Alternating microsphere grinding method and device for high rotational speed difference working conditions

Abstract

The application relates to an alternating microsphere grinding method and device for a high-rotation-difference working condition, wherein the method comprises the following steps: determining the structural parameters of microsphere grinding based on a grinding disc with an eccentric structure, establishing a topological model of a simulation object and importing the topological model into simulation software; in the simulation software, setting the working condition parameters of microsphere grinding, and applying a preset high-rotation-difference motion constraint to extract microsphere orbit data; calculating the standard deviation of the orbit distribution to obtain the lowest standard deviation, so as to determine the working condition parameters of a test ball; and controlling the grinding disc to grind the microspheres according to the working condition parameters of the test ball and the preset high-rotation-difference motion constraint, so as to generate microspheres meeting preset quality conditions. Therefore, the problem that, in the related art, the physical retainer may increase additional friction, interfere with the movement of the microspheres, and the retainer itself may become a collision source, leading to additional collisions between the microspheres and the retainer or the grinding disc, and thus affecting the surface processing quality of the microspheres and the grinding effect is solved.

Description

Technical Field

[0001] This application relates to the field of microsphere grinding technology, and in particular to an alternating microsphere grinding method and apparatus under high speed difference conditions. Background Technology

[0002] During multi-microsphere grinding, the microspheres move at high speed in the grinding disc, making them prone to collisions and accumulation. This can lead to permanent, irreparable damage to the surface of the microspheres, such as dents, scratches, and microcracks, instantly destroying the achieved precision surface shape. To prevent microsphere collisions, related technologies typically introduce physical retainers with cavities or grooves (such as retaining rings or grids) to constrain the trajectory of the microspheres, reduce direct collisions, and improve grinding uniformity.

[0003] However, in related technologies, the complex arrangement of the physical cage may increase additional friction, interfere with the movement of the microspheres, and affect their stability. At the same time, the cage itself may also become a collision source, causing additional collisions between the microspheres and the cage or grinding disc, thereby affecting the surface processing quality of the microspheres and the grinding effect, which urgently needs to be improved. Summary of the Invention

[0004] This application provides a method and apparatus for alternating microsphere grinding under high speed difference conditions, in order to solve the problems in related technologies, such as the complex arrangement of the physical cage, which may increase additional friction, interfere with the movement of microspheres, and affect their stability; at the same time, the cage itself may also become a collision source, causing additional collisions between the microspheres and the cage or grinding disc, thereby affecting the surface processing quality of the microspheres and the grinding effect.

[0005] The first aspect of this application provides a method for alternating microsphere grinding under high speed difference conditions, comprising the following steps: configuring the grinding structure of the upper and lower grinding disks according to the axial eccentricity between the center of the upper disk and the center of the lower disk, the machined V-shaped grooves on the surface of the lower disk, and the distribution eccentricity of the grooves on the lower disk, to obtain a grinding disk with an eccentric structure; determining the structural parameters of microsphere grinding based on the grinding disk to establish a topological model of the simulation object, and importing the topological model into multibody dynamics simulation software; setting the working parameters of the microsphere grinding in the multibody dynamics simulation software, and applying a preset high speed difference motion constraint to extract microsphere orbital trajectory data; calculating the standard deviation of the trajectory distribution based on the microsphere orbital trajectory data to obtain the lowest standard deviation, and determining the working parameters of the test ball based on the lowest standard deviation; controlling the grinding disk to perform microsphere grinding according to the working parameters of the test ball and the preset high speed difference motion constraint to generate microspheres that meet preset quality conditions.

[0006] Through the above technical means, the embodiments of this application can determine the working parameters of the grinding ball and the test ball according to the structure and motion characteristics of the grinding disc, and apply high speed difference motion constraints to control the grinding disc to achieve microsphere grinding, thereby generating microspheres that meet the preset quality conditions. This can effectively optimize the motion trajectory and force distribution of the ball, ensure the uniformity and stability of the grinding process, and thus obtain microspheres with high surface precision, good morphological consistency and excellent material integrity, providing reliable protection for high-end application fields.

[0007] Optionally, in one embodiment of this application, determining the structural parameters of microsphere grinding based on the grinding disc includes: determining the diameter, number, and spatial arrangement of the test balls based on the grinding disc and the grinding balls; and determining the structural parameters of microsphere grinding according to the diameter, number, and spatial arrangement of the grinding disc, the grinding balls, and the test balls.

[0008] Through the above technical means, the embodiments of this application can determine the diameter, number and spatial arrangement of the test balls according to the grinding disc and grinding balls, and then determine the structural parameters of microsphere grinding. Microspheres can be reasonably selected for grinding, the force and motion coordination between the balls can be optimized, unnecessary collisions and interference can be reduced, thereby improving the grinding accuracy and obtaining microspheres with higher surface quality and better dimensional consistency.

[0009] Optionally, in one embodiment of this application, determining the diameter, number, and spatial arrangement of the test balls includes: determining the diameter, number, and spatial arrangement of the test balls based on at least one of dynamic geometric constraints, separation constraints, and arrangement constraints.

[0010] Through the above technical means, the embodiments of this application can determine the diameter, number and spatial arrangement of the test balls according to dynamic geometric constraints, separation constraints and arrangement constraints. This can maintain a reasonable spacing relationship while ensuring the free movement of the balls, avoid serious chasing and collisions between the balls, and achieve an orderly alternating arrangement of the grinding balls and the test balls, thereby forming a stable grinding structure and creating conditions for the uniform force and trajectory distribution of the microspheres.

[0011] Optionally, in one embodiment of this application, setting the operating parameters for the microsphere grinding includes: defining the physical quality characteristics of the microsphere grinding; and setting the rotary joint of the grinding disc, the grinding drive, and the contact force between the sphere and the groove.

[0012] Through the above technical means, the embodiments of this application can set specific working parameters such as the rotating pair of the grinding disc, the grinding drive, and the contact force between the ball and the groove. It can build a complete motion and force model in the simulation environment, and then perform simulation. It can realistically reproduce the dynamic behavior and force state of the microsphere in the grinding process, accurately reflect the trajectory distribution and surface processing characteristics of the ball, and provide a reliable basis for optimizing the grinding structure parameters and working conditions.

[0013] Optionally, in one embodiment of this application, the preset high-speed difference motion constraint is: , in, Indicates the speed of the lower plate, Indicates the rotational speed of the upper plate, Indicates the axial eccentricity, Indicates the eccentricity of the trench, This represents the dynamic balancing process coefficient.

[0014] Through the above technical means, the embodiments of this application can convert high speed difference into calculable and comparable numerical indicators, so that the grinding conditions can be intuitively judged by parameters such as the upper and lower plate speeds or shaft eccentricity and groove distribution eccentricity. It can clearly reflect the relative sliding speed level of microspheres in the grinding process, and can also be used for comparison and optimization of different working condition schemes, thereby providing a reliable quantitative basis for process parameter selection and grinding quality improvement.

[0015] A second aspect of this application provides an alternating microsphere grinding device under high speed difference conditions, comprising: a configuration module, configured to configure the grinding structure of the upper and lower grinding discs according to the axial eccentricity between the center of the upper disc and the center of the lower disc, the machined V-shaped grooves on the surface of the lower disc, and the distribution eccentricity of the grooves on the lower disc, to obtain a grinding disc with an eccentric structure; a setup module, configured to determine the structural parameters of microsphere grinding based on the grinding discs, to establish a topological model of the simulation object, and import the topological model into multibody dynamics simulation software; a setting module, configured to set the working condition parameters of the microsphere grinding in the multibody dynamics simulation software, and apply a preset high speed difference motion constraint to extract microsphere orbital trajectory data; a determination module, configured to calculate the standard deviation of the trajectory distribution based on the microsphere orbital trajectory data, to obtain the lowest standard deviation, and determine the working condition parameters of the test ball based on the lowest standard deviation; and a grinding module, configured to control the grinding discs to perform microsphere grinding according to the working condition parameters of the test ball and the preset high speed difference motion constraint, to generate microspheres that meet preset quality conditions.

[0016] Through the above technical means, the embodiments of this application can determine the working parameters of the grinding ball and the test ball according to the structure and motion characteristics of the grinding disc, and apply high speed difference motion constraints to control the grinding disc to achieve microsphere grinding, thereby generating microspheres that meet the preset quality conditions. This can effectively optimize the motion trajectory and force distribution of the ball, ensure the uniformity and stability of the grinding process, and thus obtain microspheres with high surface precision, good morphological consistency and excellent material integrity, providing reliable protection for high-end application fields.

[0017] Optionally, in one embodiment of this application, the establishment module includes: a first determining unit, configured to determine the diameter, number, and spatial arrangement of the test balls based on the grinding disc and the grinding balls; and a second determining unit, configured to determine the structural parameters of the microsphere grinding based on the diameter, number, and spatial arrangement of the grinding disc, the grinding balls, and the test balls.

[0018] Through the above technical means, the embodiments of this application can determine the diameter, number and spatial arrangement of the test balls according to the grinding disc and grinding balls, and then determine the structural parameters of microsphere grinding. Microspheres can be reasonably selected for grinding, the force and motion coordination between the balls can be optimized, unnecessary collisions and interference can be reduced, thereby improving the grinding accuracy and obtaining microspheres with higher surface quality and better dimensional consistency.

[0019] Optionally, in one embodiment of this application, the first determining unit includes: a determining subunit, used to determine the diameter, number, and spatial arrangement of the test balls according to at least one of dynamic geometric constraints, separation constraints, and arrangement constraints.

[0020] Through the above technical means, the embodiments of this application can determine the diameter, number and spatial arrangement of the test balls according to dynamic geometric constraints, separation constraints and arrangement constraints. This can maintain a reasonable spacing relationship while ensuring the free movement of the balls, avoid serious chasing and collisions between the balls, and achieve an orderly alternating arrangement of the grinding balls and the test balls, thereby forming a stable grinding structure and creating conditions for the uniform force and trajectory distribution of the microspheres.

[0021] Optionally, in one embodiment of this application, the setting module includes: a definition unit for defining the physical quality characteristics of the microsphere grinding; and a setting unit for setting the rotary pair of the grinding disc, the grinding drive, and the contact force between the sphere and the groove.

[0022] Through the above technical means, the embodiments of this application can set specific working parameters such as the rotating pair of the grinding disc, the grinding drive, and the contact force between the ball and the groove. It can build a complete motion and force model in the simulation environment, and then perform simulation. It can realistically reproduce the dynamic behavior and force state of the microsphere in the grinding process, accurately reflect the trajectory distribution and surface processing characteristics of the ball, and provide a reliable basis for optimizing the grinding structure parameters and working conditions.

[0023] Optionally, in one embodiment of this application, the preset high-speed difference motion constraint is: , in, Indicates the speed of the lower plate, Indicates the rotational speed of the upper plate, Indicates the axial eccentricity, Indicates the eccentricity of the trench, This represents the dynamic balancing process coefficient.

[0024] Through the above technical means, the embodiments of this application can convert high speed difference into calculable and comparable numerical indicators, so that the grinding conditions can be intuitively judged by parameters such as the upper and lower plate speeds or shaft eccentricity and groove distribution eccentricity. It can clearly reflect the relative sliding speed level of microspheres in the grinding process, and can also be used for comparison and optimization of different working condition schemes, thereby providing a reliable quantitative basis for process parameter selection and grinding quality improvement.

[0025] A third aspect of this application provides an electronic device, including: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the alternating microsphere grinding method under high speed difference conditions as described in the above embodiments.

[0026] A fourth aspect of this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described alternating microsphere grinding method under high-speed differential conditions.

[0027] A fifth aspect of this application provides a computer program product, including a computer program that, when executed, is used to implement the alternating microsphere grinding method under high speed difference conditions as described above.

[0028] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0029] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein: Figure 1 This is a schematic diagram of the structure of the grinding disc and microspheres according to one embodiment of this application; Figure 2 This is a flowchart of an alternating microsphere grinding method under high-speed differential conditions according to an embodiment of this application; Figure 3 This is a schematic diagram of the alternating microsphere arrangement according to one embodiment of this application; Figure 4 This is a schematic diagram comparing the standard deviation values ​​of the separation conditions according to one embodiment of this application; Figure 5 This is a schematic diagram of an alternating microsphere grinding process under high speed difference conditions according to an embodiment of this application; Figure 6 This is a block diagram of an alternating microsphere grinding device under high speed difference conditions according to an embodiment of this application; Figure 7 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0030] Figure label: 101-Lower grinding disc, 102-Upper grinding disc, 103-Grinding ball, 104-Test ball, 105-V-groove; 10-Alternating microsphere grinding device under high speed difference conditions; 100-Configuration module, 200-Establishment module, 300-Setting module, 400-Confirmation module, 500-Grinding module; 701-Memory, 702-Processor, 703-Communication interface. Detailed Implementation

[0031] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0032] The following description, with reference to the accompanying drawings, describes an alternating microsphere grinding method and apparatus under high speed difference conditions according to embodiments of this application. Addressing the technical problems mentioned in the background art, such as the complex arrangement of the physical cage potentially increasing friction, interfering with microsphere movement, and affecting its stability; and the cage itself potentially becoming a collision source, leading to additional collisions between the microsphere and the cage or grinding disc, thereby affecting the surface processing quality and grinding effect of the microsphere, this application provides an alternating microsphere grinding method under high speed difference conditions. In this method, the structural parameters of the grinding balls and test balls are set according to the grinding disc with an eccentric structure, a topology model is established and imported into simulation software, and then high speed difference constraints, operating parameters, etc., are set for simulation analysis to generate the final microspheres, which can realistically simulate the microspheres in the grinding disc system. The system analyzes the stress state and motion patterns within the microspheres, comprehensively reflecting the microsphere grinding process and ultimately obtaining high-quality microspheres that meet the requirements of surface precision and material integrity. Simultaneously, based on the combination of high rotational speed difference and grinding structure parameters, it effectively avoids chasing collisions or squeezing interference between the microspheres, forming an alternating sequence of grinding and test microspheres. This eliminates the need for a cage to separate the microspheres, avoiding the additional friction and energy loss associated with cages. Furthermore, the movement of the separating balls themselves can remove grinding debris, further improving grinding efficiency. This system is applicable to multi-ball grinding systems, is easy to set up, and is controllable in operation, significantly improving the surface precision, motion uniformity, and overall processing quality of the microspheres. Therefore, it solves the problem in related technologies where physical cages may increase additional friction, interfere with microsphere movement, and potentially become a collision source, leading to additional collisions between the microspheres and the cage or grinding disc, thus affecting the surface processing quality and grinding effect of the microspheres.

[0033] Before describing the alternating microsphere grinding method under high speed difference conditions in the embodiments of this application, the system structure and application scenarios involved in the embodiments of this application will be described first.

[0034] like Figure 1 As shown, the grinding disc system structure mainly includes a lower grinding disc 101, an upper grinding disc 102, grinding balls 103, test balls 104, and a V-groove 105; it may also include a lower disc reference rotation speed. ω d upper plate rotation speed ω u axial eccentricity e u Groove eccentricity e v Orbital radius r b .

[0035] The lower grinding disc 101 can be a grooved disc; the upper grinding disc 102 can be a flat disc without grooves. The lower grinding disc 101 and the upper grinding disc 102 typically have an axial eccentricity.e u This may cause differences in the relative linear velocity at different positions on the disk, resulting in a difference in rotational speed when the ball contacts the groove.

[0036] The grinding ball 103 can be made of steel, ceramic or other hard materials.

[0037] The test ball 104 can be used to observe, test, or assist the movement of the grinding ball 103. By arranging the test balls properly, the grinding ball can achieve the required movement trajectory and uniform grinding effect.

[0038] V-grooves 105, typically present in the lower grinding disc 101, have a "V"-shaped cross-section. They can constrain and guide the movement of the grinding balls or test balls, thus significantly affecting the grinding effect and trajectory distribution. However, their arrangement may exhibit eccentricity in the groove distribution. e v The eccentricity e v This can lead to asymmetry or bias in the force and trajectory of the spheres, which in turn affects the grinding uniformity and surface quality of the microspheres.

[0039] Specifically, such as Figure 1 As shown in (c), the V-groove 105 may include, but is not limited to, the grinding disc loading pressure. N A grinding ball diameter D L Groove curvature radius R Point A represents a contact point between the upper grinding disc and the microsphere, while points B and C represent two contact points between the V-groove in the lower grinding disc and the microsphere. These three points are also the points where the load is applied to the upper grinding disc.

[0040] It can be explained that the grinding disc loading pressure N A It can be used to adjust the contact force between the grinding ball and the disc surface, thereby affecting the grinding effect and the stress state of the ball.

[0041] grinding ball diameter D L The size of the grinding ball can be selected according to the grinding target and the microsphere size requirements. It is usually in the range of micrometers to millimeters. The diameter directly affects the movement trajectory, collision frequency and surface processing accuracy of the grinding ball.

[0042] Groove curvature radius R The radius of curvature of the cross section determines the direction of force and the degree of motion constraint of the ball in the groove, which in turn affects the distribution of the grinding ball trajectory and the uniformity of grinding.

[0043] Based on the system structure and application scenarios provided in the above embodiments, the alternating microsphere grinding method under high speed difference conditions in this application embodiment can be realized. The alternating microsphere grinding method under high speed difference conditions in this application embodiment will be described in detail below.

[0044] Specifically, Figure 2 This is a schematic flowchart of an alternating microsphere grinding method under high rotational speed differential conditions provided in an embodiment of this application.

[0045] like Figure 2 As shown, the alternating microsphere grinding method under high speed difference conditions includes the following steps: In step S201, the grinding structure of the upper and lower grinding discs is configured according to the axial eccentricity between the center of the upper disc and the center of the lower disc, the machining V-shaped groove on the surface of the lower disc, and the distribution eccentricity of the groove on the lower disc, so as to obtain a grinding disc with an eccentric structure.

[0046] The axial eccentricity is typically the radial distance between the actual centerline of the rotating shaft and the reference centerline (or ideal axis of symmetry). When axial eccentricity exists, it can cause uneven movement of the grinding balls, generating additional impact force and negatively impacting the grinding effect. The eccentricity of the lower plate groove distribution is typically the radial deviation between the geometric center of the grooves on the lower plate surface and the lower plate rotation center (or reference axis). When eccentricity exists in the groove distribution, the grinding balls may experience uneven force, resulting in an offset or periodically asymmetrical trajectory distribution, ultimately leading to a decrease in grinding effect and difficulty in guaranteeing surface precision.

[0047] It should be noted that the V-shaped groove allows the grinding balls and test microspheres to be constrained by the groove shape, maintaining their orbital and rotational states throughout the process. In the embodiments of this application, the diameter of the upper grinding disk needs to be larger than the diameter of the lower grinding disk, and based on the axial eccentricity... e u Make a corresponding diameter increase.

[0048] According to the above requirements, the embodiment of this application can preset the axial eccentricity between the center of the upper plate and the center of the lower plate. e u The machining of V-shaped grooves on the surface of the lower plate, and the eccentricity of the distribution of the grooves on the lower plate. e v This allows for the configuration of upper and lower grinding discs with specific structures.

[0049] In step S202, based on the grinding disc, the structural parameters of the microsphere grinding are determined to establish the topological model of the simulation object, and the topological model is imported into the multibody dynamics simulation software.

[0050] It can be explained that structural parameters may include, but are not limited to, grinding discs, grinding balls, test balls, groove shape and distribution, etc., which can determine the motion law of microsphere grinding, the distribution of ball trajectory, the force conditions and grinding effect, thereby directly affecting the surface accuracy, surface roughness and grinding uniformity of microspheres.

[0051] As one possible approach, embodiments of this application may employ 3D modeling software, including but not limited to SolidWorks and CATIA, to accurately model the grinding disc, grinding ball, test ball, and related structures, and import the model into multibody dynamics simulation software, including but not limited to ADAMS and Simpack, for kinematic and dynamic simulation analysis to study the ball trajectory, collision force distribution, and grinding effect.

[0052] Optionally, in one embodiment of this application, determining the structural parameters of microsphere grinding based on the grinding disc includes: determining the diameter, number, and spatial arrangement of the test balls based on the grinding disc and the grinding balls; and determining the structural parameters of microsphere grinding based on the diameter, number, and spatial arrangement of the grinding disc, the grinding balls, and the test balls.

[0053] According to the specific grinding disc structure, the parameters of the grinding balls can be set, and the diameter, number and spatial arrangement of the test balls can be further set. In this way, the overall structural parameters of microsphere grinding can be determined together, so that the grinding balls and test balls can form a cooperative relationship during the movement, thereby optimizing the force state and trajectory distribution of the microspheres and improving the grinding uniformity and surface accuracy.

[0054] Optionally, in one embodiment of this application, determining the diameter, number, and spatial arrangement of the test balls includes: determining the diameter, number, and spatial arrangement of the test balls based on at least one of dynamic geometric constraints, separation constraints, and arrangement constraints.

[0055] In this embodiment, microspheres can be arranged alternately according to arrangement constraints, and grinding balls and test balls can be placed alternately in the V-groove to form an alternating sequence.

[0056] As one possible implementation method, the embodiments of this application can place microspheres according to the sequence of "...→test ball→grind ball→test ball→grind ball→...".

[0057] It should be noted that the number of test balls is subject to a separation constraint, resulting in a sequence of: "...→grinding ball→test ball→test ball→...→grinding ball→...". In the embodiments of this application, the total number of balls... n ≥3, the number of grinding balls can be n S The number of grinding balls can be n L =n - n S .

[0058] Furthermore, in the embodiments of this application, the diameter of the test ball... d S Dynamic geometric constraints can be applied, and their formula can be expressed as: , like Figure 3 As shown, as one possible approach, the diameter of the test ball should meet the following requirements: ensure it is within the V-groove, ensure separation function, and reduce bouncing and derailment.

[0059] (1) Ensure it is within the V-groove: In the embodiments of this application, when d S > d gap At this time, the test ball can be reliably positioned within the track space formed by the upper and lower grinding discs (V-grooves), without being pressed in or stuck. d gap This excessively small gap can cause the system to become immobile or even be damaged.

[0060] (2) Ensure separation function: when d S < d b_ideal In this embodiment, the diameter of the test ball can be smaller than the diameter of the target grinding ball, ensuring that the test ball effectively separates adjacent grinding balls. If d S Too large or even close to or greater than d b_ideal The test ball may come into contact with the grinding ball, creating a new source of collision and thus losing the function of the grinding ball.

[0061] (3) Reduce bouncing and derailment: In the embodiments of this application, d S > d gap It can ensure that the ball is of sufficient size and remains stably within the track, thereby reducing the frequency of irregular bounces caused by track gaps during movement and weakening the impact of the test ball on the grinding ball at any given moment.

[0062] Overall constraints of the embodiments of this application ( d gap < d S < d b_idealThis allows the size of the test ball to be within a relatively reasonable range, that is, larger than the gap but smaller than the size of the grinding ball after grinding.

[0063] Furthermore, the embodiments of this application address the number of test balls. n S The following separation constraints can be set: , , It can be noted that the number of test balls in this embodiment can be adjusted. Theoretically, the more microspheres there are, the better the separation effect, which is more beneficial to improving the grinding quality. However, there is a suitable value for changing the number. That is, the number of test balls in the middle of the grinding balls cannot be increased indefinitely. When the number of test balls is too large, the driving force of adjacent individual grinding balls is insufficient, or it means that the loading pressure of the upper grinding disc is insufficient. N A The grinding ball diameter, material elastic modulus, groove eccentricity, upper and lower grinding disc shaft eccentricity, and grinding disc rotation speed need to be increased.

[0064] The definitions of the aforementioned parameters in this application embodiment are shown in Table 1. Table 1 is a table defining the relevant parameters.

[0065] Table 1

[0066] Through the above technical means, the embodiments of this application can determine the grinding structure parameters, and further formally construct solid models of the grinding disk, microspheres and grooves using 3D modeling software (such as SolidWorks). The models are then imported into a multibody dynamics simulation platform (such as ADAMS) for preprocessing, which may include, but is not limited to, constraint settings, contact definitions, kinematic pairs and driving condition configurations, etc., laying the foundation for subsequent kinematic and dynamic simulation analysis.

[0067] In step S203, the working parameters of microsphere grinding are set in the multibody dynamics simulation software, and a preset high speed difference motion constraint is applied to extract the microsphere orbital trajectory data.

[0068] Among them, the working parameters may include, but are not limited to, physical quality characteristics, the rotating pair of the grinding disc, the grinding drive and the sphere, etc., which can be used to simulate the motion law, collision and force conditions of the sphere during the grinding process, so as to analyze and optimize the effect, trajectory distribution and surface accuracy of microsphere grinding.

[0069] In the microsphere grinding process, a high rotational speed difference refers to a significant difference in rotational speed between the upper and lower grinding discs. A reasonable high rotational speed difference can enhance the relative motion of the microspheres, thereby improving material removal efficiency, disrupting the microsphere packing state, and allowing the microspheres to form more complete rotational and revolution trajectories between the grinding discs, thus improving grinding uniformity and overall processing quality. However, if the rotational speed difference is too large, it may lead to excessive collision forces between microspheres or between microspheres and the grinding discs, resulting in defects on the surface of the microspheres and affecting the grinding effect.

[0070] Microsphere orbital trajectory data can record the spatial position or motion trajectory of the microsphere in the grinding disk as time changes. This data may include, but is not limited to, the orbital path, velocity, and acceleration of the microsphere in three-dimensional space. It can be used to analyze the force state and collision patterns of the microsphere.

[0071] It can be noted that the extraction method can directly record and export the three-dimensional motion trajectory data of the microspheres in the grinding disc system based on the visualization function of the simulation software, or it can achieve accurate extraction of the trajectory and dynamic characteristics of key microspheres by setting monitoring points or sensors; these can be set by those skilled in the art according to the actual situation, and no specific restrictions are made here.

[0072] Optionally, in one embodiment of this application, the operating parameters for microsphere grinding are set, including: defining the physical quality characteristics of microsphere grinding; setting the rotary pair of the grinding disc, the grinding drive, and the contact force between the ball and the groove.

[0073] The physical quality characteristics can include, but are not limited to, assigning material density, elastic modulus, and moment of inertia parameters to all physical entities such as the upper and lower grinding discs, grinding balls, and test balls. The rotating pairs of the grinding disc can be kinematic pairs that enable rotational motion, affecting the motion accuracy and rotational stability of the grinding disc, as well as the force state and trajectory of the grinding balls and test balls. The grinding drive can be a power applied to the grinding disc or grinding wheel to induce relative motion between the grinding disc and the grinding balls, affecting the speed, acceleration, and trajectory distribution of the grinding balls. The contact force of the grooves can be the force generated when the grinding balls or test balls come into contact with the grooves on the surface of the grinding disc during motion; its magnitude and distribution can affect the force state and trajectory of the balls.

[0074] This application embodiment, by endowing the microsphere grinding entity with mass characteristics and setting the rotation pair of the grinding disk, the grinding drive mode, and the contact force between the grinding ball and the groove, can realistically simulate the motion law, force state, and collision situation of the microsphere in the grinding disk system, providing a reliable simulation basis for optimizing the microsphere grinding structure parameters, trajectory analysis, and final processing effect evaluation.

[0075] Furthermore, in order to achieve effective grinding motion of the separator ball, a high rotational speed difference motion constraint can be set in this embodiment of the application.

[0076] Optionally, in one embodiment of this application, the preset high-speed difference motion constraint can be expressed as: , in, Indicates the speed of the lower plate, Indicates the rotational speed of the upper plate, Indicates the axial eccentricity, Indicates the eccentricity of the trench, This represents the dynamic balancing process coefficient.

[0077] The embodiments of this application perform grinding based on high rotational speed difference constraints, which can improve the surface accuracy, uniformity and overall processing quality of microspheres. At the same time, it can extract the microsphere revolution trajectory data during the grinding process, which can provide basic data for subsequent analysis of the stress state of the grinding ball, optimization of grinding structure parameters and evaluation of microsphere processing effect.

[0078] In step S204, the standard deviation of the trajectory distribution is calculated based on the microsphere orbital trajectory data to obtain the lowest standard deviation, and the working parameters of the test sphere are determined based on the lowest standard deviation.

[0079] The standard deviation (SD) of the trajectory distribution can be a quantitative indicator of the dispersion of the orbital trajectory relative to the average trajectory or the central trajectory, reflecting the uniformity and stability of the microsphere's motion trajectory. The operating parameters of the test spheres may include, but are not limited to, parameters such as the diameter, number, and spatial arrangement of the test spheres.

[0080] As a specific example, in an embodiment of this application, the formula for calculating the SD value can be expressed as: , It can be noted that the SD value can be used as an indicator to evaluate the uniformity of grinding; the smaller the value, the more uniform the grinding. In the embodiments of this application, the working parameters of the separator balls with the lowest SD value, including but not limited to diameter, number, and spatial arrangement, can be selected for subsequent grinding.

[0081] like Figure 4 As shown in the embodiments of this application, when the speed difference is greater than or equal to 22 rpm, it meets the constraint of high speed difference between the upper and lower grinding discs, and the SD value is significantly lower than the SD value under the condition of no separator test ball, which proves the effectiveness of the method.

[0082] In step S205, the grinding disc is controlled to grind the microspheres according to the working parameters of the test ball and the preset high speed difference motion constraint, so as to generate microspheres that meet the preset quality conditions.

[0083] It can be noted that the preset quality conditions may include, but are not limited to, surface roughness (e.g., Ra≤5nm), roundness error (e.g., ≤50 nm), diameter tolerance (e.g., ±0.1μm), surface defect density (e.g., defect area ratio ≤0.1%), and material integrity and mechanical property maintenance, etc., which can be set by those skilled in the art according to the actual situation, and no specific restrictions are made here.

[0084] In actual implementation, the embodiments of this application can reproduce the selected working conditions of the separator ball and the high speed difference parameters in physical grinding, and inject an appropriate amount of grinding fluid into the grinding zone to start the grinding process; then monitor the surface quality of the microspheres after grinding to obtain microspheres that meet the preset quality conditions, and the grinding is completed.

[0085] like Figure 5 As shown below, a specific example illustrates the detailed process of the alternating microsphere grinding method under high rotational speed differential conditions according to an embodiment of this application. The embodiment of this application may include the following steps: In step S501, parameters such as the axial eccentricity between the center of the upper grinding disc and the center of the lower grinding disc, the machining V-shaped groove on the surface of the lower disc, and the distribution eccentricity of the groove on the lower disc are set to pre-configure the grinding disc.

[0086] In step S502, based on the configured grinding disk, the diameter, number, and spatial arrangement of the grinding balls and test balls are determined, and then a topological model is established and imported into multibody dynamics simulation software. The motion of the balls is observed and analyzed through the software's visualization function.

[0087] In step S503, the mass characteristics of entities in the model are defined, such as the mass of the grinding ball, the mass of the test ball, and the mass of the grinding disc, in order to more realistically simulate the microsphere grinding process.

[0088] In step S504, the kinematic pair, driving mode, and high speed difference constraint of the grinding disc are set.

[0089] In step S505, simulation is performed according to the above parameter settings to obtain the trajectory distribution SD value of the microsphere's motion trajectory.

[0090] In step S506, the simulation results are analyzed, and the working parameters of the separator ball with the lowest SD value are selected as the optimal solution. At the same time, considering the high speed difference constraint and the setting of the grinding disk, grinding fluid is added under this condition to carry out experimental grinding of microspheres.

[0091] In step S507, the surface of the ground microspheres is inspected for quality. When the surface accuracy, roundness, diameter tolerance and material integrity meet the preset conditions, the grinding is completed.

[0092] The alternating microsphere grinding method under high speed difference conditions proposed in this application involves setting the structural parameters of grinding balls and test balls using a grinding disc with an eccentric structure, establishing a topological model, and importing it into simulation software. Then, high speed difference constraints and operating parameters are set for simulation analysis to generate the final microspheres. This method can realistically simulate the force state and motion law of the microspheres in the grinding disc system, thus comprehensively reflecting the microsphere grinding process and ultimately obtaining high-quality microspheres that meet the requirements of surface precision and material integrity. Simultaneously, based on the combination of high speed difference and grinding structural parameters, chasing collisions or squeezing interference between balls can be effectively avoided, forming an alternating sequence of grinding balls and test balls. Microsphere separation can be achieved without relying on a cage, avoiding the additional friction and energy loss problems caused by the cage. Furthermore, the movement of the separating balls themselves can also remove grinding debris, further improving grinding efficiency. This method is applicable to multi-ball grinding systems, is easy to set up, and is controllable in operation, significantly improving the surface precision, motion uniformity, and overall processing quality of the microspheres.

[0093] Next, referring to the accompanying drawings, an alternating microsphere grinding apparatus for high-speed differential operation is described according to an embodiment of this application.

[0094] Figure 6 This is a block diagram of an alternating microsphere grinding device under high speed difference conditions according to an embodiment of this application.

[0095] like Figure 6 As shown, the alternating microsphere grinding device 10 under high speed difference working conditions includes: a configuration module 100, a setup module 200, a setting module 300, a determination module 400, and a grinding module 500.

[0096] The configuration module 100 is used to configure the grinding structure of the upper and lower grinding discs according to the axial eccentricity between the center of the upper disc and the center of the lower disc, the machining V-shaped groove on the surface of the lower disc, and the distribution eccentricity of the grooves on the lower disc, so as to obtain a grinding disc with an eccentric structure.

[0097] Module 200 is established to determine the structural parameters of microsphere grinding based on the grinding disc, so as to establish the topological model of the simulation object and import the topological model into the multibody dynamics simulation software.

[0098] The setting module 300 is used to set the working parameters of microsphere grinding in multibody dynamics simulation software and apply preset high speed difference motion constraints to extract microsphere orbital trajectory data.

[0099] The determination module 400 is used to calculate the standard deviation of the trajectory distribution based on the microsphere's orbital trajectory data, so as to obtain the lowest standard deviation, and determine the working parameters of the test sphere based on the lowest standard deviation.

[0100] The grinding module 500 is used to control the grinding disc to grind microspheres according to the working parameters of the test ball and the preset high speed difference motion constraint, so as to generate microspheres that meet the preset quality conditions.

[0101] Optionally, in one embodiment of this application, the establishment module 200 includes: a first determining unit and a second determining unit.

[0102] The first determining unit is used to determine the diameter, number, and spatial arrangement of the test balls based on the grinding disc and grinding balls.

[0103] The second determining unit is used to determine the structural parameters of microsphere grinding based on the diameter, number, and spatial arrangement of the grinding disc, grinding balls, and test balls.

[0104] Optionally, in one embodiment of this application, the first determining unit includes: a determining subunit.

[0105] Among them, the determination sub-unit is used to determine the diameter, number and spatial arrangement of the test balls according to at least one of the dynamic geometric constraints, separation constraints and arrangement constraints.

[0106] Optionally, in one embodiment of this application, the setting module 300 includes: a definition unit and a setting unit.

[0107] Among them, the definition unit is used to define the physical quality characteristics of microsphere grinding.

[0108] The setting unit is used to set the rotary pair of the grinding disc, the grinding drive, and the contact force between the ball and the groove.

[0109] Optionally, in one embodiment of this application, the preset high-speed difference motion constraint is: , in, Indicates the speed of the lower plate, Indicates the rotational speed of the upper plate, Indicates the axial eccentricity, Indicates the eccentricity of the trench, This represents the dynamic balancing process coefficient.

[0110] It should be noted that the explanation of the above-described embodiment of the alternating microsphere grinding method under high speed difference conditions also applies to the alternating microsphere grinding device under high speed difference conditions in this embodiment, and will not be repeated here.

[0111] The alternating microsphere grinding device under high speed difference conditions proposed in this application uses a grinding disc with an eccentric structure to set the structural parameters of the grinding balls and test balls, establish a topological model and import it into simulation software, and then set high speed difference constraints, working parameters and other parameters for simulation analysis to generate the final microspheres. It can realistically simulate the force state and motion law of the microspheres in the grinding disc system, thus comprehensively reflecting the microsphere grinding process and finally obtaining high-quality microspheres that meet the requirements of surface accuracy and material integrity. At the same time, based on the combination of high speed difference and grinding structural parameters, it can effectively avoid chasing collisions or squeezing interference between balls, forming an alternating sequence of grinding balls and test balls. Microsphere separation can be achieved without relying on a cage, avoiding the additional friction and energy loss caused by the cage. Furthermore, the movement of the separating balls themselves can also remove grinding debris, further improving grinding efficiency. It can be applied to multi-ball grinding systems, is easy to set up and controllable in operation, and can significantly improve the surface accuracy, motion uniformity and overall processing quality of microspheres.

[0112] Figure 7 A schematic diagram of the structure of an electronic device provided in an embodiment of this application. The electronic device may include: The memory 701, the processor 702, and the computer program stored on the memory 701 and executable on the processor 702.

[0113] When the processor 702 executes the program, it implements the alternating microsphere grinding method under high speed difference conditions provided in the above embodiments.

[0114] Furthermore, electronic devices also include: Communication interface 703 is used for communication between memory 701 and processor 702.

[0115] The memory 701 is used to store computer programs that can run on the processor 702.

[0116] The memory 701 may include high-speed RAM memory, and may also include non-volatile memory, such as at least one disk storage device.

[0117] If the memory 701, processor 702, and communication interface 703 are implemented independently, then the communication interface 703, memory 701, and processor 702 can be interconnected via a bus to complete communication between them. The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc. For ease of representation, Figure 7 The bus is represented by a single thick line, but this does not mean that there is only one bus or one type of bus.

[0118] Optionally, in a specific implementation, if the memory 701, processor 702, and communication interface 703 are integrated on a single chip, then the memory 701, processor 702, and communication interface 703 can communicate with each other through an internal interface.

[0119] The processor 702 may be a central processing unit (CPU), an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of this application.

[0120] This embodiment also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described alternating microsphere grinding method under high-speed differential conditions.

[0121] This application also provides a computer program product, including a computer program that can run computer instructions. When the computer instructions are executed by a processor, they implement the alternating microsphere grinding method under high speed difference conditions provided in this application.

[0122] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0123] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "N" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0124] Any process or method described in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or N executable instructions for implementing custom logic functions or processes, and the scope of the preferred embodiments of this application includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the functions involved, as should be understood by those skilled in the art to which embodiments of this application pertain.

[0125] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-included system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of computer-readable media include: an electrical connection having one or more wires (electronic device), a portable computer disk drive (magnetic device), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Alternatively, the computer-readable medium may be paper or other suitable media on which the program can be printed, since the program can be obtained electronically by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in a computer memory.

[0126] It should be understood that the various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, the N steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. If implemented in hardware, as in another embodiment, it can be implemented using any one or more of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0127] Those skilled in the art will understand that all or part of the steps of the methods in the above embodiments can be implemented by a program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, the program includes one or a combination of the steps of the method embodiments.

[0128] Furthermore, the functional units in the various embodiments of this application can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.

[0129] The storage medium mentioned above can be a read-only memory, a disk, or an optical disk, etc. Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of this application.

Claims

1. A method for alternating microsphere grinding under high-speed differential conditions, characterized in that, Includes the following steps: The grinding structure of the upper and lower grinding discs is configured according to the axial eccentricity between the center of the upper disc and the center of the lower disc, the machining V-shaped groove on the surface of the lower disc, and the distribution eccentricity of the grooves on the lower disc, so as to obtain a grinding disc with an eccentric structure. Based on the grinding disc, the structural parameters of the microsphere grinding are determined to establish a topological model of the simulation object, and the topological model is imported into multibody dynamics simulation software. In the multibody dynamics simulation software, the working parameters of the microsphere grinding are set, and a preset high speed difference motion constraint is applied to extract the microsphere orbital trajectory data; The standard deviation of the trajectory distribution is calculated based on the microsphere orbital trajectory data to obtain the lowest standard deviation, and the working parameters of the test sphere are determined based on the lowest standard deviation. The grinding disc is controlled to grind microspheres according to the working parameters of the test ball and the preset high speed difference motion constraint, so as to generate microspheres that meet the preset quality conditions. The step of determining the structural parameters of microsphere grinding based on the grinding disc includes: determining the diameter, number, and spatial arrangement of the test balls according to at least one of dynamic geometric constraints, separation constraints, and arrangement constraints, the grinding disc, and the grinding balls; and determining the structural parameters of microsphere grinding according to the diameter, number, and spatial arrangement of the grinding disc, the grinding balls, and the test balls. The setting of the working parameters for the microsphere grinding includes: defining the physical quality characteristics of the microsphere grinding; setting the rotary joint of the grinding disc, the grinding drive, and the contact force between the sphere and the groove; The preset high-speed difference motion constraint is: ， in, Indicates the speed of the lower plate, Indicates the rotational speed of the upper plate, Indicates the axial eccentricity, Indicates the eccentricity of the trench, This represents the dynamic balancing process coefficient.

2. An alternating microsphere grinding device under high speed difference conditions, characterized in that, For implementing the alternating microsphere grinding method under high speed difference conditions as described in claim 1, the alternating microsphere grinding device under high speed difference conditions includes: The configuration module is used to configure the grinding structure of the upper and lower grinding discs according to the axial eccentricity between the center of the upper disc and the center of the lower disc, the machining V-shaped groove on the surface of the lower disc, and the distribution eccentricity of the grooves on the lower disc, so as to obtain a grinding disc with an eccentric structure. A module is established to determine the structural parameters of the microsphere grinding based on the grinding disc, so as to establish a topological model of the simulation object and import the topological model into multibody dynamics simulation software; The setting module is used to set the working parameters of the microsphere grinding in the multibody dynamics simulation software and apply a preset high speed difference motion constraint to extract the microsphere orbital trajectory data. The determination module is used to calculate the standard deviation of the trajectory distribution based on the microsphere orbital trajectory data, so as to obtain the lowest standard deviation, and determine the working parameters of the test sphere based on the lowest standard deviation; The grinding module is used to control the grinding disc to grind microspheres according to the working parameters of the test ball and the preset high speed difference motion constraint, so as to generate microspheres that meet the preset quality conditions. The establishment module includes: determining the diameter, number, and spatial arrangement of the test balls based on at least one of dynamic geometric constraints, separation constraints, and arrangement constraints, the grinding disc, and the grinding balls; and determining the structural parameters of the microsphere grinding based on the diameter, number, and spatial arrangement of the grinding disc, the grinding balls, and the test balls. The setting module includes: defining the physical quality characteristics of the microsphere grinding; setting the rotary pair of the grinding disc, the grinding drive, and the contact force between the sphere and the groove; The preset high-speed difference motion constraint is: ， in, Indicates the speed of the lower plate, Indicates the rotational speed of the upper plate, Indicates the axial eccentricity, Indicates the eccentricity of the trench, This represents the dynamic balancing process coefficient.

3. An electronic device, characterized in that, include: The memory, the processor, and the computer program stored in the memory and executable on the processor, the processor executing the program to implement the alternating microsphere grinding method under high speed difference conditions as described in claim 1.

4. A computer-readable storage medium having a computer program stored thereon, characterized in that, The program is executed by the processor to implement the alternating microsphere grinding method under high speed difference conditions as described in claim 1.

5. A computer program product, comprising a computer program, characterized in that, The computer program is executed to implement the alternating microsphere grinding method under high speed difference conditions as described in claim 1.

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