Method for stacking material, electronic device and processing system
By calculating the target rotation angle and controlling the robot, efficient stacking of sheet materials was achieved, solving the problems of pin damage and low flipping efficiency, and improving the efficiency and space utilization of the material processing system.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HANS CNC SCI & TECH
- Filing Date
- 2025-09-19
- Publication Date
- 2026-07-14
AI Technical Summary
In the prior art, sheet materials are damaged on the surface when stacked due to protruding pins, and the low space utilization of multi-layer material racks or the need for flipping operations reduces efficiency.
By acquiring material dimensions and pin information, the target rotation angle is calculated so that the pin projection area of adjacent materials is outside the contour projection area, avoiding flipping operations. Robots and control equipment are used for precise rotation and stacking.
It improves the efficiency of material loading and unloading, avoids damage to the material surface by pins, and optimizes space utilization.
Smart Images
Figure CN121044352B_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of material processing technology, and in particular relates to a method for stacking materials, electronic equipment, and processing system. Background Technology
[0002] In the field of material processing, to neatly and securely fix sheet materials together, pin holes are machined on opposite edges of the materials, and pins are driven into them. For positioning, the pins need to protrude a certain distance from the workpiece surface; however, protruding pins can easily damage the material surface during stacking. Some related technologies use multi-layer racks to avoid this problem. However, multi-layer racks have low space utilization and cannot temporarily store large amounts of material. Other related technologies stack materials in opposite directions, thus eliminating the need for multi-layer racks. However, this method requires flipping the materials during stacking and loading, leading to reduced loading and unloading efficiency. Summary of the Invention
[0003] This application provides a method, apparatus, robot, and product for stacking materials, which can improve the efficiency of material loading and unloading.
[0004] The first aspect of this application provides a method for stacking materials, including: acquiring the size information of the materials and pin information of pins disposed on the materials; determining a target rotation angle based on the size information and the pin information, wherein the target rotation angle is used to rotate the materials to be stacked about a target rotation axis such that the pin projection area of materials stacked adjacent to the materials to be stacked is located outside the contour projection area of the materials to be stacked, and the target rotation axis is the normal line of the material surface passing through the center point of the material surface; and performing a stacking operation on the materials to be stacked based on the target rotation angle.
[0005] In some embodiments of the first aspect, the size information includes the length and width of the material, and the pin information includes the diameter of the pin and the distance between the pin and the material boundary; determining the target rotation angle based on the size information and the pin information includes: determining, based on the length and width of the material, the diameter of the pin, and the distance between the pin and the material boundary, the minimum rotation angle that causes the pin projection area of the adjacent stacked materials to be located outside the contour projection area of the material to be stacked; and determining the target rotation angle based on the minimum rotation angle.
[0006] In some embodiments of the first aspect, determining the minimum rotation angle that causes the pin projection area of the adjacent stacked materials to be located outside the outline projection area of the material to be stacked, based on the length and width of the material, the diameter of the pin, and the distance between the pin and the material boundary, includes: calculating the sum of the width of the material and the diameter of the pin to obtain a sum value; subtracting the length of the material from twice the distance between the pin and the material boundary to obtain a difference value; and calculating the arcsine function of the ratio between the sum value and the difference value to obtain the minimum rotation angle.
[0007] In some embodiments of the first aspect, determining the target rotation angle based on the minimum rotation angle includes: adjusting the minimum rotation angle according to a preset offset to obtain the target rotation angle.
[0008] In some embodiments of the first aspect, determining the target rotation angle based on the minimum rotation angle includes: determining a rotation angle range based on the minimum rotation angle; and determining the target rotation angle within the rotation angle range.
[0009] In some embodiments of the first aspect, the pin information further includes the height of the pin relative to the material surface; the size information further includes the height of the material; determining the rotation angle range based on the minimum rotation angle includes: determining the minimum number of material-sized gaps between pins at the same position in the normal direction of the material surface based on the height of the pin relative to the material surface and the height of the material; determining the maximum rotation angle based on the minimum number of material-sized gaps; and determining the rotation angle range based on the minimum rotation angle and the maximum rotation angle.
[0010] In some embodiments of the first aspect, determining the target rotation angle within the rotation angle range includes: determining a plurality of candidate angles within the rotation angle range; determining the duration of a single rotation when rotating at each candidate angle, and the size of the space occupied by the stacked material when stacking at each candidate angle; and determining the target rotation angle from the plurality of candidate angles based on the size of the space occupied and the duration of a single rotation corresponding to each candidate angle.
[0011] A second aspect of this application provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor; the processor executes the computer program to implement the steps of the above-described method for stacking materials.
[0012] A third aspect of this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the above-described material stacking method.
[0013] A fourth aspect of this application provides a computer program product that, when run, causes the stacking method of the materials described above to be executed.
[0014] A fifth aspect of this application provides a processing system, comprising: a loading / unloading robot, the loading / unloading robot including a robot body and a base plate; the robot body has an integrated controller for executing the steps of the material stacking method as described in any of the first aspects, the robot body is connected to an end effector for moving the material; and the base plate is used to support the material and the robot body.
[0015] A sixth aspect of this application provides a processing system, comprising: a control device connected to a loading / unloading robot, the control device being configured to perform steps of a material stacking method as described in any of the first aspects; the loading / unloading robot comprising a robot body and a base plate; the robot body being connected to an end effector for moving materials; and the base plate for supporting the materials and the robot body.
[0016] In some embodiments of the fifth or sixth aspect, the processing system further includes a drilling device; the base plate is also used to move between the loading / unloading area of the drilling device and the material stacking area of the loading / unloading robot; the loading / unloading robot is used to move the material carried on the base plate to the processing platform of the drilling device, or to stack the material on the processing platform of the drilling device onto the base plate when the base plate is located in the loading / unloading area; the drilling device is used to perform drilling operations on the material on the processing platform.
[0017] In the embodiments of this application, a target rotation angle is determined based on the material's size information and the pin information of the pins set on the material. Based on this target rotation angle, the materials to be stacked are then stacked. The materials to be stacked can rotate around the normal to the material surface passing through its center point, ensuring that the pin projection area of adjacent stacked materials is outside the outline projection area of the materials to be stacked. This offsets the pins of the materials to be stacked from those of adjacent stacked materials without flipping them, preventing damage to the materials from the pins. This method eliminates the need for flipping operations during material loading and unloading, thus improving loading and unloading efficiency. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is a schematic diagram illustrating the implementation process of a material stacking method provided in an embodiment of this application;
[0020] Figure 2 This is a schematic diagram of the contour projection area and the pin projection area provided in the embodiments of this application;
[0021] Figure 3 This is a schematic diagram of rotating and stacking according to different degrees of rotation provided in the embodiments of this application;
[0022] Figure 4 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application;
[0023] Figure 5 This is a schematic diagram of the structure of a processing system provided in an embodiment of this application;
[0024] Figure 6 This is a schematic diagram of another processing system provided in an embodiment of this application. Detailed Implementation
[0025] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are protected by this application.
[0026] In the field of material processing, to neatly and securely fix sheet materials together, pin holes are machined on opposite edges of the materials, and pins are driven into them. For positioning, the pins need to protrude a certain distance from the workpiece surface; however, protruding pins can easily damage the material surface during stacking. Some related technologies use multi-layer racks to avoid this problem. However, multi-layer racks have low space utilization and cannot temporarily store large amounts of material. Other related technologies stack materials in opposite directions, thus eliminating the need for multi-layer racks. However, this method requires flipping the materials during stacking and loading, leading to reduced loading and unloading efficiency.
[0027] In view of this, this application proposes a material stacking method that can stagger the pins of the material to be stacked with those of the adjacent stacked materials without flipping them over, thereby avoiding damage to the materials by the pins and eliminating the need to perform flipping operations when loading and unloading materials, which helps to improve the efficiency of loading and unloading.
[0028] To illustrate the technical solution of this application, specific embodiments are described below.
[0029] Figure 1 The illustration shows a schematic diagram of the implementation process of a material stacking method provided in an embodiment of this application, which can be applied to electronic devices.
[0030] Specifically, the stacking method of the above materials may include the following steps S101 to S103.
[0031] Step S101: Obtain the size information of the material and the pin information of the pins set on the material.
[0032] The materials can be in sheet or plate form, and may include, but are not limited to, printed circuit boards (PCBs), aluminum sheets, and cardboard.
[0033] In the embodiments of this application, due to the requirements of the processing technology, the outlines of the stacked materials and the positions of the pins on the material surfaces are consistent. The pins can be located at the short edges of the materials. The material size information represents the individual dimensions of the materials to be stacked, and may include, but is not limited to, the length, width, and height of the materials. The pin information can represent the shape of the pin and its position on the material, and may include, but is not limited to, the pin diameter, the distance between the pin and the material boundary, and the height of the pin relative to the material surface.
[0034] It should be noted that the size information and pin information can be obtained from the material cutting process and process data, or through visual inspection. This application does not impose any restrictions on this.
[0035] Step S102: Determine the target rotation angle based on the size information and pin information.
[0036] The target rotation angle is used to rotate the materials to be stacked about the target rotation axis, so that the outline projection area of the pins of the materials stacked adjacent to the materials to be stacked is outside the outline projection area of the materials to be stacked. The target rotation axis is the normal to the material surface passing through the center point of the material surface.
[0037] The material to be stacked refers to any material that needs to be stacked. The materials stacked adjacent to the material to be stacked are those stacked on top of or below the material to be stacked.
[0038] The outline projection area of the pin and the outline projection area of the material to be stacked are projection areas obtained by projecting the outlines of the pins of the materials stacked adjacent to the material to be stacked, and the outlines of the materials to be stacked, onto the same plane along the normal direction of the material surface. For example, projecting the outline of the pin onto the horizontal plane yields the projection area of the pin, and projecting the outline of the material to be stacked onto the horizontal plane yields the projection area of the material to be stacked.
[0039] The projection area of the pin's outline is outside the projection area of the material to be stacked, indicating that the stacked material is viewed along the normal direction of the material surface. The pins of adjacent stacked materials can be offset from the material to be stacked. For example, as Figure 2 A schematic diagram of projection is shown, in which the material to be stacked and the adjacent stacked materials are projected onto a horizontal plane, and the outline projection area of the material to be stacked is outside the pin projection area of the adjacent stacked materials.
[0040] Step S103: Stack the materials to be stacked according to the target rotation angle.
[0041] Specifically, depending on the target rotation angle, the material to be stacked can be rotated around the target rotation axis, and the rotated material to be stacked can be stacked on the material stacked next to it. At this time, the outline projection area of the pins of the adjacent stacked material is outside the outline projection area of the rotated material to be stacked.
[0042] In the embodiments of this application, a target rotation angle is determined based on the material's size information and the pin information of the pins set on the material. Based on this target rotation angle, the materials to be stacked are then stacked. The materials to be stacked can rotate around the normal to the material surface passing through its center point, ensuring that the pin projection area of adjacent stacked materials is outside the outline projection area of the materials to be stacked. This offsets the pins of the materials to be stacked from those of adjacent stacked materials without flipping them, preventing damage to the materials from the pins. This method eliminates the need for flipping operations during material loading and unloading, thus improving loading and unloading efficiency.
[0043] In some embodiments of this application, dimensional information may include the length and width of the material. Pin information may include the diameter of the pin and the distance between the pin and the material boundary.
[0044] Accordingly, determining the target rotation angle based on the size information and pin information may include: determining the minimum rotation angle that makes the pin projection area of adjacent stacked materials located outside the outline projection area of the material to be stacked, based on the length and width of the material, the diameter of the pin, and the distance between the pin and the material boundary; and determining the target rotation angle based on the minimum rotation angle.
[0045] In the embodiments of this application, based on the length and width of the material, the diameter of the pin, and the distance between the pin and the material boundary, it is possible to analyze the position of the outline projection area of the material to be stacked after rotation when the material to be stacked is rotated at different angles, starting from the adjacent stacked material. This allows us to determine the angle at which the outline projection area of the material to be stacked just leaves the pin projection area of the adjacent stacked material after rotation, and this angle is the minimum rotation angle.
[0046] Specifically, based on the length and width of the material, the diameter of the pin, and the distance between the pin and the material boundary, the minimum rotation angle is determined so that the pin projection area of adjacent stacked materials is outside the outline projection area of the material to be stacked. This can include: calculating the sum of the width of the material and the diameter of the pin to obtain the sum value; subtracting the length of the material from twice the distance between the pin and the material boundary to obtain the difference value; and calculating the arcsine function of the ratio between the sum value and the difference value to obtain the minimum rotation angle.
[0047] In other words, the minimum rotation angle φ can be expressed as φ=arcsin((W+d) / (L-2a)). Where W is the width of the material, d is the diameter of the pin, L is the length of the material, and a is the distance between the pin and the boundary of the material.
[0048] For details, please refer to Figure 2 Let the origin O(0,0) be the center point of the surface of the adjacent stacked materials. Then the outline range of the adjacent stacked materials is (-L / 2,L / 2) and (-W / 2,W / 2). The center coordinates of the two pins are (±(L / 2-a),0). When the center point of the surface of the material to be stacked coincides with the center point of the surface of the first material, the coordinates of the pin in the first quadrant when rotated to a position where there is no interference are ((L / 2-a)cosφ,(L / 2-a)sinφ). Based on the inequality (L / 2-a)sinφ-d / 2≥W / 2, the minimum rotation angle φ=arcsin((W+d) / (L-2a)) can be obtained.
[0049] In some embodiments of this application, determining the target rotation angle based on the minimum rotation angle may include using the minimum rotation angle as the target rotation angle. This allows the stacked materials to be rotated at the minimum rotation angle, which helps to increase the rotation speed and thus improve loading and unloading efficiency.
[0050] In some other embodiments of this application, determining the target rotation angle based on the minimum rotation angle may include: adjusting the minimum rotation angle according to a preset offset to obtain the target rotation angle.
[0051] The offset is a preset value in degrees, such as 0.5° or 0.3°. The preset offset is added to the minimum rotation angle, and the resulting value can be used as the target rotation angle. Thus, by making a small offset based on the minimum rotation angle, the collision between the pin and the material surface can be avoided due to tolerance and control accuracy issues when directly applying the minimum rotation angle.
[0052] In some other embodiments of this application, determining the target rotation angle based on the minimum rotation angle may include: determining a rotation angle range based on the minimum rotation angle, and determining the target rotation angle within the rotation angle range.
[0053] Understandably, the minimum rotation angle can serve as the lower limit of the rotation angle range to prevent the pin from damaging the material, while the upper limit of the rotation angle range can be set based on experience, such as 90°, 60°, etc. Within the rotation angle range, an angle can be selected as the target rotation angle.
[0054] In some embodiments of this application, considering that a larger rotation degree means the material needs fewer rotations to reach 180°, and since the pins are symmetrically arranged on both sides of the material, when the material rotates 180°, it can be considered that the pins return to the same position. The pins tend to protrude a certain height from the material surface. The fewer the layers between two materials with pins at the same position, the smaller the height difference between the two materials. If the height difference is less than the height of the pin protruding from the material surface, the pin can cross over the middle layer of material and damage other materials with the pin at the same position.
[0055] For example, when the rotation degree is 90°, after two rotations the material rotates 180°, which means that the pins of the first layer of material and the third layer of material are in the same position, with a layer of material in between. Assuming that the height of the pin protruding from the material surface is 5mm and the height of the material layer is 3mm, it is obvious that even with a layer in between, the pin of the first layer of material will still damage the third layer of material.
[0056] Therefore, the aforementioned pin information may also include the height of the pin relative to the material surface. Dimensional information may also include the height of the material.
[0057] At this point, determining the rotation angle range based on the minimum rotation angle may include: determining the minimum number of material gaps between pins at the same position in the normal direction of the material surface based on the height of the pin relative to the material surface and the height of the material; determining the maximum rotation angle based on the minimum number of material gaps; and determining the rotation angle range based on the minimum and maximum rotation angles.
[0058] Specifically, dividing the height of the pin relative to the material surface by the height of the material and rounding up yields the minimum number of material pieces between pins at the same position in the normal direction. For example, if the height of the pin relative to the material surface is 5mm and the height of the material is 3mm, then the minimum number of material pieces is 2. Based on this minimum number of material pieces, the maximum rotation angle can then be determined.
[0059] For example, the maximum rotation angle can be expressed as 180° / (x+1), where x is the minimum number of materials between the pins. For instance, when the minimum number of materials between the pins is 2, the maximum rotation angle can be expressed as 60°. In this case, after the materials have rotated 180° three times, the number of materials between the two materials with the pins in the same position is 2, which can prevent the pins from damaging the materials.
[0060] By setting the minimum and maximum rotation angles as the lower and upper limits of the rotation angle range, respectively, angle selection can be performed within this range. For example, angles such as 30° and 45°, which are easy for the robotic arm to control, can be selected as the target rotation angle, thus providing more possibilities for the rotation of the target angle to adapt to different scenarios.
[0061] Understandably, within the rotation angle range, a smaller rotation degree results in higher loading and unloading efficiency. Please refer to [reference needed]. Figure 3 , Figure 3 The diagrams show the stacking operations at 90° and 60° respectively, combined with... Figure 3 It is readily apparent that different rotation angles result in different minimum bounding rectangle areas for the outline projection region of the stacked materials. For example, when stacked by rotation at 90°, the minimum bounding rectangle area of the outline projection region is smaller than that when stacked by rotation at 60°, thus saving more space.
[0062] In view of this, in some embodiments, determining the target rotation angle within the rotation angle range may include: determining multiple candidate angles within the rotation angle range; determining the duration of a single rotation when rotating at each candidate angle, and the size of the space occupied by the stacked material when stacking at each candidate angle; and determining the target rotation angle among the multiple candidate angles based on the size of the space occupied and the duration of a single rotation corresponding to each candidate angle.
[0063] Multiple candidate angles can be selected within the rotation angle range according to a preset step size, for example, every 3° is a candidate angle.
[0064] For each candidate angle θ, the duration of a single rotation when rotating at each candidate angle can be determined. Specifically, the angular velocity ω of the robotic arm can be obtained, and the duration of a single rotation t = θ / ω.
[0065] For each candidate angle θ, the required space can be determined by calculating the outer contour of the material pile formed by rotating N times and stacking N times accordingly, projected onto a plane along the normal direction of the material surface, and then calculating the minimum bounding rectangle of this outer contour. N is the total number of materials stacked together in each group, or the number of rotations required to rotate the material 180°. For example... Figure 3 In the case where the rotation angle is 90° and N = 2, the minimum bounding rectangle of the outer contour becomes a square with the length L of the material.
[0066] At this point, based on the space occupied and the single rotation duration corresponding to each candidate angle, each candidate angle can be scored. For example, the space occupied and the single rotation duration can be weighted to select the candidate angle with the highest score from multiple candidate angles as the target rotation angle.
[0067] In this way, both material loading and unloading efficiency and space cost can be balanced.
[0068] It should be noted that, for the sake of simplicity, the aforementioned method embodiments are described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, because based on this application, some steps can be performed in other orders.
[0069] like Figure 4 The diagram shown is a schematic representation of an electronic device provided in an embodiment of this application. Specifically, the electronic device 4 may include: a processor 40, a memory 41, and a computer program 42 stored in the memory 41 and executable on the processor 40, such as a material stacking program. When the processor 40 executes the computer program 42, it implements the steps in the various material stacking method embodiments described above, for example... Figure 1 Steps S101 to S103 are shown.
[0070] The computer program can be divided into one or more modules / units, which are stored in the memory 41 and executed by the processor 40 to complete this application. The one or more modules / units can be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program in the electronic device.
[0071] The electronic device may include, but is not limited to, a processor 40 and a memory 41. Those skilled in the art will understand that... Figure 4This is merely an example of an electronic device and does not constitute a limitation on the electronic device. It may include more or fewer components than illustrated, or combine certain components, or different components. For example, the electronic device may also include input / output devices, network access devices, buses, etc.
[0072] The processor 40 may be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), off-the-shelf programmable gate arrays or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor.
[0073] The memory 41 can be an internal storage unit of the electronic device, such as a hard drive or memory. The memory 41 can also be an external storage device of the electronic device, such as a plug-in hard drive, Smart Media Card (SMC), Secure Digital (SD) card, or Flash Card. Furthermore, the memory 41 can include both internal and external storage units. The memory 41 is used to store the computer program and other programs and data required by the electronic device. The memory 41 can also be used to temporarily store data that has been output or will be output.
[0074] It should be noted that, for the sake of convenience and brevity, the structure of the above-mentioned electronic device can also be referred to the specific description of the structure in the method embodiment, which will not be repeated here.
[0075] In the embodiments of this application, the aforementioned electronic device may be a loading / unloading robot or a control device connected to the loading / unloading robot.
[0076] Specifically, Figure 5 This application illustrates a processing system comprising:
[0077] The loading and unloading robot 10 includes a robot body 101 and a base plate 102; the robot body 101 integrates a controller, which is used to perform actions such as... Figure 1 In the steps of the material stacking method, the robot body 101 is connected to an end effector 103, which is used to move the material; the base plate 102 is used to support the material and the robot body 101.
[0078] Specifically, the robot body 101 can provide several degrees of freedom (e.g., 6 degrees of freedom) and is the supporting body for the movement of the end effector 103 during loading and unloading. The base plate 102 is used to support materials, the robot body 101, and other control components connected to the robot body 101. The end effector 103 may include, but is not limited to, grippers or suction cups, and can be used to transfer materials. The controller of the robot body 101 controls the robot body 101 and the end effector 103 to stack materials in conjunction with the material stacking method provided in this application. Each layer of materials can be placed in a uniform orientation (e.g., upward) without additional flipping actions. The pins are staggered and do not interfere with or squeeze each other. At this time, more materials can be transferred at the same time in one handling, which can greatly improve the loading and unloading efficiency.
[0079] In some embodiments of this application, the processing system may further include a drilling device. The aforementioned base plate 102 may also be used to move between the loading / unloading area of the drilling device and the material stacking area of the loading / unloading robot 10. In this case, the loading / unloading robot 10 may be used to move the material carried on the base plate 102 to the processing platform of the drilling device, or to stack the material on the processing platform of the drilling device onto the base plate 102, when the base plate 102 is located in the loading / unloading area; the drilling device may be used to perform drilling operations on the material on the processing platform.
[0080] In some embodiments of this application, the end tool 103 described above may be equipped with a sensor to form an "eye-in-hand" hand-eye system. This sensor may include, but is not limited to, a laser displacement sensor or an industrial camera, and can be used to identify positioning mark features on pins and drilling equipment to accurately move materials to the target position on the processing stage of the drilling equipment.
[0081] In some embodiments of this application, the robot body 101 may also be equipped with an industrial camera that captures pin features from bottom to top to identify the pin position and compensate for possible pin position deviations.
[0082] Figure 6 Another processing system provided in this application is shown, comprising:
[0083] Control device 20, connected to loading / unloading robot 10, is used to perform actions such as... Figure 1 The steps of the stacking method of the material shown; the loading and unloading robot 10 includes a robot body 101 and a base plate 102; the robot body 101 is connected to an end tool 103, which is used to move the material; the base plate 102 is used to support the material and the robot body 101.
[0084] and Figure 5 compared to, Figure 5In the processing system shown, the material stacking method is executed by the control device 20. That is, the target rotation angle can be determined by the external control device 20 (e.g., an industrial computer), and the loading and unloading robot 10 can be controlled to perform the relevant stacking operations.
[0085] Similarly, the aforementioned processing system may also include drilling equipment to perform drilling operations on the material on the processing platform. The specific structure and function of the loading / unloading robot 10 can be found in [reference needed]. Figure 5 The description of this is not repeated here.
[0086] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.
[0087] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.
[0088] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for various specific applications, but such implementations should not be considered beyond the scope of this application.
[0089] In the embodiments provided in this application, it should be understood that the disclosed devices / electronic devices / systems and methods can be implemented in other ways. For example, the device / electronic device / system embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the displayed or discussed mutual couplings or direct couplings or communication connections may be through some interfaces; indirect couplings or communication connections between devices or units may be electrical, mechanical, or other forms.
[0090] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected based on actual needs to achieve the purpose of this embodiment.
[0091] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.
[0092] If the integrated module / unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include: any entity or device capable of carrying the computer program code, recording media, USB flash drives, portable hard drives, magnetic disks, optical disks, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, etc. It should be noted that the content included in the computer-readable medium can be appropriately added or removed based on the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, based on legislation and patent practice, computer-readable media do not include electrical carrier signals and telecommunication signals.
[0093] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.
Claims
1. A method for stacking materials, characterized in that, include: Obtain the material's dimension information and the pin information of the pins set on the material; Based on the size information and the pin information, a target rotation angle is determined. The target rotation angle is used to rotate the material to be stacked around the target rotation axis, so that the pin projection area of the material stacked adjacent to the material to be stacked is outside the contour projection area of the material to be stacked. The target rotation axis is the normal line of the material surface passing through the center point of the material surface. The materials to be stacked are stacked according to the target rotation angle.
2. The method for stacking materials as described in claim 1, characterized in that, The dimensional information includes the length and width of the material, and the pin information includes the diameter of the pin and the distance between the pin and the boundary of the material; Determining the target rotation angle based on the size information and the pin information includes: Based on the length and width of the material, the diameter of the pin, and the distance between the pin and the material boundary, determine the minimum rotation angle that makes the pin projection area of the adjacent stacked materials located outside the outline projection area of the material to be stacked. The target rotation angle is determined based on the minimum rotation angle.
3. The material stacking method as described in claim 2, characterized in that, The step of determining the minimum rotation angle that causes the pin projection area of adjacent stacked materials to be located outside the contour projection area of the material to be stacked, based on the length and width of the material, the diameter of the pin, and the distance between the pin and the material boundary, includes: Calculate the sum of the width of the material and the diameter of the pin to obtain the sum value; The difference is obtained by subtracting the length of the material from twice the distance between the pin and the boundary of the material; The minimum rotation angle is obtained by calculating the arcsine function of the ratio between the sum and the difference.
4. The method for stacking materials as described in claim 2, characterized in that, Determining the target rotation angle based on the minimum rotation angle includes: The minimum rotation angle is adjusted according to the preset offset to obtain the target rotation angle.
5. The method for stacking materials as described in claim 2, characterized in that, Determining the target rotation angle based on the minimum rotation angle includes: Determine the rotation angle range based on the minimum rotation angle; The target rotation angle is determined within the range of rotation angles.
6. The method for stacking materials as described in claim 5, characterized in that, The pin information also includes the height of the pin relative to the material surface; the dimension information also includes the height of the material. Determining the rotation angle range based on the minimum rotation angle includes: Based on the height of the pin relative to the material surface and the height of the material, determine the minimum number of material pieces between pins at the same position in the normal direction of the material surface. The maximum rotation angle is determined based on the minimum number of materials at the interval. The rotation angle range is determined based on the minimum rotation angle and the maximum rotation angle.
7. The method for stacking materials as described in claim 5, characterized in that, Determining the target rotation angle within the rotation angle range includes: Multiple candidate angles are determined within the range of rotation angles; Determine the duration of a single rotation when rotating according to each candidate angle, and the space occupied by the stacked material when stacking according to each candidate angle; The target rotation angle is determined from the plurality of candidate angles based on the space occupied by each candidate angle and the duration of a single rotation.
8. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the stacking method of materials as described in any one of claims 1 to 7.
9. A processing system, characterized in that, include: A loading and unloading robot, comprising a robot body and a base plate; the robot body integrates a controller for executing the steps of the material stacking method as described in any one of claims 1 to 7; the robot body is connected to an end effector for moving materials; the base plate is used to support the materials and the robot body. or, A control device, connected to a loading / unloading robot, is used to perform the steps of the material stacking method as described in any one of claims 1 to 7; the loading / unloading robot includes a robot body and a base plate; the robot body is connected to an end effector for moving materials; the base plate is used to support the materials and the robot body.
10. The processing system as described in claim 9, characterized in that, The processing system also includes drilling equipment; The base plate is also used to move between the loading and unloading area of the drilling equipment and the material stacking area of the loading and unloading robot; The loading and unloading robot is used to move the material carried on the base plate to the processing platform of the drilling equipment when the base plate is located in the loading and unloading area, or to stack the material on the processing platform of the drilling equipment onto the base plate. The drilling equipment is used to perform drilling operations on the material on the processing platform.