半导体测温装置
By setting temperature sensing components and capacitor structures between wafers, the problems of contamination and interference in wafer temperature detection devices are solved, achieving higher temperature measurement accuracy and equipment stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENZHEN PENGXIN MICRO INTEGRATED CIRCUIT MFG CO LTD
- Filing Date
- 2025-04-01
- Publication Date
- 2026-07-17
AI Technical Summary
Existing wafer temperature detection devices suffer from problems such as contamination introduced by wired measurement devices and susceptibility to electrical interference in wireless devices, which affect the accuracy of temperature measurement and the stability of the equipment.
The temperature sensing assembly between the first and second wafers, which are stacked, includes a temperature sensing device, a power supply, a main controller, and a capacitor structure, which are coupled through interconnect circuits. The capacitor structure is used to contain plasma, charge, and spike current to reduce interference.
It improves the anti-interference capability of the temperature measuring device, reduces signal transmission instability and the risk of device damage, and enhances the accuracy of temperature measurement and the stability of the equipment.
Smart Images
Figure CN121096906B_ABST