Conductive contact assembly and earphone
Patent Information
- Application Number
- CN202511250736.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-03
- Publication Date
- 2026-08-18
- Estimated Expiration
- 2045-09-03
AI Technical Summary
[0005]本发明公开了一种导电触头组件及耳机,以解决相关技术中的耳机在装配时,存在导电触头和第一导电弹片易损坏的技术问题
本发明的导电触头组件,包括导电触头,导电触头具有弹片抵接部和充电接触部,弹片抵接部用于与耳机内的第一导电弹片抵接,充电接触部用于与耳机盒内的第二导电弹片抵接,当弹片抵接部与第一导电弹片抵接时,弹片抵接部受力形变,弹片抵接部形变过程中,弹片抵接部以弹片抵接部与充电接触部的连接点为支点进行转动,由于弹片抵接部与充电接触部偏置设置,相比于现有技术,可减小充电接触部对弹片抵接部形变造成的阻力,从而在耳机装配过程中,可降低弹片抵接部和第一导电弹片损坏的隐患,从而可提高产品合格率。
Smart Images

Figure CN121076508B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electronic product technology, and in particular to a conductive contact assembly and an earphone. Background Technology
[0002] Currently, headphones are becoming increasingly widely used. To improve the ease of use of headphones and eliminate the interference caused by traditional headphone cables during use and storage, Bluetooth headphones based on Bluetooth chip technology have been developed. Traditional Bluetooth headphones typically use conductive contacts inside the headphone housing to connect with external charging devices for charging.
[0003] Patent application number 202222009724.5 discloses an earphone in which a conductive contact is inserted into the earphone shell, with one end of the conductive contact abutting against a first conductive spring on a circuit board, and the other end abutting against a second conductive spring inside the earphone case. However, in the related technology, the conductive contact is installed in the earphone shell by insertion, which not only easily leads to the conductive contact falling out of the shell, but also easily causes damage to the conductive contact and the first conductive spring when they abut against each other, affecting the product qualification rate.
[0004] Therefore, providing a headphone with a robust structure that is not easily damaged during assembly is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention
[0005] This invention discloses a conductive contact assembly and an earphone, in order to solve the technical problem that the conductive contacts and the first conductive spring are easily damaged during the assembly of earphones in the related art.
[0006] To solve the above problems, the present invention adopts the following technical solution: The first aspect of the present invention discloses a conductive contact assembly.
[0007] The conductive contact assembly of this embodiment is used in an earphone. The conductive contact assembly includes a conductive contact, which includes a spring contact portion and a charging contact portion. One end of the spring contact portion is connected to the charging contact portion and is offset from the charging contact portion. The other end of the spring contact portion is used to abut against a first conductive spring in the earphone. One side of the charging contact portion is used to connect to the spring contact portion, and the other side is used to abut against a second conductive spring in the earphone case.
[0008] According to an optional embodiment, the conductive contact further includes a connecting portion, the two ends of which are fixedly connected to the spring contact portion and the charging contact portion, respectively.
[0009] According to an optional embodiment, the spring contact portion includes an abutting section and a fixing section, the abutting section and the fixing section are bent and connected, and an angle is formed between the abutting section and the fixing section, wherein the abutting section is used to abut against the first conductive spring contact, and the fixing section is used to fixally connect to the connecting portion.
[0010] According to an optional embodiment, the conductive contact is slidably disposed on the earphone housing, and the sliding of the conductive contact can adjust the pressure of the spring contact portion against the first conductive spring.
[0011] According to an optional embodiment, the side of the spring contact portion that contacts the first conductive spring is a beveled structure, and when the conductive contact slides, the pressure exerted by the spring contact portion on the first conductive spring can be increased or decreased; and / or, the conductive contact slides along the housing based on automatic or manual control.
[0012] According to an optional embodiment, the conductive contact assembly further includes a first elastic element disposed on the housing. The first elastic element is also located on the movement path of the conductive contact, and causes the conductive contact to move in a first direction by pressing against the first elastic element, or to move in a second direction by the rebound force of the elastic element; and / or, a barb is further provided on the side of the spring contact portion that contacts the first conductive spring piece, and when the conductive contact moves in a direction that reduces the pressure of the spring contact portion on the first conductive spring piece, the barb engages with the end of the first conductive spring piece.
[0013] According to an optional embodiment, the conductive contact assembly further includes a first pressure adjustment component, which is slidably disposed on the earphone housing. The first pressure adjustment component also contacts the spring contact portion, and based on the sliding of the first pressure adjustment component, the pressure exerted by the spring contact portion on the first conductive spring can be increased or decreased.
[0014] According to an optional embodiment, the first pressure adjustment assembly includes a pressure adjustment piece, the pressure adjustment piece including a pressure portion, the pressure portion contacting the spring contact portion, and the side of the pressure portion contacting the spring contact portion being inclined, so that when the pressure portion slides, the pressure of the pressure portion on the spring contact portion can be increased or decreased; the pressure adjustment piece further includes a pushing portion, the pushing portion being connected to the pressure portion, and the pushing portion being used to automatically or manually control the sliding of the pressure portion.
[0015] According to an optional embodiment, the conductive contact assembly further includes a second elastic element disposed on the housing. The second elastic element is also located on the movement path of the pushing part, and causes the pushing part to move in a first direction by squeezing the second elastic element, or to move in a second direction by the rebound force of the elastic element; and / or, a barb is further provided on the side of the spring contact portion that contacts the first conductive spring, and when the pushing part moves in a direction that reduces the pressure of the pressing part on the spring contact portion, the barb engages with the end of the first conductive spring.
[0016] A second aspect of the present invention discloses an earphone.
[0017] The earphone of the present invention includes an earphone body, the earphone body including a shell, the shell being provided with a conductive contact assembly as described in any of the technical solutions of the present invention, and the conductive contacts of the conductive contact assembly engaging with the shell.
[0018] The technical solution adopted in this invention can achieve the following beneficial effects: The conductive contact assembly of the present invention includes a conductive contact having a spring abutment portion and a charging contact portion. The spring abutment portion is used to abut against a first conductive spring inside the earphone, and the charging contact portion is used to abut against a second conductive spring inside the earphone case. When the spring abutment portion abuts against the first conductive spring, the spring abutment portion deforms under force. During the deformation process, the spring abutment portion rotates around the connection point between the spring abutment portion and the charging contact portion as a fulcrum. Since the spring abutment portion and the charging contact portion are offset, compared with the prior art, the resistance caused by the deformation of the spring abutment portion by the charging contact portion can be reduced. Therefore, during the earphone assembly process, the risk of damage to the spring abutment portion and the first conductive spring can be reduced, thereby improving the product qualification rate.
[0019] Furthermore, the preferred technical solution of the present invention can also achieve the following beneficial effects: The conductive contact of the present invention also includes a connecting portion, the two ends of which are fixedly connected to the spring contact portion and the charging contact portion, respectively. When the spring contact portion abuts against the first conductive spring, the spring contact portion deforms under force. During the deformation process, the spring contact portion rotates around the connection point between the spring contact portion and the connecting portion, which can further reduce the resistance of the charging contact portion to the deformation of the spring contact portion. Thus, during the earphone assembly process, the potential for damage to the spring contact portion and the first conductive spring can be further reduced.
[0020] The conductive contact assembly of the present invention has a conductive contact slidably disposed on the housing, and the sliding of the conductive contact can adjust the pressure of the spring contact portion against the first conductive spring. Alternatively, the conductive contact assembly of the present invention further includes a first pressure adjustment component, which is slidably disposed on the housing of the earphone. The first pressure adjustment component can adjust the pressure of the spring contact portion against the first conductive spring. After long-term use of the earphone, the pressure of the spring contact portion against the first conductive spring can be adjusted by one of the above two methods, so that a reliable electrical connection is maintained between the spring contact portion and the first conductive spring, avoiding the problem of poor conductivity caused by poor contact between the spring contact portion and the first conductive spring. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is an overall schematic diagram of the earphones assembled inside the earphone case according to an embodiment of this application; Figure 2 This is a partial schematic diagram of the earphones assembled inside the earphone case according to an embodiment of this application; Figure 3 This is a schematic diagram of the earphone according to the first embodiment of this application; Figure 4 This is a schematic diagram of the earphone abutting against the second conductive spring in the first embodiment of this application; Figure 5 This is a schematic diagram of the earphone shell and conductive contacts in the first embodiment of this application. Figure 6 This is a schematic diagram of the earphone housing according to the first embodiment of this application; Figure 7 This is a first schematic diagram of the conductive contact of the first embodiment of this application; Figure 8 This is a second schematic diagram of the conductive contact of the first embodiment of this application; Figure 9 This is a third schematic diagram of the conductive contact of the first embodiment of this application; Figure 10 This is a schematic diagram of the earphone according to the second embodiment of this application; Figure 11 This is a schematic diagram of the earphone housing according to the second embodiment of this application; Figure 12 This is a first schematic diagram of the conductive contact of the second embodiment of this application; Figure 13This is a second schematic diagram of the conductive contact of the second embodiment of this application; Figure 14 This is a schematic diagram of the earphone according to the third embodiment of this application; Figure 15 This is a schematic diagram of the earphone housing according to the third embodiment of this application; Figure 16 This is a schematic diagram of the engagement between the pressure regulating plate and the conductive contact in this application; Figure 17 This is a schematic diagram of the pressure regulating piece of this application; Figure 18 This is a first schematic diagram of the conductive contact of the third embodiment of this application; Figure 19 This is a second schematic diagram of the conductive contact of the third embodiment of this application; Figure 20 This is a schematic diagram of the first state of the first conductive spring sheet in an embodiment of this application; Figure 21 This is a schematic diagram of the second state of the first conductive spring sheet in an embodiment of this application.
[0023] In the figure: 100, conductive contact; 110, spring contact part; 111, contact section; 1111, contact surface; 1112, first inclined surface; 112, fixing section; 113, barb; 120, charging contact part; 121, protrusion; 130, connecting part; 140, first elastic element; 150, pressure adjustment piece; 151, pressure part; 1511, second inclined surface; 152, pushing part; 160, second elastic element; 20, earphone; 210, first conductive spring; 220, housing; 221, first sliding groove; 222, second sliding groove; 223, mounting part; 30, earphone case; 310, second conductive spring. Detailed Implementation
[0024] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be described in detail below. Obviously, the described embodiments are merely some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this invention.
[0025] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0026] The conductive contact in the related technology includes a charging contact portion and a spring abutment portion. One end of the spring abutment portion is fixedly connected to the charging contact portion, and the other end is used to abut against a first conductive spring. The center lines of the charging contact portion and the spring abutment portion are aligned with each other. In this type of conductive contact, when the spring abutment portion abuts against the first conductive spring, the spring abutment portion deforms under force. During the deformation process, the spring abutment portion deforms with the connection point between the spring abutment portion and the charging contact portion as the fulcrum. At this time, the resistance experienced by the spring abutment portion is relatively large, which can easily lead to damage to the conductive contact. At the same time, the first conductive spring is also subjected to relatively large compressive force, which can easily lead to damage to the first conductive spring.
[0027] To address this, this application provides a conductive contact assembly, which includes a conductive contact having a spring contact portion and a charging contact portion. One end of the spring contact portion is connected to the charging contact portion, and the spring contact portion and the charging contact portion are offset from each other. Compared with the prior art, the offset setting of the spring contact portion and the charging contact portion can reduce the resistance caused by the deformation of the spring contact portion by the charging contact portion, thereby reducing the risk of damage to the spring contact portion and the first conductive spring during the earphone assembly process.
[0028] The following is in conjunction with the appendix Figures 1 to 21 The conductive contact assembly and earphone provided in this application will be described in detail through specific embodiments and application scenarios.
[0029] The conductive contact assembly of this embodiment is used in the earphone 20. For example, the earphone 20 is a rechargeable Bluetooth earphone, such as... Figure 1 and Figure 2 As shown. The earphone 20 includes a housing 220, a circuit board, and conductive contacts 100. The circuit board is disposed inside the housing 220, and the conductive contacts 100 pass through the housing 220 and are electrically connected to the circuit board. When the conductive contacts 100 abut against the charging terminals in an external charging device such as the earphone case 30, the earphone case 30 can charge the battery inside the earphone 20 through the conductive contacts 100 and the circuit board, so that the battery can be replenished and recycled. Figure 1 and Figure 2As shown. Typically, there are two conductive contacts 100, one of which abuts against the positive charging terminal inside the earphone case 30, and the other conductive contact 100 abuts against the negative charging terminal inside the earphone case 30, as shown. Figure 4 As shown.
[0030] In some embodiments, the conductive contact assembly includes a conductive contact 100 for electrical connection to a circuit board within the housing 220. Specifically, the conductive contact 100 is electrically connected to the circuit board via a first conductive spring 210. The conductive contact 100 is also used for electrical connection to a second conductive spring 310 of the earphone case 30.
[0031] In some embodiments, the conductive contact 100 includes a spring contact portion 110 and a charging contact portion 120. The spring contact portion 110 is used to abut against a first conductive spring 210 inside the earphone 20, and the charging contact portion 120 is used to abut against a second conductive spring 310 inside the earphone case 30, such as... Figures 7-9 As shown. Preferably, one end of the spring contact portion 110 is connected to the charging contact portion 120, and the spring contact portion 110 and the charging contact portion 120 are offset from each other, as shown. Figures 7-9 As shown. The other end of the spring contact portion 110 is used to abut against the first conductive spring contact 210 inside the earphone 20. One side of the charging contact portion 120 is used to connect with the spring contact portion 110, and the other side is used to abut against the second conductive spring contact 310 inside the earphone case 30, as shown. Figure 4 As shown.
[0032] In this embodiment, the offset arrangement of the spring contact portion 110 and the charging contact portion 120 means that the centerline L1 of the portion of the spring contact portion 110 that abuts against the first conductive spring contact 210 in the width direction is misaligned with the centerline L2 of the charging contact portion 120 in the width direction. Figure 7 As shown. In this embodiment, the spring contact portion 110 and the charging contact portion 120 are offset from each other. Alternatively, the portion of the spring contact portion 110 that abuts against the first conductive spring 210 can be positioned offset from the charging contact portion 120; or the charging contact portion 120 can be positioned offset from the portion of the spring contact portion 110 that abuts against the first conductive spring 210, such as... Figure 7 As shown.
[0033] The conductive contact assembly of this embodiment includes a conductive contact 100, which has a spring abutment portion 110 and a charging contact portion 120. When the spring abutment portion 110 abuts against the first conductive spring 210, the spring abutment portion 110 deforms under force, and the end of the spring abutment portion 110 that abuts against the first conductive spring 210 deforms away from the first conductive spring 210. During the deformation process, the spring abutment portion 110 rotates around the connection point between the spring abutment portion 110 and the charging contact portion 120 as a fulcrum. Since the spring abutment portion 110 and the charging contact portion 120 are offset, compared with the prior art, the resistance caused by the deformation of the spring abutment portion 110 by the charging contact portion 120 can be reduced. Therefore, during the earphone assembly process, the risk of damage to the spring abutment portion 110 and the first conductive spring 210 can be reduced, thereby improving the product qualification rate.
[0034] In some embodiments, the conductive contact 100 further includes a connecting portion 130, such as... Figure 8 and Figure 9 As shown. The two ends of the connecting portion 130 are fixedly connected to the spring contact portion 110 and the charging contact portion 120, respectively. Exemplarily, the spring contact portion 110, the charging contact portion 120, and the connecting portion 130 are a single integrated structure, which facilitates the production and assembly of the conductive contact 100. Exemplarily, the spring contact portion 110, the charging contact portion 120, and the connecting portion 130 are formed into a single integrated structure by injection molding.
[0035] The conductive contact 100 in this embodiment also includes a connecting portion 130. The spring contact portion 110 is indirectly connected to the charging contact portion 120 through the connecting portion 130. When the spring contact portion 110 abuts against the first conductive spring 210, the spring contact portion 110 deforms under force. During the deformation process, the spring contact portion 110 rotates around the connection point between the spring contact portion 110 and the connecting portion 130 as a fulcrum, which can further reduce the resistance caused by the deformation of the spring contact portion 110 by the charging contact portion 120. Therefore, during the earphone assembly process, the risk of damage to the spring contact portion 110 and the first conductive spring 210 can be further reduced. On the other hand, the housing 220 is provided with a mounting portion 223. The mounting portion 223 has a notch in the middle. During assembly, the connecting portion 130 can be snapped into the notch, thereby enhancing the stability of the fit between the conductive contact 100 and the housing 220.
[0036] In some embodiments, the spring contact portion 110 includes an contact section 111 and a fixing section 112, such as... Figure 8 As shown. The abutting section 111 is used to abut against the first conductive spring 210, and the fixing section 112 is used to fix it to the connecting portion 130. Preferably, the abutting section 111 and the fixing section 112 are bent together, and an angle is formed between the abutting section 111 and the fixing section 112, such as... Figure 8As shown. For example, the abutting section 111 and the fixing section 112 form a 90° angle. For example, the abutting section 111 and the fixing section 112 are an integral structure, specifically, the abutting section 111 and the fixing section 112 are formed into an integral structure by injection molding.
[0037] In this embodiment, the bending connection of the abutment section 111 and the fixing section 112 facilitates the offset setting between the spring abutment portion 110 and the charging contact portion 120. For example, the offset setting between the spring abutment portion 110 and the charging contact portion 120 in this embodiment specifically refers to the offset setting between the abutment section 111 of the spring abutment portion 110 and the charging contact portion 120. This offset setting between the abutment section 111 and the charging contact portion 120 reduces the resistance caused by the charging contact portion 120 to the deformation of the abutment section 111 during force deformation, thereby reducing the risk of damage to the abutment section 111 and the first conductive spring 210 during earphone assembly.
[0038] In some embodiments, an abutment surface 1111 is formed on the abutment segment 111, the abutment surface 1111 being used to abut against the first conductive spring piece 210, such as... Figure 8 As shown. Preferably, the contact surface 1111 has a first projection in the direction of the fixed section 112, and the charging contact portion 120 has a second projection in the direction of the fixed section 112 on the side near the contact surface 1111, and the first projection and the second projection coincide with each other. This not only reduces the resistance caused by the deformation of the spring contact portion 110 by the charging contact portion 120, but also makes the structure of the conductive contact 100 compact, avoiding increasing the size of the earphone 20.
[0039] In some embodiments, the conductive contact 100 is slidably disposed on the housing 220 of the earphone 20, and the sliding of the conductive contact 100 allows for adjustment of the pressure exerted by the spring contact portion 110 on the first conductive spring contact 210. Preferably, the conductive contact 100 slides along the housing 220 based on automatic or manual control.
[0040] The inventors discovered during their research that when the earphone 20 is assembled, the first conductive spring 210 remains in contact with the spring contact portion 110 and the circuit board. The first conductive spring 210 and the spring contact portion 110 are constantly under pressure. After prolonged use, there is a risk that the first conductive spring 210 and the spring contact portion 110 may experience creep and eventually plastic deformation, causing the first conductive spring 210 to fail to rebound and maintain reliable contact with the spring contact portion 110. Therefore, after prolonged use of the earphone 20, poor contact between the first conductive spring 210 and the spring contact portion 110 may occur, leading to a potential problem of poor conductivity. Figure 20 and Figure 21 The diagrams show the first conductive spring 210 in its natural state and under pressure.
[0041] In this embodiment, the conductive contact 100 is slidably disposed on the housing 220. After the earphone 20 has been used for a long time, the sliding of the conductive contact 100 can adjust the pressure of the spring contact portion 110 against the first conductive spring 210, so that the spring contact portion 110 and the first conductive spring 210 maintain a reliable electrical connection, avoiding the problem of poor conductivity caused by poor contact between the spring contact portion 110 and the first conductive spring 210.
[0042] In some embodiments, the side of the spring contact portion 110 that contacts the first conductive spring 210 has a beveled structure, and when the conductive contact 100 slides, the pressure exerted by the spring contact portion 110 on the first conductive spring 210 can increase or decrease. For example... Figure 12 and Figure 13 As shown, the abutment surface 1111 is an inclined surface. For example, the thickness of the abutment section 111 gradually decreases from the end near the fixed section 112 to the end away from the fixed section 112. That is, from the end near the fixed section 112 to the end away from the fixed section 112, the abutment surface 1111 gradually slopes away from the first conductive spring 210. With this structure, when the conductive contact 100 moves towards the first conductive spring 210 (upwards), the abutment force of the abutment section 111 on the first conductive spring 210 increases; conversely, when the conductive contact 100 moves away from the first conductive spring 210 (downwards), the abutment force of the abutment section 111 on the first conductive spring 210 decreases.
[0043] In some embodiments, the conductive contact assembly further includes a first elastic element 140, such as... Figure 10 As shown. Exemplarily, the first elastic element 140 is made of an elastic material, such as deformable rubber, silicone, etc. The first elastic element 140 is disposed on the housing 220 and is also located on the movement path of the conductive contact 100, causing the conductive contact 100 to move in a first direction by pressing against the first elastic element 140, or to move in a second direction by the rebound force of the first elastic element 140. Figure 10 As shown, the first elastic member 140 is located above the charging contact portion 120.
[0044] When a force is applied to the conductive contact 100, causing it to move towards the first conductive spring 210 (upward), the charging contact 120 exerts a compressive force on the first elastic member 140. This allows the first elastic member 140 to provide clearance for the movement of the charging contact 120, which in turn drives the spring abutment 110 to move. Conversely, when the force is released from the conductive contact 100, the first elastic member 140 has a restoring deformation drive. The rebound force of the first elastic member 140 applies force to the charging contact 120, causing the conductive contact 100 to return to its original position.
[0045] The conductive contact assembly in this embodiment also includes a first elastic element 140. By compressing the first elastic element 140, not only can space be provided for the movement of the charging contact portion 120, but the rebound force of the first elastic element 140 can also be used to return the conductive contact 100 to its original position, preventing the spring contact portion 110 and the first conductive spring 210 from always being in a state of excessive pressure. On the other hand, the first elastic element 140 can also play a sealing role, enhancing the sealing performance of the housing 220.
[0046] In some embodiments, a protrusion 121 is provided on the side of the charging contact portion 120, and a first groove 221 is provided on the side of the housing 220 that contacts the charging contact portion 120, such as... Figures 11-13 As shown. The protrusion 121 is located in the first groove 221, and based on the force applied to the conductive contact 100, the protrusion 121 can slide in the first groove 221, thereby causing the conductive contact 100 to move towards or away from the first conductive spring 210.
[0047] In some embodiments, force can be applied to the charging contact 120 manually to move the conductive contact 100 toward the first conductive spring 210.
[0048] In some embodiments, the second conductive spring 310 can apply force to the charging contact 120, causing the conductive contact 100 to move closer to the first conductive spring 210; alternatively, a force-applying part can be provided inside the earphone case 30, which applies force to the charging contact 120, causing the conductive contact 100 to move closer to the first conductive spring 210. In this embodiment, by applying force to the charging contact 120 through the second conductive spring 310 or the force-applying part, when the earphone 20 is inserted into the earphone case 30, the second conductive spring 310 or the force-applying part automatically applies force to the charging contact 120; when the earphone 20 is removed from the earphone case 30, the force applied to the charging contact 120 by the second conductive spring 310 or the force-applying part is automatically released.
[0049] In some embodiments, the housing 220 may also be provided with multiple settings, so that when force is applied to the charging contact 120 in a manual or automatic manner, different adjustment settings can be selected according to the actual situation to control the degree of contact between the spring contact 110 and the first conductive spring contact 210.
[0050] In some embodiments, a barb 113 is further provided on the side of the spring contact portion 110 that contacts the first conductive spring 210, such as... Figure 13 As shown. When the conductive contact 100 moves in the direction of reducing the pressure of the spring contact portion 110 against the first conductive spring 210, the barb 113 engages with the end of the first conductive spring 210. Figure 13As shown, a barb 113 is provided near the end of the contact surface 1111.
[0051] In this embodiment, by providing a barb 113 on the contact surface 1111, when the conductive contact 100 moves in the direction of returning to its original position, the barb 113 can hold the first conductive spring 210, causing the end of the first conductive spring 210 to deform in the direction of approaching the contact surface 1111, thereby allowing the first conductive spring 210 to recover a certain elasticity.
[0052] In some embodiments, the conductive contact assembly further includes a first pressure adjustment component. The first pressure adjustment component is slidably disposed on the housing 220 of the earphone 20. The first pressure adjustment component also contacts the spring contact portion 110, and based on the sliding of the first pressure adjustment component, the pressure exerted by the spring contact portion 110 on the first conductive spring 210 can be increased or decreased. Preferably, the first pressure adjustment component slides along the housing 220 based on automatic or manual control.
[0053] The inventors discovered during their research that when the earphone 20 is assembled, the first conductive spring 210 remains in contact with the spring contact portion 110 and the circuit board. The first conductive spring 210 and the spring contact portion 110 are constantly under pressure. After prolonged use, there is a risk that the first conductive spring 210 and the spring contact portion 110 may experience creep and eventually plastic deformation, causing the first conductive spring 210 to fail to rebound and maintain reliable contact with the spring contact portion 110. Therefore, after prolonged use of the earphone 20, poor contact between the first conductive spring 210 and the spring contact portion 110 may occur, leading to a potential problem of poor conductivity.
[0054] The conductive contact assembly in this embodiment also includes a first pressure adjustment assembly. The first pressure adjustment assembly is slidably disposed on the housing 220. After the earphone 20 has been used for a long time, the sliding of the first pressure adjustment assembly can adjust the pressure of the spring contact portion 110 against the first conductive spring 210, so that the spring contact portion 110 and the first conductive spring 210 maintain a reliable electrical connection, and avoid the problem of poor conductivity caused by poor contact between the spring contact portion 110 and the first conductive spring 210.
[0055] In some embodiments, the first pressure adjustment assembly includes a pressure adjustment piece 150, such as... Figure 14 As shown. The pressure adjusting piece 150 includes a pressure part 151 and a pushing part 152. The pressure part 151 contacts the spring contact part 110, and the pushing part 152 is connected to the pressure part 151. The pushing part 152 is used to automatically or manually control the sliding of the pressure part 151, such as... Figure 16 and Figure 17As shown. Exemplarily, the pressure adjusting piece 150 has two pressure portions 151, each of which contacts one of the two spring contact portions 110. A pushing portion 152 is connected to the two pressure portions 151, as shown. Figure 16 As shown. Thus, by applying force to the pushing part 152, the movement of the two pressing parts 151 can be controlled simultaneously, thereby adjusting the pressing force of the two spring contact parts 110 on the two first conductive spring pieces 210.
[0056] In some embodiments, the side of the pressing part 151 that contacts the spring abutment part 110 is inclined, and when the pressing part 151 slides, the pressure exerted by the pressing part 151 on the spring abutment part 110 can increase or decrease. For example Figure 16 As shown, the pressing part 151 contacts the side of the abutting section 111 opposite to the abutting surface 1111. A first inclined surface 1112 is provided on the side of the abutting section 111 opposite to the abutting surface 1111, as shown... Figure 18 As shown. For example, where the first inclined surface 1112 is provided, the thickness of the abutting section 111 gradually increases from the end near the fixed section 112 to the end away from the fixed section 112. That is, from the end near the fixed section 112 to the end away from the fixed section 112, the first inclined surface 1112 gradually slopes towards the pressing part 151, as shown. Figure 18 As shown. Correspondingly, the side of the pressing part 151 that contacts the spring contact part 110 is provided with a second inclined surface 1511. The inclination direction of the second inclined surface 1511 is opposite to the inclination direction of the first inclined surface 1112, as shown. Figure 17 As shown.
[0057] In this structure, when the pushing part 152 moves towards the first conductive spring 210 (upward), the pressing part 151 increases the pressing force on the abutting section 111, thereby increasing the pressing force of the abutting section 111 on the first conductive spring 210; conversely, when the pushing part 152 moves away from the first conductive spring 210 (downward), the pressing part 151 decreases the pressing force on the abutting section 111, thereby reducing the pressing force of the abutting section 111 on the first conductive spring 210.
[0058] In some embodiments, the conductive contact assembly further includes a second elastic element 160, such as... Figure 14 As shown. Exemplarily, the second elastic member 160 is made of an elastic material, such as deformable rubber, silicone, etc. The second elastic member 160 is disposed on the housing 220, and is also located on the moving path of the pushing part 152, causing the pushing part 152 to move in a first direction by pressing against the second elastic member 160, or to move in a second direction by the rebound force of the second elastic member 160. Figure 14 As shown, the second elastic element 160 is located above the pusher 152.
[0059] When force is applied to the pushing part 152, causing it to move towards the first conductive spring 210 (upward), the pushing part 152 exerts a compressive force on the second elastic member 160. This allows the second elastic member 160 to provide clearance for the movement of the pushing part 152, thereby driving the pressing part 151 to move. Conversely, when the force applied to the pushing part 152 is released, the second elastic member 160 has a restoring deformation drive. The rebound force of the second elastic member 160 can apply force to the pushing part 152, causing it to return to its original position.
[0060] The conductive contact assembly in this embodiment also includes a second elastic element 160. By compressing the second elastic element 160, not only can space be provided for the movement of the pushing part 152, but the rebound force of the second elastic element 160 can also be used to return the pushing part 152 to its original position, preventing the spring contact part 110 and the first conductive spring 210 from always being in a state of excessive pressure. On the other hand, the second elastic element 160 can also play a sealing role, enhancing the sealing performance of the housing 220.
[0061] In some embodiments, one end of the pushing part 152 connected to the pressing part 151 penetrates through the housing 220, and the inner surface of the housing 220 is also provided with a second sliding groove 222, such as... Figure 15 As shown. The end of the pushing part 152 connected to the pressing part 151 is located in the second slide groove 222. Based on the force applied to the pushing part 152, the end of the pushing part 152 connected to the pressing part 151 can slide in the second slide groove 222, thereby causing the pressing adjustment piece 150 to move towards or away from the first conductive spring piece 210.
[0062] In some embodiments, force can be applied to the pushing part 152 manually to move the pressure adjusting piece 150 toward the first conductive spring piece 210.
[0063] In some embodiments, a force-applying part can be provided inside the earphone case 30. This force-applying part applies force to the pushing part 152, causing the pressure adjustment piece 150 to move closer to the first conductive spring piece 210. In this embodiment, by applying force to the pushing part 152 through the force-applying part, when the earphone 20 is inserted into the earphone case 30, the force-applying part automatically applies force to the pushing part 152; when the earphone 20 is removed from the earphone case 30, the force-applying part automatically releases its force on the pushing part 152.
[0064] In some embodiments, the housing 220 may also be provided with multiple gears, so that when force is applied to the pushing part 152 in a manual or automatic manner, different adjustment gears can be selected according to the actual situation to control the degree of contact between the pressing part 151 and the spring contact part 110, thereby controlling the degree of contact between the spring contact part 110 and the first conductive spring 210.
[0065] In some embodiments, a barb 113 is further provided on the side of the spring contact portion 110 that contacts the first conductive spring 210, such as... Figure 16 and Figure 19 As shown. When the pressure adjusting piece 150 moves in the direction of reducing the pressure of the spring contact portion 110 on the first conductive spring 210, the barb 113 engages with the end of the first conductive spring 210. Figure 16 and Figure 19 As shown, a barb 113 is provided near the end of the contact surface 1111.
[0066] In this embodiment, by providing a barb 113 on the contact surface 1111, when the pressure adjustment piece 150 moves in the direction of returning to its original position, the barb 113 can hold the first conductive spring piece 210, causing the barb 113 to drive the end of the first conductive spring piece 210 to deform in the direction close to the contact surface 1111, thereby allowing the first conductive spring piece 210 to recover a certain elasticity.
[0067] The earphone of this embodiment includes an earphone body. The earphone body includes a housing 220, and further includes a circuit board and a first conductive spring 210 disposed within the housing 220. The housing 220 is provided with a conductive contact assembly according to any of the technical solutions in this embodiment, thereby reducing the risk of damage to the spring contact portion 110 and the first conductive spring 210 during the assembly process of the earphone of this embodiment, and improving the product qualification rate. The earphone of this embodiment is as follows: Figure 3 , Figure 10 and Figure 14 As shown.
[0068] As can be seen, the earphones in this embodiment also include an earphone case 30, which is used to store the earphones and can also be used to charge the earphones. Figure 1 and Figure 2 As shown.
[0069] Preferably, when the conductive contact 100 or the pressure adjustment piece 150 is moved by automatic control, a force application part is also provided inside the earphone box 30.
[0070] In some embodiments, the housing 220 is provided with a mounting portion 223, which is used to mount the conductive contact 100, such as... Figure 5 , Figure 6 , Figure 11 and Figure 15As shown. Preferably, the conductive contact 100 is snapped into the mounting portion 223. For example, the housing 220 has a first housing and a second housing. After the circuit board and the first conductive spring 210 are mounted on the first housing, the conductive contact 100 is snapped into the mounting portion 223, and then the second housing is closed onto the first housing to complete the earphone assembly. By snapping the conductive contact 100 into the mounting portion 223, not only is the assembly of the conductive contact 100 convenient, but the conductive contact 100 is also less likely to detach from the housing 220.
[0071] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.
[0072] Furthermore, it should be noted that the scope of the methods and apparatus in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.
[0073] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.
Claims
1. A conductive contact assembly for use in an earphone (20), characterized in that, The conductive contact assembly includes a conductive contact (100), the conductive contact (100) including a spring contact portion (110) and a charging contact portion (120), wherein, One end of the spring contact part (110) is connected to the charging contact part (120), and the spring contact part (110) and the charging contact part (120) are offset from each other. The other end of the spring contact part (110) is used to contact the first conductive spring (210) inside the earphone (20). One side of the charging contact (120) is used to connect with the spring contact (110), and the other side is used to contact the second conductive spring (310) inside the earphone case (30); The offset arrangement of the spring contact portion (110) and the charging contact portion (120) means that the center line L1 of the portion of the spring contact portion (110) that abuts against the first conductive spring (210) is misaligned with the center line L2 of the charging contact portion (120) in the width direction.
2. The conductive contact assembly according to claim 1, characterized in that, The conductive contact (100) further includes a connecting portion (130), the two ends of which are fixedly connected to the spring contact portion (110) and the charging contact portion (120), respectively.
3. The conductive contact assembly according to claim 2, characterized in that, The spring contact portion (110) includes a contact section (111) and a fixing section (112), wherein the contact section (111) and the fixing section (112) are bent and connected, and an angle is formed between the contact section (111) and the fixing section (112), wherein, The abutting section (111) is used to abut against the first conductive spring sheet (210), and the fixing section (112) is used to fix the connection part (130).
4. The conductive contact assembly according to any one of claims 1 to 3, characterized in that, The conductive contact (100) is slidably disposed on the housing (220) of the earphone (20), and based on the sliding of the conductive contact (100), the pressure of the spring contact portion (110) against the first conductive spring (210) can be adjusted.
5. The conductive contact assembly according to claim 4, characterized in that, The side of the spring contact portion (110) that contacts the first conductive spring (210) has a beveled structure, and when the conductive contact (100) slides, the pressure of the spring contact portion (110) against the first conductive spring (210) can increase or decrease. And / or, the conductive contact (100) slides along the housing (220) based on automatic or manual control.
6. The conductive contact assembly according to claim 5, characterized in that, The conductive contact assembly further includes a first elastic element (140), which is disposed on the housing (220). The first elastic element (140) is also located on the movement path of the conductive contact (100), and causes the conductive contact (100) to move in a first direction by squeezing the first elastic element (140), or to move in a second direction by the rebound force of the first elastic element (140). And / or, a barb (113) is also provided on the side of the spring contact portion (110) that contacts the first conductive spring (210). When the conductive contact (100) moves in a direction that reduces the pressure of the spring contact portion (110) on the first conductive spring (210), the barb (113) engages with the end of the first conductive spring (210).
7. The conductive contact assembly according to any one of claims 1 to 3, characterized in that, It also includes a first pressure adjustment component, which is slidably disposed on the housing (220) of the earphone (20). The first pressure adjustment component is also in contact with the spring contact part (110), and based on the sliding of the first pressure adjustment component, the pressure of the spring contact part (110) on the first conductive spring (210) can be increased or decreased.
8. The conductive contact assembly according to claim 7, characterized in that, The first pressure adjustment component includes a pressure adjustment piece (150). The pressure adjustment piece (150) includes a pressure part (151), which contacts the spring contact part (110). The side of the pressure part (151) that contacts the spring contact part (110) is inclined. When the pressure part (151) slides, the pressure of the pressure part (151) on the spring contact part (110) can be increased or decreased. The pressure adjustment piece (150) further includes a pushing part (152), which is connected to the pressure part (151), and the pushing part (152) is used to automatically or manually control the sliding of the pressure part (151).
9. The conductive contact assembly according to claim 8, characterized in that, The conductive contact assembly further includes a second elastic element (160), which is disposed on the housing (220). The second elastic element (160) is also located on the moving path of the pushing part (152), and causes the pushing part (152) to move in a first direction by squeezing the second elastic element (160), or to move in a second direction by the rebound force of the second elastic element (160). And / or, a barb (113) is also provided on the side of the spring contact portion (110) that contacts the first conductive spring (210). When the pushing portion (152) moves in the direction of reducing the pressure of the pressing portion (151) on the spring contact portion (110), the barb (113) engages with the end of the first conductive spring (210).
10. An earphone, characterized in that, The device includes an earphone body, the earphone body including a housing (220), the housing (220) having a conductive contact assembly as described in any one of claims 1 to 9, and the conductive contact (100) of the conductive contact assembly engaging with the housing (220).
Citation Information
Patent Citations
Earphone and electronic equipment
CN217741884U
Earphone and assembling method thereof
CN111988694A
Bluetooth wireless earphone
CN212115615U