A temperature control system and method for chip manufacturing

Abstract

The application discloses a temperature control system and method for chip manufacturing, which comprises a load unit for carrying a chip to be manufactured, wherein the temperature of the load unit is related to the resistance value; a current measurement unit electrically connected with the load unit and used for acquiring real-time current of the load unit; a voltage measurement unit electrically connected with the load unit and used for acquiring real-time voltage of the load unit; and a control unit electrically connected with the load unit and signal-connected with the current measurement unit and the voltage measurement unit, and used for determining a power to be adjusted according to the real-time current, the real-time voltage and a preset target resistance, and controlling the conduction time of an alternating current power supply of the load unit in each half cycle based on the power to be adjusted.

Description

[0001] This invention is a divisional application of the parent patent number 202510983935.4, entitled "A temperature control system and method for chip manufacturing". Technical Field

[0002] This application relates to the field of chip manufacturing technology, and specifically to a temperature control system and method for chip manufacturing. Background Technology

[0003] Temperature is a crucial production parameter in chip manufacturing, affecting the final quality and yield of the chips. The chip to be manufactured is the fundamental material used in chip production. In current chip manufacturing processes, the common method for adjusting the temperature of the chip is as follows: a temperature sensor is connected to the semiconductor device carrying the chip to acquire its temperature information. This temperature information is then sent to a control center, which in turn sends a power adjustment command to the corresponding power control circuit to adjust the input power of the load device. The temperature sensor can be one or more of a thermocouple, thermistor, or potentiometer, or it can be one or more of an infrared sensor, thermal imager, pyrometer, or infrared fiber optic thermometer.

[0004] However, as semiconductor technology nodes continue to shrink, the requirements for temperature control accuracy become increasingly stringent. Consequently, the demands on the measurement accuracy of temperature measuring equipment and the efficiency of temperature data and power conversion data are also rising. Furthermore, because calculating power conversion data is time-consuming and phase differences exist when executing power conversion commands, the data adjustment accuracy during the temperature control process is not high, thus affecting the effectiveness of temperature control.

[0005] Therefore, in the chip manufacturing process, the complexity of the data conversion process makes it difficult to accurately control the temperature of the chip being manufactured. Summary of the Invention

[0006] The present application provides a temperature control system and method for chip manufacturing, which aims to solve the problem in the prior art that it is difficult to accurately control the temperature of the chip to be manufactured due to the complexity of the data conversion process.

[0007] To address the aforementioned technical problems, the embodiments of this application provide the following technical solutions: A temperature control system for chip manufacturing, comprising: A load unit is used to support the chip to be manufactured, wherein the temperature of the load unit is related to its resistance value; A current measurement unit, electrically connected to the load unit, is used to acquire the real-time current of the load unit; A voltage measurement unit, electrically connected to the load unit, is used to acquire the real-time voltage of the load unit; The control unit is electrically connected to the load unit and signal-connected to the current measurement unit and the voltage measurement unit. It is used to determine the power to be adjusted based on the real-time current, the real-time voltage and the preset target resistance, and to control the conduction time of the AC power supply of the load unit in each half-cycle based on the power to be adjusted.

[0008] Optionally, the control unit includes a data processing module, a first driving circuit, and a second driving circuit, wherein the data processing module is signal-connected to the first driving circuit and the second driving circuit; The first driving circuit and the second driving circuit are both electrically connected to the power supply of the load unit. The data processing module is signal connected to the current measurement unit and the voltage measurement unit respectively. The data processing module is used to determine the power to be adjusted based on the real-time current, the real-time voltage and the preset target resistance, and generate driving instructions based on the power to be adjusted. The driving instructions include boost instructions and buck instructions. When the power to be adjusted is less than zero, the step-down command is generated, and the first drive circuit controls the conduction time of the reverse AC power according to the step-down command. When the power to be adjusted is greater than zero, the boost command is generated, and the second drive circuit controls the conduction time of the positive AC power according to the boost command.

[0009] Optionally, the first driving circuit includes a first unidirectional thyristor, a first capacitor, a third capacitor, a first resistor, a third resistor, a first diode, a second diode, a fifth diode, and a first driving transformer; the second driving circuit includes a second unidirectional thyristor, a second capacitor, a fourth capacitor, a second resistor, a fourth resistor, a third diode, a fourth diode, a sixth diode, and a second driving transformer. The first unidirectional thyristor is connected in parallel with the second unidirectional thyristor. The first end of the first unidirectional thyristor is electrically connected to the first end of the second unidirectional thyristor, the first end of the second capacitor, the first end of the second resistor, and the first end of the third diode. The second end of the first unidirectional thyristor is electrically connected to the second end of the second unidirectional thyristor, the power supply of the load unit, the second end of the first capacitor, the second end of the first resistor, the second end of the second diode, and the second end of the first drive transformer. The third end of the first unidirectional thyristor is electrically connected to the first end of the first capacitor, the first end of the first resistor, and the first end of the first diode. The first end of the second unidirectional thyristor is electrically connected to the first end of the second capacitor, the first end of the second resistor, and the first end of the third diode, respectively. The second end of the second unidirectional thyristor is electrically connected to the power supply, the second end of the first capacitor, the second end of the first resistor, the second end of the second diode, and the second end of the first drive transformer, respectively. The third end of the second unidirectional thyristor is electrically connected to the second end of the second capacitor, the second end of the second resistor, the second end of the fourth diode, and the second end of the second drive transformer, respectively. The second capacitor is connected in parallel with the second resistor. The first terminal of the third diode is electrically connected to the first terminal of the second capacitor and the first terminal of the second resistor, respectively. The second terminal of the third diode is electrically connected to the first terminal of the fourth diode and the first terminal of the first drive transformer, respectively. The second terminal of the fourth diode is electrically connected to the second... Drive transformer The second terminal of the second capacitor and the second terminal of the second resistor are electrically connected; The third terminal of the first driving transformer is electrically connected to the first terminal of the fifth diode and the first terminal of the third capacitor, respectively. The fourth terminal of the first driving transformer is electrically connected to the second terminal of the fifth diode and the first terminal of the third resistor, respectively. The second terminal of the third resistor is connected to the control unit. The third terminal of the second drive transformer is electrically connected to the first terminal of the sixth diode and the first terminal of the fourth capacitor, respectively. The fourth terminal of the second drive transformer is electrically connected to the second terminal of the sixth diode and the first terminal of the fourth resistor, respectively. The second terminal of the fourth resistor is connected to the control unit. The first unidirectional thyristor is used to control the conduction time of the reverse alternating current according to the buck command, and the second unidirectional thyristor is used to control the conduction time of the forward alternating current according to the boost command.

[0010] Optionally, the current measurement unit includes a fifth resistor, a sixth resistor, a seventh resistor, an eighth resistor, a ninth resistor, a tenth resistor, an eleventh resistor, a twelfth resistor, a thirteenth resistor, a fifth capacitor, a sixth capacitor, a seventh capacitor, an eighth capacitor, a ninth capacitor, a tenth capacitor, an eleventh capacitor, a twelfth capacitor, a thirteenth capacitor, a first isolation amplifier, a first operational amplifier, and a first transient voltage suppression diode; Wherein, the first end of the fifth resistor is electrically connected to the first end of the sixth resistor, and the second end of the fifth resistor is electrically connected to the first end of the seventh resistor; the second end of the sixth resistor is electrically connected to the first end of the fifth capacitor, the second end of the seventh capacitor, and the second end of the first isolation amplifier; the second end of the seventh resistor is electrically connected to the first end of the sixth capacitor, the first end of the seventh capacitor, and the first end of the first isolation amplifier; the first end of the fifth capacitor is electrically connected to the second end of the seventh capacitor, and the first end of the sixth capacitor is electrically connected to the first end of the seventh capacitor; the first end of the first isolation amplifier is electrically connected to the first end of the eighth capacitor and the first end of the ninth capacitor, and the eighth and ninth capacitors are connected in parallel; the third end of the first isolation amplifier is electrically connected to the tenth capacitor. The first terminal, the first terminal of the eleventh capacitor, and the first terminal of the eighth resistor are electrically connected; the fourth terminal of the first isolation amplifier is electrically connected to the first terminal of the ninth resistor; the second terminal of the eighth resistor is electrically connected to the first terminal of the tenth resistor and the first terminal of the twelfth capacitor, respectively; the second terminal of the ninth resistor is electrically connected to the first terminal of the eleventh resistor and the second terminal of the twelfth capacitor, respectively; the second terminal of the tenth resistor is electrically connected to the first terminal of the twelfth resistor and the first terminal of the first operational amplifier, respectively; the second terminal of the eleventh resistor is electrically connected to the first terminal of the thirteenth resistor and the second terminal of the first operational amplifier, respectively; the third terminal of the first operational amplifier is electrically connected to the second terminal of the twelfth resistor, the first terminal of the first transient voltage suppression diode, and the second terminal of the thirteenth capacitor, respectively.

[0011] Optionally, the voltage measurement unit includes a fourteenth resistor, a fifteenth resistor, a sixteenth resistor, a seventeenth resistor, an eighteenth resistor, a nineteenth resistor, a twentieth resistor, a twenty-first resistor, a twenty-second resistor, a twenty-third resistor, a twenty-fourth resistor, a twenty-fifth resistor, a twenty-sixth resistor, a twenty-seventh resistor, a twenty-eighth resistor, a fourteenth capacitor, a fifteenth capacitor, a sixteenth capacitor, a seventeenth capacitor, an eighteenth capacitor, a nineteenth capacitor, a twentieth capacitor, a twenty-first capacitor, a twenty-second capacitor, a second isolation amplifier, a second operational amplifier, and a second transient voltage suppression diode; The fourteenth resistor, the fifteenth resistor, the sixteenth resistor, the seventeenth resistor, the eighteenth resistor, and the nineteenth resistor are connected in series. The first end of the fourteenth resistor is electrically connected to the load unit, and the second end of the nineteenth resistor is electrically connected to the first end of the twentieth resistor and the first end of the twenty-first resistor, respectively. The second end of the twentieth resistor is electrically connected to the first end of the load unit and the twentieth twelfth resistor, respectively; The second terminal of the 21st resistor is electrically connected to the first terminal of the 15th capacitor, the first terminal of the 18th capacitor, and the first terminal of the second isolation amplifier, respectively. The first terminal of the second isolation amplifier is electrically connected to the first terminal of the sixteenth capacitor and the first terminal of the seventeenth capacitor, respectively, and the sixteenth capacitor and the seventeenth capacitor are connected in parallel; The second terminal of the 22nd resistor is electrically connected to the first terminal of the 14th capacitor, the second terminal of the 18th capacitor, and the second terminal of the second isolation amplifier, respectively. The third terminal of the second isolation amplifier is electrically connected to the first terminal of the nineteenth capacitor, the first terminal of the twentieth capacitor, and the first terminal of the twenty-third resistor, respectively. The fourth terminal of the second isolation amplifier is electrically connected to the first terminal of the twenty-fourth resistor; The second end of the 23rd resistor is electrically connected to the first end of the 21st capacitor and the first end of the 25th resistor, respectively. The second terminal of the 24th resistor is electrically connected to the second terminal of the 21st capacitor and the first terminal of the 26th resistor, respectively. The second terminal of the 25th resistor is electrically connected to the first terminal of the 27th resistor and the first terminal of the second operational amplifier, respectively. The second terminal of the 26th resistor is electrically connected to the first terminal of the 28th resistor and the second terminal of the second operational amplifier, respectively. The third terminal of the second operational amplifier is electrically connected to the second terminal of the second seventeenth resistor, the first terminal of the second transient voltage suppressor diode, and the first terminal of the second twenty-second capacitor.

[0012] Optionally, the temperature control system for chip manufacturing further includes a power supply unit, a first terminal of which is electrically connected to the load unit, and a second terminal of which is electrically connected to the control unit. The power supply unit is used to provide AC power to the load unit.

[0013] Optionally, the temperature control system for chip manufacturing further includes an alarm unit, which is signal-connected to the control unit and is used to issue an alarm signal based on the real-time current, the real-time voltage, and a preset alarm resistor.

[0014] Optionally, the temperature control system for chip manufacturing further includes an information interaction unit, which is electrically connected to the control unit and is used to adjust the preset target resistance.

[0015] A temperature control method for chip manufacturing, comprising: The real-time current and real-time voltage of the load unit are obtained, wherein the chip to be manufactured is arranged adjacent to the load unit, and the temperature of the load unit is related to its resistance value; The power to be adjusted is determined based on the real-time current, the real-time voltage, and the preset target resistance. The on-time of the AC power supply of the load unit in each half-cycle is controlled based on the power to be adjusted.

[0016] Optionally, before determining the power to be adjusted based on the real-time current, the real-time voltage, and the preset target resistance, the method further includes: Obtain the target temperature of the chip to be manufactured; Based on the relationship between the temperature and resistance of the load unit, the resistance corresponding to the target temperature is determined as the target resistance.

[0017] In this embodiment, the temperature of the load unit is used as a reference for the manufacturing temperature of the chip to be manufactured. First, the real-time power of the load unit is calculated based on the real-time current and real-time voltage. Then, the current target power of the load unit is calculated based on the preset target resistance and real-time current of the load unit. Finally, the conduction time of the AC power supply of the load unit in each half-cycle is adjusted based on the real-time power and the target power so that the load unit reaches the target power. Since the temperature of the load unit is related to the resistance value, when the load unit reaches the target power, the resistance value also reaches the target resistance. Therefore, the temperature of the load unit reaches the target temperature corresponding to the target resistance, which can better control the chip to be manufactured to be accurately at the target temperature during the manufacturing process. In addition, since the adjustment of the load unit's power does not involve temperature detection and conversion, but is only related to the electrical parameters of the load unit, and the detection efficiency of electrical parameters is high, the power result of the load unit can be quickly calculated, thereby ensuring the accuracy of the temperature of the chip to be manufactured during the chip manufacturing process. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of an embodiment of the temperature control system for chip manufacturing provided by the present invention; Figure 2 This is a circuit diagram of an embodiment of a temperature control system for chip manufacturing provided by the present invention; Figure 3This is a schematic flowchart of an embodiment of a temperature control method for chip manufacturing provided in this application. Detailed Implementation

[0020] It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the invention.

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0023] Furthermore, the use of terms such as "first" and "second" in this invention is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, the user should consider such a combination of technical solutions to be non-existent and not within the scope of protection claimed by this invention.

[0024] This invention provides a temperature control system for chip manufacturing, referring to... Figure 1 , Figure 1 This is a schematic diagram of an embodiment of a temperature control system for chip manufacturing provided by the present invention.

[0025] Temperature control system 100 for chip manufacturing includes: The load unit 101 is used to support the chip to be manufactured, wherein the temperature of the load unit 101 is related to the resistance value; The current measurement unit 102 is electrically connected to the load unit 101 and is used to acquire the real-time current of the load unit 101. The voltage measurement unit 103 is electrically connected to the load unit 101 and is used to acquire the real-time voltage of the load unit 101. The control unit 104 is electrically connected to the load unit 101 and signal-connected to the current measurement unit 102 and the voltage measurement unit 103. It is used to determine the power to be adjusted based on the real-time current, real-time voltage and the preset target resistance, and to control the conduction time of the AC power supply of the load unit 101 in each half-cycle based on the power to be adjusted.

[0026] It should be noted that the load unit 101 is arranged adjacent to the chip to be manufactured or the chip to be manufactured is placed inside the cavity of the load unit 101. When ignoring the influence of other external factors, it is assumed that the temperature of the load unit 101 is the same as the manufacturing temperature of the chip to be manufactured.

[0027] The temperature-resistance relationship of the load unit 101 means that the resistance value of the load unit 101 changes with the temperature. In a specific embodiment, the load unit 101 can be a positive temperature coefficient (PTC) thermistor or a negative temperature coefficient (NTC) thermistor, and there is no limitation here.

[0028] In this embodiment, the temperature of the load unit 101 is used as a reference for the manufacturing temperature of the chip to be manufactured. First, the real-time power of the load unit 101 is calculated based on the real-time current and real-time voltage. Then, the current target power of the load unit 101 is calculated based on the preset target resistance of the load unit 101 and the real-time current. Finally, the conduction time of the AC power supply of the load unit 101 in each half-cycle is adjusted based on the real-time power and the target power to make the load unit 101 reach the target power. Since the temperature of the load unit 101 is related to the resistance value, when the load unit 101 reaches the target power, the resistance value also reaches the target resistance. Therefore, the temperature of the load unit 101 reaches the target temperature corresponding to the target resistance, which can better control the chip to be manufactured to be accurately at the target temperature during the manufacturing process. In addition, since the adjustment of the power of the load unit 101 does not involve temperature detection and conversion, but is only related to the electrical parameters of the load unit 101, and the detection efficiency of electrical parameters is high, the power result of the load unit 101 can be quickly calculated, thereby ensuring the accuracy of the temperature of the chip to be manufactured during the chip manufacturing process.

[0029] In this embodiment, by converting the temperature and resistance value of the load unit 101 to each other, since the target temperature and target resistance of the load unit 101 are uniquely correlated, after determining the target resistance, it is only necessary to calculate the real-time resistance of the load unit 101 based on the real-time current and real-time voltage, and compare the magnitude relationship between the target resistance and the real-time resistance to determine the direction of resistance adjustment. Since the resistance of the load unit 101 changes with its power, by controlling the conduction time of the AC power supply of the load unit 101 in each half-cycle to adjust the power of the load unit 101, the temperature of the load unit 101 can be adjusted efficiently and accurately.

[0030] In a specific embodiment, in order to achieve efficient and accurate control of the power of the load unit 101, the control unit 104 is finely configured. Specifically, the control unit 104 includes a data processing module, a first drive circuit Drive1 and a second drive circuit Drive2, and the data processing module is signal-connected to the first drive circuit Drive1 and the second drive circuit Drive2. The first driving circuit Drive1 and the second driving circuit Drive2 are both electrically connected to the power supply of the load unit 101. The data processing module is connected to the current measurement unit 102 and the voltage measurement unit 103 respectively. The data processing module is used to determine the power to be adjusted based on the real-time current, real-time voltage and the preset target resistance, and generate driving instructions based on the power to be adjusted. The driving instructions include boost instructions and buck instructions. When the power to be adjusted is less than zero, a step-down command is generated, and the first drive circuit Drive1 controls the conduction time of the reverse AC power according to the step-down command. When the power to be adjusted is greater than zero, a boost command is generated, and the second drive circuit Drive2 controls the conduction time of the positive AC power according to the boost command.

[0031] In this embodiment, the power to be adjusted of the load unit 101 is calculated with the target resistance as a reference, and a drive command is generated based on the power to be adjusted. This enables feedback closed-loop control of the power of the load unit 101. The conduction time of the reverse AC and forward AC is adjusted by the first drive circuit Drive1 and the second drive circuit Drive2, respectively. Without changing other modules of the chip manufacturing system, the power of the load unit 101 can be controlled accurately and quickly, and unnecessary power consumption is avoided.

[0032] Furthermore, to accurately describe the connection relationships of the various components in the temperature control system used for chip manufacturing, refer to... Figure 2 , Figure 2 This is a circuit diagram of an embodiment of a temperature control system for chip manufacturing provided by the present invention.

[0033] The first driving circuit Drive1 includes a first unidirectional thyristor SCRA1, a first capacitor C1, a third capacitor C3, a first resistor R1, a third resistor R3, a first diode VD1, a second diode VD2, a fifth diode VD5, and a first driving transformer T1. The second driving circuit Drive2 includes a second unidirectional thyristor SCRA2, a second capacitor C2, a fourth capacitor C4, a second resistor R2, a fourth resistor R4, a third diode VD3, a fourth diode VD4, a sixth diode VD6, and a second driving transformer T2. The first unidirectional thyristor SCRA1 and the second unidirectional thyristor SCRA2 are connected in parallel. The first terminal of the first unidirectional thyristor SCRA1 is electrically connected to the first terminal of the second unidirectional thyristor SCRA2, the first terminal of the second capacitor C2, the first terminal of the second resistor R2, and the first terminal of the third diode VD3. The second terminal of the first unidirectional thyristor SCRA1 is electrically connected to the second terminal of the second unidirectional thyristor SCRA2, the power supply of the load unit 101, the second terminal of the first capacitor C1, the second terminal of the first resistor R1, the second terminal of the second diode VD2, and the second terminal of the first drive transformer T1. The third terminal of the first unidirectional thyristor SCRA1 is electrically connected to the first terminal of the first capacitor C1, the first terminal of the first resistor R1, and the first terminal of the first diode VD1. The first terminal of the second unidirectional thyristor SCRA2 is electrically connected to the first terminal of the second capacitor C2, the first terminal of the second resistor R2, and the first terminal of the third diode VD3. The second terminal of the second unidirectional thyristor SCRA2 is electrically connected to the power supply, the second terminal of the first capacitor C1, the second terminal of the first resistor R1, the second terminal of the second diode VD2, and the second terminal of the first drive transformer T1. The third terminal of the second unidirectional thyristor SCRA2 is electrically connected to the second terminal of the second capacitor C2, the second terminal of the second resistor R2, the second terminal of the fourth diode VD4, and the second terminal of the second drive transformer T2. The second capacitor C2 is connected in parallel with the second resistor R2. The first terminal of the third diode VD3 is electrically connected to the first terminal of the second capacitor C2 and the first terminal of the second resistor R2. The second terminal of the third diode VD3 is electrically connected to the first terminal of the fourth diode VD4 and the first terminal of the first drive transformer T1. The second terminal of the fourth diode VD4 is electrically connected to the first terminal of the second capacitor C2 and the first terminal of the second resistor R2. Drive transformer The second terminal of T2, the second terminal of the second capacitor C2, and the second terminal of the second resistor R2 are electrically connected; The third terminal of the first drive transformer T1 is electrically connected to the first terminal of the fifth diode VD5 and the first terminal of the third capacitor C3, respectively. The fourth terminal of the first drive transformer T1 is electrically connected to the second terminal of the fifth diode VD5 and the first terminal of the third resistor R3, respectively. The second terminal of the third resistor R3 is connected to the control unit 104. The third terminal of the second drive transformer T2 is electrically connected to the first terminal of the sixth diode VD6 and the first terminal of the fourth capacitor C4, respectively. The fourth terminal of the second drive transformer T2 is electrically connected to the second terminal of the sixth diode VD6 and the first terminal of the fourth resistor R4, respectively. The second terminal of the fourth resistor R4 is connected to the control unit 104. The first unidirectional thyristor SCRA1 is used to control the on-time of the reverse AC current according to the step-down command, and the second unidirectional thyristor SCRA2 is used to control the on-time of the forward AC current according to the step-up command.

[0034] It should be noted that by adjusting the conduction angles of the first unidirectional thyristor SCRA1 and the second unidirectional thyristor SCRA2, the conduction time of the reverse / forward alternating current can be precisely adjusted. The longer the conduction time, the greater the energy supplied to the load unit 101 within one AC cycle, and the higher the heat generation power of the load unit 101. By connecting the first unidirectional thyristor SCRA1 and the second unidirectional thyristor SCRA2 in parallel, the current flow in the circuit can be independently controlled in both the positive and negative half-cycles.

[0035] The third diode VD3 and the fourth diode VD4 act as selection valves, ensuring that the positive pulse generated by the first drive transformer T1 can only turn on the first unidirectional thyristor SCRA1; the positive pulse generated by the second drive transformer T2 can only turn on the second unidirectional thyristor SCRA2. They block potential interference paths or false trigger voltages formed from the high-voltage side (anode) through the gate circuit, increasing the triggering reliability of the system under high-voltage operation.

[0036] The connection relationship of the third diode VD3, the fourth diode VD4, the fifth diode VD5, and the sixth diode VD6 helps with signal path selection, freewheeling, and protection of drive circuit components. The use of a drive transformer effectively isolates the low-voltage control unit 104 (which sends buck or boost commands) from the high-voltage, high-current main circuit, protecting the controller and improving the system's anti-interference capability.

[0037] By independently and precisely controlling the conduction start point (phase angle) of the forward (second unidirectional thyristor SCRA2) and reverse (first unidirectional thyristor SCRA1) AC waves, extremely precise adjustment of the heater (load) input power is achieved within a single AC cycle.

[0038] In this embodiment, efficient independent bidirectional power regulation is achieved by setting up two completely independent drive circuits (first drive circuit Drive1 and second drive circuit Drive2). Specifically, the first drive circuit Drive1 controls the negative power injection by controlling the reverse conduction time to reduce the load power and achieve the purpose of cooling the load unit 101; the second drive circuit Drive2 controls the positive power injection by controlling the forward conduction time to increase the load power and achieve the purpose of heating the load unit 101. This isolation design ensures that the boost (heating) and buck (cooling) actions do not interfere with each other, and the command execution is clear and efficient. In addition, since the average power actually delivered to the load can be adjusted by controlling the conduction angle of the thyristor within each AC half-cycle, the power adjustment range can be maximized, and the efficiency of temperature control can be improved.

[0039] Further, please refer to Figure 2 The current measurement unit 102 includes a fifth resistor R5, a sixth resistor R6, a seventh resistor R7, an eighth resistor R8, a ninth resistor R9, a tenth resistor R10, an eleventh resistor R11, a twelfth resistor R12, a thirteenth resistor R13, a fifth capacitor C5, a sixth capacitor C6, a seventh capacitor C7, an eighth capacitor C8, a ninth capacitor C9, a tenth capacitor C10, an eleventh capacitor C11, a twelfth capacitor C12, a thirteenth capacitor C13, a first isolation amplifier U1, a first operational amplifier OP1, and a first transient voltage suppression diode TVS1; Specifically, the first terminal of the fifth resistor R5 is electrically connected to the first terminal of the sixth resistor R6, and the second terminal of the fifth resistor R5 is electrically connected to the first terminal of the seventh resistor R7; the second terminal of the sixth resistor R6 is electrically connected to the first terminal of the fifth capacitor C5, the second terminal of the seventh capacitor C7, and the second terminal of the first isolation amplifier U1; the second terminal of the seventh resistor R7 is electrically connected to the first terminal of the sixth capacitor C6, the first terminal of the seventh capacitor C7, and the first terminal of the first isolation amplifier U1; the first terminal of the fifth capacitor C5 is electrically connected to the second terminal of the seventh capacitor C7, and the first terminal of the sixth capacitor C6 is electrically connected to the first terminal of the seventh capacitor C7; the first terminal of the first isolation amplifier U1 is electrically connected to the first terminal of the eighth capacitor C8 and the first terminal of the ninth capacitor C9, and the eighth capacitor C8 and the ninth capacitor C9 are connected in parallel; the third terminal of the first isolation amplifier U1 is electrically connected to the first terminal of the tenth capacitor C10, ... The first terminal of capacitor C11 is electrically connected to the first terminal of the eighth resistor R8; the fourth terminal of the first isolation amplifier U1 is electrically connected to the first terminal of the ninth resistor R9; the second terminal of the eighth resistor R8 is electrically connected to the first terminal of the tenth resistor R10 and the first terminal of the twelfth capacitor C12; the second terminal of the ninth resistor R9 is electrically connected to the first terminal of the eleventh resistor R11 and the second terminal of the twelfth capacitor C12; the second terminal of the tenth resistor R10 is electrically connected to the first terminal of the twelfth resistor R12 and the first terminal of the first operational amplifier OP1; the second terminal of the eleventh resistor R11 is electrically connected to the first terminal of the thirteenth resistor R13 and the second terminal of the first operational amplifier OP1; the third terminal of the first operational amplifier OP1 is electrically connected to the second terminal of the twelfth resistor R12, the first terminal of the first transient voltage suppression diode TVS1, and the second terminal of the thirteenth capacitor C13.

[0040] In this embodiment, a differential front end is formed by the fifth resistor R5, the sixth resistor R6, the seventh resistor R7, the fifth capacitor C5, the sixth capacitor C6, the seventh capacitor C7 and the input terminal of the first isolation amplifier U1. This front end can measure the small voltage drop on the high-side current sensing resistor and accurately acquire small signals. In addition, since the differential filter capacitor can filter out low-frequency information and block high-frequency interference, the circuit can process cleaner signals and improve the accuracy of current detection results.

[0041] In addition, the first isolation amplifier U1 electrically isolates the input side (connected to the current being measured loop) and the output side (connected to the logic circuit of the control system), so that high voltage and transient interference (such as ESD and surge) are limited to the input side and cannot be conducted to the vulnerable control system; the transient voltage suppression diode is located at the output of the first operational amplifier OP1, providing secondary protection, clamping abnormal high voltage (such as accidental induced voltage), and preventing it from damaging the subsequent microcontroller.

[0042] High-frequency noise (such as switching noise) in the measured current is filtered out by capacitors C5, C6, C7, C8, and C9; a clean and stable power supply is provided by capacitors C8 and C9 to prevent power fluctuations from affecting accuracy; and noise introduced by the amplifier circuit is further filtered out by capacitors C12 and C13.

[0043] The first operational amplifier OP1 constitutes a precision differential amplifier / signal conditioning circuit, providing appropriate gain and accurately adjusting the processed signal level to the input range of the ADC (analog-to-digital converter). The precise matching of the op-amp input terminals (tenth resistor R10, eleventh resistor R11, twelfth resistor R12 and thirteenth resistor R13) with the feedback resistor (twelfth resistor R12) determines the gain accuracy and linearity.

[0044] In this embodiment, by providing a high-precision, securely isolated current measurement front-end design, it is possible to accurately sample weak current signals (which may be the excitation current of the temperature measuring resistor or the operating current of the sensing element). Based on this accurate and reliable current measurement value, a fast and accurate heating or cooling decision can be made, thereby achieving high-precision and high-stability control of the temperature of key processes in chip manufacturing (such as heat treatment, deposition, and etching).

[0045] Further, please refer to Figure 2 The voltage measurement unit 103 includes fourteenth resistor R14, fifteenth resistor R15, sixteenth resistor R16, seventeenth resistor R17, eighteenth resistor R18, nineteenth resistor R19, twentieth resistor R20, twenty-first resistor R21, twenty-second resistor R22, twenty-third resistor R23, twenty-fourth resistor R24, twenty-fifth resistor R25, twenty-sixth resistor R26, twenty-seventh resistor R27, twenty-eighth resistor R28, fourteenth capacitor C14, fifteenth capacitor C15, sixteenth capacitor C16, seventeenth capacitor C17, eighteenth capacitor C18, nineteenth capacitor C19, twentieth capacitor C20, twenty-first capacitor C21, twenty-second capacitor C22, second isolation amplifier U2, second operational amplifier OP2, and second transient voltage suppression diode TVS2; Among them, the fourteenth resistor R14, the fifteenth resistor R15, the sixteenth resistor R16, the seventeenth resistor R17, the eighteenth resistor R18 and the nineteenth resistor R19 are connected in series. The first end of the fourteenth resistor R14 is electrically connected to the load unit 101, and the second end of the nineteenth resistor R19 is electrically connected to the first end of the twentieth resistor R20 and the first end of the twenty-first resistor R21, respectively. The second terminal of the twentieth resistor R20 is electrically connected to the first terminal of the load unit 101 and the twenty-second resistor R22, respectively; the second terminal of the twenty-first resistor R21 is electrically connected to the first terminal of the fifteenth capacitor C15, the first terminal of the eighteenth capacitor C18, and the first terminal of the second isolation amplifier U2, respectively; the first terminal of the second isolation amplifier U2 is electrically connected to the first terminal of the sixteenth capacitor C16 and the first terminal of the seventeenth capacitor C17, respectively, with the sixteenth capacitor C16 and the seventeenth capacitor C17 connected in parallel; the second terminal of the twenty-second resistor R22 is electrically connected to the first terminal of the fourteenth capacitor C14, the second terminal of the eighteenth capacitor C18, and the second terminal of the second isolation amplifier U2, respectively; the third terminal of the second isolation amplifier U2 is electrically connected to the first terminal of the nineteenth capacitor C19, the first terminal of the twentieth capacitor C20, and the first terminal of the twenty-third resistor R23, respectively; the second isolation... The fourth terminal of amplifier U2 is electrically connected to the first terminal of the twenty-fourth resistor R24; the second terminal of the twenty-third resistor R23 is electrically connected to the first terminal of the twenty-first capacitor C21 and the first terminal of the twenty-fifth resistor R25; the second terminal of the twenty-fourth resistor R24 ​​is electrically connected to the second terminal of the twenty-first capacitor C21 and the first terminal of the twenty-sixth resistor R26; the second terminal of the twenty-fifth resistor R25 is electrically connected to the first terminal of the twenty-seventh resistor R27 and the first terminal of the second operational amplifier OP2; the second terminal of the twenty-sixth resistor R26 is electrically connected to the first terminal of the twenty-eighth resistor R28 and the second terminal of the second operational amplifier OP2; the third terminal of the second operational amplifier OP2 is electrically connected to the second terminal of the twenty-seventh resistor R27, the first terminal of the second transient voltage suppressor diode TVS2, and the first terminal of the twenty-second capacitor C22.

[0046] It should be noted that by connecting the fourteenth resistor R14, the fifteenth resistor R15, the sixteenth resistor R16, the seventeenth resistor R17, the eighteenth resistor R18, and the nineteenth resistor R19 in series, these high-value resistors attenuate the high input voltage to a lower range suitable for subsequent circuitry (especially operational amplifiers). Connecting resistors in series distributes the high voltage, preventing individual resistors from being damaged by excessive voltage or power.

[0047] The second isolation amplifier U2 provides electrical isolation between the measurement end (high voltage side) and the signal processing / output end (low voltage side). This not only prevents high voltage / high current faults (such as short circuits and lightning strikes) from endangering equipment and operators on the low voltage side through the measurement line, but also effectively isolates common-mode noise, ground loop interference, and potential difference that exist between the measurement point and the low voltage ground.

[0048] A differential measurement structure is formed by the twentieth resistor R20, the twenty-first resistor R21, and the twenty-second resistor R22, which realizes dual-end voltage division sampling and can effectively suppress common-mode interference that occurs between the two measurement points.

[0049] A pre-stage low-pass filter is constructed using capacitors C15 (15th), C16 (16th), C17 (17th), and C18 (18th) to filter out high-frequency noise and interference, preventing these noises from being amplified in subsequent amplification stages. C16 and C17 are connected in parallel to improve high-frequency filtering or reduce the equivalent series resistance / inductance, while C15 and C18 form another branch of the filter.

[0050] The nineteenth capacitor C19 and the twentieth capacitor C20 are connected to the output of the isolation amplifier to form a low-pass filter in the subsequent stage, which can filter the output signal again; the twenty-second capacitor C22 plays a filtering and stabilizing role.

[0051] A precision differential amplifier / subtractor is constructed using resistors R25 (25th), R26 (26th), R27 (27th), and R28 (28th). This accurately converts the differential signal output from the isolation amplifier into a single-ended voltage signal that is easily processed by the main control system or ADC. This set of resistors is crucial for maintaining a high common-mode rejection ratio, ensuring that the output signal only reflects changes in voltage difference. Multi-stage filtering effectively suppresses interference of various frequencies, resulting in a cleaner and more stable measurement signal.

[0052] In this embodiment, high voltage is processed by a voltage divider network, electrical isolation and safety are achieved by using an isolation amplifier, common-mode interference is suppressed by a precision differential amplifier, and multi-stage filtering and transient voltage suppression diode protection are provided to achieve accurate, reliable and safe measurement of high voltage or voltage with large interference and potential difference.

[0053] As a preferred embodiment, the temperature control system for chip manufacturing further includes a power supply unit, with a first end of the power supply unit electrically connected to the load unit 101 and a second end of the power supply unit electrically connected to the control unit 104. The power supply unit is used to provide AC power to the load unit 101.

[0054] Furthermore, the temperature control system for chip manufacturing also includes an alarm unit, which is signal-connected to the control unit 104 and is used to issue an alarm signal based on real-time current, real-time voltage, and a preset alarm resistor.

[0055] In this embodiment, the alarm unit monitors the current and voltage of the load unit 101 in real time to calculate the real-time resistance, and compares it with a preset safety alarm resistance threshold. Once the resistance deviates from the safe range, an alarm signal is immediately issued. This enables early detection and warning of potential load unit 101 (heating element) faults (aging, short circuit, poor contact, etc.), thereby ensuring the safety, stability, and reliability of the chip manufacturing process, preventing equipment damage and material loss, and assisting in maintenance and diagnostic work.

[0056] Furthermore, the temperature control system for chip manufacturing also includes an information interaction unit, which is electrically connected to the control unit 104 and is used to adjust a preset target resistance.

[0057] In this embodiment, the key parameter of preset target resistance is transformed from a fixed state to a configurable option through the information interaction unit, which greatly improves the system adaptability and process compatibility and realizes the adjustability of the control target.

[0058] On the other hand, this application also provides a temperature control method for chip manufacturing; please refer to [link to relevant documentation]. Figure 3 , Figure 3 This is a schematic flowchart of an embodiment of a temperature control method for chip manufacturing provided in this application, including: S301: Obtain the real-time current and real-time voltage of the load cell, wherein the chip to be manufactured is arranged adjacent to the load cell, and the temperature of the load cell is related to the resistance value. S302: Determine the power to be adjusted based on real-time current, real-time voltage, and preset target resistance; S303: On-time of the AC power supply for the load unit to be adjusted in each half-cycle.

[0059] In this embodiment, the temperature of the load unit is used as a reference for the manufacturing temperature of the chip to be manufactured. First, the real-time power of the load unit is calculated based on the real-time current and real-time voltage. Then, the current target power of the load unit is calculated based on the preset target resistance and real-time current of the load unit. Finally, the conduction time of the AC power supply of the load unit in each half-cycle is adjusted based on the real-time power and the target power to ensure that the load unit reaches the target power. Since the temperature of the load unit is related to the resistance value, when the load unit reaches the target power, the resistance value also reaches the target resistance. Therefore, the temperature of the load unit reaches the target temperature corresponding to the target resistance, which can effectively control the chip to be manufactured to be precisely at the target temperature during the manufacturing process. In addition, since the adjustment of the load unit's power does not involve temperature detection and conversion, but only relates to the electrical parameters of the load unit, and the detection efficiency of electrical parameters is high, the power result of the load unit can be calculated quickly, thereby ensuring the accuracy of the temperature of the chip to be manufactured during the chip manufacturing process. In one specific embodiment, before determining the power to be adjusted based on the real-time current, real-time voltage, and preset target resistance in S302, the method further includes: Obtain the target temperature of the chip to be manufactured; Based on the relationship between the temperature and resistance of the load unit, the resistance corresponding to the target temperature is determined as the target resistance.

[0060] In this embodiment, the temperature target, which is difficult to measure directly and quickly, is converted into a resistance target that can be accurately tracked and adjusted using real-time electrical measurements (voltage and current) by using resistance as an intermediate quantity, thus providing clear feedback for power regulation.

[0061] In one specific embodiment, determining the power to be adjusted based on real-time current, real-time voltage, and a preset target resistance includes: Calculate the real-time power of the load unit based on the real-time current and real-time voltage. Calculate the target power based on the real-time current and the preset target resistance; The difference between the target power and the real-time power is used to obtain the power to be adjusted.

[0062] In this embodiment, the real-time power of the load unit is compared with the target power based on the real-time current to obtain the power to be adjusted. Since this application only adaptively adjusts the conduction time of the AC power supply in each half-cycle, the impact on the current of the load unit is small, thus improving the rationality of the power to be adjusted and the temperature control accuracy during chip manufacturing.

[0063] In one specific embodiment, in order to adjust the power change time of the load unit and control the power change amplitude, a drive command is generated based on the power to be adjusted, and the conduction time of the AC power supply of the load unit in each half-cycle is controlled according to the drive command, including: The power adjustment ratio is obtained by dividing the value of the power to be adjusted by the preset power adjustment threshold. The conduction time is obtained by multiplying the power adjustment ratio by the half-cycle time.

[0064] In this embodiment, the effective power consumed by the load is precisely adjusted by changing the conduction time of the AC power supply of the load unit, thereby achieving stepless adjustment of the load unit power.

[0065] It should be noted that the workflow described above is merely illustrative and does not limit the scope of protection of this invention. In practical applications, those skilled in the art can select some or all of the workflow to achieve the purpose of this embodiment according to actual needs, and no restrictions are imposed here.

[0066] In addition, for technical details not described in detail in this embodiment, please refer to the temperature control method for chip manufacturing provided in any embodiment of the present invention, which will not be repeated here.

[0067] Furthermore, it should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0068] The sequence numbers of the above embodiments of the present invention are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0069] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as read-only memory (ROM) / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of the present invention.

[0070] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. A temperature control system for chip manufacturing, characterized in that, include: A load unit is used to support the chip to be manufactured, wherein the temperature of the load unit is related to its resistance value; A current measurement unit, electrically connected to the load unit, is used to acquire the real-time current of the load unit; A voltage measurement unit, electrically connected to the load unit, is used to acquire the real-time voltage of the load unit; The control unit is electrically connected to the load unit and signal-connected to the current measurement unit and the voltage measurement unit. It is used to determine the power to be adjusted based on the real-time current, the real-time voltage and the preset target resistance, and to control the conduction time of the AC power supply of the load unit in each half-cycle based on the power to be adjusted. The control unit includes a data processing module, a first driving circuit, and a second driving circuit, wherein the data processing module is signal-connected to the first driving circuit and the second driving circuit. The first driving circuit and the second driving circuit are both electrically connected to the power supply of the load unit. The data processing module is signal connected to the current measurement unit and the voltage measurement unit respectively. The data processing module is used to determine the power to be adjusted based on the real-time current, the real-time voltage and the preset target resistance, and generate driving instructions based on the power to be adjusted. The driving instructions include boost instructions and buck instructions. When the power to be adjusted is less than zero, the step-down command is generated, and the first drive circuit controls the conduction time of the reverse AC power according to the step-down command; when the power to be adjusted is greater than zero, the step-up command is generated, and the second drive circuit controls the conduction time of the forward AC power according to the step-up command. The first driving circuit includes a first unidirectional thyristor, and the second driving circuit includes a second unidirectional thyristor; the first unidirectional thyristor is used to control the conduction time of the reverse alternating current according to the buck command, and the second unidirectional thyristor is used to control the conduction time of the forward alternating current according to the boost command.

2. The temperature control system for chip manufacturing according to claim 1, wherein determining the power to be adjusted based on the real-time current, the real-time voltage, and a preset target resistance, and controlling the on-time of the AC power supply of the load unit in each half-cycle based on the power to be adjusted includes: The real-time power of the load unit is calculated based on the real-time current and the real-time voltage, and the current target power of the load unit is calculated based on the target resistance of the load unit and the real-time current. The conduction time of the AC power supply of the load unit in each half-cycle is adjusted based on the real-time power and the target power.

3. The temperature control system for chip manufacturing according to claim 1, characterized in that, The first driving circuit further includes a first capacitor, a third capacitor, a first resistor, a third resistor, a first diode, a second diode, a fifth diode, and a first driving transformer; the second driving circuit further includes a second capacitor, a fourth capacitor, a second resistor, a fourth resistor, a third diode, a fourth diode, a sixth diode, and a second driving transformer. The first unidirectional thyristor is connected in parallel with the second unidirectional thyristor. The first end of the first unidirectional thyristor is electrically connected to the first end of the second unidirectional thyristor, the first end of the second capacitor, the first end of the second resistor, and the first end of the third diode. The second end of the first unidirectional thyristor is electrically connected to the second end of the second unidirectional thyristor, the power supply of the load unit, the second end of the first capacitor, the second end of the first resistor, the second end of the second diode, and the second end of the first drive transformer. The third end of the first unidirectional thyristor is electrically connected to the first end of the first capacitor, the first end of the first resistor, and the first end of the first diode. The first end of the second unidirectional thyristor is electrically connected to the first end of the second capacitor, the first end of the second resistor, and the first end of the third diode, respectively. The second end of the second unidirectional thyristor is electrically connected to the power supply, the second end of the first capacitor, the second end of the first resistor, the second end of the second diode, and the second end of the first drive transformer, respectively. The third end of the second unidirectional thyristor is electrically connected to the second end of the second capacitor, the second end of the second resistor, the second end of the fourth diode, and the second end of the second drive transformer, respectively. The second capacitor is connected in parallel with the second resistor. The first terminal of the third diode is electrically connected to the first terminal of the second capacitor and the first terminal of the second resistor, respectively. The second terminal of the third diode is electrically connected to the first terminal of the fourth diode and the first terminal of the first driving transformer, respectively. The second terminal of the fourth diode is electrically connected to the second terminal of the second driving transformer, the second terminal of the second capacitor, and the second terminal of the second resistor, respectively. The third terminal of the first driving transformer is electrically connected to the first terminal of the fifth diode and the first terminal of the third capacitor, respectively. The fourth terminal of the first driving transformer is electrically connected to the second terminal of the fifth diode and the first terminal of the third resistor, respectively. The second terminal of the third resistor is connected to the control unit. The third terminal of the second drive transformer is electrically connected to the first terminal of the sixth diode and the first terminal of the fourth capacitor, respectively. The fourth terminal of the second drive transformer is electrically connected to the second terminal of the sixth diode and the first terminal of the fourth resistor, respectively. The second terminal of the fourth resistor is connected to the control unit.

4. The temperature control system for chip manufacturing according to claim 1, characterized in that, The voltage measurement unit includes a fourteenth resistor, a fifteenth resistor, a sixteenth resistor, a seventeenth resistor, an eighteenth resistor, a nineteenth resistor, a twentieth resistor, a twenty-first resistor, a twenty-second resistor, a twenty-third resistor, a twenty-fourth resistor, a twenty-fifth resistor, a twenty-sixth resistor, a twenty-seventh resistor, a twenty-eighth resistor, a fourteenth capacitor, a fifteenth capacitor, a sixteenth capacitor, a seventeenth capacitor, an eighteenth capacitor, a nineteenth capacitor, a twentieth capacitor, a twenty-first capacitor, a twenty-second capacitor, a second isolation amplifier, a second operational amplifier, and a second transient voltage suppression diode; The fourteenth resistor, the fifteenth resistor, the sixteenth resistor, the seventeenth resistor, the eighteenth resistor, and the nineteenth resistor are connected in series. The first end of the fourteenth resistor is electrically connected to the load unit, and the second end of the nineteenth resistor is electrically connected to the first end of the twentieth resistor and the first end of the twenty-first resistor, respectively. The second end of the twentieth resistor is electrically connected to the first end of the load unit and the twentieth twelfth resistor, respectively; The second terminal of the 21st resistor is electrically connected to the first terminal of the 15th capacitor, the first terminal of the 18th capacitor, and the first terminal of the second isolation amplifier, respectively. The first terminal of the second isolation amplifier is electrically connected to the first terminal of the sixteenth capacitor and the first terminal of the seventeenth capacitor, respectively, and the sixteenth capacitor and the seventeenth capacitor are connected in parallel; The second terminal of the 22nd resistor is electrically connected to the first terminal of the 14th capacitor, the second terminal of the 18th capacitor, and the second terminal of the second isolation amplifier, respectively. The third terminal of the second isolation amplifier is electrically connected to the first terminal of the nineteenth capacitor, the first terminal of the twentieth capacitor, and the first terminal of the twenty-third resistor, respectively. The fourth terminal of the second isolation amplifier is electrically connected to the first terminal of the twenty-fourth resistor; The second end of the 23rd resistor is electrically connected to the first end of the 21st capacitor and the first end of the 25th resistor, respectively. The second terminal of the 24th resistor is electrically connected to the second terminal of the 21st capacitor and the first terminal of the 26th resistor, respectively. The second terminal of the 25th resistor is electrically connected to the first terminal of the 27th resistor and the first terminal of the second operational amplifier, respectively. The second terminal of the 26th resistor is electrically connected to the first terminal of the 28th resistor and the second terminal of the second operational amplifier, respectively. The third terminal of the second operational amplifier is electrically connected to the second terminal of the second seventeenth resistor, the first terminal of the second transient voltage suppressor diode, and the first terminal of the second twenty-second capacitor.

5. The temperature control system for chip manufacturing according to claim 1, characterized in that, It also includes a power supply unit, the first end of which is electrically connected to the load unit, and the second end of which is electrically connected to the control unit; The power supply unit is used to provide AC power to the load unit.

6. The temperature control system for chip manufacturing according to claim 1, characterized in that, It also includes an alarm unit, which is signal-connected to the control unit and is used to issue an alarm signal based on the real-time current, the real-time voltage, and a preset alarm resistor.

7. The temperature control system for chip manufacturing according to claim 1, characterized in that, It also includes an information interaction unit, which is electrically connected to the control unit and is used to adjust the preset target resistance.

8. A temperature control method for chip manufacturing, characterized in that, The temperature control system for chip manufacturing as described in any one of claims 1-7 includes: The real-time current and real-time voltage of the load unit are obtained, wherein the chip to be manufactured is arranged adjacent to the load unit, and the temperature of the load unit is related to its resistance value; The power to be adjusted is determined based on the real-time current, the real-time voltage, and the preset target resistance. The on-time of the AC power supply of the load unit in each half-cycle is controlled based on the power to be adjusted.

9. The temperature control method for chip manufacturing according to claim 8, characterized in that, Before determining the power to be adjusted based on the real-time current, the real-time voltage, and the preset target resistance, the method further includes: Obtain the target temperature of the chip to be manufactured; Based on the relationship between the temperature and resistance of the load unit, the resistance corresponding to the target temperature is determined as the target resistance.

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