Automatic sorting system of thin silicon wafer and sorting method thereof

Abstract

The present application relates to a kind of automatic sorting system of thin silicon wafer and its sorting method.It includes: the floating plate of inclination arrangement, the air float mechanism being arranged along the edge of the floating plate, the swing mechanism being arranged in the inlet of the floating plate and the first shooting mechanism for shooting thin silicon wafer;Wherein, the floating plate sprays gas, and thin silicon wafer moves along the floating plate and floats;The floating plate rotates and drives thin silicon wafer to move;The air float mechanism sprays gas and acts on thin silicon wafer, suspends thin silicon wafer and adjusts the angle of thin silicon wafer;The first shooting mechanism is oppositely arranged in the two sides of the floating plate.Solve the problem that the collapse deformation of the middle position of thin silicon wafer in the prior art affects the shooting accuracy and the conveying belt blocks thin silicon wafer, and there is a shooting blind area.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer equipment, and more particularly to an automatic sorting system and method for thin silicon wafers. Background Technology

[0002] After cleaning, silicon wafers need to be sorted to identify those with defects such as chipped edges and scratches. The wafers are typically placed on a conveyor belt and moved into a sorting machine. The conveyor belt supports both sides of the wafers for transport, while a camera mechanism films both the top and bottom sides of the wafers for sorting.

[0003] Due to the trend towards thinner and larger silicon wafers, the conveyor belt supporting the sides of the thin silicon wafer can cause collapse and deformation in the middle, affecting the accuracy of the image. Widening the conveyor belt or increasing the number of conveyor belts to support the middle of the thin silicon wafer will cause some obstruction to the lower surface of the thin silicon wafer, creating blind spots in the image.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] To address the shortcomings of the prior art, the present invention aims to provide an automatic sorting system and method for thin silicon wafers, thereby solving the problems of the collapse and deformation of the middle position of the thin silicon wafer affecting the accuracy of shooting and the blind spots in shooting caused by the conveyor belt obstructing the thin silicon wafer in the prior art.

[0006] To achieve the above objectives, the technical solution of the present invention is as follows: An automated sorting system for thin silicon wafers; It includes: an inclined floating plate, an air flotation mechanism arranged along the edge of the floating plate, a swing mechanism oscillating at the inlet of the floating plate, and a first imaging mechanism for photographing thin silicon wafers; wherein, the floating plate sprays gas, and the thin silicon wafer floats and moves along the floating plate; the floating plate rotates, causing the thin silicon wafer to move; the air flotation mechanism sprays gas to act on the thin silicon wafer, suspending the thin silicon wafer and adjusting the angle of the thin silicon wafer; the first imaging mechanism is arranged opposite to each other on both sides of the floating plate.

[0007] A further technical solution is that air flotation holes are formed side by side on the float plate; a cavity is formed inside the float plate, and the cavity is connected to the air flotation holes and an air source respectively.

[0008] A further technical solution includes a fixed frame, a swing frame movably mounted on the fixed frame, an adjusting rod rotatably mounted on the fixed frame, a first gear mounted on the adjusting rod, and a tooth profile along the swing frame; wherein, the float is rotatably mounted on the swing frame; rotating the adjusting rod drives the first gear to mesh and roll along the tooth profile, causing the swing frame to tilt at a certain angle.

[0009] A further technical solution is that the swing mechanism includes: a base, a placement frame swinging on the base, a movable frame movably disposed on the placement frame, and a conveying device for conveying thin silicon wafers; wherein, the conveying device is disposed on the placement frame; the silicon wafer basket is placed on the movable frame, the placement frame swings at a preset angle so that the silicon wafer basket is perpendicular to the floating plate, the movable frame drives the silicon wafer basket closer to the conveying device, and the conveying device drives the silicon wafer to move into the floating plate.

[0010] A further technical solution is that the air flotation mechanism includes: a nozzle, a side block disposed along the edge of the float plate, and a ring plate disposed on the side block; wherein, the nozzle is installed along the side block and the ring plate respectively; the nozzle on the ring plate sprays gas to press down the thin silicon wafer; the nozzle on the side block sprays gas to act on the edge of the thin silicon wafer to adjust the angle of the thin silicon wafer.

[0011] A sorting method for an automated sorting system for thin silicon wafers includes the following steps: Parameter adjustment steps: Adjust the tilt angle of the floating plate, the rotation speed of the floating plate, and the amount of gas injected on the floating plate according to the size parameters of the thin silicon wafer; adjust the swing angle of the swing mechanism according to the tilt angle of the floating plate. Feeding steps: The silicon wafer basket is placed on the swing mechanism, which drives the silicon wafer basket to swing perpendicular to the floating plate, and the thin silicon wafer is moved into the floating plate; Sorting steps: The floating plate rotates and moves the thin silicon wafer in. The nozzles on the side block spray gas to adjust the angle of the thin silicon wafer, and the thin silicon wafer moves under the ring plate. The nozzles on the ring plate spray gas to press down the thin silicon wafer, and the first imaging mechanism takes pictures of the thin silicon wafer. The floating plate continues to rotate and moves the thin silicon wafer out. According to the imaging results, the nozzles on the side block spray gas to adjust the position of the thin silicon wafer, and the thin silicon wafer moves out from different directions.

[0012] Compared with the prior art, the beneficial technical effects of the present invention are as follows: (1) The floating plate is made of transparent material and transparent gas flows inside the floating plate. The thin silicon wafer is floated by the gas, so that there is no blind spot in the shooting of the first shooting mechanism; multiple streams of gas flow upward to support the thin silicon wafer, so that the thin silicon wafer is supported in a dispersed manner, and the thin silicon wafer is prevented from collapsing.

[0013] (2) The air flotation holes are located at the edge of the upper surface of the floating plate. When the gas enters the chamber, it contacts the middle position of the upper surface of the chamber. At this time, the gas diffuses into each air flotation hole. This prevents the gas from being concentrated and discharged through the air flotation holes. The gas can support the thin silicon wafer as a whole, making the thin silicon wafer float. The expansion of the air flotation holes makes the gas more dispersed when it is discharged, preventing the gas from being concentrated in a certain position of the thin silicon wafer. The dispersed support of the gas prevents the thin silicon wafer from collapsing.

[0014] (3) The larger the size of the thin silicon wafer, the smaller the tilt angle of the floating plate, the slower the rotation speed of the floating plate, and the greater the amount of gas jet on the floating plate, so as to avoid the positional displacement caused by inertia during the thin silicon wafer's movement in and out, or the thin silicon wafer's distortion caused by the thin silicon wafer floating up.

[0015] (4) The gas sprayed by the nozzle on the side block can prevent the thin silicon wafer from hitting the side block and avoid damage to the thin silicon wafer; at the same time, the gas slows down the thin silicon wafer in the moving direction, ensuring the shooting quality of the first shooting mechanism; finally, the thin silicon wafer is adjusted to the angle of being placed in the positive direction, so that the nozzle on the ring plate can press down the thin silicon wafer as a whole, and at the same time, it is convenient to judge the damage of the thin silicon wafer. The floating plate continues to rotate and remove the thin silicon wafer. The thin silicon wafer is judged based on the shooting results. The nozzle on the edge block sprays gas onto the edge of the thin silicon wafer, adjusting the position of the thin silicon wafer on the floating plate. The thin silicon wafer is removed from different directions. One group of directions is used to collect the qualified thin silicon wafers, and the other group of directions is used to collect the unqualified thin silicon wafers.

[0016] (5) The silicon wafer basket is placed on the moving frame. The placing frame swings at a preset angle so that the silicon wafer basket is perpendicular to the floating plate. The moving frame moves the silicon wafer basket closer to the conveying device, and the conveying device moves the silicon wafer into the floating plate. Since the silicon wafer basket is perpendicular to the floating plate, the thin silicon wafer is parallel to the floating plate. The thin silicon wafer can be smoothly moved into the floating plate without bending or deformation. Attached Figure Description

[0017] Figure 1 A top view of the automatic sorting system for thin silicon wafers according to the first embodiment of the present invention is shown.

[0018] Figure 2 The diagram shows a left-side view of the float plate, air flotation mechanism, first shooting mechanism, and second shooting mechanism according to a first embodiment of the present invention.

[0019] Figure 3 A left-side structural view of the swing mechanism according to the first embodiment of the present invention is shown.

[0020] The attached diagram is labeled as follows: 1. Float plate; 11. Air flotation hole; 12. Chamber; 13. Swing frame; 131. Straight plate; 132. Arc plate; 133. Guide rail; 134. Slider; 135. Toothed plate; 136. Power wheel; 14. Adjusting rod; 15. First gear; 16. Tooth shape; 17. Fixing frame; 171. Arc surface; 172. Roller; 2. Air flotation mechanism; 21. Side block; 22. Ring plate; 23. Nozzle; 3. Swing mechanism; 31. Base; 32. Placement frame; 321. Second gear; 33. Moving frame; 331. Rack; 34. Conveying device; 341. Conveying wheel; 342. Conveying belt; 35. Connecting rod; 351. First rod body; 352. Second rod body; 4. First shooting mechanism; 5. Second shooting mechanism. Detailed Implementation

[0021] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the following detailed description of the specific implementation methods, structures, features, and effects of the present invention, in conjunction with the accompanying drawings and preferred embodiments, is provided below.

[0022] First embodiment: Figure 1 A top view of the automatic sorting system for thin silicon wafers according to the first embodiment of the present invention is shown. Figure 2 The diagram shows a left-side view of the float plate, air flotation mechanism, first shooting mechanism, and second shooting mechanism according to a first embodiment of the present invention.

[0023] Combination Figure 1 and Figure 2 As shown, the present invention discloses an automatic sorting system for thin silicon wafers, comprising: an inclined floating plate 1, an air flotation mechanism 2 disposed along the rear edge of the floating plate 1, a swing mechanism 3 oscillating at the inlet of the floating plate 1, and a first imaging mechanism 4 for imaging thin silicon wafers.

[0024] The silicon wafer basket is placed in the swing mechanism 3. The swing mechanism 3 swings to lift one end of the silicon wafer basket, making the silicon wafer basket perpendicular to the floating plate 1, and the thin silicon wafers in the silicon wafer basket are moved into the floating plate 1. The inlet of the floating plate 1 is located on the left side of the front end of the floating plate 1, and the outlet of the floating plate 1 is located on the right side of the front end of the floating plate 1.

[0025] Gas is ejected from the floating plate 1, and the thin silicon wafer floats and moves along the floating plate 1. The floating plate 1 rotates, causing the thin silicon wafer to move. For example, the floating plate 1 is made of transparent material, and the first shooting mechanism 4 is arranged opposite to each other on both sides of the floating plate 1. The first shooting mechanism 4 can simultaneously shoot the upper and lower surfaces of the thin silicon wafer without any obstruction affecting the shooting.

[0026] As the thin silicon wafer moves along the insertion direction, the air flotation mechanism 2 sprays gas onto the edge of the thin silicon wafer, adjusting it to a positive angle. The air flotation mechanism 2 sprays gas onto the upper surface of the thin silicon wafer, suspending it, and the first imaging mechanism 4 captures images of both the upper and lower surfaces of the thin silicon wafer.

[0027] Based on the shooting results, it is determined whether the thin silicon wafer is qualified. When the thin silicon wafer moves along the removal direction, the air flotation mechanism 2 sprays gas to act on the edge of the thin silicon wafer, removing qualified and unqualified thin silicon wafers from different angles.

[0028] The floating plate 1 is made of transparent material, and transparent gas flows inside the floating plate 1. The gas floats the thin silicon wafer, so that there are no blind spots in the imaging of the first imaging mechanism 4. Multiple streams of gas flow upward to support the thin silicon wafer, thus dispersing and supporting the thin silicon wafer and preventing it from collapsing.

[0029] Air float holes 11 are formed side by side on the upper surface of the float plate 1. The upper and lower ends of the air float holes 11 are enlarged, and the enlarged holes, the air float holes 11 and the float plate 1 form an arc transition to avoid the float plate 1 forming obvious edges, which would affect the imaging quality captured by the first shooting mechanism 4.

[0030] A chamber 12 is formed inside the float plate 1, and the chambers 12 are distributed along the inside of the float plate 1. The chambers 12 are respectively connected to the air flotation holes 11 and the air source. Since the float plate 1 needs to rotate, the middle position of the lower end of the chamber 12 is connected to the air source through a rotary joint.

[0031] The air-float holes 11 are located at the edge of the upper surface of the float plate 1. When the gas enters the chamber 12, it contacts the middle position of the upper surface of the chamber 12, at which point the gas diffuses into each air-float hole 11. This prevents the gas from being concentrated and discharged through the air-float holes 11, allowing the gas to support the thin silicon wafer as a whole, thus making the thin silicon wafer float.

[0032] The enlarged air flotation holes 11 allow for more dispersed gas discharge, preventing gas from concentrating in a single location on the thin silicon wafer. This dispersed gas support prevents the thin silicon wafer from collapsing.

[0033] A dispersion block 121 is positioned at the center of the upper surface of chamber 12, with steps 122 forming around the dispersion block 121 at various heights. When gas enters chamber 12, it contacts the lower end of the dispersion block 121. After dispersion, the gas flows upwards along each step 122, distributing the gas at various heights. The gas diffuses, with different diffusion distances at different heights, and exits from the air flotation holes 11 at different locations, ensuring uniform gas discharge.

[0034] A diffuser plate 123 is formed at the step 122, and the diffuser plate 123 extends along the curvature. Due to the rotation of the float 1, the diffuser plate 123 is driven to rotate, and the diffuser plate 123 pushes the gas near the step 122 to diffuse outward, increasing the diffusion range of the gas.

[0035] The automatic sorting system for thin silicon wafers also includes a fixed frame 17, a swing frame 13 movably mounted on the fixed frame 17, an adjusting rod 14 rotatably mounted on the fixed frame 17 in the left and right directions, a first gear 15 mounted on the adjusting rod 14, and a tooth profile 16 along the swing frame 13.

[0036] The upper end of the swing frame 13 forms a straight plate 131, and the lower end forms an arc plate 132. An arc surface 171 is formed on the fixed frame 17. The arc plate 132 contacts and moves along the arc surface 171, realizing the swing of the swing frame 13, thereby causing the float 1 to swing at a certain angle. Rollers 172 are distributed on both sides of the arc surface 171. The rollers 172 roll and press down on the arc plate 132, allowing the arc plate 132 to move smoothly.

[0037] The float 1 is rotatably mounted on the swing frame 13. A ring-shaped guide rail 133 is mounted on the straight plate 131, and a slider 134 is mounted on the float 1, which is slidably mounted on the guide rail 133.

[0038] A ring-shaped toothed plate 135 is coaxially mounted on the float plate 1, and a power wheel 136 is rotatably mounted on the straight plate 131. The toothed plate 135 meshes with the power wheel 136. The power wheel 136 is driven to rotate by a motor, which in turn drives the toothed plate 135 and the float plate 1 to rotate.

[0039] The adjusting rod 14 is driven to rotate by a motor. The adjusting rod 14 drives the first gear 15 to rotate along the tooth profile 16, causing the swing frame 13 to tilt to a preset angle.

[0040] The air flotation mechanism 2 includes: a nozzle 23, a side block 21 arranged along the edge of the float plate 1, and a ring plate 22 arranged on the side block 21.

[0041] The nozzle 23 is installed along the edge block 21, and the spraying end of the nozzle 23 faces the edge of the thin silicon wafer. The spraying schedule of the nozzle 23 can be adjusted so that the sprayed gas from the nozzle 23 can act on the edge of the thin silicon wafer at different positions.

[0042] The nozzle 23 is mounted below the ring plate 22, which surrounds the first imaging mechanism 4. The spray pattern of the nozzle 23 can be adjusted so that the sprayed gas from the nozzle 23 presses down on the thin silicon wafer.

[0043] The nozzle 23 on the edge block 21 sprays gas onto the edge of the thin silicon wafer, slowing down its movement. At the same time, the nozzle 23 on the ring plate 22 sprays gas to press down on the thin silicon wafer, achieving rapid deceleration of the thin silicon wafer, making it easier for the first imaging mechanism 4 to capture a clear image of the thin silicon wafer.

[0044] Figure 3 A left-side structural view of the swing mechanism according to the first embodiment of the present invention is shown. (In conjunction with...) Figures 1-3As shown, the swing mechanism 3 includes: a base 31, a placement frame 32 swingably disposed on the base 31, a movable frame 33 movablely disposed on the placement frame 32, and a conveying device 34 for conveying thin silicon wafers.

[0045] The placement rack 32 is driven to swing by a motor, and the driving end of the motor is connected to a connecting rod 35, which in turn drives the placement rack 32 to swing.

[0046] The connecting rod 35 includes a first rod 351 and a second rod 352 that are rotatably connected to each other. The first rod 351 is connected to the drive end of the motor, and the second rod 352 is rotatably connected to the placement frame 32.

[0047] Before the silicon wafer basket is moved into the swing mechanism 3, both the placement rack 32 and the moving rack 33 are in a horizontal position, facilitating the horizontal movement of the silicon wafer basket onto the moving rack 33. The motor drives the first rod 351 to rotate at a certain angle, pushing the second rod 352 upwards. The second rod 352 then pushes the placement rack 32 upwards. The placement rack 32 and the moving rack 33 swing to an angle perpendicular to the floating plate 1.

[0048] After all the thin silicon wafers on the silicon wafer basket have been removed, the silicon wafer basket needs to be removed. The motor drives the first rod 351 to rotate in the opposite direction at a certain angle. The first rod 351 pulls the second rod 352 downward, and the second rod 352 pulls the placement rack 32 downward to swing it horizontally.

[0049] The conveying device 34 is mounted on the placement frame 32, and the installation angle of the conveying device 34 is perpendicular to the placement frame 32. The conveying device 34 includes a conveying wheel 341 rotatably mounted on the placement frame 32 and a conveyor belt 342 wound around the conveying wheel 341. The conveying wheel 341 is driven to rotate by a motor, and the conveying wheel 341 drives the conveyor belt 342 to move. After the thin silicon wafer contacts the conveyor belt 342, it moves into the floating plate 1.

[0050] A rack 331 is provided on the movable frame 33, and a second gear 321 is rotatably provided on the placement frame 32. The rack 331 meshes with the second gear 321. The second gear 321 is driven to rotate by a motor and rolls along the rack 331, thereby driving the movable frame 33 to move along the placement frame 32.

[0051] The silicon wafer basket is placed on the movable frame 33. The placement frame 32 swings at a preset angle so that the silicon wafer basket is perpendicular to the floating plate 1. The movable frame 33 moves the silicon wafer basket closer to the conveying device 34, and the conveying device 34 moves the silicon wafer into the floating plate 1. Because the silicon wafer basket is perpendicular to the floating plate 1, the thin silicon wafer is parallel to the floating plate 1, and the thin silicon wafer can be smoothly moved into the floating plate 1 without bending or deformation.

[0052] The automatic sorting system for thin silicon wafers also includes a second imaging mechanism 5. The second imaging mechanism 5 is located in front of the floating plate 1 and is mounted on the straight plate 131 via a bracket. The second imaging mechanism 5 can capture images of the thin silicon wafers moving in and out of the floating plate 1. When there is a deviation in the angle or position of the thin silicon wafer, the second imaging mechanism 5 can capture images and adjust the angle and position accordingly by spraying gas through the nozzle 23 on the edge block 21.

[0053] Second embodiment: The sorting method of the automated sorting system for thin silicon wafers includes the following steps: Parameter adjustment steps: Adjust the tilt angle of floating plate 1, the rotation speed of floating plate 1, and the gas injection volume on floating plate 1 according to the size parameters of the thin silicon wafer.

[0054] The adjusting rod 14 rotates at a certain angle, and through the first gear 15, it rotates along the tooth profile 16, driving the swing frame 13 to tilt the float 1 to a preset angle.

[0055] The larger the size of the thin silicon wafer, the smaller the tilt angle of the floating plate 1, the slower the rotation speed of the floating plate 1, and the greater the amount of gas injected on the floating plate 1, so as to avoid the thin silicon wafer from shifting position due to inertia or from being distorted and deformed by floating during the process of moving the thin silicon wafer in and out.

[0056] Because the thin silicon wafer is relatively large, a large gas injection volume is used to float the entire thin silicon wafer to maintain balance, while also being able to withstand the downward pressure of the gas injected by the nozzle 23 on the edge block 21.

[0057] The thin silicon wafer needs to be moved into the floating plate 1 from an angle parallel to the floating plate 1 to ensure that the thin silicon wafer does not bend or deform during the process of moving from the silicon wafer basket into the floating plate 1.

[0058] Adjust the swing angle of the swing mechanism 3 according to the tilt angle of the floating plate 1, so that the swing mechanism 3 swings to be perpendicular to the floating plate 1, which facilitates the insertion of the thin silicon wafer.

[0059] Material placement steps: The silicon wafer basket is placed on the swing mechanism 3, which drives the silicon wafer basket to swing perpendicular to the floating plate 1. As needed, the motor drives the first rod 351 to rotate a certain angle, which in turn pushes the second rod 352 upwards. The second rod 352 then pushes the placement frame 32 upwards to swing a certain angle, making the silicon wafer basket perpendicular to the floating plate 1.

[0060] The rotating conveyor wheel 341 drives the conveyor belt 342 to move. The second gear 321 meshes and rolls along the rack 331, driving the moving frame 33 to move along the placement frame 32, so that the thin silicon wafer is close to the conveying device 34. The thin silicon wafer contacts the conveyor belt 342, and the conveyor belt 342 drives the thin silicon wafer to move into the floating plate 1.

[0061] The moving speed of the conveyor belt 342 is coordinated with the rotational speed of the floating plate 1 to avoid an excessive speed difference between the two, which could cause the thin silicon wafer to stall during the transfer process. By controlling the rotational speed of the conveyor wheel 341, the moving speed of the conveyor belt 342 is controlled, keeping the difference between the moving speed of the conveyor belt 342 and the rotational speed of the floating plate 1 within a small range, so that the thin silicon wafer can smoothly transition from the conveyor belt 342 to the floating plate 1.

[0062] Sorting Steps: Gas from the gas source enters chamber 12 and exits through air float holes 11. The rotation of the power wheel 136 drives the toothed plate 135 and float plate 1 to rotate. The float plate 1 rotates and moves the thin silicon wafer in. When the thin silicon wafer approaches the edge block 21, the nozzle 23 on the edge block 21 sprays gas to adjust the angle of the thin silicon wafer. The gas spraying from the nozzle 23 on the edge block 21 can prevent the thin silicon wafer from hitting the edge block 21 and avoid damage to the thin silicon wafer. At the same time, the gas slows down the thin silicon wafer in the moving direction, ensuring the imaging quality of the first imaging mechanism 4. Finally, the thin silicon wafer is adjusted to a positive orientation so that the nozzle 23 on the ring plate 22 can press down on the thin silicon wafer as a whole, and at the same time, it is easy to judge the damage of the thin silicon wafer. The second imaging mechanism 5 photographs the thin silicon wafer during the moving process, judges the angle deviation of the thin silicon wafer, and the nozzle 23 on the edge block 21 sprays gas to adjust it.

[0063] The thin silicon wafer is moved below the ring plate 22, and the nozzle 23 on the ring plate 22 sprays gas to press down on the thin silicon wafer, so that the thin silicon wafer is in a suspended state. At this time, the first shooting mechanism 4 shoots the top and bottom surfaces of the thin silicon wafer.

[0064] The floating plate 1 continues to rotate and remove the thin silicon wafer, judging its quality based on the imaging results. Gas is sprayed from nozzle 23 on edge block 21, acting on the edge of the thin silicon wafer to adjust its position on the floating plate 1. The thin silicon wafer is removed from different directions. One set of directions recovers qualified thin silicon wafers, while the other set recovers unqualified ones. The second imaging mechanism 5 images the thin silicon wafer during the removal process, judging its positional deviation, and gas is sprayed from nozzle 23 on edge block 21 for adjustment.

[0065] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. An automatic sorting system for thin silicon wafers, characterized in that, include: A transparent floating plate (1) is tilted, an air flotation mechanism (2) is arranged along the edge of the floating plate (1), a swing mechanism (3) is oscillating at the inlet of the floating plate (1), and a first imaging mechanism (4) for photographing thin silicon wafers; wherein, the floating plate (1) sprays gas, and the thin silicon wafer floats and moves along the floating plate (1); the floating plate (1) rotates to drive the thin silicon wafer to move; the air flotation mechanism (2) sprays gas to act on the thin silicon wafer, suspend the thin silicon wafer and adjust the angle of the thin silicon wafer; the first imaging mechanism (4) is arranged opposite to each other on both sides of the floating plate (1); The air flotation mechanism (2) includes: a nozzle (23), a side block (21) disposed along the edge of the float plate (1), and a ring plate (22) disposed on the side block (21); wherein, the nozzle (23) is installed along the side block (21) and the ring plate (22) respectively; the nozzle (23) on the ring plate (22) sprays gas to press down the thin silicon wafer; the nozzle (23) on the side block (21) sprays gas to act on the edge of the thin silicon wafer to adjust the angle of the thin silicon wafer; The swing mechanism (3) includes: a base (31), a placement rack (32) swinging on the base (31), a movable rack (33) movably disposed on the placement rack (32), and a conveying device (34) for conveying thin silicon wafers; wherein, the conveying device (34) is disposed on the placement rack (32); the silicon wafer basket is placed on the movable rack (33), the placement rack (32) swings at a preset angle so that the silicon wafer basket is perpendicular to the floating plate (1), the movable rack (33) moves the silicon wafer basket closer to the conveying device (34), and the conveying device (34) moves the silicon wafer into the floating plate (1).

2. The automatic sorting system for thin silicon wafers as described in claim 1, characterized in that, Air flotation holes (11) are formed on the float plate (1); a cavity (12) is formed inside the float plate (1), and the cavity (12) is connected to the air flotation holes (11) and the air source respectively.

3. The automatic sorting system for thin silicon wafers as described in claim 2, characterized in that, It also includes a fixed frame (17), a swing frame (13) movably mounted on the fixed frame (17), an adjusting rod (14) rotatably mounted on the fixed frame (17), a first gear (15) mounted on the adjusting rod (14), and a tooth profile (16) along the swing frame (13); wherein, the float (1) is rotatably mounted on the swing frame (13); rotating the adjusting rod (14) drives the first gear (15) to mesh and roll along the tooth profile (16), thereby causing the swing frame (13) to tilt at a certain angle.

4. A sorting method for an automatic sorting system for thin silicon wafers, using the automatic sorting system for thin silicon wafers as described in claim 1, characterized in that, Includes the following steps: Parameter adjustment steps: Adjust the tilt angle of the float (1), the rotation speed of the float (1), and the gas injection volume on the float (1) according to the size parameters of the thin silicon wafer; adjust the swing angle of the swing mechanism (3) according to the tilt angle of the float (1); Material feeding steps: The silicon wafer basket is placed on the swing mechanism (3), and the swing mechanism (3) drives the silicon wafer basket to swing perpendicular to the floating plate (1), and the thin silicon wafer moves into the floating plate (1). Sorting steps: The floating plate (1) rotates and moves the thin silicon wafer in. The nozzle (23) on the side block (21) sprays gas to adjust the angle of the thin silicon wafer, and the thin silicon wafer moves into the ring plate (22). The nozzle (23) on the ring plate (22) sprays gas to press down the thin silicon wafer, and the first shooting mechanism (4) shoots the thin silicon wafer. The floating plate (1) continues to rotate and moves the thin silicon wafer out. According to the shooting results, the nozzle (23) on the side block (21) sprays gas to adjust the position of the thin silicon wafer, and the thin silicon wafer moves out from different directions.

Images