Wafer thickness measuring system and measuring jig thereof

Abstract

The invention discloses a wafer thickness measuring system and a measuring jig thereof. The measuring system comprises a transmitting module, a receiving module, a signal output head, a signal receiving head and an analysis host. The transmitting module comprises a first carrying platform and a first conductive column, and the first conductive column is inserted on the first carrying platform and is electrically insulated from the first carrying platform. The receiving module comprises a second carrying platform and a second conductive column, and the second conductive column is inserted on the second carrying platform, is electrically insulated from the second carrying platform and is aligned with the first conductive column. An object to be measured is fixedly held between the second carrying platform and the first carrying platform. The signal output head is electrically connected with the first conductive column and transmits a test signal to an object to be tested through the first conductive column. The signal receiving head is electrically connected with the second conductive column and receives a test signal passing through the object to be tested through the second conductive column. The analysis host is electrically connected with the signal output head and the signal receiving head so as to analyze the test signal. According to the invention, the opportunity that a test signal is interfered can be reduced, the precision of a measurement result is improved, errors are reduced, and a more accurate test result is provided.

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