A method and apparatus for improving the mounting stress of lath crystals

CN121097478BActive Publication Date: 2026-08-14BEIJING ORIENTAL SHARP LASER TECH
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-08-27
Publication Date
2026-08-14

AI Technical Summary

Technical Problem

[0003]但是在焊料熔化再凝固的热循环过程中,两块金属热沉的吸热面会不可避免地发生相对偏移,导致其难以保持严格平行;这种平行度偏差会使得板条晶体受到非均匀夹持力,进而在其内部产生安装应力,对板条激光器的输出效率和光束质量造成不利影响

Benefits of technology

[0019]本申请公开的改善板条晶体安装应力的方法,通过在第一处理组件的四个长度侧面对称装配第一热沉锁紧件,形成了“每块金属热沉对应一对目标侧面组”的对称支撑结构;第二热沉锁紧件针对每块热沉的目标侧面组实施可控预紧力调节,通过微调预紧力使金属热沉的吸热面恢复相对平行,补偿焊接后金属热沉因热循环产生的平行度偏差,使得板条晶体的安装应力得到释放,提高板条激光器的输出效率和光束质量。

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN121097478B_ABST
    Figure CN121097478B_ABST
Patent Text Reader

Abstract

This invention discloses a method and apparatus for improving the installation stress of slab crystals, relating to the field of slab laser technology. The method is applied to a heat sink fixing module. The slab crystal is assembled between two metal heat sinks in a double-sided bonding manner to obtain a first processing assembly. A first heat sink locking member is assembled on each length side of the first processing assembly. The overlapping area of ​​the first heat sink locking member with the corresponding length side is adjusted so that the target side of the first heat sink locking member protrudes from the first processing assembly in a direction away from the slab crystal, resulting in a second processing assembly. A second heat sink locking member is assembled on each pair of target side groups of the second processing assembly. The fixing preload of the second heat sink locking member with each target side in the corresponding target side group is adjusted to release the installation stress of the slab crystal, resulting in a target mounting assembly.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This invention relates to the field of slab laser technology, and more particularly to a method and apparatus for improving the mounting stress of slab crystals. Background Technology

[0002] During the installation and commissioning of high-power slab lasers, a welding process is typically used to weld the slab-shaped crystal between the heat-absorbing surfaces of two metal heat sinks to achieve efficient heat conduction.

[0003] However, during the thermal cycle of solder melting and resolidification, the heat-absorbing surfaces of the two metal heat sinks will inevitably shift relative to each other, making it difficult for them to maintain strict parallelism. This parallelism deviation will cause the slab crystal to be subjected to non-uniform clamping force, which in turn will generate installation stress inside it, adversely affecting the output efficiency and beam quality of the slab laser.

[0004] Therefore, how to improve the mounting stress of slab crystals and enhance the output efficiency and beam quality of slab lasers has become one of the urgent problems to be solved in the field of slab laser technology. Summary of the Invention

[0005] To address the aforementioned problems, this application discloses a method for improving the mounting stress of a slab crystal, thereby enhancing the output efficiency and beam quality of a slab laser.

[0006] This application discloses the following technical solution:

[0007] The first aspect of this application discloses a method for improving the installation stress of a slab crystal, applied to a heat sink fixing module, wherein the heat sink fixing module is equipped with a slab crystal and the heat sink fixing module includes two metal heat sinks, four first heat sink locking members and two second heat sink locking members;

[0008] The method includes:

[0009] A lath crystal is assembled between two metal heat sinks using a double-sided bonding method to obtain a first processing assembly; the first processing assembly includes four length sides; the length sides are the sides of the cuboid-shaped metal heat sink along its length.

[0010] A first heat sink locking member is mounted on each length side of the first processing component. The overlapping area of ​​the first heat sink locking member and the corresponding length side is adjusted so that the target side of the first heat sink locking member protrudes from the first processing component in a direction away from the slab crystal, thus obtaining a second processing component. The target side is the length side of the first heat sink locking member in the shape of a cuboid. The second processing component includes two pairs of target side groups. Each pair of target side groups consists of the target side of the first heat sink locking member mounted on the same metal heat sink.

[0011] One of the second heat sink locking elements is fitted on each pair of target side groups of the second processing component.

[0012] Adjust the fixing preload of the second heat sink locking member and each target side in the corresponding target side group to release the installation stress of the slat crystal, thereby obtaining the target installation assembly.

[0013] The second aspect of this application discloses an apparatus for improving the mounting stress of lath crystals using the method described above.

[0014] The device includes:

[0015] The first processing component acquisition module is used to assemble the slab crystal between two metal heat sinks in a double-sided bonding manner to obtain the first processing component; the first processing component includes four length sides; the length sides are the sides of the cuboid-shaped metal heat sink along its length.

[0016] The second processing component acquisition module is used to assemble a first heat sink locking member on each length side of the first processing component, and adjust the overlapping area of ​​the first heat sink locking member with the corresponding length side so that the target side of the first heat sink locking member protrudes from the first processing component in a direction away from the slab crystal, thereby obtaining the second processing component; the target side is the length side of the first heat sink locking member in the shape of a cuboid; the second processing component includes two pairs of target side groups; each pair of target side groups consists of the target side of the first heat sink locking member mounted on the same metal heat sink;

[0017] The target mounting component acquisition module is used to assemble a second heat sink locking member on each pair of target side groups of the second processing component, and adjust the fixing preload of the second heat sink locking member and each target side in the corresponding target side group to release the installation stress of the slat crystal and obtain the target mounting component.

[0018] Advantages compared to existing technologies:

[0019] The method disclosed in this application for improving the mounting stress of slab crystals involves symmetrically assembling first heat sink locking components on the four length sides of a first processing assembly, forming a symmetrical support structure where "each metal heat sink corresponds to a pair of target side groups". The second heat sink locking component implements controllable pre-tightening force adjustment for each heat sink's target side group. By finely adjusting the pre-tightening force, the heat-absorbing surfaces of the metal heat sinks are restored to relative parallelism, compensating for the parallelism deviation caused by thermal cycling after welding. This releases the mounting stress of the slab crystal and improves the output efficiency and beam quality of the slab laser. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a heat sink fixing module provided in an embodiment of this application;

[0021] Figure 2 A flowchart illustrating a method for improving the mounting stress of lath crystals, provided in an embodiment of this application;

[0022] Figure 3 This is a schematic diagram of a device for improving the mounting stress of slab crystals, provided in an embodiment of this application.

[0023] Reference numerals: 1-Strip crystal; 2-Metal heat sink; 3-First heat sink locking element; 4-Second heat sink locking element; 5-Bellwall; S1-First threaded hole; S2-Second threaded hole; S3-Third threaded hole; S4-Fourth threaded hole; S5-Fifth threaded hole. Detailed Implementation

[0024] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0025] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0026] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0027] Figure 1 The structure diagram of a heat sink fixing module provided by an embodiment of the present application. Combining Figure 1 As shown, the heat sink fixing module disclosed in the present application includes: a slab crystal 1, two metal heat sinks 2, four first heat sink locking members 3, two second heat sink locking members 4, and four bellows 5.

[0028] Combining Figure 1 As shown, both the metal heat sink 2 and the first heat sink locking member 3 are rectangular parallelepiped-shaped components, the second heat sink locking member 4 is a "convex"-shaped component, the material of the bellows 5 is stainless steel and has a bending property, and the surface of the metal heat sink 2 is gold-plated.

[0029] Each metal heat sink 2 in the present application has two surfaces and four sides. In the present application, the surface of the metal heat sink 2 that is close to the slab crystal is defined as the heat absorption surface; the surface of the metal heat sink 2 that corresponds to the heat absorption surface and is far from the slab crystal 1 is defined as the heat dissipation surface; the side surface of the metal heat sink 2 in the length direction is defined as the length side surface; the side surface of the metal heat sink 2 in the width direction is defined as the width side surface.

[0030] Combining Figure 1 As shown, the surface of the metal heat sink 2 that is close to the slab crystal 1 is the heat absorption surface; the surface of the metal heat sink 2 that is far from the slab crystal 1 and faces the second heat sink locking member 4 is the heat dissipation surface; the surface of the metal heat sink 2 that faces the first heat sink locking member 3 is the length side surface.

[0031] Each first heat sink locking member 3 in the present application has two surfaces and four sides. In the present application, the side surface of the first heat sink locking member 3 in the length direction is defined as the target side surface; the two planes perpendicular to the target side surface in the first heat sink locking member 3 are respectively defined as the upper surface of the first heat sink locking member and the lower surface of the first heat sink locking member.

[0032] Combining Figure 1 As shown, the side surface of the first heat sink locking member 3 that faces the second heat sink locking member 4 is the target side surface; the surface of the first heat sink locking member 3 that faces the length side surface of the metal heat sink 2 is the lower surface of the first heat sink locking member 3.

[0033] In this application, the second heat sink locking member 4 adopts a "convex" shaped component. In this application, the side surface of the "convex" shaped component close to the top of the "convex" character is defined as the protruding end, and the bottom surface of the "convex" shaped component close to the lower end of the "convex" character is defined as the flat end.

[0034] On the length side surface of the metal heat sink 2 in this application, a plurality of first threaded holes S1 are provided. As shown in Figure 1 each length side surface of each metal heat sink 2 has 4 first threaded holes S1.

[0035] On the first heat sink locking member 3 in this application, a plurality of second threaded holes S2 penetrating the upper surface and the lower surface of the first heat sink locking member 3 are provided. As shown in Figure 1 each first heat sink locking member 3 has 4 second threaded holes S2 penetrating the upper surface and the lower surface of the first heat sink locking member 3.

[0036] On the target side surface of the first heat sink locking member 3 in this application, a plurality of third threaded holes S3 are provided. As shown in Figure 1 each target side surface of each first heat sink locking member 3 has 3 third threaded holes S3.

[0037] As shown in Figure 1 on the plane close to the protruding end of the second heat sink locking member 4, 3 fourth threaded holes S4 penetrating the second heat sink locking member 4 are provided, and on the plane close to the flat end of the second heat sink locking member 4, a plurality of fifth threaded holes S5 penetrating the second heat sink locking member 4 are provided.

[0038] In each metal heat sink 2 of this application, a water channel structure is provided; a water channel inlet and a water channel outlet are provided on the heat dissipation surface of the metal heat sink 2; both the water channel inlet and the water channel outlet are connected to a water tank through a bellows 5.

[0039] The bellows 5 in this application is made of stainless steel; through the bellows 5 and the water channel structure in the metal heat sink 2, the volatilization of organic or inorganic substances and the leakage of water vapor are prevented, and the pulling of the water channel structure on the plate crystal 1 and the two metal heat sinks 2 is reduced.

[0040] Figure 2 It is a flowchart of a method for improving the installation stress of a plate crystal provided in an embodiment of this application. As shown in Figure 2 the method for improving the installation stress of the plate crystal disclosed in this application includes:

[0041] S201, assembling the plate crystal 1 between two said metal heat sinks 2 in a double-sided bonding manner to obtain a first processed component.

[0042] S202, assemble a first heat sink locking member 3 on each length side of the first processing component, adjust the overlapping area of ​​the first heat sink locking member 3 with the corresponding length side so that the target side of the first heat sink locking member 3 protrudes from the first processing component in a direction away from the slab crystal 1, and obtain the second processing component.

[0043] The target side is the side along the length of the first heat sink locking member 3, which is in the shape of a cuboid; the second processing component includes two pairs of target side groups; each pair of target side groups consists of the target side of the first heat sink locking member 3 mounted on the same metal heat sink 2.

[0044] The following is combined with Figure 2 Taking the assembly process of a single first heat sink locking component 3 with the corresponding length side as an example, step S202 will be explained in detail:

[0045] A1. Place the two length sides of the first processing component stably on the optical operation platform as the assembly reference; take a cuboid first heat sink locking component 3, and make the multiple second threaded holes S2 penetrating the upper and lower surfaces of it precisely aligned with the multiple first threaded holes S1 on the length side to be assembled in the first processing component, and initially achieve pre-fixing by screws (not fully locked, leaving room for adjustment).

[0046] A2, then by finely adjusting the assembly position of the first heat sink locking member 3 along the length or width direction of the metal heat sink 2, the overlapping area of ​​its lower surface with the length side of the metal heat sink 2 is changed, so that the target side protrudes out of the contour range of the first processing component along the direction "away from the slab crystal" (i.e. away from the central area of ​​the two metal heat sinks 2 clamping the slab crystal 1), forming an outwardly extending rigid reference side.

[0047] A3, after adjustment, pass a fastener (such as a screw) through the second threaded hole S2 of the first heat sink locking member 3 and screw it into the first threaded hole S1 of the metal heat sink 2 to complete the rigid locking and fixing of the two.

[0048] In this way, four first heat sink locking members 3 can be symmetrically distributed on the four long sides of the first processing component, and the target sides of the two first heat sink locking members 3 on each metal heat sink 2 form a pair of "target side groups" (two pairs in total). At this point, the first processing component completes the assembly and adjustment with the first heat sink locking members 3, forming the second processing component.

[0049] S203, assemble a second heat sink locking member 4 on each pair of target side groups of the second processing component, adjust the fixing preload of the second heat sink locking member 4 and each target side in the corresponding target side group to release the installation stress of the slat crystal 1, and obtain the target mounting component.

[0050] The following will, Figure 2 taking the assembly process of a single second heat sink locking member 4 and the corresponding target side group as an example, elaborate on step S203 in detail:

[0051] B1. For the target side group composed of the target sides of two first heat sink locking members 3 on the same metal heat sink 2 in the second processing component, take a second heat sink locking member 4 with a "convex" shape structure, align multiple fourth threaded holes S4 on the second heat sink locking member 4 with multiple third threaded holes S3 on one of the target sides in the target side group, and align multiple fifth threaded holes S5 on the second heat sink locking member 4 with multiple third threaded holes S3 on the other target side in the target side group. Initially, pass fasteners (such as screws) through the fourth threaded holes S4 and screw them into the third threaded holes S3 to achieve pre - fixation of the second heat sink locking member 4 and the target side group (not fully tightened, leaving room for pre - tightening force adjustment).

[0052] B2. Based on the distribution state of the installation stress of the slab crystal (which can be judged by stress detection or assembly experience), step - by - step adjust the fixed pre - tightening force between the second heat sink locking member 2 and the two target sides in the target side group, making the heat absorption surfaces of the two metal heat sinks 趋于 parallel, thereby alleviating the non - uniform clamping force on the slab crystal 1.

[0053] B3. After the installation stress of the slab crystal 1 is fully released through pre - tightening force adjustment (which can be verified by crystal deformation monitoring or subsequent performance testing), fully tighten all the fasteners between the second heat sink locking member 4 and the target side group to achieve rigid fixation.

[0054] According to the above process, assemble and adjust the second heat sink locking member 4 for the two pairs of target side groups of the second processing component respectively, and finally complete all the assembly and stress optimization to obtain the target installation component.

[0055] S204. Install the bellows 5 on the two metal heat sinks 2.

[0056] In summary, for the method for improving the installation stress of the slab crystal disclosed in this application, by symmetrically assembling the first heat sink locking members 3 on the four length sides of the first processing component, a symmetric support structure of "each metal heat sink 2 corresponds to a pair of target side groups" is formed; the second heat sink locking member 4 implements controllable pre - tightening force adjustment for the target side group of each metal heat sink 2, and by finely adjusting the pre - tightening force, the heat absorption surfaces of the metal heat sinks 2 are restored to be relatively parallel, compensating for the parallelism deviation of the metal heat sinks 2 caused by thermal cycling after welding, so that the installation stress of the slab crystal 1 is released, improving the output efficiency and beam quality of the slab laser.

[0057] Based on the same inventive concept, this application discloses a device for improving the installation stress of the slab crystal. Figure 3This is a schematic diagram of a device for improving the mounting stress of slab crystals, provided as an embodiment of this application. (Combined with...) Figure 3 As shown, the apparatus 300 for improving the mounting stress of slab crystals disclosed in this application includes:

[0058] The first processing component acquisition module 301 is used to assemble the slab crystal 1 between two metal heat sinks 2 in a double-sided bonding manner to obtain the first processing component; the first processing component includes four length sides; the length sides are the sides of the cuboid-shaped metal heat sink 2 along the length direction;

[0059] The second processing component acquisition module 302 is used to assemble a first heat sink locking member 3 on each length side of the first processing component, and adjust the overlapping area of ​​the first heat sink locking member 3 with the corresponding length side so that the target side of the first heat sink locking member 3 protrudes from the first processing component in a direction away from the slab crystal 1, thereby obtaining the second processing component; the target side is the length side of the first heat sink locking member 3 in the shape of a cuboid; the second processing component includes two pairs of target side groups; each pair of target side groups consists of the target side of the first heat sink locking member 3 installed on the same metal heat sink 2.

[0060] The target mounting component acquisition module 303 is used to assemble a second heat sink locking member 4 on each pair of target side groups of the second processing component, adjust the fixing preload of the second heat sink locking member 4 and each target side in the corresponding target side group, so that the installation stress of the slat crystal 1 is released, and the target mounting component is obtained.

[0061] The above embodiments only illustrate one or more implementations of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the appended claims.

Claims

1. A method for improving the mounting stress of lath crystals, characterized in that, Applied to a heat sink fixing module, the heat sink fixing module is installed with a slab crystal, and the heat sink fixing module includes two metal heat sinks, four first heat sink locking parts and two second heat sink locking parts; the method includes: assembling the slab crystal between the two metal heat sinks in a double-sided bonding manner to obtain a first processing component; the first processing component includes four length sides; the length side is the side in the length direction of the cuboid-shaped metal heat sink; assembling one of the first heat sink locking parts on each length side of the first processing component, and adjusting the overlapping area between the first heat sink locking part and the corresponding length side, so that the target side of the first heat sink locking part protrudes from the first processing component in the direction away from the slab crystal to obtain a second processing component; the target side is the side in the length direction of the cuboid-shaped first heat sink locking part; the second processing component includes two pairs of target side groups; each pair of the target side groups is composed of the target sides of the first heat sink locking parts installed on the same metal heat sink; assembling one of the second heat sink locking parts on each pair of target side groups of the second processing component, and adjusting the fixing pre-tightening force between the second heat sink locking part and each target side in the corresponding target side group to release the installation stress of the slab crystal to obtain a target installation component.

2. The method according to claim 1, characterized in that, A plurality of first threaded holes are provided on the length side of the metal heat sink; a plurality of second threaded holes penetrating the upper surface and the lower surface of the first heat sink locking part are provided on the first heat sink locking part; assembling one of the first heat sink locking parts on each length side of the first processing component, and based on the plurality of first threaded holes and the plurality of second threaded holes, assembling the first heat sink locking part onto the corresponding length side.

3. The method according to claim 2, characterized in that, A plurality of third threaded holes are provided on the target side of the first heat sink locking part; the second heat sink locking part is a "convex"-shaped component, and a plurality of fourth threaded holes penetrating the second heat sink locking part are provided on the plane near the protruding end of the second heat sink locking part, and a plurality of fifth threaded holes penetrating the second heat sink locking part are provided on the plane near the straight end of the second heat sink locking part; assembling one of the second heat sink locking parts on each pair of target side groups of the second processing component, and based on the plurality of third threaded holes, the plurality of fourth threaded holes and the plurality of fifth threaded holes, assembling the second heat sink locking part onto the corresponding target side group.

4. The method according to any one of claims 1-3, characterized in that, A water channel structure is provided inside each of the metal heat sinks; a water channel inlet and a water channel outlet are provided on the heat dissipation surface of the metal heat sink; both the water channel inlet and the water channel outlet are connected to a water tank through bellows.

5. The method according to any one of claims 1-3, characterized in that, The surface of the metal heat sink is gold-plated.

6. The method according to claim 4, characterized in that, The bellows is made of stainless steel.

7. An apparatus for implementing the method for improving the mounting stress of lath crystals according to any one of claims 1-6, characterized in that, The device includes: A first processing component acquisition module is used to assemble a slab crystal between two metal heat sinks in a double-sided bonding manner to obtain a first processing component; the first processing component includes four length sides; the length sides are the sides of the cuboid-shaped metal heat sink along its length direction; a second processing component acquisition module is used to assemble a first heat sink locking member on each length side of the first processing component, and adjust the overlapping area of ​​the first heat sink locking member with the corresponding length side so that the target side of the first heat sink locking member protrudes from the first processing component in a direction away from the slab crystal to obtain a second processing component; the target side is the side of the cuboid-shaped first heat sink locking member along its length direction; the second processing component includes two pairs of target side groups; each pair of target side groups consists of the target side of the first heat sink locking member installed on the same metal heat sink; a target mounting component acquisition module is used to assemble a second heat sink locking member on each pair of target side groups of the second processing component, and adjust the fixing preload of the second heat sink locking member with each target side in the corresponding target side group to release the installation stress of the slab crystal to obtain a target mounting component.