other tap structures of the PMTL have the same construction as the aforementioned taps, and the transmission stripline 232 is a continuous line with the same width over the entire length of the PMTL. It should be noted that alternative geometry values ​​can also be selected from a range of suitable geometries, as these alternative geometries can also form multi-tap transmission lines for multiple devices. This range can be any suitable range, such as, for example, between -30% and +30%, between -35% and +35%, etc.

[0224] PMTL Modeling and Simulation

[0225] Figure 21 The connection diagram of the PT2100 flat tap is shown, which follows... Figure 15 Figure 20The model is based on the illustrations and related descriptions in the diagram, except for terminating resistor element 230D3, terminating pad 230D1, and terminating via group 230D2. The model is symmetrical about the centerline of the tap connector for a total tap length of 18 mm to allow for expansion of the model, such as... Figure 23 The description in the article is through simple chaining Figure 21 The 24 planar tap PT models are used to construct Figure 13 The entire PMTL circuit model. Tap port 2115 is similar to... Figure 4 Tap port 403. Left port (L) 2105 is similar. Figure 4 The left port is 430a; and the right port (R)2110 is similar to... Figure 4 The right port (R)430b in the middle.

[0226] Next Figure 22 For reference, this figure illustrates a planar tapped PT model, for example... Figure 21 The S-parameters were extracted and plotted using PT2100. S-parameters can be extracted using any 3D EM software. Plot 2200 shows the attenuation on the y-axis 2202 as a function of frequency on the x-axis 2204.

[0227] As shown in the figure, curve 2200 shows the first curve SLR2220, which represents the insertion loss between the left port L2105 and the right port R2110, equivalent to that defined by equation (8) and in Figure 7 The longitudinal insertion loss LIL is plotted in Figure STR2205. Figure STR2205 represents the insertion loss between the left port L2105 and the right port R2110, which is equivalent to the insertion loss defined by equation (9) and in... Figure 7 The diagram shows the lateral insertion loss (TIL). Figure STT2210 shows the return loss at tap port 2115, while Figure SLL2215 shows the return loss at the left port L2105.

[0228] like Figure 22 As can be seen in Figure SLR2220, the line length is low as expected, 18 mm, and the tap ports are well isolated by embedded resistive elements with extremely low parasitic parameters. The slope is primarily caused by dielectric and copper losses. Figure STR2205 has a TIL close to the predicted TIL; for Zc = 4.3 ohms, the TIL is approximately 17 dB. Figure 7 As seen in the figure. Figure SLL2215 shows attenuation below 30dB, indicating minimal reflection along tap port 2115. Figure STT2210 shows very low attenuation for low frequencies, while its performance degrades slightly for higher frequencies. This degradation is likely due to the transition between the tap connector and the transmission stripline.

[0229] Can target Figure 21S-parameters extracted from taps in the modeling process are inserted into Figure 23 In circuit 2300, a suitable circuit simulator can be used to... Figure 13 The behavior of the entire PMTL is modeled.

[0230] Figure 23 The tap circuit 2350 shown is... Figure 5 The tap circuit is similar to 400. Figure 23 It also shows 24 tap ports, T1 to T24.

[0231] Figure 23 The circuit modeled in [the original text] was tested and plotted under two conditions. Figure 24 In the middle: (1) the termination condition when all taps T are terminated to a nominal impedance of 50 ohms; and (2) the open circuit condition when all untested taps remain open.

[0232] The port under test is always terminated. The terminated state represents the normal condition, while the open-circuit state measures the performance loss of the PMTL when operating with an unconnected or defective open-circuit tap. It was determined that the short-circuit tap state produces a similar level of performance loss to the open-circuit state, therefore no graph was drawn for clearer illustration.

[0233] Figure 24 Figure 2400 provides a model for insert loss 2402 as a function of frequency 2404. Figures (St124) 2410 and (St124) 2405 show the insert loss between tapped ports at each end of the PMTL for the corresponding open and terminated states, respectively. Reference Figure 23 The tap ports at each end include the first tap port (T1) and the last tap port (T24).

[0234] Figures (So1213) 2425 and (St1213) 2430 show the insertion loss between adjacent tap ports in the middle of the PMTL for the corresponding open-circuit and terminated states, respectively. Reference Figure 23 The adjacent taps in the middle of the PMTL include the 12th tap (T12) and the 13th tap (T13).

[0235] Figures (So1212) 2415 and (St1212) 2420 show the return loss at the middle tap of the PMTL for the corresponding open-circuit and terminated states, respectively. Reference Figure 23 The taps in the middle of the PMTL include the 12th tap (T12).

[0236] Figures (SoLL)2440 and (StLL)2445 show the return loss at the left port of the PMTL for the corresponding open-circuit and terminated states, respectively.

[0237] The middle tap of the PMTL is chosen for evaluation of its worst position in Figures (So1212) 2415 and (So1213) 2425 because any tap closer to the PMTL terminal will see lower reflections, and the effect of tap discontinuity between the tap and the terminal will become smaller.

[0238] like Figure 24 As can be seen in Figure (St124)2405 and Figure 10 The case (C)1016 is similar to Figure (S124), which verifies the modeling. Figure (S124)2410 follows Figure (S124)2405, superimposed with the oscillation caused by the cumulative effect of open-tap disturbance, but the small amplitude has little or no effect on PMTL operation. Figures (S1213)2425 and (S1213)2430 are close to equations (8) to (10) or Figure 7 The predicted values ​​show little to no difference between open-circuit and terminated states, indicating good isolation from other taps. Figures (So1212) 2415 and (St1212) 2420 are almost identical, showing that the return loss of this tap is well isolated from all other taps. The small peak at approximately 4.3 GHz in Figures (So1213) 2425 and (St1213) 2430 is due to the reflection impact of the traveling wave along the multi-tap line caused by the periodic structure formed by the 18 mm pitch between the taps. Each tap introduces discontinuities as the resistance of the resistive elements drops to zero and operates with a lossy transmission line. For the same reasons mentioned above, the reflection along the multi-tap transmission line quantified by Figures (SoLL) 2440 and (StLL) 2425 is consistent with the preliminary model. Figure 11 The diagram is consistent with the one in the image.

[0239] Design instructions for PMTL

[0240] In at least one embodiment, the PMTL parameter is selected as follows. First, for the required number of taps, for example... Figure 8 or Figure 9 As shown, the optimal characteristic impedance value (Zc) is selected. Next, a test specimen made of the selected layer is constructed for the desired PMTL construction, such as a stripline or microstrip transmission line. The insertion loss at the desired PMTL length is determined. This test is less expensive than using material data sheets or other engineering approximations and provides a better prediction of the worst-case insertion loss. Next, the insertion loss plot from the previous step is shifted down by the worst-case insertion loss (TTLN) value, which is calculated for the expected number of taps from... Figure 8 or Figure 9Read. This new graph provides a useful approximation of the maximum inter-tap insertion loss over the expected frequency range.

[0241] Next, the tap resistor element value is determined based on equation (5). In some cases, the tap resistor element is implemented using an embedded resistor layer to maintain the lowest possible parasitic effects of the tap. Next, the lowest possible characteristic impedance value (Zc) is used. This provides the advantage of reducing PMTL radiated emissions and improving its immunity to external interference and tap load defects. The lowest possible characteristic impedance value (Zc) is determined based on the RF link budget or the allowable space on the PCB. Further reducing the characteristic impedance value (Zc) can increase insertion loss and transmission line width.

[0242] Next, the series resistance element is calculated based on equation (4). The series resistance element, using the same thin-film technology as the tapped resistance element, is used to reduce reflections on the line as needed. Furthermore, the values ​​of the series resistance element are adjusted to optimize insertion loss and reflection performance. Additionally, the geometry and thin-film material used for both the series and tapped resistance elements are adjusted to reduce geometric discontinuities along the PMTL line, resulting in the lowest possible parasitic effects on the PMTL. This is done while keeping the area of ​​common nodes to a minimum, as the insertion of the series resistance element may cause more reflections than it blocks.

[0243] The frequency response of a PMTL implemented on the same layer without any conversions or connectors is practically flat over the frequency range up to 100 GHz, and the insertion loss in the PCB will produce its expected loss over this range.

[0244] Backplane planar multi-tap transmission line bPMTL

[0245] Figure 25 This is a schematic diagram of a backplane PMTL or bPMTL2500 according to one embodiment. The backplane 2500 includes a backplane 241, a plurality of properly terminated PMTL2505s, a plurality of tapped resistor elements 2510, and a plurality of slot connectors 242. Each slot connector 242 includes a plurality of differential connector pin pairs 243. The plurality of PMTL2505s are arranged side-by-side, their respective tapped resistor elements connected to the p-pin 2515 of the differential pin pair 243 via a shortest transmission line, wherein the n-pin 2520 of the differential pin pair 243 is grounded. The differential pin pairs 243 are grouped as part of the slot connectors 242. Each slot may be equipped with a plug-in card with mating pins and an RF tap device connected to a corresponding tap port of the bPMTL via the mating p-pin 2515 of the differential pin pair 243. The grounded n-pin 2520 is used to control the impedance of the differential pin pair 243 to achieve an effective impedance of approximately 50 ohms for the line connected to the p-pin 2515.

[0246] The performance of the connection between the tapped device on the plug-in card and the tapped resistor on its backplane is essentially limited by the backplane connector. This connection is chosen as the impedance of the transmission line to match the connector impedance, and matching pads are provided on the plug-in card between the tapped device and the connector. The short-line impedance on the backplane between the connector and the tapped resistor element is chosen to match the connector impedance, and the resistance value of the tapped resistor element is calculated using the backplane connector impedance as Zo in equation (5).

[0247] The calculated optimal value can then be used to construct the optimal bPMTL for a specific end product requirement.

[0248] CMTL coaxial multi-tap transmission line

[0249] The following discussion focuses on coaxial multi-tap transmission lines (CMTL). Incomplete portions or fragments of CMTL are referred to as "coaxial stacks" in this paper, while CMTL refers to the precise and complete definition of a coaxial multi-tap transmission line.

[0250] Figure 26 and Figure 27 An embodiment of a coaxial multi-tap transmission line 2600, 2700, or CMTL is shown. The CMTL includes a coaxial cable 301, multiple spring pins 302, mounting bolts 303, coaxial taps 320, coaxial terminals 330, coaxial brackets 340, a coaxial connector adapter 350, and a tap device card 310 relating to the tap device 311.

[0251] Figure 26 Figure 2600 in the figure shows how the individual components are assembled into a CMTL, the construction of which is adapted in terms of size and composition to meet specific requirements.

[0252] Coaxial bracket for CMTL

[0253] Figure 28 and Figure 29 A portion of the CMTL2800 and 2900 is shown, including mounting bolts 303, coaxial terminals 330, coaxial brackets 340, coaxial taps 320, and an inner bracket 342 surrounded by a dielectric bracket 343, which is surrounded by an outer bracket 344.

[0254] The inner bracket 342 secures the dielectric bracket 343 and the outer bracket 344 together by clamping adjacent clips, such as coaxial taps 320, tap device clips 310, or coaxial terminals 330. The required clamping force can be achieved by using threaded features of the screw-nut type, where the friction between the threads helps to hold them together; or by using ball-and-socket joints of the snap-fit ​​type, where the friction between the mating ball and its socket holds them together. In the case of threaded brackets, they are provided with means to lock them in place to prevent them from falling out. If ball-and-socket brackets are used, they are provided with means to separate them.

[0255] Figure 28 , Figure 29 , Figure 43 and Figure 44 The inner bracket 342 shown and referenced is presented in the form of a thread with a hexagonal profile for easy tightening with an Allen wrench. The inner bracket 342 acts as the inner conductor of the coaxial bracket 340, conducting coaxial RF current primarily on its surface due to the skin effect. When the inner bracket 342 is part of the coaxial bracket 340, it operates under mechanical tensile stress and requires compliant conductive pads attached to one or both of its mounting surfaces to ensure proper contact with the PCB landing pads. These compliant conductive pads can be implemented as in-situ molded pads on the mounting surface of the inner bracket 342, or as in-situ molded pads attached to the PCB landing pads.

[0256] In one embodiment, the dielectric support 343 is made of a material whose relative permittivity matches that of the PCB dielectric material used in the coaxial tap 320 or tap device card 310.

[0257] When the outer support 344 is part of the coaxial support 340, the outer support 344 operates under mechanical compressive stress between adjacent cards, such as coaxial terminal 330, coaxial tap 320 and tap device card 310.

[0258] The compression on the outer bracket 344 is actually equal to the tension on the inner bracket 342, because the dielectric bracket 342 typically experiences very little stress due to its softer material. The tensile stress on the inner bracket 342 translates into compressive stress on the outer bracket 344, generating shear and bending stresses in the PCB area between them. The outer bracket 344, inner bracket 342, and the PCB area between them also need to support the structural integrity of the CMTL and dissipate stresses from large attachments, such as tap device cards 310 or coaxial cables connected to coaxial taps 320. These stresses need to be considered because they can affect the contact quality between the coaxial stack and its landing pads on the corresponding PCB, or the physical integrity of the CMTL components.

[0259] Furthermore, since it is necessary to prevent the inner bracket 342 from loosening and to prevent the entire coaxial bracket 340 from rotating relative to the PCB, a solution is provided, and it is in Figure 26 As shown, the outer bracket 344 has an irregularly shaped outer surface with four grooves, which allows the coaxial bracket 340 to be locked at a specific angle to the PCB using spring pins 302 that are securely attached to the PCB via a compression-insertion release process.

[0260] The outer support 344 serves as the outer conductor of the coaxial transmission line formed within the coaxial support 340 structure, and due to the skin effect, it primarily conducts the coaxial RF current of the CMTL on its inner cylindrical surface.

[0261] The inner bracket 342, dielectric bracket 343, and outer bracket 344 need to have a coordinated structure, material, and geometry that match the mating PCB. It was observed that the bandwidth of the CMTL increases when the average inner and outer diameters of the dielectric bracket 343 decrease. A flat bandwidth of approximately 8 GHz is obtained when the CMTL is operated using a dielectric bracket 343 with the following characteristics: (1) a hexagonal internal void profile with an end face width of 5 mm, driven by selecting and mounting off-the-shelf M3 stainless steel brackets; (2) an outer diameter of 7.5 mm; and (3) made of epoxy resin or other insulating material with a DK of approximately 3.74, matching the PCB dielectric material.

[0262] In various embodiments, the dielectric support is manufactured using a tolerance-controlled extrusion process to minimize the gap between the dielectric material and the surrounding conductive surface. In examples where the dielectric material is made of a softer material, its softness can be used to fill any gaps by cutting the dielectric support 343 slightly longer than the outer support 344 and using the inherent compressive force generated by the inner support 342 to expand the softer material and fill the unwanted gap between the inner and outer supports.

[0263] The dielectric loss of the dielectric support 343, as well as the conductive losses of the inner support 342 and the outer support 344, affect the loss and reflection along the CMTL, and they can be used to control the performance of the CMTL. It has been observed that higher dielectric or conductive losses on the CMTL suppress reflections caused by discontinuities at tap discontinuities. Therefore, in various embodiments, the coaxial support is constructed for the highest acceptable insertion loss to achieve optimal system performance predictability.

[0264] In some embodiments, insertion loss and reflection along the CMTL are controlled as follows: (1) by controlling the dielectric material formulation to achieve a specific dielectric dissipation factor while maintaining its relative permittivity; (2) by controlling the overall plating of the inner and outer supports to control the conductivity loss of the coaxial support; or (3) by achieving, as Figure 29 The referenced local resistor element 342A or 344A is constructed by selective / sequential resistance plating on the corresponding support or by using a resistor washer.

[0265] In another embodiment, the coaxial support 340 is constructed as a semi-rigid structure, including an inner support 342, an outer support 344, and a dielectric support 343. The inner support 342 is made of a flexible tubular profile with a ball-and-socket fastening feature at its end. The outer support 344 is made of thick and thin walls, with thick walls in the PCB contact area and thin walls along its length. The dielectric support 343 is made of a compliant dielectric material.

[0266] Mounting bolt 303 is used to clamp coaxial terminal 330 against coaxial bracket 340 by using the clamping method described herein for inner bracket 342 to engage the mating features of inner bracket 342. Figure 26 , Figure 28 and Figure 29 Mounting bolt 303 is shown in its threaded variant. In various embodiments, mounting bolt 303 is made of a dielectric material to avoid any interference with CMTL operation.

[0267] CMTL coaxial taps

[0268] Figures 30 to 36Various embodiments 3000, 3100, 3200, 3300, 3400, 3500, and 3600 of the coaxial tap 320 are shown. The coaxial tap 320 includes a tap connector 322, a center hole 325, tap pins 328A soldered to a landing pad 328B surrounded by a gap 328C, a microvia group 328D, a tap strip 328E, a tap resistive element 329, a tap pad 327, an internal via structure 326A, an internal landing pad 323A, an internal landing pad 323B, a pad 328F, an external via structure 326B, an external via structure 326D, an external via structure 326C, an external landing pad 324A, and an external landing pad 324B.

[0269] The construction of coaxial tap 320 is based on Figure 14 The stacked structure 210 is used in the fabrication of the coaxial tap 320. Various modifications can typically be made during the fabrication of the coaxial tap 320 based on 210 to accommodate local process capabilities and material availability, and these modifications can be coordinated with the geometry and parameters of the PCB structure described herein. For clarity, non-essential PCB layers commonly used in PCB manufacturing, such as plating, solder mask, or screen-printed layers, are omitted.

[0270] refer to Figure 34 Next, we will discuss the layer assignment of the copper features of the coaxial tap 320. The first layer 1402 includes inner landing pads 323A, 328B, and outer landing pads 324A. The second layer 1404 includes pad 328F, tap stripe 328E, and tap pad 327. The fourth layer 1408 includes inner landing pads 323B and outer landing pads 324B.

[0271] refer to Figure 35 In some embodiments, the internal via structure 326A, and the external via structures 326B, 326C, and 326D are V1-4 type vias with a finished via diameter of 0.16 mm, and the landing pads on the first copper layers L1 1402 and L4 1408 have a diameter of 0.55 mm. In some embodiments, the microvia group 328D is a V1-2 type microvia with a finished via diameter of 0.1 mm, the landing pads on the first copper layer L1 1402 have a diameter of 0.35 mm, and the landing pads on the second copper layer L2 1404 have a diameter of 0.325 mm.

[0272] In some embodiments, the internal via structure 326A is constructed with a pitch of approximately 0.67 mm, forming an inner conductor of a CMTL coaxial structure on the PCB thickness, and connecting internal landing pads 323A and 323B. The geometry of the internal via structure 326A is coordinated with the geometry of the internal landing pads 323A and 323B and the external geometry of the inner support 342 to achieve optimal matching, thereby limiting wave reflection at their contact interfaces. Furthermore, the plating of the internal landing pads 323A and 323B is coordinated with the plating of the inner support 342 and its conductive compliant pads to prevent corrosion or electromigration at their contact interfaces.

[0273] In some embodiments, the compliant conductive pads used between the inner bracket 342 and the inner landing pads 323A and 323B are achieved by field molding technology, which deposits a layer of the required material that is cured prior to assembly and can be deposited onto the mounting surface of the bracket 342 or onto the pads on the PCB.

[0274] In some embodiments, external via structure 326B is constructed with a pitch of approximately 0.63 mm between vias, forming the outer conductor of the coaxial structure of the CMTL passing through the PCB and connecting external landing pads 324A and 324B. The geometry of external via structure 326B is coordinated with the geometry of the internal voids of external landing pads 324A and 324B and the internal geometry of the outer support 344 to achieve optimal matching, thereby limiting wave reflection at the contact interface of the coaxial waveguide. The plating of external landing pads 324A and 324B is coordinated with the plating and dimensions of the outer support 344 to prevent corrosion or electromigration on their contact surfaces. External via structure 326C connecting external landing pads 324A and 324B is used to prevent RF edge leakage from the tapped stripline 328E on the second copper layer L2 1404, and a pitch of approximately 1 mm is constructed between the vias.

[0275] In some embodiments, the external via structure 326D is made of two vias between external landing pads 324A and 324B and is part of the transition between tap connector 322 and tap strip 328E.

[0276] In various embodiments, a tap transmission line is formed between the tap connector 322 and the tap resistive element 329, including a landing pad 328B, a microvia group 328D, a pad 328F, and a tap strip 328E.

[0277] In one example, tapped strip 328E is implemented with a controlled impedance of 50 ohms, which matches the impedance of tapped connector 322 on the second copper layer L2 1404, and has a nominal width of approximately 0.125 mm and a length of approximately 2 mm. Pad 328F has a width of approximately 0.35 mm and a length of approximately 0.8 mm to mate the width of microvia assembly 328D with landing pad 328B. Tapped strip 328E passes between the vias of external via structure 326D and through the gaps in external via structure 326B. In all examples, the length of tapped strip 328E is kept to a minimum.

[0278] In one example, the tapped resistor element 329 is achieved by sequential etching on a thin-film resistor layer of 25 ohms per square meter embedded in a second copper layer L2 1404, resulting in a finished length of 0.63 mm and a width of 0.35 mm for a final resistor of 45 ohms. It is connected at one end to a tapped stripe 328E and at the other end to a tapped pad 327. The tapped pad 327 is connected to one of the vias in the internal via structure 326A, and its size is kept to a minimum in the preferred embodiment.

[0279] Tap device card for CMTL

[0280] If a sufficient number of coaxial structures, similar to those used for coaxial tap 320, are provided in the printed circuit card, one or more stacked data terminal cards can be connected in the CMTL. The implementation of the coaxial tap circuitry of the tap device card 310 follows the teachings given for coaxial tap 320, but with the following differences.

[0281] In at least one embodiment, the PCB dielectric material of the tap device card 310 can be matched with the dielectric material of all coaxial dielectric materials used in CMTL.

[0282] In at least one embodiment, if dielectric matching is not feasible, performance losses may occur, resulting in increased wave reflection along the CMTL line and pronounced peaks and troughs in the inter-tap insertion loss characteristics, which worsen with the increase in the number of tap device cards. Accurate performance prediction can be performed using simulation.

[0283] In at least one embodiment, the tap pad 327, the tap resistor element 329, and the tap strip 328E can be implemented in the layer closest to the tap device 311 to minimize via parasitic effects.

[0284] In at least one embodiment, the tap strip is connected to the tap device 311 via a via in the pad microvia, wherein the tap strip is bridging a pair of through vias that connect to the reference ground plane used by the strip immediately adjacent to the microvia.

[0285] In at least one embodiment, the impedance of the tap strip is matched with the impedance of the tapping device.

[0286] In at least one embodiment, the value of the tap resistor element is determined using equation (5).

[0287] In at least one embodiment, stray RF currents in the external via structure 326B are avoided by connecting the external via structure 326B to the ground plane of the tap device card 310 only at two vias across the tap strip 328E at its exit relative to the coaxial structure.

[0288] In at least one embodiment, the coaxial structure area is kept away from any wiring on the tap device card 310.

[0289] Coaxial Termination for CMTL

[0290] Figures 37 to 40 Various embodiments, 3700, 3800, 3900, 4000, are shown illustrating structural details 3700, 3800, 3900, 4000 of a coaxial terminal 330 according to another embodiment of the present disclosure. The coaxial terminal 330 includes a landing pad 332, a gap 333, a landing pad 334, a hole 335, a plurality of terminating resistor elements 336, and a plurality of copper attachment features 337.

[0291] Coaxial terminal 330 based on Figure 14 The layered structure 210 is implemented on the PCB. Landing pads 332 and 334 are built on the first copper layer L1 1402, and their geometry and manufacturing details match the geometry and manufacturing details given for the coaxial tap 320 and coaxial bracket 340.

[0292] In this embodiment, there are 12 terminating resistor elements 336, which are identically implemented by sequential etching on a thin-film resistor layer of 25 ohms per square embedded in the second copper layer L2 1404. Each such resistor element has a finished length of 0.8 mm and a width of 0.162 mm, with a single resistance of 123 ohms and a total equivalent terminating resistance of 10 ohms, which matches the impedance of the coaxial bracket 340 and the coaxial tap 320, driven by their geometry and dielectric selection.

[0293] The radial structure of the terminating resistor element 336 optimizes the frequency bandwidth of the termination itself to well over 20 GHz. The terminating resistor element 336 is connected between the inner landing pad 334 and the outer landing pad 332 via a V12-type microvia through a copper attachment feature 337. The terminating resistor element 336 can be implemented on the same first copper layer L1 1402 as the landing pads 332 and 334, thereby achieving a coaxial termination 330 on a single layer of PCB including an embedded thin-film resistor layer.

[0294] Coaxial connector adapter for CMTL

[0295] Figures 41 to 44 Various embodiments are shown, and construction details of another embodiment 4100, 4200, 4300, and 4400 are shown. This embodiment is a coaxial connector adapter 350, including a male coaxial connector 351, a female coaxial connector 352, four mounting bolts 353, a coaxial PCB adapter 354, and a coaxial bracket adapter 355.

[0296] In various embodiments, the coaxial connector adapter 350 is constructed to match the geometry and impedance of other coaxial elements with a 10-ohm CMTL. The male coaxial connector 351 is of type BNC, with its dielectric material and geometry adapted to match the 10-ohm CMTL impedance, featuring a coaxial cable crimp at one end and engaging with a mating female coaxial connector 352 at the other end.

[0297] The dielectric material, structure, dimensions, and construction details of the coaxial PCB adapter 354 are similar to those of the coaxial tap 320, except for the tap resistor element 329 and related components, and four through mounting holes that match the hole size and pattern of the female coaxial connector 352.

[0298] The inner bracket 342, dielectric bracket 343, and coaxial bracket adapter 355, as a whole, follow the details given for the coaxial bracket 340. The coaxial bracket adapter 355 has a geometry and structure derived from the outer bracket 344, with its external structure facing the female coaxial connector 352 matching the corresponding geometry. Its four threaded holes match the positions of the through holes on the female coaxial connector 352 and the coaxial PCB adapter 354. The remaining structure of the coaxial bracket adapter 355 is identical to that of the outer bracket 344 to complete the adaptation. The coaxial bracket adapter 355 is clamped onto the female coaxial connector 352 by four threaded bolts 353, with the coaxial PCB adapter 354 serving as the interface between them. The inner bracket 342 is threaded into the mating threads in the female coaxial connector 352.

[0299] The assembly, consisting of two coaxial connector adapters 350 and a mating coaxial cable 301, is designed to increase the flexibility and range of the CMTL.

[0300] Modeling and simulation for CMTL

[0301] Figure 45 The diagram shows the connection of the coaxial tap CT4500, and its modeling method is similar to that of the reference. Figure 28 and Figure 36 The discussion in the middle is similar. Figure 45 In the embodiment shown, the coaxial tap model has a coaxial tap 320 at the center and two 7 mm long coaxial brackets 340 on each side, with their respective open ends marked as port L and port R, and the open end of the tap connector 322 marked as port T.

[0302] Figure 46 A coaxial tap model is shown, for example Figure 45 The S-parameters of the coaxial tap model 4500 are shown. The S-parameters can be extracted and plotted using 3DEM software. Plot 4600 shows the attenuation on the y-axis 4602 as a function of frequency on the x-axis 4604.

[0303] As shown in the figure, curve 4600 displays the first graph SL-R4620, which represents the insertion loss between the left port L4505 and the right port R4510, equivalent to the value defined by equation (8) and plotted on... Figure 7 The longitudinal insertion loss LIL in the figure. Figure ST-R4605 shows the insertion loss between the left port L4505 and the right port R4510, which is equivalent to the insertion loss defined by equation (9) and plotted on the graph. Figure 7 The lateral insertion loss TIL is shown in Figure ST-T4610, which represents the return loss at tap port T4515, and Figure SL-L4615, which represents the return loss at the left port L4605.

[0304] like Figure 46 As observed, Figure SL-R4620 is low, consistent with expectations, with a trace length of approximately 15 mm, and the tap ports are well isolated by embedded tap resistors with extremely low parasitic parameters. The slope is primarily caused by dielectric and conductive losses in the coaxial bracket and PCB. For Zc=10 ohms, Figure ST-R4605 is close to the predicted TIL of approximately 13 dB. Figure 7 As seen in the figure. Figure SL-L4615 has an attenuation of less than 20 dB, indicating minimal reflection along the tap. Figure ST-T4610 shows very low attenuation at low frequencies, but its performance degrades at higher frequencies. This degradation may originate from two reasons: (1) the transition between tap connector 322 and tap strip 328E; and (2) the transition of tap strip 328E through the dielectric region between external via structure 326B and internal via structure 326A.

[0305] Can target Figure 45The S-parameters extracted from the taps in the model are inserted into, for example... Figure 47 In the circuit, to simulate the behavior of a CMTL, which is assembled from 24 identical coaxial taps 320 separated by coaxial brackets 340, each 14 mm long and terminated at both ends with its characteristic impedance value Zc = 10 ohms.

[0306] Figure 48 Figure 4800 is provided for modeling the insertion loss 4802 as a function of frequency 4804. Figure (S1-24) 4805 shows the insertion loss between tapped ports at each end of the CMTL to evaluate the highest insertion loss. Reference Figure 47 The tap ports at each end include the first tap port (T1) and the last tap port (T24).

[0307] Figure (S1213) 4810 shows the insertion loss between adjacent tap ports to evaluate the lowest insertion loss. Reference Figure 48 The middle adjacent tap ports of CMTL include the 12th tap port (T12) and the 13th tap port (T13).

[0308] Figure (SL-L)4815 shows the return loss at the left port to evaluate reflection along CMTL.

[0309] Figure (SL-L)4815 replicates similar behavior observed in PMTL, but with poorer overall performance, because... Figure 4 The tap circuit in the middle lacks a higher optimal resistor element (compared to PMTL, which lacks about 0.1 ohms, and CMTL, which lacks 0.5 ohms).

[0310] Compared to approximately 4.3 GHz for PMTL, the peak value in Figure (SL-L) 4815 is at 4.9 GHz for CMTL. This is due to the shorter tap length of CMTL. Figure (S12-13) 4810 shows the average value, as... Figure 7 As predicted by equations (1) to (3), the low point at 4.9 GHz is correlated with the high point in Figure (SL-L) 4815 and is caused by reflections along the CMTL. Figure (S124) 4805 shows a satisfactory insertion loss of approximately -40 dB, consistent with expectations, but with a lower slope compared to the PMTL.

[0311] Design recommendations for CMTL

[0312] In at least one embodiment, the CMTL is designed and constructed using a method that includes evaluating specifications given for a PMTL design and considering the lowest possible cross-sectional geometry for the coaxial cable. Next, the method includes calculating its impedance and then evaluating the worst-case loss for the maximum number of taps planned for the CMTL. The method also includes constructing a coaxial cable with the desired geometry and measuring its insertion loss as a function of frequency. Next, the method includes repeating insertion loss measurements on multiple plating formulations of the internal metal structure to separate dielectric and conductive losses, using selective resistance ring plating or resistance gaskets. Figure 29 The resistors 342A and / or 344A shown are optimized for CMTL with minimal reflection, and a metal shielding cap is used on the mounting bolt 303 if the RF radiation from the aperture of the coaxial terminal 330 is too high.

[0313] Figure 49 A schematic diagram 4900 of a multi-tap transmission line 4901 according to an embodiment is provided. As shown, the multi-tap transmission line 4901 includes a first end 4902a and a second end 4902b. The multi-tap transmission line 4901 also includes two or more tap circuits connected to the multi-tap transmission line 4901 at corresponding tap ports 4903.

[0314] In the illustrated embodiment, the multi-tap transmission line 4901 includes various tap devices 4909, 4910, and 4911. In one embodiment, the tap devices include at least one of a frequency division multiple access (FDMA) tap device 4909, a time division multiple access (TDMA) tap device 4910, and a combined tap device 4911. Frequency division multiple access and time division multiple access are well-known techniques in wireless communication and can be readily applied to the novel transmission medium provided by the multi-tap transmission line 4901.

[0315] In this embodiment, the terminal has the same impedance as the characteristic impedance value Zc, which provides the advantage of minimizing or eliminating signal reflections within the multi-tap transmission line 4901. The transmission line serves as a communication medium between multiple tapped devices 4911 connected to the multi-tap transmission line 4900 via multiple tapped ports at tapped line 4904.

[0316] The tapped device 4911 can take the form of an RF transmitter output 4907T, an RF receiver input 4907R, a combination of inputs and outputs of an RF transceiver 4907, an RF multiplexer 4905, an RF switch 4906, a data terminal 4908, a combined stream of one or more RF transceivers, a test port of a vector network analyzer (VNA), a test port of a time domain reflectometer (TDR), a terminal, or any other suitable RF device. In some cases, the tapped device 4911 can resemble an antenna tower, providing access to the transmission medium provided by the multi-tap transmission line 4901 for multiple RF applications. Various known wireless technologies can be applied to fully utilize the advantages of the multi-tap transmission line 4901.

[0317] In at least one embodiment, tap line 4904 may be connected to another multi-tap transmission line, such as tap line 4904 of multi-tap transmission line 4901.

[0318] Next Figure 50 For reference, a schematic diagram 5000 of a redundant multi-tap transmission line system is shown, which consists of a first multi-tap transmission line 5000A and a second multi-tap transmission line 5000B. As shown, the tap port 5003 of the first multi-tap transmission line 5000A is connected to the second multi-tap transmission line 5000B, thereby providing redundancy for the first multi-tap transmission line 5000A. In this embodiment, the multi-tap transmission line is terminated at both ends by terminals 5002a and 5002b.

[0319] In some embodiments, transmission line 5001 may require higher availability or reliability. In these cases, it may be useful to conveniently deploy multiple transmission lines to increase system redundancy. When the first multi-tap transmission line 5000A is disconnected, RF switch 5006 can be used to switch tap device 5011 to a second multi-tap transmission line 5000B. In some embodiments, the second multi-tap transmission line 5000B can be used to double the number of tap devices 5011. As shown, a dual-tap device 5012 can be used for digital switching. Tap device 5012 can be connected to tap port 5003 via tap line 5004. This may be more convenient than RF switch 5006. Therefore, the second multi-tap transmission line 5000B can provide the advantage of additional bandwidth during normal operation or serve as a backup for the first multi-tap transmission line 5000A.

[0320] Next to Figure 51For reference, the figure illustrates a schematic diagram 5100 of bridging a multi-tap transmission line 5101. In this embodiment, the multi-tap transmission line includes a first segment 5101A and a second segment 5101B. Each segment 5101A and 5101B terminates at a first end and a second end 5102, and each segment may include at least one tap port 5103. The tap port 5103 is connected to a tap device 5111 via a tap line 5104. The tap device 5111 on the first segment 5101A is connected to or coupled to the tap device 5111 on the second segment 5101B, thereby bridging the first segment 5101A to the second segment 5101B. Multi-tap transmission line bridging can be used to extend the length of a transmission line for a specific frequency channel, or simply to bridge certain data links across multiple MTLs.

[0321] Next to Figure 52 Referring to the figure, a schematic diagram 5200 of a multi-tap transmission line 5201 according to an exemplary embodiment is shown. In this embodiment, the multi-tap transmission line 5201 terminates at ends 5202a and 5202b. The multi-tap transmission line 5201 is coupled to a narrowband connector 5213 and to taps 5203 of a tapped device 5211 via tapped lines 5204. Narrowband connectors 5213 can be used when lower insertion loss is required in a particular frequency band. They can be directional, which can provide advantages in certain configurations.

[0322] Use cases for multi-tap transmission lines

[0323] The multi-tap transmission line described in at least one of the above embodiments can be used in a variety of applications or use cases, wherein multiple RF devices are communicatively connected to each other to transmit at least one RF signal.

[0324] In at least one embodiment, the multi-tap transmission line is implemented for use in a vehicle, including but not limited to a car, train, ship, truck, or any other vehicle that requires a communication connection to send and receive data from multiple devices. Figure 53 This is a schematic diagram 5300 showing a multi-tap transmission line system 5301 suitable for automotive use case 5314.

[0325] As shown in the figure, system 5300 consists of a first multi-tap transmission line 5301A and a second multi-tap transmission line 5301B. Each multi-tap transmission line terminates at a termination point 5302. Tap devices 5312 are connected to the first multi-tap transmission line 5301A and the second multi-tap transmission line 5301B at corresponding tap ports 5303 via corresponding tap lines 5304. Each transmission line has a corresponding characteristic impedance value (Zc). The tap device connected to the transmission line 5301 at the corresponding tap port 5303 has a corresponding tap impedance value (Zo). In at least one embodiment, the characteristic impedance value Zc is lower than the individual tap impedance values ​​Zo, and in some cases, it is significantly lower than the individual tap impedance values ​​Zo. In at least one embodiment, when tap device 5312 is connected to multi-tap transmission line 5300, the first and second terminal impedances remain matched with the transmission lines.

[0326] MTLs used in automobiles, for example Figure 53 The MTL shown allows heterogeneous software-defined radio network architectures to interconnect a wide variety of sensors and computing nodes by shielding and sharing a transmission medium. Figure 53 The MTL can be constructed as a flexible printed circuit board within self-adhesive tape. This offers numerous advantages compared to traditional and conventional wiring systems used in automobiles, such as lighter weight and ease of design, manufacture, and installation. Redundant MTLs are easy to install and operate, providing greater system reliability. This embodiment incorporates a tapping device that allows switching from an MTL that has lost its functionality due to physical damage to an alternative MTL.

[0327] In at least one embodiment, the tap device 5312 may be a vehicle sensor, an engine control unit (ECU), a gateway, and an AI node. In the vehicle, sensors can collect data on various parameters, such as speed, temperature, pressure, and more. These sensors send signals to the engine control unit (ECU), which is responsible for controlling various functions such as fuel injection, ignition timing, and emissions control. The AI ​​node in the vehicle is a node that integrates artificial intelligence algorithms. These nodes can be used for various applications, such as autonomous driving, predictive maintenance, and advanced driver assistance systems (ADAS).

[0328] Therefore, these signals need to be transmitted in real time and require high frequency and high bandwidth for transmission. In at least one embodiment, the multi-tap transmission line has at least 24 taps 5312. This is common for automotive implementations, but it is understood that any number of taps can be used.

[0329] In at least one embodiment, the multi-tap transmission line is constructed of a flexible printed circuit board with self-adhesive tape. In at least one embodiment, the multi-tap transmission line also includes an auxiliary multi-tap transmission line to provide redundancy, thereby improving vehicle safety. In at least one embodiment, the tapping device uses an RF switch to switch from a first multi-tap transmission line 5301A to a second multi-tap transmission line 5301B.

[0330] Next Figure 54 For reference, a schematic diagram of a branch-constructed multi-tap transmission line system 5400 according to an example embodiment is shown. The multi-tap transmission line system 5400 is applicable to any remotely operated vehicle (ROV), manned or unmanned aerial vehicle (UAV / AV), or drone 5415, etc.

[0331] As shown in the figure, the multi-tap transmission line system 5400 consists of four MTL branches, such as the first transmission line 5401A, the second transmission line 5401B, the third transmission line 5401C, and the fourth transmission line 5401D. Each transmission line 501A-501D has a first end 5402 on one side and a common node 5416 in the middle. The common node 5416 is a four-port resistive power divider, with each port connected to one of the transmission lines, such as... Figure 55 As shown in the diagram, each transmission line has the same corresponding characteristic impedance value (Zc).

[0332] Furthermore, each transmission line has two or more tap devices 5411 connected to its corresponding tap port 5403. Each tap port 5403 has a corresponding tap impedance value (Zo), wherein the characteristic impedance value Zc is lower than the individual tap impedance value Zo, and in some cases significantly lower than the individual tap impedance value Zo. In various embodiments, the transmission lines are configured and optimized based on the teachings herein.

[0333] In at least one embodiment, the tap device 5411 may be an ROV sensor, an ROV engine control unit (ECU), an ROV gateway, and an ROV AI node. Within the ROV, sensors can collect data on various parameters, such as airspeed, temperature, pressure, and more. These sensors send signals to the ROV engine control unit (ECU), which is responsible for controlling various functions, such as battery life, takeoff, landing, and flight path. The ROV AI node in the vehicle is a node that integrates artificial intelligence algorithms. These nodes can be used for various purposes, such as autonomous flight, predictive maintenance, and flight path determination.

[0334] Therefore, the placement of tapping devices such as sensors 5411 may be limited, as ROVs may need to maintain weight balance and be as lightweight as possible to optimize operation. Figure 54As shown, using multi-tap transmission lines can provide a lightweight system that can replace cables such as Ethernet or coaxial cables. This also offers the advantage of strategically placing tapped devices 5411, such as sensors, to strategically and evenly distribute weight.

[0335] Combined with reference Figure 54 and Figure 55 , Figure 55 The diagram 5500 shows a power divider 5516 with a characteristic impedance value Zc that is the same as that of a multi-tap transmission line. Figure 54 and Figure 55 In the illustrated embodiment, four branches are shown. However, it will be understood that the power divider 5516 may include any number of branches, such as 2, 3, 4, 5, 6...N, and therefore, the multi-tap transmission line system 5400 may include a different number of branches corresponding to the number of branches in the power divider 5516. In at least one embodiment, the multi-tap transmission line may have multiple branches, wherein a transmission line such as the first transmission line 5401A, the second transmission line 5401B, the third transmission line 5401C, or the fourth transmission line 5401D is further branched into multiple lines.

[0336] In one embodiment, a second multi-tap transmission line may be added as a tapping device to a first multi-tap transmission line. In another embodiment, the tapping device is another multi-tap transmission line.

[0337] exist Figure 55 The illustrated embodiment demonstrates a branched transmission medium. This could be useful in drones and similar applications, where compute nodes and sensor nodes are ideally positioned under tight weight balance, allowing them to interconnect via a lightweight transmission medium and wide data bandwidth without switches. Essentially, a branched MTL allows for the construction of a shared transmission medium for compute and sensor nodes arbitrarily placed on the drone fuselage, adhering to the drone's static and dynamic balance requirements without compromising data transmission.

[0338] Now go to Figure 56 This provides a schematic diagram 5600 of a multi-tap transmission line system suitable for server rack use cases. Reference number 5617 illustrates a server rack according to an example embodiment. Figure 57 This is a schematic diagram of the 5700 multi-tap transmission line, showing in detail... Figure 56 The connection in 5622.

[0339] Figure 56 and Figure 57 Multi-tap transmission lines allow servers in a server rack to interconnect without the need for data switches or cables that could cause cable management problems.

[0340] like Figure 56 and Figure 57 As shown, system 5600 includes a multi-tap transmission line 5700 connected to a plurality of tapped lines 5704. Tapped lines 5704 are connected to multi-tap transmission line 5700 at reinforced attachment point 5720. Tapped lines 5704 are connected at their other ends to RF connector 5718 on the panel of server 5719, wherein server 5719 is a tapped device.

[0341] In this embodiment, the multi-tap transmission line is implemented as a flexible printed circuit board attached to the rack frame 5617, located at the upright member 5721 of the rack frame 5617. In some embodiments, the multi-tap transmission line is made of a shorter length of rigid PCB, or is mounted horizontally in the rack, between servers.

[0342] Therefore, each server 5719 can simultaneously broadcast its data to all other servers via a shared, interference-free transmission medium. Each tap provides additional broadband access to the MTL for fast and easy data transmission over the line.

[0343] Figure 58 This is a simplified diagram of a three-layer AI network, 5800. Reference number 5823 represents a single-layer compute node, 5824. Figure 59 The diagram shows that each compute node 5824 has an integrated tap device 5911. Reference numeral 5825 shows the data link connecting compute nodes 5824 in adjacent layers 5823. Reference numeral 5826 represents the mesh network between compute nodes 5824 organized according to compute node layers 5823.

[0344] Figure 59 yes Figure 58 The schematic diagram 5900 of the AI ​​network is shown, which is implemented as a multi-tap transmission line 5901. (See diagram 5901.) Figure 59 As shown, compute node 5924 is similar to Figure 58 The three layers 5923 of layer 5823 are connected by two transmission lines, wherein the first transmission line is located between the first two layers 5923, and the second transmission line is located between the second and third layers 5923.

[0345] Each transmission line terminates at a termination point 5902 at each end. Each transmission line has multiple tap ports 5903, and corresponding tap lines 5904 connect computing nodes 5924 to the transmission lines at the corresponding tap ports 5903. In the illustrated embodiment, each computing node 5924 has two integrated tap devices 5911. In some other examples, a different number of integrated tap devices may be provided in each computing node.

[0346] In the illustrated embodiment, each multi-tap transmission line 5901 has a corresponding characteristic impedance value (Zc), and each tap port has a corresponding tap impedance value (Zo). In at least one embodiment, the characteristic impedance value Zc is lower than the individual tap impedance values ​​Zo, and in some cases, it is significantly lower than the individual tap impedance values ​​Zo. The illustrated MTL system 5900 efficiently solves the communication problem between successive computation layers 5923 of a machine learning neural network by broadcasting RF data over different radio frequency channels. Each connected computation node 5924 can instantly and directly share its data, with each connected node 5924 on the multi-tap transmission line 5901 acting as a broadband transmission medium.

[0347] In this embodiment, the MTL can be implemented in a rigid printed circuit board (PCB) commonly found in data server motherboard designs, or, when needed, as a discrete flexible printed circuit board to supplement existing rigid PCB structures. In some cases, among other implementations, the illustrated MTL can be implemented in the chip silicon substrate, die, or interposer, etc.

[0348] While the invention has been described and illustrated with reference to its preferred embodiments, those skilled in the art will understand that various modifications in form and detail may be made to the invention without departing from the spirit and scope of the invention as defined in the appended claims. Although the applicant's teachings described herein incorporate various embodiments for illustrative purposes, this does not mean that the applicant's teachings are limited to these embodiments. Rather, the applicant's teachings described and illustrated herein encompass various alternatives, modifications, and equivalents without departing from the embodiments, the overall scope of which is limited by the appended claims.

[0349] project:

[0350] 1. In one project, this document discloses a broadband radio frequency transmission line that uses waveguides and taps to connect multiple radio frequency terminals and create a data network. The transmission line includes a left terminal, a right terminal, and multiple tap circuits. Each tap circuit includes a left port, a right port, a tap port, a left transmission line, a right transmission line, a left resistive element, a right resistive element, and a tap resistive element. In this transmission line, the left and right resistive elements are characterized by their respective substantially identical series resistance values ​​Rs, and the tap resistive element is characterized by its tap resistance value Rt. In this transmission line, the left and right transmission lines have their respective substantially identical characteristic impedance values ​​Zc. The left transmission line is connected between the left port and the left resistive element, the left resistive element is connected between the left transmission line and the right resistive element, the right resistive element is connected between the left resistive element and the right transmission line, the right transmission line is connected between the right resistive element and the right port, and one end of the tap resistive element is connected to the common connection between the respective left and right resistive elements, and the other end is connected to the tap port. In the transmission line, tapped ports are connected to external RF terminals with a tap impedance of Zo, measured at the tapped port. Both left and right terminals are constructed as resistive elements, characterized essentially by their respective characteristic impedance values ​​Zc. These multiple tapped circuits are connected in series, such that the first tapped circuit connects its left port to the left terminal, the last tapped circuit connects its right port to the right terminal, and all other right ports of the tapped circuits are each connected to one and only one left port of the tapped circuit.

[0351] 2. In another project, the impedance of the transmission line and the resistive elements of its tap circuit were optimized for power transmission.

[0352] 3. In another project, the terminations, resistive elements, and transmission lines were essentially constructed as planar waveguides.

[0353] 4. In another project, the termination, left resistive element, right resistive element, and transmission line were essentially constructed as coaxial waveguides.

[0354] 5. In one project, multi-tap transmission lines were provided.

[0355] 6. In another project, a multi-tap transmission line includes: a first end and at least one second end; the transmission line having a corresponding characteristic impedance value (Zc); the first end having a corresponding first end impedance, which is the same as the characteristic impedance; at least one second end having a corresponding at least one second end impedance, which is the same as the characteristic impedance; at least two tap circuits connected to the transmission line; wherein each tap circuit includes a tap port, wherein each tap port has a corresponding tap impedance value (Zo); and wherein the characteristic impedance value Zc is lower than the tap impedance value Zo.

[0356] 7. In another project, for each tap circuit, the multi-tap transmission line further includes: a first resistive element corresponding to a first port of the tap circuit and having a corresponding first resistance value; and a second resistive element corresponding to a second port of the tap circuit and having a second resistance value, the first resistance value and the second resistance value being substantially equal to the series resistance value (Rs); a corresponding tap device connected to the corresponding tap port; and a tap resistive element corresponding to the tap port, the tap resistive element having a tap resistance value (Rt); wherein the first resistive element, the second resistive element and the tap resistive element are connected at the connection point in a T-shaped configuration.

[0357] 8. In another project, tapped devices are selected from the group consisting of: output RF transmitters, input RF receivers, combined input and output RF transceivers, RC transceivers, multiple RF transceivers, test ports of a Vector Network Analyzer (VNA), test ports of a Time Domain Reflectometer (TDR) analyzer, taps of another multi-tap transmission line, and any RF devices and terminals.

[0358] 9. In another project, when tapped devices are connected to multi-tap transmission lines, the impedance at the first and second ends is kept matched to the transmission line impedance.

[0359] 10. In another project, the transmission line includes a splitter configuration, and the at least one second end includes two second ends.

[0360] 11. In another project, multi-tap transmission lines were implemented as rigid printed circuit boards.

[0361] 12. In another project, multi-tap transmission lines were implemented as discrete flexible printed circuit boards.

[0362] 13. In another project, multi-tap transmission lines were constructed as flexible printed circuit boards with self-adhesive tape.

[0363] 14. In another project, multi-tap transmission lines were constructed as branched structures.

[0364] 15. In another project, the multi-tap transmission line operates under at least one of the following conditions: tap device disconnection, short circuit, or damage. In such embodiments, the multi-tap transmission line operates together with the remaining tap devices.

[0365] 16. In another project, the first and second resistive elements have a corresponding series resistance value of approximately 0 ohms.

[0366] 17. In one project, a method for optimizing multi-tap transmission lines was provided.

[0367] 18. In another project, the method includes: determining an optimal characteristic impedance value (Zc) for each corresponding tap impedance value (Zo) and for the total number of tap ports in the transmission line; and determining a series resistance value (Rs) and a tap resistance value (Rt) based on the optimal characteristic impedance value (Zc) such that the loss between the first tap circuit and the last tap circuit is minimized.

[0368] 19. In another project, determining the optimal characteristic impedance value (Zc) includes: selecting candidate impedance values ​​from a range of values ​​between 0 and the terminal impedance value; for each candidate impedance value: determining the worst-case insertion loss between the first and last tap circuits based on the candidate impedance value and the tap impedance value corresponding to the tap port, the worst-case insertion loss being determined based on the longitudinal insertion loss and the lateral insertion loss determined according to the following formula:

[0369] TTLN[dB]=TIL(1)+LIL(2)+LIL(3)+...+LIL(j)+...LIL(N-1)+TIL(N) Where LIL is the longitudinal insertion loss value determined according to the following formula:

[0370] LIL(j)=20LOG10(1-Zc / 2Zo(j)) , where j represents the range of tap index values, from 2 to (N-1), and N represents the total number of tap ports; and TIL is the lateral insertion loss value determined according to the following formula: TIL(j) = 10LOG10(Zc / 4Zo(j)) , where j is 1 or N, and the optimal characteristic impedance value (Zc) is determined based on the candidate impedance value that minimizes the worst-case insertion loss.

[0371] 20. In another project, the series resistance value (Rs) is determined according to the following formula:

[0372] Where Zo(j) is the tap impedance value of tap port j; j represents the range of tap index values, from 1 to N, where N represents the total number of tap ports; and Zc is the optimal characteristic impedance value.

[0373] 21. In another project, the tap resistance value (Rt) is determined according to the following formula:

[0374] Where Zo(j) is the tap impedance value of tap port j; j represents the range of tap index values, from 1 to N, where N represents the total number of tap ports; and Zc is the optimal characteristic impedance value.

[0375] 22. In another project, the method also includes selecting an alternative characteristic impedance value (Zc) from a range between -30% and +30% of the optimal characteristic impedance value.

[0376] 23. In another project, the optimal characteristic impedance value (Zc) was determined via graphical analysis in the following manner:

[0377] The loss function is plotted using the following formula as a function of the candidate impedance values.

[0378] TTLN[Zc]=TIL(1)+LIL(2)+LIL(3)+...+LIL(j)+...LIL(N-1)+TIL(N) ;as well as

[0379] The optimal characteristic impedance value is selected based on the candidate impedance value corresponding to the minimum value of the loss and loss function.

[0380] 24. In one project, a multi-tap transmission line for motorized vehicles was provided.

[0381] 25. In another project, a multi-tap transmission line includes: a first end and at least one second end; the transmission line having a corresponding characteristic impedance value (Zc); the first end having a corresponding first end impedance, the first end impedance being the same as the characteristic impedance; the at least one second end having a corresponding at least one second end impedance, the corresponding at least one second end impedance being the same as the characteristic impedance; at least two tap circuits connected to the transmission line; wherein each tap circuit includes a tap port, wherein each tap port has a corresponding tap impedance value (Zo); and wherein the characteristic impedance value Zc is less than the individual tap impedance values ​​Zo.

[0382] 26. In another project, for each tap circuit, the multi-tap transmission line further includes: a first resistive element corresponding to a first port of the tap circuit and having a corresponding first resistance value; and a second resistive element corresponding to a second port of the tap circuit and having a second resistance value, the first resistance value and the second resistance value being substantially equal to the series resistance value (Rs); a corresponding tap device connected to the corresponding tap port; and a tap resistive element corresponding to the tap port, the tap resistive element having a tap resistance value (Rt); wherein the first resistive element, the second resistive element and the tap resistive element are connected at the connection point in a T-shaped configuration.

[0383] 27. In another project, multi-tap transmission lines also include at least 24 tap devices.

[0384] 28. In another project, tapping devices are selected from the group consisting of: vehicle sensors, engine control units (ECUs), gateways, and AI nodes.

[0385] 29. In another project, multi-tap transmission lines were constructed as flexible printed circuit boards with self-adhesive tape.

[0386] 30. In another project, multi-tap transmission lines also include auxiliary multi-tap transmission lines to provide redundancy.

[0387] 31. In another project, the tapping equipment was switched from a multi-tap transmission line to an auxiliary multi-tap transmission line.

[0388] 32. In one project, a multi-tap transmission line for a remotely operated vehicle (ROV) was provided.

[0389] 33. In another project, the tapping device is selected from the group consisting of: ROV sensors, ROV engine control units (ECUs), ROV gateways, and ROV AI nodes.

[0390] 34. In another project, multi-tap transmission lines were constructed as branched structures.

[0391] 35. In another project, multi-tap transmission lines include resistive power dividers to branch the multi-tap transmission line into multiple lines.

[0392] 36. In one project, a multi-tap transmission cable for server racks was provided.

[0393] 37. In another project, the tap device is the server.

[0394] 38. In one project, a multi-tap transmission line for use in an inter-chip architecture for multiple processor chips was provided.

[0395] 39. In another project, multi-tap transmission lines are located outside the multiple processor chips and connected to nodes within the multiple processor chips.

[0396] 40. In another project, multi-tap transmission lines were implemented as rigid printed circuit boards.

[0397] 41. In another project, multi-tap transmission lines were implemented as discrete flexible printed circuit boards.

[0398] 42. In another project, a multi-tap transmission line is implemented in at least one of the following: a chip silicon substrate, a die, and an interposer.

Claims

1. A multi-tap transmission line, comprising: A first end and at least one second end; The transmission line has a corresponding characteristic impedance value (Zc). The first end has a corresponding first end impedance, which is the same as the characteristic impedance. The at least one second terminal has a corresponding at least one second terminal impedance, and the corresponding at least one second terminal impedance is the same as the characteristic impedance; At least two tap circuits are connected to the transmission line, wherein each tap circuit includes a tap port, and wherein each tap port has a corresponding tap impedance value (Zo). Wherein, the characteristic impedance value Zc is less than the impedance value Zo of each tap, and Each tap circuit includes: A first resistive element corresponding to the first port of the tap circuit and having a first resistance value; A second resistive element corresponding to the second port of the tap circuit and having a second resistance value. The first resistance value and the second resistance value are equal to the series resistance value (Rs); The corresponding tap device connected to the corresponding tap port; A tap resistor element corresponding to the tap port, the tap resistor element having a tap resistance value (Rt); wherein, the first resistor element, the second resistor element, and the tap resistor element are connected at the connection point in a T-shape configuration, and Wherein, the characteristic impedance value (Zc) minimizes the worst-case insertion loss (TTLN) between the first and last tap circuits of the at least two tap circuits, the worst-case insertion loss being determined based on the longitudinal insertion loss (LIL) and the lateral insertion loss (TIL) according to the following formula: TTLN[dB]=TIL(1)+LIL(2)+LIL(3)+...+LIL(j)+...LIL(N-1)+TIL(N) ； Wherein, LIL is the longitudinal insertion loss value determined according to the following formula: LIL(j)=20LOG10(1-Zc / 2Zo(j)) ， Where Zo(j) is the tap impedance value of tap port j, j is the range of values ​​representing the tap index, ranging from 2 to (N-1), and N represents the total number of tap ports; Wherein, TIL is the lateral insertion loss value determined according to the following formula: TIL(j) = 10LOG10(Zc / 4Zo(j)) ， Where Zo(j) is the tap impedance value of tap port j, and j is 1 or N.

2. The multi-tap transmission line according to claim 1, wherein, The tapped device is selected from the group consisting of: output radio frequency (RF) transmitter, input RF receiver, combined input and output RF transceiver, radio control (RC) transceiver, multiple RF transceivers, test port of vector network analyzer (VNA), test port of time domain reflectometer (TDR) analyzer, tap of another multi-tap transmission line, RF device, and terminal.

3. The multi-tap transmission line according to claim 1, wherein, When the tapping device is connected to the multi-tap transmission line, the first terminal impedance and the second terminal impedance remain matched with the transmission line.

4. The multi-tap transmission line according to claim 1, wherein, The transmission line includes a splitter configuration, and the at least one second end includes two second ends.

5. The multi-tap transmission line according to claim 1, wherein, The multi-tap transmission line is implemented as a rigid printed circuit board.

6. The multi-tap transmission line according to claim 1, wherein, The multi-tap transmission line is implemented as a flexible printed circuit board.

7. The multi-tap transmission line according to claim 1, wherein, The first resistive element and the second resistive element have corresponding series resistance values ​​of 0 ohms.

8. A method for optimizing a multi-tap transmission line, the multi-tap transmission line comprising: A first end and at least one second end; The transmission line has a corresponding characteristic impedance value (Zc). The first end has a corresponding first end impedance, which is the same as the characteristic impedance. The at least one second terminal has a corresponding at least one second terminal impedance, and the corresponding at least one second terminal impedance is the same as the characteristic impedance; At least two tap circuits are connected to the transmission line, wherein each tap circuit includes a tap port, and wherein each tap port has a corresponding tap impedance value (Zo). For each tap circuit: A first resistive element corresponding to a first port of the tap circuit and having a first resistance value; and a second resistive element corresponding to a second port of the tap circuit and having a second resistance value, wherein the first resistance value and the second resistance value are equal to the series resistance value (Rs). A corresponding tap device connected to the corresponding tap port; and a tap resistor element corresponding to the tap port, the tap resistor element having a tap resistance value (Rt), the first resistor element, the second resistor element and the tap resistor element being connected at the connection point in a T-shaped configuration; The method includes: for each corresponding tap impedance value (Zo) and for the total number of tap ports in the transmission line, Determine the optimal characteristic impedance value (Zc); and Based on the optimal characteristic impedance value (Zc), the series resistance value (Rs) and the tap resistance value (Rt) are determined such that the loss between the first tap circuit and the last tap circuit is minimized. Determining the optimal characteristic impedance value (Zc) includes: Select a candidate impedance value, which is chosen from a range of values ​​between 0 and the terminal impedance value; For each candidate impedance value: The worst-case insertion loss (TTLN) between the first tap circuit and the last tap circuit is determined based on the candidate impedance value and the tap impedance value corresponding to the tap port. The worst-case insertion loss (TTLN) is determined based on the longitudinal insertion loss (LIL) and lateral insertion loss (TIL) determined according to the following formula: TTLN[dB]=TIL(1)+LIL(2)+LIL(3)+...+LIL(j)+...LIL(N-1)+TIL(N) ； Wherein, LIL is the longitudinal insertion loss value determined according to the following formula: LIL(j)=20LOG10(1-Zc / 2Zo(j)) ， Where j represents the range of tap index values, from 2 to (N-1), and N represents the total number of tap ports; Wherein, TIL is the lateral insertion loss value determined according to the following formula: TIL(j) = 10LOG10(Zc / 4Zo(j)), Where j is 1 or N, and The optimal characteristic impedance value (Zc) is determined based on the candidate impedance value that minimizes the worst-case insertion loss.

9. The method according to claim 8, wherein, The series resistance value (Rs) is determined according to the following formula: Where Zo(j) is the tap impedance value of tap port j; j represents the range of tap index values, from 1 to N, where N represents the total number of tap ports; and Zc is the optimal characteristic impedance value.

10. The method according to claim 9, wherein, The tap resistance value (Rt) is determined according to the following formula: Where Zo(j) is the tap impedance value of tap port j; j represents the range of tap index values, from 1 to N, where N represents the total number of tap ports; and Zc is the optimal characteristic impedance value.

11. The method of claim 8, further comprising selecting an alternative characteristic impedance value (Zc) from a range between -30% and +30% of the optimal characteristic impedance value.

12. The method according to claim 8, wherein, The optimal characteristic impedance value (Zc) is determined through graphical analysis in the following manner: The loss function, which is a function of the candidate impedance value, is plotted according to the following formula: TTLN[Zc]=TIL(1)+LIL(2)+LIL(3)+...+LIL(j)+...LIL(N-1)+TIL(N) ;as well as The optimal characteristic impedance value is selected based on the candidate impedance value corresponding to the minimum value of the loss function, wherein TTLN defines the worst-case insertion loss, LIL defines the longitudinal insertion loss, and TIL defines the lateral insertion loss.

13. The method according to claim 8, wherein, The first resistive element and the second resistive element have corresponding series resistance values ​​of 0 ohms.

14. A multi-tap transmission line for use in a vehicle, the multi-tap transmission line comprising: A first end and at least one second end; The transmission line has a corresponding characteristic impedance value (Zc). The first end has a corresponding first end impedance, which is the same as the characteristic impedance. The at least one second terminal has a corresponding at least one second terminal impedance, and the corresponding at least one second terminal impedance is the same as the characteristic impedance; At least two tap circuits are connected to the transmission line, wherein each tap circuit includes a tap port, and wherein each tap port has a corresponding tap impedance value (Zo). Wherein, the characteristic impedance value Zc is less than the tap impedance value Zo, and Each tap circuit includes: A first resistive element corresponding to the first port of the tap circuit and having a first resistance value; A second resistive element that corresponds to the second port of the tap circuit and has a second resistance value; The first resistance value and the second resistance value are equal to the series resistance value (Rs); Connect the corresponding tap device to the corresponding tap port; A tap resistor element corresponding to the tap port, the tap resistor element having a tap resistance value (Rt); Wherein, the first resistive element, the second resistive element, and the tapped resistive element are connected at the connection point in a T-shape configuration; and wherein, the characteristic impedance value (Zc) minimizes the worst-case insertion loss (TTLN) between the first and last tapped circuits of the at least two tapped circuits, the worst-case insertion loss being determined based on the longitudinal insertion loss (LIL) and the lateral insertion loss (TIL) according to the following formula: TTLN[dB]=TIL(1)+LIL(2)+LIL(3)+...+LIL(j)+...LIL(N-1)+TIL(N) ； Wherein, LIL is the longitudinal insertion loss value determined according to the following formula: LIL(j)=20LOG10(1-Zc / 2Zo(j)) ， Where Zo(j) is the tap impedance value of tap port i, i is the range of values ​​representing the tap index, ranging from 2 to (N-1), and N represents the total number of tap ports; Wherein, TIL is the lateral insertion loss value determined according to the following formula: TIL(j) = 10LOG10(Zc / 4Zo(j)) ， Where Zo(j) is the tap impedance value of tap port i, and i is 1 or N.

15. The multi-tap transmission line according to claim 14, wherein, The vehicle is an automated vehicle that includes at least 24 taps.

16. The multi-tap transmission line according to claim 15, wherein, The tapping device is selected from the group consisting of: vehicle sensors, engine control units (ECUs), gateways, and AI nodes.

17. The multi-tap transmission line according to claim 15, wherein, The multi-tap transmission line is constructed as a flexible printed circuit board with self-adhesive tape.

18. The multi-tap transmission line of claim 14, further comprising an auxiliary multi-tap transmission line to provide redundancy.

19. The multi-tap transmission line according to claim 18, wherein, During a fault event, one or more tapping devices switch from the multi-tap transmission line to the auxiliary multi-tap transmission line.

20. The multi-tap transmission line according to claim 14, wherein, The vehicle is a remotely operated vehicle (ROV), and the tapping device is selected from the group consisting of: ROV sensors, ROV engine control units (ECUs), ROV gateways, and ROV AI nodes.

21. The multi-tap transmission line according to claim 20, wherein, The multi-tap transmission line is constructed as a branched structure.

22. The multi-tap transmission line of claim 21 further includes a resistor power divider to branch the multi-tap transmission line into multiple transmission lines.

23. A multi-tap transmission line for use in an inter-chip architecture with multiple processor chips, wherein, The multi-tap transmission line is located outside the plurality of processor chips and connected to nodes within the plurality of processor chips. The multi-tap transmission line includes: A first end and at least one second end; The transmission line has a corresponding characteristic impedance value (Zc). The first end has a corresponding first end impedance, which is the same as the characteristic impedance. The at least one second terminal has a corresponding at least one second terminal impedance, and the corresponding at least one second terminal impedance is the same as the characteristic impedance; At least two tap circuits connected to the transmission line; Each tap circuit includes a tap port, wherein each tap port has a corresponding tap impedance value (Zo), and Wherein, the characteristic impedance value Zc is less than the tap impedance value Zo; Each tap circuit includes: A first resistive element corresponding to the first port of the tap circuit and having a first resistance value; A second resistive element that corresponds to the second port of the tap circuit and has a second resistance value; The first resistance value and the second resistance value are equal to the series resistance value (Rs); Connect the corresponding tap device to the corresponding tap port; A tap resistor element corresponding to the tap port, the tap resistor element having a tap resistance value (Rt); The first resistive element, the second resistive element, and the tapped resistive element are connected at the connection point in a T-shape configuration; and Wherein, the characteristic impedance value (Zc) minimizes the worst-case insertion loss (TTLN) between the first and last tap circuits of the at least two tap circuits, the worst-case insertion loss being determined based on the longitudinal insertion loss (LIL) and the lateral insertion loss (TIL) according to the following formula: TTLN[dB]=TIL(1)+LIL(2)+LIL(3)+...+LIL(j)+...LIL(N-1)+TIL(N) ； Wherein, LIL is the longitudinal insertion loss value determined according to the following formula: LIL(j)=20LOG10(1-Zc / 2Zo(j)) ， Where Zo(j) is the tap impedance value of tap port i, i is the range of values ​​representing the tap index, ranging from 2 to (N-1), and N represents the total number of tap ports; Wherein, TIL is the lateral insertion loss value determined according to the following formula: TIL(j) = 10LOG10(Zc / 4Zo(j)) ， Where Zo(j) is the tap impedance value of tap port i, and j is 1 or N.

24. The multi-tap transmission line according to claim 23, wherein, The multi-tap transmission line is implemented as a rigid printed circuit board.

25. The multi-tap transmission line according to claim 23, wherein, The multi-tap transmission line is implemented as a flexible printed circuit board.

26. The multi-tap transmission line according to claim 23, wherein, The multi-tap transmission line is implemented in at least one of the following: a chip silicon substrate, a die, and an interposer.

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