A tin paste printing jig for SMT
By introducing positioning adjustment components, vacuum positioning components, and board removal components into the solder paste printing fixture, the problems of inflexible positioning, micro-displacement, and inconvenient board removal in the prior art are solved, realizing a high-precision, stable, and efficient integrated circuit printing process.
CN121078644BActive Publication Date: 2026-06-26KUNSHAN TIANZAN ELECTRONIC TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- KUNSHAN TIANZAN ELECTRONIC TECH CO LTD
- Filing Date
- 2025-10-31
- Publication Date
- 2026-06-26
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Figure CN121078644B_ABST
Abstract
The application relates to the technical field of circuit board manufacturing, and discloses a tin paste printing jig for SMT (Surface Mount Technology), which comprises a base and a printing bearing plate; a positioning and adjusting assembly is arranged between the base and the printing bearing plate and is used for supporting and positioning printing bearing plates of different sizes; a plate taking assembly is arranged at the middle of the lower end of the printing bearing plate and can eject a circuit board in the printing bearing plate; and the front side of the plate taking assembly is further provided with a locking assembly with an anti-mis-touch function. The tin paste printing jig for SMT realizes the whole-process optimization from positioning, printing to plate taking through the cooperative work of multiple assemblies, significantly improves the yield and production efficiency of integrated circuit manufacturing, solves the technical problems of poor adaptability, insufficient positioning accuracy and low plate taking safety of the existing tin paste printing jig in integrated circuit manufacturing, and provides reliable process equipment support for high-precision integrated circuit manufacturing.
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