Component soldering apparatus and method

Abstract

The application provides a component soldering device and method, which comprises a feeding and discharging mechanism, a transfer mechanism, a transmission module, a jig and a soldering mechanism; the transmission module is provided with the jig, the jig comprises a body and a soldering cover plate, and the soldering cover plate is provided with a soldering avoidance hole; the transfer mechanism comprises a component transfer assembly and a cover plate moving assembly; the soldering mechanism comprises a soldering gun, and the soldering gun can pass through the soldering avoidance hole to the inside of the jig. The component transfer assembly is used for transferring components between the feeding and discharging mechanism and the transmission module, and the cover plate moving assembly is used for assembling the soldering cover plate to the jig before soldering, so that the soldering mechanism can accurately work at a predetermined position through the soldering avoidance hole on the soldering cover plate. Compared with the conventional soldering processing technology at the present stage, the application has the advantages of high automation, strong processing continuity, high soldering precision and strong controllability, and can effectively improve the quality and efficiency of soldering processing.

Description

Technical Field

[0001] This invention relates to the field of soldering technology, specifically to a component soldering equipment and method. Background Technology

[0002] In the manufacturing and assembly of electronic components such as printed circuit boards (PCBs), multi-point soldering of electrodes is a core process for achieving circuit conduction, signal transmission, and structural fixation, and is widely used in consumer electronics, industrial control, automotive electronics, aerospace, and other fields. With the rapid development of electronic devices towards miniaturization, high density, and high integration, the distribution density of electrodes on components continues to increase, the number of points increases significantly, and the electrode size continues to shrink. This places increasingly stringent requirements on the precision of the soldering process.

[0003] Currently, multi-point soldering of electronic components mainly relies on semi-automatic soldering equipment. While semi-automatic equipment can achieve basic point positioning and solder filling, it is limited by the lack of mechanical positioning accuracy detection. When dealing with high-density electrode points, problems such as solder point misalignment, short circuits, or cold solder joints are prone to occur. More importantly, existing soldering equipment generally lacks a feasible high-precision system for continuous soldering and has not formed a closed-loop system for coordinated control, which severely restricts the efficiency of electronic component soldering. Summary of the Invention

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the problem that the soldering accuracy and efficiency of the prior art need to be improved, and to provide a component soldering equipment and method.

[0005] To address the aforementioned technical problems, this invention provides a component soldering device, comprising: a loading / unloading mechanism, a transfer mechanism, at least one transmission module, at least one fixture, and at least one soldering mechanism; the transmission module is disposed on one side of the loading / unloading mechanism, and at least one fixture is provided on the transmission module, the fixture including a body and a soldering cover plate, the body being slidably connected to the transmission module, the component being disposed inside the body, and the soldering cover plate being detachably connected to the body and having multiple soldering clearance holes thereon; the transfer mechanism includes a component transfer component and at least one cover plate moving component, wherein the component transfer component is movable between the loading / unloading mechanism and the transmission module, and includes component grippers, the cover plate moving component being correspondingly disposed above the transmission module, and includes liftable and movable cover plate grippers for disassembling / assembling the cover plate; the soldering mechanism is correspondingly disposed at the end of the transmission module, and includes a soldering gun, the soldering gun being able to pass through the soldering clearance holes into the fixture to solder the component.

[0006] In one embodiment of the present invention, the component soldering equipment includes a machine base, multiple transmission modules, and multiple soldering mechanisms. The machine base is equipped with a control mechanism. The loading and unloading mechanism, the transfer mechanism, the transmission modules, and the soldering mechanisms are respectively disposed on the machine base and connected to the control mechanism. The multiple transmission modules are symmetrically disposed on both sides of the loading and unloading mechanism and are arranged in parallel at intervals. The multiple soldering mechanisms are respectively disposed at both ends of the multiple transmission modules. Each transmission module has one or two fixtures. The transfer mechanism includes multiple cover plate moving components, and the multiple cover plate moving components are correspondingly disposed above the multiple transmission modules.

[0007] In one embodiment of the present invention, the loading and unloading mechanism includes a loading and unloading module, a carrier tray, and at least two material detectors. The two ends of the loading and unloading mechanism are respectively connected to a soldering component supply device and a soldering component collection device. The carrier tray is slidably connected to the loading and unloading module and carries components thereon. The at least two material detectors are respectively disposed at the two ends of the loading and unloading module.

[0008] In one embodiment of the present invention, the main body includes a support platform, two fixed clamping plates and a clamping driver. The bottom of the support platform is slidably connected to the transmission module via a sliding plate. The clamping driver is disposed on the sliding plate. The two fixed clamping plates are respectively located on both sides of the support platform in the width direction and are respectively connected to the two working ends of the clamping driver so as to move relatively closer to / away from each other.

[0009] In one embodiment of the present invention, the edge of the support platform is provided with a plurality of limiting blocks to enclose an accommodating space. The main body also includes a push block and a push driver. The push driver is connected to the slide plate and is located at one end of the support platform in the length direction. The push block is connected to the working end of the push driver and can move toward / away from the accommodating space.

[0010] In one embodiment of the present invention, the edge of the support platform is provided with a plurality of positioning pins, the plurality of positioning pins including at least two diameters, and the solder cover plate is provided with a plurality of positioning holes, the plurality of positioning holes being configured one-to-one with the plurality of positioning pins.

[0011] In one embodiment of the present invention, the transfer mechanism includes a transfer frame, a transfer module is provided on one side of the transfer frame, and the cover plate moving assembly is connected to the other side. The transfer module is located above the extension path of the loading and unloading mechanism and the transmission module, and the component transfer assembly is slidably connected to the transfer module.

[0012] In one embodiment of the present invention, the component transfer assembly includes a slide, a first lifting module, component grippers, and a component detector. The slide is slidably connected to the transfer module. The first lifting module is disposed on the slide and has a first lifting driver at its end to drive the component grippers to move up and down. The two component grippers can open and close relative to each other to form a component clamping space. The component detector is connected to the component grippers and is disposed facing the component clamping space.

[0013] In one embodiment of the present invention, the cover plate moving assembly includes a second lifting driver, a second lifting module, a cover plate gripper, and a cover plate detector. The second lifting driver and the second lifting module are both disposed on the slide. The cover plate gripper is connected to the working end of the second lifting driver and moves along the second lifting module. The two cover plate grippers can open and close relative to each other to form a cover plate clamping space. Each cover plate gripper is provided with a connecting groove, and the edge of the soldered cover plate can be engaged in the connecting groove. The cover plate detector is connected to the cover plate gripper and is disposed facing the cover plate clamping space.

[0014] In one embodiment of the present invention, the soldering mechanism further includes a mounting frame and an adjustment component. The mounting frame is disposed at the end of the transmission module. The adjustment component includes a horizontal module and a vertical module. The horizontal module extends along the width direction of the transmission module. The vertical module is slidably connected to the horizontal module and extends along the height direction of the soldering mechanism. The soldering gun is slidably connected to the vertical module.

[0015] This invention also provides a method for soldering electronic components, which uses the aforementioned soldering equipment to perform soldering processing on electronic components. The method includes: Step S1, transferring the component to be soldered to the working range of a component transfer assembly via a loading / unloading mechanism; Step S2, moving the component to be soldered from the loading / unloading mechanism to a fixture body via the component transfer assembly; Step S3, moving the fixture body to the working range of a cover plate moving assembly via a transfer module, and then fastening a soldering cover plate onto the fixture body via the cover plate moving assembly; Step S4, moving the fixture with the soldering cover plate fastened onto the fixture body via a transfer module. After the mechanism reaches its working range, the welding torch is driven through the soldering clearance hole on the soldering cover plate into the fixture to solder the components; Step S5: The fixture containing the soldered components is moved back to the working range of the cover plate moving assembly via the transfer module, and then the soldering cover plate is removed from the main body via the cover plate moving assembly; Step S6: The fixture body with the removed soldering cover plate is moved back to the working range of the component transfer assembly via the transfer module; Step S7: The soldered components are moved from the main body to the loading and unloading mechanism via the component transfer assembly, and the unloading is completed via the loading and unloading mechanism.

[0016] The technical solution of the present invention has the following advantages compared with the prior art: The component soldering equipment and method described in this invention utilizes a loading and unloading mechanism to load components to be soldered or unload soldered components. A component transfer assembly transfers components between the loading and unloading mechanism and the transfer module. A cover plate moving assembly assembles a soldering cover plate on the fixture before soldering to ensure the soldering mechanism can precisely operate at a predetermined position through soldering avoidance holes on the cover plate, while protecting other positions. Furthermore, the cover plate moving assembly can remove the soldering cover plate after soldering to facilitate component unloading. The coordination between these structures enables a continuous and orderly component soldering process. The design of the soldering cover plate also significantly improves soldering accuracy. Compared to current conventional soldering technologies, this application combines high automation, strong processing continuity, high soldering accuracy, and strong controllability, effectively improving the quality and efficiency of soldering and possessing broad application prospects in the industry. Attached Figure Description

[0017] To make the content of this invention easier to understand, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0018] Figure 1 This is a three-dimensional structural schematic diagram of the component soldering equipment in a preferred embodiment of the present invention; Figure 2 yes Figure 1 Top view of the soldering equipment for the components shown; Figure 3 yes Figure 1 A three-dimensional structural diagram of the component soldering equipment shown, including the machine base, loading and unloading mechanism, transmission module, fixture, and transfer mechanism. Figure 4 yes Figure 1 A three-dimensional structural diagram of the transfer module and fixture in the component soldering equipment shown; Figure 5 yes Figure 1 A three-dimensional structural diagram of the fixture in the soldering equipment for the components shown; Figure 6 yes Figure 5 A three-dimensional structural diagram of the main body and sliding plate in the fixture shown; Figure 7 yes Figure 5 A schematic diagram of the sliding plate and part of the internal structure of the fixture shown; Figure 8 yes Figure 1 A three-dimensional structural diagram of the transfer mechanism in the component soldering equipment shown; Figure 9 yes Figure 1 A three-dimensional structural diagram of the component transfer assembly in the component soldering equipment shown. Figure 10 yes Figure 1 A three-dimensional structural diagram of the transfer mechanism in the component soldering equipment shown from another perspective; Figure 11 yes Figure 10 Enlarged structural diagram at point A in the middle; Figure 12 yes Figure 1 The diagram shows a three-dimensional structural schematic of the soldering mechanism in the component soldering equipment.

[0019] Explanation of reference numerals in the accompanying drawings: 100, Loading / unloading mechanism; 110, Loading / unloading module; 120, Carrier tray; 130, Material detector; 200, Transfer module; 300, Fixture; 310, Body; 311, Support platform; 312, Fixing clamp; 313, Clamping driver; 314, Push block; 315, Push driver; 316, Limit block; 317, Positioning pin; 320, Soldering cover plate; 321, Soldering clearance hole; 330, Slide plate; 400, Transfer mechanism; 410, Transfer frame; 411, Transfer module; 420. Component transfer assembly; 421. Carriage; 422. First lifting module; 423. First lifting driver; 424. Component gripper; 425. Component detector; 430. Cover plate moving assembly; 431. Second lifting driver; 432. Second lifting module; 433. Cover plate gripper; 4331. Connecting groove; 434. Cover plate detector; 500. Soldering mechanism; 510. Mounting bracket; 520. Adjustment assembly; 521. Horizontal module; 522. Vertical module; 530. Soldering torch; 600. Machine base. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0021] Example 1:

[0022] See Figure 1As shown, this embodiment provides a component soldering device for soldering electrodes on a PCB board of a battery. Specifically, it includes: a loading / unloading mechanism 100, a transfer mechanism 400, at least one transmission module 200, at least one fixture 300, and at least one soldering mechanism 500. The transmission module 200 is disposed on one side of the loading / unloading mechanism 100. At least one fixture 300 is provided on the transmission module 200. The fixture 300 includes a body 310 and a soldering cover plate 320. The body 310 is slidably connected to the transmission module 200, and the components are disposed inside the body 310. The soldering cover plate 320 is detachably connected to the body 310 and has a [missing information - likely a design feature]. Multiple soldering clearance holes 321; the transfer mechanism 400 includes a component transfer assembly 420 and at least one cover plate moving assembly 430, wherein the component transfer assembly 420 is movable between the loading / unloading mechanism 100 and the transmission module 200, and includes component grippers 424; the cover plate moving assembly 430 is correspondingly disposed above the transmission module 200, and includes liftable cover plate grippers 433 for disassembling / assembling the cover plate; the soldering mechanism 500 is correspondingly disposed at the end of the transmission module 200, and includes a soldering gun 530, which can pass through the soldering clearance holes 321 into the fixture 300 to solder components.

[0023] The component soldering equipment shown in this embodiment uses a loading / unloading mechanism 100 to load components to be soldered or to unload soldered components. A component transfer assembly 420 transfers components between the loading / unloading mechanism 100 and the transfer module 200. A cover plate moving assembly 430 assembles the soldering cover plate 320 on the fixture 300 before soldering to ensure that the soldering mechanism 500 can precisely operate at a predetermined position through the soldering avoidance holes 321 on the soldering cover plate 320, while protecting other positions. Furthermore, the soldering cover plate 320 can be removed after soldering by the cover plate moving assembly 430 to facilitate component unloading. Based on the cooperation between the above structures, a continuous and orderly component soldering process can be achieved. The design of the soldering cover plate 320 also significantly improves soldering accuracy. Compared with current conventional soldering technologies, this application has advantages such as high automation, strong processing continuity, high soldering accuracy, and strong controllability.

[0024] See Figures 1 to 3As shown, the component soldering equipment in this embodiment includes a machine base 600, multiple transmission modules 200, and multiple soldering mechanisms 500. The machine base 600 is equipped with a control mechanism. The loading / unloading mechanism 100, the transfer mechanism 400, the transmission modules 200, and the soldering mechanisms 500 are respectively disposed on the machine base 600 and connected to the control mechanism. The multiple transmission modules 200 are symmetrically disposed on both sides of the loading / unloading mechanism 100 and are arranged in parallel intervals. The multiple soldering mechanisms 500 are respectively disposed at both ends of the multiple transmission modules 200. Each transmission module 200 is provided with two fixtures 300. The transfer mechanism 400 includes multiple cover plate moving components 430, which are disposed one-to-one above the multiple transmission modules 200. Based on this structural design, this embodiment not only avoids the space waste of traditional distributed layouts, but also enables real-time data exchange and precise action linkage among various mechanisms through a unified control mechanism. For example, it can automatically adjust the grasping rhythm of the transfer component and synchronously trigger the start and stop of the transmission module 200, effectively ensuring the accuracy of the entire process.

[0025] Furthermore, multiple transmission modules 200 are symmetrically arranged on both sides of the loading / unloading mechanism 100 and arranged in parallel intervals to form a multi-directional parallel processing channel. The loading / unloading mechanism 100 can sequentially supply materials to the multiple transmission modules 200 on both sides. When the left module is being soldered, the right module can simultaneously complete loading or cover plate assembly, completely breaking the capacity bottleneck of single module waiting for idleness. At the same time, the loading / unloading mechanism 100 is located at the center of symmetry, and the transfer components can achieve bidirectional material feeding without long-distance cross-regional movement, further improving its operating efficiency.

[0026] In this embodiment, eight soldering mechanisms 500 are respectively set at both ends of four transmission modules 200. They can flexibly adjust the processing method according to the distribution of component electrode sheets. When a jig 300 is provided on the transmission module 200, the electrode sheets at both ends of the PCB board can be soldered in sequence. It can realize the processing flow of soldering the front side at one end and the back side at the other end. In addition, when a soldering mechanism 500 at one end experiences a brief failure, it can be temporarily switched to the other end component to continue operation, which greatly reduces the equipment idle time and ensures production continuity. It is especially suitable for large-scale scenarios with high requirements for production capacity stability. Correspondingly, when any transmission module 200 is equipped with two fixtures 300, they are arranged one after the other along the transmission direction. With the station switching function of the transmission module 200, an overlapping operation mode can be realized, in which the front fixture 300 is soldered and the rear fixture 300 is prepared. When the front fixture 300 is completed and moved to the cover plate disassembly station, the rear fixture 300 can be moved to the soldering station to start soldering. The loading, soldering and unloading cycle time of a single transmission module 200 is shortened compared with the traditional single fixture 300 module, thereby significantly improving the processing efficiency of a single module per unit time.

[0027] In actual production and processing, operators can adjust the above structure in real time through the control mechanism, thereby improving the flexibility of the equipment. They can also preset parameters through the control mechanism, thereby improving the automation level of the equipment.

[0028] In this embodiment, the loading and unloading mechanism 100 is the starting and ending point of the material flow of the entire equipment. Its core function is to realize the orderly supply of components to be soldered and the centralized transmission of components after soldering. Specifically, in this embodiment, the loading and unloading mechanism 100 includes a loading and unloading module 110, a carrier tray 120 and at least two material detectors 130. The two ends of the loading and unloading mechanism 100 are respectively connected to the component supply equipment for receiving soldered components and the component collection equipment after soldering. The carrier tray 120 is slidably connected to the loading and unloading module 110 and carries components on it. At least two material detectors 130 are respectively arranged at both ends of the loading and unloading module 110.

[0029] The loading and unloading mechanism 100, through the combination of the loading and unloading module 110, the carrier tray 120, and at least two material detectors 130, constructs a complete material channel from external material supply to internal transfer and then to finished product output. The loading and unloading module 110, as the core bearing and conveying structure, provides a stable sliding track for the carrier tray 120. The carrier tray 120, as the direct carrier for components, can be designed with appropriate grooves or positioning structures according to the size and shape of the components to be soldered, ensuring uniform posture and accurate positioning of components when placed on the carrier tray 120, avoiding deviations in the subsequent gripping by the transfer mechanism 400 due to disordered material placement. Simultaneously, the design of the carrier tray 120 slidingly connected to the loading and unloading module 110 allows the carrier tray 120 to move along the module's direction... The loading and unloading mechanism 110 allows for smooth movement of components. When components to be soldered are transported from external supply equipment to the loading / unloading mechanism 100, the carrier tray 120 can move to the docking end to receive the material, and then slide to a preset station near the transfer mechanism 400, facilitating precise gripping by the component grippers 424 of the transfer assembly. Conversely, after the soldered finished components are returned to the carrier tray 120 via the transfer mechanism 400, the carrier tray 120 can also slide along the module to one end of the docking collection equipment to complete the finished product output. The entire process requires no manual intervention in material handling, significantly improving material flow efficiency. At least two material detectors 130 are respectively set at both ends of the loading / unloading module 110 to monitor the component loading and unloading process.

[0030] See Figure 4As shown, the transmission module 200 is a conveyor belt that drives the fixture 300 along a preset path, providing stable linear conveying power for the fixture 300 and enabling the orderly flow of the fixture 300 between multiple stations, such as component placement, cover plate assembly, soldering operation, cover plate removal, and component removal. The fixture 300 is the core structure that directly carries the components and ensures the soldering accuracy. It consists of a body 310 and a soldering cover plate 320. The two work together to fix the components, expose the electrodes, and protect the non-soldering areas.

[0031] Specifically, the diameter, position, and number of the soldering avoidance holes 321 on the cover plate are perfectly matched to the electrode parameters of the components within the fixture 300. Only the electrodes requiring soldering are exposed through these avoidance holes, providing a single working channel for the soldering torch 530 and physically preventing the torch from accidentally contacting non-soldering areas. After the cover plate is placed on the body 310, it covers the non-electrode areas of the components, preventing solder from splashing into these areas and causing short circuits during soldering. It also prevents the high temperature of the soldering torch 530 from damaging the material of the non-soldering areas.

[0032] See Figures 5 to 7 As shown, the main body 310 includes a support platform 311, two fixed clamping plates 312, and a clamping driver 313. The bottom of the support platform 311 is slidably connected to the transmission module 200 via a sliding plate 330. The clamping driver 313 is disposed on the sliding plate 330. The two fixed clamping plates 312 are located on both sides of the support platform 311 in the width direction and are respectively connected to the two working ends of the clamping driver 313 to move relatively closer / away. The support platform 311 serves as a direct support platform for components. Its top surface can be designed with a suitable positioning reference according to the outline of the component to be soldered, thus initially defining its placement position on the support platform 311. The cooperation between the two fixed clamping plates 312 and the clamping driver 313 solves the potential loosening problem that may occur when relying solely on the support platform 311 for positioning: the two fixed clamping plates 312 are located on both sides of the support platform 311 in the width direction and are directly connected to the two working ends of the clamping driver 313, which provides a stable and adjustable clamping force. After the component is placed into the support platform 311 by the transfer mechanism 400 and initially positioned, the clamping driver 313 is activated, driving the two fixed clamping plates 312 to move closer to each other along the width direction of the support platform 311, applying uniform clamping force from both sides of the component, and firmly fixing it to the support platform 311; if it is necessary to replace the component with a component of different width specifications in the future, the distance between the two fixed clamping plates 312 can be changed by adjusting the stroke of the clamping driver 313 through the control mechanism, so as to achieve compatible fixing of components of different sizes without replacing the entire fixture body 310, which greatly improves the versatility of the fixture 300.

[0033] Furthermore, the support platform 311 has multiple limiting blocks 316 along its edge to enclose an accommodating space. The body 310 also includes a pushing block 314 and a pushing driver 315. The pushing driver 315 is connected to the slide plate 330 and located at one end of the support platform 311 along its length. The pushing block 314 is connected to the working end of the pushing driver 315 and can move toward / away from the accommodating space. The multiple limiting blocks 316 along the edge of the support platform 311 enclose an accommodating space for the components, thus constructing a preliminary positioning framework for the components in terms of spatial outline. The pushing block 314 and the pushing driver 315 provide active clamping and positioning for the components along the length of the support platform 311, compensating for the shortcomings of positioning solely by the limiting blocks 316 and the fixing plate 312. When there are slight differences in the size of the components, the push block 314 can push the components of different sizes to a uniform reference position in the length direction through adaptive pushing, which solves the problem of inconsistent positioning caused by the individual size deviation of the components.

[0034] Furthermore, in this embodiment, the support platform 311 has multiple positioning pins 317 along its edge. These positioning pins 317 include at least two different diameters. The solder cover plate 320 has multiple positioning holes, each corresponding to one of the positioning pins 317. The multiple positioning pins 317 along the edge of the support platform 311 serve as precise positioning references for the assembly of the solder cover plate 320, forming a one-to-one matching relationship with the multiple positioning holes on the solder cover plate 320. When the cover plate moving assembly 430 moves the solder cover plate 320 to close onto the support platform 311, the positioning holes on the cover plate must precisely engage with the positioning pins 317 of the support platform 311 to complete the initial positioning of the cover plate and the support platform 311. This pin-hole matching structure can strictly limit the assembly position of the solder cover plate 320 in space, ensuring that the solder avoidance holes 321 on the cover plate are completely aligned with the electrode positions of the components within the accommodating space of the support platform 311. Meanwhile, the locating pins 317 also provide vertical support for the soldering cover plate 320, preventing it from sinking or tilting due to its own weight or minor external impacts after the cover plate is closed, thus ensuring the stability of the soldering torch 530 when passing through the clearance holes. The design of multiple locating pins 317 with at least two diameters enables foolproof assembly between the soldering cover plate 320 and the body 310, completely eliminating the risk of reverse or misaligned assembly of the soldering cover plate 320. The differentiated arrangement of the at least two diameter locating pins 317, along with the corresponding differentiated arrangement of the locating holes in the soldering cover plate 320 with the same diameter, ensures that the locating holes of different diameters can only be fitted with the corresponding diameter locating pins 317 when the cover plate's orientation and position are completely correct, thereby completely preventing incorrect assembly from a physical structural perspective.

[0035] See Figure 8As shown, the transfer mechanism 400 in this embodiment is a power component connecting the loading / unloading mechanism 100, the transmission module 200, and the fixture 300. It includes a transfer frame 410, with a transfer module 411 on one side and the cover plate moving assembly 430 connected to the other side. The transfer module 411 is located above the extension path of the loading / unloading mechanism 100 and the transmission module 200. The component transfer assembly 420 is slidably connected to the transfer module 411. The transfer frame 410 provides a stable mounting reference for the transfer module 411, ensuring that the transfer module 411 can be accurately positioned above the extension path of the loading / unloading mechanism 100 and the transmission module 200, forming a transfer track spanning at least two workstations.

[0036] Specifically, see Figure 9 As shown, the component transfer assembly 420 includes a slide 421, a first lifting module 422, component grippers 424, and a component detector 425. The slide 421 is slidably connected to the transfer module 411. The first lifting module 422 is disposed on the slide 421, and its end is provided with a first lifting driver 423 to drive the component grippers 424 to move up and down. The two component grippers 424 can open and close relative to each other to form a component clamping space. The component detector is connected to the component grippers 424 and is positioned towards the component clamping space. The slide 421 serves as the moving carrier of the component transfer assembly 420. By sliding it to the transfer module 411, it provides a stable horizontal movement foundation for the entire assembly. The slide 421 can drive the first lifting module 422, component grippers 424, and other components to slide horizontally along a preset path, and the sliding process is precisely controlled by the transfer module 411.

[0037] The first lifting module 422, mounted on the slide 421, drives the component gripper 424 to move up and down via the first lifting driver 423 at its end. When the slide 421 moves the component above the tray 120 of the loading and unloading mechanism 100, the first lifting driver 423 drives the component gripper 424 to descend vertically until the gripper reaches a height where it can grasp the component. After grasping, the driver then drives the gripper to rise vertically to avoid collisions between the component and other parts during horizontal transfer. When the slide 421 moves above the fixture 300 of the transfer module 200, the driver drives the gripper to descend again to accurately place the component into the receiving space of the fixture 300.

[0038] Two relatively movable component grippers 424 form a gripping space adapted to the component, enabling stable gripping and release of the component. A component detector 425, connected to the component grippers 424 and facing the gripping space, is used to detect the status of the component within the gripping space. If an abnormal component posture is detected, the grippers can be triggered to readjust, or feedback can be sent to the control mechanism to prompt manual intervention, preventing components with abnormal postures from affecting the positioning, cover plate assembly, and soldering accuracy of the fixture 300 after being placed in the fixture 300.

[0039] Correspondingly, see Figure 10 and Figure 11 As shown, the cover plate moving assembly 430 includes a second lifting driver 431, a second lifting module 432, a cover plate gripper 433, and a cover plate detector 434. The second lifting driver 431 and the second lifting module 432 are both mounted on the carriage 421. The cover plate gripper 433 is connected to the working end of the second lifting driver 431 and moves along the second lifting module 432. The two cover plate grippers 433 can open and close relative to each other to form a cover plate clamping space. Each cover plate gripper 433 is provided with a connecting groove 4331. The edge of the soldered cover plate 320 can be engaged in the connecting groove 4331. The cover plate detector is connected to the cover plate gripper 433 and is positioned towards the cover plate clamping space. The cover plate moving assembly 430, through the coordinated design of the second lifting drive 431, the second lifting module 432, the openable and closable cover plate gripper 433 with connecting groove 4331 and the cover plate detector 434, completes the flow of the cover plate from the storage position to the fixture 300 and then from the fixture 300 to the recycling position.

[0040] Specifically, the second lifting driver 431 provides lifting power to the cover plate gripper 433, while the second lifting module 432 provides stable guidance for the lifting of the cover plate gripper 433. When it is necessary to grab the soldered cover plate 320, the second lifting driver 431 drives the cover plate gripper 433 to descend vertically along the second lifting module 432 to the cover plate storage position, ensuring that the gripper is accurately aligned with the cover plate. After the grabbing is completed, the driver drives the gripper to rise along the module to avoid the cover plate colliding with other components during horizontal movement. When it moves above the fixture 300, the driver drives the gripper to descend along the module again to accurately close the cover plate on the support platform 311 of the fixture 300, or remove the cover plate from the fixture 300 and then rise and retract it.

[0041] Two relatively movable cover plate grippers 433, in conjunction with connecting grooves 4331 on the grippers, form a stable clamping structure for the solder cover plate 320. The edge of the solder cover plate 320 can be precisely engaged in the connecting grooves 4331. The depth and width of the connecting grooves 4331 match the thickness and width of the cover plate edge, which not only restricts the vertical displacement of the cover plate within the clamping space through the groove walls, but also prevents the grippers from directly pressing on the cover plate surface and causing deformation. Especially for cover plates with positioning holes, the connecting grooves 4331 can avoid the positioning hole positions, preventing damage to the edges of the positioning holes during clamping. A cover plate detector 434, connected to the cover plate grippers 433 and facing the cover plate clamping space, is used to confirm whether the grippers have successfully gripped the cover plate. If no cover plate is detected in the clamping space, a signal will be sent to the control mechanism immediately to prevent the empty grippers from moving above the fixture 300 and causing the process to stop.

[0042] In this embodiment, see Figure 12 As shown, the soldering mechanism 500 achieves high-precision soldering through the cooperation of the soldering gun 530 and the cover plate of the fixture 300. It also includes a mounting frame 510 and an adjustment component 520. The mounting frame 510 is located at the end of the transmission module 200. The adjustment component 520 includes a horizontal module 521 and a vertical module 522. The horizontal module 521 extends along the width direction of the transmission module 200, and the vertical module 522 is slidably connected to the horizontal module 521 and extends along the height direction of the soldering mechanism 500. The soldering gun 530 is slidably connected to the vertical module 522. Based on the existing structure of the cover plate moving component 430, the mounting frame 510 and the adjustment component 520 further enhance the precise control capability of the soldering gun 530's working position. The mounting frame 510, as the basic load-bearing structure of the adjustment component 520 and the soldering gun 530, provides a stable and precise installation reference for the entire adjustment system by being located at the end of the transmission module 200.

[0043] The horizontal module 521 and vertical module 522 in the adjustment assembly 520 achieve flexible and precise control of the position of the soldering gun 530 through a two-dimensional adjustment structure in both the horizontal and vertical directions. Furthermore, before soldering, the descent depth of the soldering gun 530 can be adjusted according to the height of the component electrode and the thickness of the soldering cover plate 320 to ensure that the soldering gun 530 can pass through the clearance hole and reach the electrode welding position precisely, avoiding collision between the soldering gun 530 and the cover plate or failure to contact the electrode due to improper height.

[0044] Example 2:

[0045] This embodiment provides a component soldering method, which uses the component soldering equipment described in Embodiment 1 to perform component soldering processing, and includes: Step S1: The components to be soldered are transferred to the working range of the component transfer assembly 420 by the loading and unloading mechanism 100. Step S2: The component to be soldered is moved from the loading and unloading mechanism 100 to the fixture body 310 via the component transfer assembly 420; Step S3: Move the jig 300 body 310 to the working range of the cover plate moving assembly 430 through the transmission module 200, and then fasten the solder cover plate 320 onto the body 310 through the cover plate moving assembly 430. Step S4: After the jig 300 with the solder cover 320 fastened is moved to the working range of the soldering mechanism 500 by the transmission module 200, the soldering gun 530 is driven to pass through the soldering avoidance hole 321 on the solder cover 320 and into the jig 300 to solder the components. Step S5: The jig 300 containing the soldered components is moved back to the working range of the cover plate moving assembly 430 by the transfer module 200, and then the solder cover plate 320 is removed from the body 310 by the cover plate moving assembly 430. Step S6: The jig 300 body 310 for removing the solder cover 320 is moved again to the working range of the component transfer assembly 420 via the transfer module 200. Step S7: The soldered components are moved from the body 310 to the loading / unloading mechanism 100 by the component transfer assembly 420, and the unloading is completed by the loading / unloading mechanism 100.

[0046] In summary, the component soldering equipment and method of the present invention uses the loading and unloading mechanism 100 to load components to be soldered or to unload components after soldering. The component transfer assembly 420 transfers components between the loading and unloading mechanism 100 and the transfer module 200. The cover plate moving assembly 430 assembles the soldering cover plate 320 on the fixture 300 before soldering to ensure that the soldering mechanism 500 can operate precisely at a predetermined position through the soldering avoidance holes 321 on the soldering cover plate 320, while protecting other positions. In addition, the soldering cover plate 320 can also be removed by the cover plate moving assembly 430 after soldering to facilitate component unloading. Based on the cooperation between the above structures, a continuous and orderly component soldering process can be achieved. At the same time, the design of the soldering cover plate 320 can significantly improve the soldering accuracy. Compared with the current conventional soldering technology, this application has the advantages of high automation, strong processing continuity, high soldering accuracy and strong controllability, which can effectively improve the quality and efficiency of soldering and has broad application prospects in this industry.

[0047] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A component soldering equipment, characterized in that: include: The machine base, loading and unloading mechanism, transfer mechanism, multiple transmission modules, multiple fixtures, and multiple soldering mechanisms; Multiple transmission modules are symmetrically arranged on both sides of the loading and unloading mechanism and are arranged in parallel intervals. Each transmission module is provided with at least one fixture, which includes a body and a solder cover plate. The body is slidably connected to the transmission module, and the components are disposed inside the body. The solder cover plate is detachably connected to the body and is provided with multiple solder avoidance holes. The transfer mechanism includes a component transfer assembly, a transfer frame, and multiple cover plate moving assemblies. One side of the transfer frame has a transfer module, and the other side is connected to the cover plate moving assemblies. The transfer module is located above the extension path of the loading / unloading mechanism and the transmission module. The component transfer assembly, movable between the loading / unloading mechanism and the transmission module, includes a slide, a first lifting module, component grippers, and a component detector. The slide is slidably connected to the transfer module. The first lifting module is mounted on the slide and has a first lifting driver at its end to drive the component grippers to move up and down. Two component grippers can open and close relative to each other to form a component clamping space. The component detector is connected to... The component grippers are positioned on the component clamping space; multiple cover plate moving assemblies are correspondingly positioned above the multiple transmission modules. Each cover plate moving assembly includes a second lifting driver, a second lifting module, cover plate grippers, and a cover plate detector. The second lifting driver and the second lifting module are both positioned on the carriage. The cover plate grippers are connected to the working end of the second lifting driver and move along the second lifting module. Two cover plate grippers can open and close relative to each other to form a cover plate clamping space. Each cover plate gripper has a connecting groove, and the edge of the soldered cover plate can be engaged in the connecting groove. The cover plate detector is connected to the cover plate gripper and is positioned towards the cover plate clamping space. Multiple soldering mechanisms are respectively disposed at both ends of multiple transmission modules. Each soldering mechanism includes a soldering gun, which can pass through the soldering clearance hole into the fixture to solder components.

2. The component soldering equipment according to claim 1, characterized in that: The loading and unloading mechanism includes a loading and unloading module, a carrier tray, and at least two material detectors. The two ends of the loading and unloading mechanism are respectively connected to a soldering component supply device and a soldering component collection device. The carrier tray is slidably connected to the loading and unloading module and carries the components. The at least two material detectors are respectively disposed at the two ends of the loading and unloading module.

3. The component soldering equipment according to claim 1, characterized in that: The main body includes a support platform, two fixed clamping plates, and a clamping driver. The bottom of the support platform is slidably connected to the transmission module via a sliding plate. The clamping driver is disposed on the sliding plate. The two fixed clamping plates are located on both sides of the support platform in the width direction and are respectively connected to the two working ends of the clamping driver so as to move relatively closer to / away from each other.

4. The component soldering equipment according to claim 3, characterized in that: The support platform is provided with multiple limiting blocks at its edge to enclose the accommodating space. The main body also includes a push block and a push driver. The push driver is connected to the slide plate and is located at one end of the support platform along its length. The push block is connected to the working end of the push driver and can move toward / away from the accommodating space.

5. The component soldering equipment according to claim 3, characterized in that: The support platform has multiple positioning pins on its edge, and the multiple positioning pins include at least two diameters. The solder cover plate has multiple positioning holes, and the multiple positioning holes are set one-to-one with the multiple positioning pins.

6. The component soldering equipment according to claim 1, characterized in that: The soldering mechanism further includes a mounting frame and an adjustment component. The mounting frame is disposed at the end of the transmission module. The adjustment component includes a horizontal module and a vertical module. The horizontal module extends along the width direction of the transmission module. The vertical module is slidably connected to the horizontal module and extends along the height direction of the soldering mechanism. The soldering gun is slidably connected to the vertical module.

7. A method for soldering electronic components, characterized in that: Soldering of components using the component soldering equipment according to any one of claims 1 to 6 includes: Step S1: The components to be soldered are transferred to the working range of the component transfer assembly by the loading and unloading mechanism. Step S2: Move the components to be soldered from the loading and unloading mechanism to the fixture body through the component transfer assembly; Step S3: Move the fixture body to the working range of the cover plate moving assembly through the transmission module, and then fasten the solder cover plate onto the body through the cover plate moving assembly; Step S4: After the fixture with the soldering cover plate fastened is moved to the working range of the soldering mechanism by the transmission module, the soldering gun is driven to pass through the soldering clearance hole on the soldering cover plate into the interior of the fixture to solder the components. Step S5: Move the fixture containing the soldered components back to the working range of the cover plate moving assembly through the transfer module, and then remove the solder cover plate from the body through the cover plate moving assembly. Step S6: Move the jig body with the solder cover removed back to the working range of the component transfer assembly through the transfer module. Step S7: Move the soldered components from the body to the loading / unloading mechanism via the component transfer assembly, and complete the unloading via the loading / unloading mechanism.

Images