Remote plasma generator power supply voltage scheduling method

Abstract

The application relates to the technical field of plasma generator voltage scheduling, and discloses a remote plasma generator power supply voltage scheduling method, which comprises the following steps: performing a heat conduction distance calculation strategy, using a plasma beam to irradiate a single copper wire, and calculating the heat diffusion length along the copper wire based on the initial temperature of a circuit board; performing a rectangular grouping irradiation strategy, grouping the rectangular cleaning areas with the heat diffusion length, controlling two end plasma generators to irradiate at an initial power, and measuring the temperature of each rectangular cleaning area in the group; performing a proportion estimation temperature judgment strategy, using a plasma beam to irradiate the rectangular cleaning area, and estimating the temperature of each rectangular cleaning area; performing a power scheduling control strategy, remotely scheduling the power supply voltage control output power of the two plasma generators, adjusting the single cleaning time length, and completing the cleaning task; and performing a group switching control strategy, remotely controlling the plasma generator to irradiate the rectangular cleaning area among different groups, and improving the process quality and production efficiency.

Description

Technical Field

[0001] This invention relates to the field of plasma generator voltage scheduling technology, specifically a method for remote plasma generator power supply voltage scheduling. Background Technology

[0002] Plasma generator cleaning of circuit boards is a highly efficient and environmentally friendly dry process. By bombarding the surface with high-energy active particles, it effectively removes organic contaminants, fine particles, and oxides, improving the solderability and adhesion of the pads. This technology has advantages such as relatively low processing temperature, no chemical waste, and suitability for delicate structures, making it widely used in modern electronics manufacturing.

[0003] Existing plasma cleaning technologies suffer from several systemic drawbacks. Traditional methods typically employ fixed power output or simple timing control strategies, which are ill-suited to the complex and variable copper trace layouts of circuit boards. This leads to overheating damage to the substrate in densely traced areas due to heat accumulation, while insufficient energy results in incomplete cleaning in sparsely traced areas. More critically, current technologies fail to effectively utilize the excellent thermal conductivity of copper traces, treating each cleaning area as an independent unit. This approach cannot predict or control lateral heat conduction and misses opportunities to improve cleaning efficiency through heat conduction. At the process control level, the lack of accurate heat diffusion models and real-time temperature prediction capabilities means that group cleaning strategies often rely on empirical settings, making it difficult to achieve the optimization goals of maximizing intra-group thermal coupling effects and minimizing inter-group thermal interference. Furthermore, process parameters are severely out of sync with production plans. The use of a single plasma generator often fails to coordinate with the overall production cycle, impacting production efficiency and delivery time. In addition, energy management is relatively crude, failing to dynamically adjust output power based on actual contaminant load and temperature changes, resulting in low energy efficiency. These shortcomings collectively restrict the application effectiveness and further development of plasma cleaning technology in the field of high-end circuit board manufacturing.

[0004] This solution proposes a method for remote plasma generator power supply voltage scheduling, addressing the problems mentioned in the background section. Summary of the Invention

[0005] This invention provides a method for remote plasma generator power supply voltage scheduling, which helps to solve the problems mentioned in the background art.

[0006] This invention provides the following technical solution: a method for remote plasma generator power supply voltage scheduling, comprising:

[0007] The plasma beam generated by the plasma generator is used to irradiate the surface of the circuit board for cleaning. The pattern of the plasma beam mapped on the circuit board is rectangular. Different rectangles can be obtained by adjusting the plasma beam.

[0008] The copper traces on the circuit board are extracted and divided into multiple trace clusters, and a rectangular cleaning area is designed for each trace cluster.

[0009] Set the initial power of the plasma generator;

[0010] A strategy for calculating thermal conduction distance is implemented by irradiating a single copper trace with a plasma beam and calculating the thermal diffusion length along the copper trace based on the initial temperature of the circuit board.

[0011] Two plasma generators are configured for each wiring cluster;

[0012] For any cluster of traces:

[0013] A rectangular grouping irradiation strategy was implemented, with rectangular cleaning zones grouped by thermal diffusion length. Plasma generators at both ends were controlled to irradiate with initial power, and the temperature of each rectangular cleaning zone within the group was measured.

[0014] Set a maximum cleaning time for a single zone to limit the cleaning time of each rectangular cleaning zone within the group;

[0015] The two unwashed rectangular cleaning areas with the highest temperatures within the group are denoted as Rectangle 1 and Rectangle 2, respectively.

[0016] To determine the critical temperature required for pollutants to be heated and evaporated by a plasma beam;

[0017] The execution ratio estimation temperature determination strategy is to use plasma beam to irradiate rectangle one and rectangle two to estimate the temperature of each rectangular cleaning zone, and determine whether to execute the group switching command based on the temperature.

[0018] When the remotely controlled plasma generator irradiates rectangles one and two:

[0019] The power scheduling control strategy is implemented to remotely schedule the power supply voltage of the two plasma generators to control the output power, thereby adjusting the duration of a single cleaning cycle and completing the group cleaning task.

[0020] When a group switching command is executed, the inter-group switching control strategy is implemented, and the plasma generator is remotely controlled to irradiate the rectangular cleaning area between different groups.

[0021] Optionally, the copper traces of the extracted circuit board are divided into multiple trace clusters, and a rectangular cleaning area is designed for each trace cluster, including:

[0022] Set reference interval and floating error Calculate the reference interval. ;

[0023] Get any two adjacent copper traces and set multiple location points between the adjacent copper traces;

[0024] Measure the spacing between adjacent copper traces at each location point. When the spacing at all locations is within the reference spacing range, the adjacent copper traces are classified into the same trace cluster.

[0025] For any trace cluster, obtain the width of the trace cluster perpendicular to the trace direction. ;

[0026] Adjust the width of the rectangle mapped onto the circuit board by the plasma beam control to be equal to the width of the trace cluster, and obtain the maximum length of the rectangle. ;

[0027] The length and width of the rectangular cleaning area are respectively and ;

[0028] Obtain the length of the trace cluster along the trace direction. ,calculate ,in, This represents the number of rectangular cleaning areas on the wiring cluster.

[0029] Optionally, the strategy for calculating the thermal conduction distance, which involves irradiating a single copper trace with a plasma beam and calculating the thermal diffusion length along the copper trace based on the initial temperature of the circuit board, includes:

[0030] The plasma generator is controlled to irradiate a single copper trace with initial power, and the center of the rectangular cleaning area is located on the single copper trace.

[0031] Measuring the initial temperature of a single copper trace and plasma beam temperature ;

[0032] Obtain the position point x from the center of the rectangular cleaning area on a single copper trace;

[0033] Calculate the temperature at the given location point at time t. , ,in, The thermal diffusivity of copper describes the rate at which heat diffuses along copper traces. It is a function of heat loss with distance;

[0034] when When the thermal diffusion length is set to .

[0035] Optionally, the implementation of the rectangular grouping irradiation strategy, grouping rectangular cleaning zones by thermal diffusion length, controlling the plasma generators at both ends to irradiate at initial power, and measuring the temperature of each rectangular cleaning zone within the group, includes:

[0036] calculate ,Will The number of rectangular cleaning areas covered by the thermal diffusion length;

[0037] The rectangular cleaning areas of the wiring clusters are grouped, with each group including... A continuous rectangular cleaning area;

[0038] The rectangular cleaning area is cleaned using plasma beams in groups, specifically as follows:

[0039] Multiple points were set up in each rectangular cleaning area within the group, and the contaminant thickness at each point was measured. The average contaminant thickness of all rectangular cleaning areas was calculated, and the result was recorded as the average contaminant thickness. ;

[0040] Two plasma generators were controlled to clean the rectangular cleaning areas at both ends of the group at initial power for a duration of [duration missing]. , ,in, This represents the initial power of the plasma generator. Energy transfer efficiency is the proportion of effective energy from the plasma beam to the contaminant surface. It is the critical temperature;

[0041] For pollutant density, For the specific heat of pollutants, The area of ​​the rectangular cleaning area;

[0042] This represents the energy required to evaporate a pollutant with a thickness of d.

[0043] The temperature of the rectangular cleaning zone is measured at each point, and the average of all temperatures in a single rectangular cleaning zone is calculated as the temperature of that single rectangular cleaning zone.

[0044] Optionally, if a plasma beam is used to irradiate rectangle one and rectangle two, a proportional estimation temperature determination strategy is implemented to estimate the temperature of each rectangular cleaning zone, including:

[0045] A proportional temperature estimation strategy is applied to rectangle 1.

[0046] The rectangular cleaning areas are numbered sequentially along the routing direction, with rectangle one numbered as follows: ;

[0047] Get the current temperature of rectangle 1 , ;

[0048] calculate ,in, This represents the heating margin for rectangle one;

[0049] Using plasma beam irradiation of rectangle one to control the temperature of rectangle one and increase the temperature rise margin, estimate the temperature rise value of other rectangular cleaning areas in the group caused by this irradiation.

[0050] When cleaning rectangle one, the rectangular cleaning area will be... The temperature rise value is denoted as ;

[0051] The calculation formula is: ,in, It is a function of heat loss with distance;

[0052] A proportional temperature estimation strategy is applied to rectangle two, where rectangle two is numbered as follows: ;

[0053] When cleaning rectangle two, the rectangular cleaning area will be... The temperature rise value is denoted as ;

[0054] The calculation formula is: ;

[0055] Perform a unit-time cooling test to calculate the cooling rate of the copper trace. ;

[0056] calculate ,in, For cooling value, This is the maximum duration for a single zone;

[0057] Obtain the rectangular cleaning area Current temperature ;

[0058] calculate ,in, Rectangular cleaning area Temperature exceeding the maximum duration for a single zone.

[0059] Optionally, determining whether to execute a group switching command based on temperature includes:

[0060] The unit-time cooling measurement experiment calculates the cooling rate of the copper trace, specifically as follows:

[0061] The temperature rise at the irradiation point was controlled by irradiating a single copper trace with a plasma beam. Then stop irradiation;

[0062] The temperature at the irradiation point naturally cooled down to the initial temperature. Duration ,but ;

[0063] Set zone temperature threshold ;

[0064] like Execute group switching commands and remotely control the plasma generator to perform inter-group cleaning;

[0065] like Then, the plasma generator can be remotely controlled to irradiate rectangle one and rectangle two.

[0066] Optionally, the execution power scheduling control strategy remotely schedules the power supply voltage of the two plasma generators to control the output power, thereby adjusting the duration of a single cleaning cycle and completing the group cleaning task, including:

[0067] The group cleaning task is defined as a total cleaning time for each group not exceeding [a certain value]. ;

[0068] Set the balance duration;

[0069] Accumulate excess cleaning time into a balanced time, and release the balanced time by adjusting the output power;

[0070] Set the maximum output power of the plasma generator. ;

[0071] For the rectangular cleaning area being irradiated by the plasma generator, obtain its temperature rise margin. ;

[0072] Calculate the required output power of the plasma generator based on the heating margin and the upper limit of the single-zone duration. ;

[0073] ;

[0074] like Set the output power to ;

[0075] Calculate the duration of a single cleaning cycle for a rectangular cleaning area. , , ;

[0076] calculate ,in, To balance the duration, ;

[0077] like ,but Determine if the compensation duration is greater than 0;

[0078] like This can be achieved by increasing the output power to release the balance time, specifically as follows:

[0079] If the output power is set to ,Compare and Size:

[0080] like If increasing the output power is insufficient to fully release the equilibrium time, then the output power is set to... ;

[0081] like If the output power is sufficient to fully release the equilibrium time, then the output power for the full release equilibrium time is calculated. , .

[0082] Optionally, when executing a group switching command, the execution of an inter-group switching control strategy, remotely controlling the plasma generator to irradiate the rectangular cleaning area between different groups, includes:

[0083] Get the group where the current cleaning task is located, and denote it as group one;

[0084] Get and group by one interval The unwashed group within the rectangular cleaning area is designated as Group Two;

[0085] The plasma generator was remotely controlled to complete the cleaning task for Group Two;

[0086] When group 1 matches Then, in the unwashed rectangular cleaning area of ​​group one, rectangle one and rectangle two are selected, and the plasma generator is controlled to complete the cleaning tasks of rectangle one and rectangle two.

[0087] The present invention has the following beneficial effects:

[0088] 1. This remote plasma generator power supply voltage scheduling method significantly improves the cleaning area coverage and overall cleaning efficiency by configuring two plasma generators for each trace cluster and implementing rectangular group irradiation. Secondly, utilizing the excellent thermal conductivity of copper traces, when irradiating the rectangles at both ends of the group, the generated heat is rapidly conducted along the copper traces to the middle area, creating a preheating effect. This indirectly accelerates the process of all areas within the group reaching the critical evaporation temperature for contaminants, improving the overall cleaning rate. Thirdly, the introduction of a single-zone duration upper limit combined with a temperature prediction model effectively prevents damage to the circuit board substrate (such as FR-4 substrate delamination or copper foil peeling) caused by localized overheating, improving process reliability. Fourthly, the set single-zone duration upper limit is not a fixed value but is dynamically determined based on the overall production plan and the total duration requirements of the cleaning task. This ensures that the cleaning time of a single area is controlled, thereby guaranteeing that the entire board cleaning task can meet the predetermined production cycle and delivery time, achieving predictable and manageable production efficiency. Finally, the power scheduling and inter-group switching strategy can dynamically adjust energy input based on real-time thermal field distribution, avoiding unnecessary energy waste and achieving energy conservation and consumption reduction. This ensures high efficiency, safety, and economy at the macro level.

[0089] 2. This remote plasma generator power supply voltage scheduling method categorizes trace clusters by setting a reference interval and floating error. It can intelligently identify copper traces with uneven density on the circuit board, avoiding a "one-size-fits-all" approach to cleaning parameter settings and making the cleaning strategy more aligned with the actual physical layout. Secondly, by acquiring the trace cluster width and adjusting the width of the rectangle mapped by the plasma beam to match it, it ensures that the cleaning energy accurately covers the target traces. This avoids accidentally damaging adjacent insulation areas due to an excessively wide beam spot and prevents incomplete cleaning due to an excessively narrow beam spot, significantly improving cleaning quality. Finally, by calculating the number of rectangles, it provides a quantitative basis for subsequent group cleaning and resource allocation, enabling the entire cleaning task to be decomposed into manageable and schedulable units, achieving a uniform and controllable cleaning process.

[0090] 3. This remote plasma generator power supply voltage scheduling method, by irradiating a single copper trace and establishing a mathematical model of temperature decay with distance and time, can accurately calculate the heat diffusion length x. This quantitative calculation based on a physical model, compared to rough estimations based on experience, can more accurately predict the range of heat transfer on the copper trace, thus scientifically defining the "thermal coupling zone" where thermal influence between groups is significant. Using this heat diffusion length as a grouping basis ensures significant thermal coupling effects between rectangular cleaning zones within the same group, while essentially eliminating thermal interference between different groups. This grouping strategy avoids the transfer and accumulation of heat between groups during the cleaning process from the source, laying the foundation for subsequent precise inter-group switching and independent power control, and ensuring the effectiveness and safety of global thermal management.

[0091] 4. This remote plasma generator power supply voltage scheduling method divides thermally correlated rectangular cleaning areas into groups based on thermal diffusion length. First, collaborative cleaning is performed within each group, controlling the plasma generators at both ends to irradiate simultaneously. Utilizing the excellent thermal conductivity of copper traces, heat can diffuse from both ends to the middle area, effectively "preheating" the middle area within the group. This reduces the energy and time required for the middle area to reach the critical temperature, thus improving the overall cleaning speed. Second, by measuring the average contaminant thickness in each rectangular cleaning area within the group and calculating the theoretical cleaning time accordingly, the energy input is precisely matched to the contaminant load, avoiding the problems of "over-cleaning" (wasting energy and damaging the substrate) or "under-cleaning" (failing to meet the required results).

[0092] 5. This remote plasma generator power supply voltage scheduling method establishes a simple proportional estimation model and uses data from a limited number of temperature measurement points to calculate the temperature rise of all areas within the group. This achieves virtual perception of the entire thermal field, enabling real-time monitoring of the temperature distribution of the entire wiring cluster, a prerequisite for precise power scheduling. The model calculation is simple, requiring low computational resources from the control system, which helps reduce hardware costs and achieve rapid response, meeting the real-time control needs of industrial sites. Finally, by comprehensively considering the temperature rise and natural cooling of this irradiation, the method more closely approximates the real situation, making subsequent judgments on whether to switch groups more scientific and accurate, avoiding process interruptions or substrate damage due to misjudgments. The temperature threshold establishes a "firewall" for process safety; when the predicted temperature exceeds the threshold, the cleaning of the current group is automatically paused, and the system switches to another group with less thermal impact, effectively preventing thermal damage and improving product yield. The entire cleaning process operates automatically and in a standardized manner, suitable for large-scale mass production.

[0093] 6. This remote plasma generator power supply voltage scheduling method, by introducing the concept of "balanced duration," dynamically adjusts the output power of the plasma generator, achieving precise control over the duration of a single cleaning cycle. The advantages are: it allows the system to flexibly schedule within a safe window. When a certain area is difficult to clean, the system will operate at maximum power, storing the excess time in the balanced duration; when a certain area is easy to clean, there is an opportunity to "redeem" time by appropriately increasing the power, thereby accelerating the cleaning speed without exceeding the total duration. This "peak shaving and valley filling" mechanism optimizes the total cleaning time. It always constrains the power within the equipment's maximum output power, protecting equipment safety. While ensuring process quality, it pursues optimal production cycle time and minimizes energy consumption.

[0094] 7. The power supply voltage scheduling method for this remote plasma generator prioritizes Group 2, which is separated from the current group by e rectangular cleaning areas. First, it maximizes the use of spatial distance for thermal isolation. When switching from "Group 1" to the distant "Group 2," the physical distance between the currently cleaning Group 2 and the just-heated Group 1 is sufficiently large, minimizing thermal interference and providing ample cooling time for the area of ​​Group 1, effectively preventing the continuous accumulation of heat across the entire plate. Second, the intelligent switching strategy ensures that both plasma generators can operate continuously with almost no idle waiting time, greatly improving equipment utilization and overall production capacity. Attached Figure Description

[0095] Figure 1 This is a schematic diagram of the method flow of the present invention.

[0096] Figure 2 This is a schematic diagram of the remote scheduling voltage control module of the present invention. Detailed Implementation

[0097] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0098] Example 1, refer to Figure 1 A method for scheduling the power supply voltage of a remote plasma generator, comprising:

[0099] The plasma beam generated by the plasma generator is used to irradiate the surface of the circuit board for cleaning. The pattern of the plasma beam mapped on the circuit board is rectangular. Different rectangles can be obtained by adjusting the plasma beam.

[0100] Advanced plasma systems in the prior art have the ability to adjust the shape of the irradiation area, especially to make it rectangular, such as adjustable slit systems: by changing the width and length of the slit at the plasma source outlet, the rectangular shape and size of the emitted plasma beam can be directly controlled; electromagnetic focusing / shaping systems: by using a specific electromagnetic field configuration to constrain and focus the plasma beam, the size of the rectangular spot can be adjusted.

[0101] The copper traces on the circuit board are extracted and divided into multiple trace clusters, and a rectangular cleaning area is designed for each trace cluster.

[0102] Select a single cabling cluster, where the total length of a single cabling is L = 80mm = 0.08m;

[0103] Set reference interval and floating error Calculate the reference interval. ;

[0104] Get any two adjacent copper traces and set multiple location points between the adjacent copper traces;

[0105] Measure the spacing between adjacent copper traces at each location point. When the spacing at all locations is within the reference spacing range, the adjacent copper traces are classified into the same trace cluster.

[0106] For any trace cluster, obtain the width of the trace cluster perpendicular to the trace direction. ;

[0107] Adjust the width of the rectangle mapped onto the circuit board by the plasma beam control to be equal to the width of the trace cluster, and obtain the maximum length of the rectangle. ;

[0108] The length and width of the rectangular cleaning area are respectively and ;

[0109] Obtain the length of the trace cluster along the trace direction. ,calculate ,in, This represents the number of rectangular cleaning areas on the wiring cluster.

[0110] Set the initial power of the plasma generator to 2.0W;

[0111] A strategy for calculating thermal conduction distance is implemented by irradiating a single copper trace with a plasma beam and calculating the thermal diffusion length along the copper trace based on the initial temperature of the circuit board.

[0112] The plasma generator is controlled to irradiate a single copper trace with initial power, and the center of the rectangular cleaning area is located on the single copper trace.

[0113] Measuring the initial temperature of a single copper trace and plasma beam temperature ;

[0114] Obtain the position point x from the center of the rectangular cleaning area on a single copper trace;

[0115] Calculate the temperature at the given location point at time t. , ,in, The thermal diffusivity of copper describes the rate at which heat diffuses along copper traces. It is a function of heat loss with distance;

[0116] when When the thermal diffusion length is set to In the actual calculation process, temperature rise error is set as the criterion. To determine whether this is true, in this embodiment, the temperature rise error is set to 1°C.

[0117] Configure two plasma generators for each trace cluster; for any trace cluster:

[0118] A rectangular grouping irradiation strategy was implemented, with rectangular cleaning zones grouped by thermal diffusion length. Plasma generators at both ends were controlled to irradiate with initial power, and the temperature of each rectangular cleaning zone within the group was measured.

[0119] calculate , The number of rectangular cleaning areas covered by the thermal diffusion length;

[0120] The rectangular cleaning areas of the wiring clusters are grouped, with each group including... A continuous rectangular cleaning area;

[0121] The rectangular cleaning area is cleaned using plasma beams in groups, specifically as follows:

[0122] Multiple points were set up in each rectangular cleaning area within the group, and the contaminant thickness at each point was measured. The average contaminant thickness of all rectangular cleaning areas was calculated, and the result was recorded as the average contaminant thickness. ;

[0123] The critical temperature required for pollutants to be heated and evaporated by plasma beam was obtained. ;

[0124] Two plasma generators were controlled to clean the rectangular cleaning areas at both ends of the group at initial power for a duration of [duration missing]. , ,in, This represents the initial power of the plasma generator. Energy transfer efficiency is the effective energy ratio of the plasma beam to the contaminant surface.

[0125] For pollutant density, For the specific heat of pollutants, The area of ​​the rectangular cleaning area;

[0126] This represents the energy required to evaporate a pollutant with a thickness of d.

[0127] The temperature of the rectangular cleaning zone is measured at each point, and the average of all temperatures in a single rectangular cleaning zone is calculated as the temperature of that single rectangular cleaning zone.

[0128] [ , , , , , , , ]℃;

[0129] Set the maximum cleaning time for a single zone to 0.2 seconds, thus limiting the cleaning time of each rectangular cleaning zone within the group.

[0130] The two unwashed rectangular cleaning areas with the highest temperatures within the group are denoted as Rectangle 1 and Rectangle 2, respectively.

[0131] The selection principle is to choose the highest temperature within the group because the highest temperature within the group can reach the critical temperature for pollutant evaporation the fastest. At the same time, the highest temperature within the group has a low temperature rise margin. Increasing the temperature rise margin will result in a lower temperature rise value in other rectangular cleaning areas within the group, thus balancing safety and efficiency.

[0132] Rectangle 1 and Rectangle 2 are the second rectangular cleaning areas. and the 7th rectangular cleaning area ;

[0133] The execution ratio estimation temperature determination strategy is to use plasma beam to irradiate rectangle one and rectangle two to estimate the temperature of each rectangular cleaning zone, and determine whether to execute the group switching command based on the temperature.

[0134] Several temperature measurement points were set at the center of each rectangle, and the average was taken. The initial temperatures within the group were as follows:

[0135] A proportional temperature estimation strategy is applied to rectangle 1.

[0136] The rectangular cleaning areas are numbered sequentially along the routing direction, with rectangle one numbered as follows: ;

[0137] Get the current temperature of rectangle 1 , ;

[0138] calculate ,in, This represents the heating margin for rectangle one;

[0139] Using plasma beam irradiation of rectangle one to control the temperature of rectangle one and increase the temperature rise margin, estimate the temperature rise value of other rectangular cleaning areas in the group caused by this irradiation.

[0140] When cleaning rectangle one, the rectangular cleaning area will be... The temperature rise value is denoted as ;

[0141] The calculation formula is: ;

[0142] A constant, squared term This reflects the essential characteristic of heat diffusion—temperature decay is proportional to the square of the distance. This nonlinear relationship accurately describes the physical phenomenon of heat decaying rapidly with distance during conduction in copper traces.

[0143] in, ;

[0144] |ki| represents the number of rectangular intervals, not the actual physical distance. The actual physical distance x = |ki×l (where l is the length of the rectangle). Therefore, the attenuation factor should be: However, in engineering applications, to simplify the approximation of factors, squaring operations are avoided, reducing computational complexity. At the same time, sufficient accuracy is maintained through parameter calibration. .

[0145] but ; , , ; ; ;

[0146] When rectangle 1 is irradiated, calculate the temperature rise value of each rectangular cleaning zone. Arranged in order as follows: ;

[0147] A proportional temperature estimation strategy is applied to rectangle two, where rectangle two is numbered as follows: ;

[0148] When cleaning rectangle two, the rectangular cleaning area will be... The temperature rise value is denoted as ;

[0149] When rectangle two is irradiated, calculate the temperature rise value of each rectangular cleaning zone. Arranged in order as follows: ;

[0150] ;

[0151] Perform a unit-time cooling test to calculate the cooling rate of the copper trace. ;

[0152] calculate ,in, For cooling value, The maximum cleaning time for a single zone is limited to the cleaning tasks of the limited group. Each rectangular cleaning area is actually restricted to cleaning according to the maximum cleaning time for a single zone. Moreover, the temperature determination strategy based on the execution ratio is an estimation before irradiation. Therefore, the cooling value can be directly calculated using the maximum cleaning time for a single zone.

[0153] The upper limit on the cleaning time for a single zone is based on three key considerations: first, to prevent localized overheating damage to the circuit board by controlling heat accumulation at individual points to ensure the safety of the substrate; second, to ensure controllable production cycle time and avoid impacting overall production efficiency on individual difficult-to-clean areas; and third, to protect equipment lifespan and prevent the plasma generator from operating at full load for extended periods. This limit works in conjunction with power scheduling strategies to optimize resource allocation while ensuring cleaning quality.

[0154] Obtain the rectangular cleaning area Current temperature ;

[0155] count ,in, Rectangular cleaning area Temperature exceeding the maximum duration for a single zone.

[0156] k=1: 120.57 + 22.89 + 0.59 - 1.75 = 142.30℃;

[0157] k=2: 72.59 + 47.41 + 1.23 - 1.75 = 119.48℃;

[0158] k=3: 51.30 + 22.89 + 2.54 - 1.75 = 74.98℃;

[0159] k=4: 43.44 + 11.04 + 5.28 - 1.75 = 58.01℃;

[0160] k=5: 44.94 + 5.31 + 10.98 - 1.75 = 59.4℃;

[0161] k=6: 51.90 + 2.56 + 22.75 - 1.75 = 75.46℃;

[0162] k=7: 72.89 + 1.24 + 47.11 - 1.75 = 119.49℃;

[0163] k=8: 119.57 + 0.60 + 22.75 - 1.75 = 141.17℃;

[0164] The unit-time cooling measurement experiment calculates the cooling rate of the copper trace, specifically as follows:

[0165] The temperature rise at the irradiation point was controlled by irradiating a single copper trace with a plasma beam. Then stop irradiation;

[0166] The temperature at the irradiation point naturally cooled down to the initial temperature. Duration ,but Since the temperature determination strategy based on the proportional estimation is performed before irradiation, the simplified calculation of the cooling rate is feasible.

[0167] Set zone temperature threshold ;

[0168] All Then, the plasma generator can be remotely controlled to irradiate rectangle one and rectangle two.

[0169] When the remotely controlled plasma generator irradiates rectangles one and two:

[0170] The power scheduling control strategy is implemented to remotely schedule the power supply voltage of the two plasma generators to control the output power, thereby adjusting the duration of a single cleaning cycle and completing the group cleaning task.

[0171] The group cleaning task is defined as a total cleaning time for each group not exceeding [a certain value]. The total cleaning time of a group is calculated by limiting the cleaning time of each rectangular cleaning area between groups to no more than the upper limit of the single area cleaning time, excluding the rectangular cleaning areas at both ends.

[0172] Set the balance duration;

[0173] Accumulate excess single-cleaning time to the equilibrium time, and release the equilibrium time by adjusting the output power;

[0174] Set the maximum output power of the plasma generator. ;

[0175] For the rectangular cleaning area being irradiated by the plasma generator, obtain its temperature rise margin. ;

[0176] Calculate the required output power of the plasma generator based on the heating margin and the upper limit of the single-zone duration. ;

[0177] ;

[0178] like Set the output power to ;

[0179] Calculate the duration of a single cleaning cycle for a rectangular cleaning area. , , ;

[0180] calculate ,in, To balance the duration, ;

[0181] when When the value is large, the upper limit of the fixed single-zone duration is used to illuminate the rectangular cleaning area, and the calculation is as follows: Due to the limitation on the maximum output power of the plasma generator Therefore, the output power can only be set to However, to increase the duration of a single cleaning session, the total cleaning time for each group of cleaning tasks is fixed. Therefore, the portion of the single cleaning session that exceeds the maximum duration for a single area is accumulated into the balanced duration.

[0182] like ,but Determine if the compensation duration is greater than 0;

[0183] like This can be achieved by increasing the output power to release the balance time, specifically:

[0184] If the output power is set to ,Compare and Size:

[0185] like If increasing the output power is insufficient to fully release the equilibrium time, then the output power is set to... ;

[0186] like If the output power is sufficient to fully release the equilibrium time, then the output power for the full release equilibrium time is calculated. , .

[0187] when When the size is small, the upper limit of the fixed single-zone duration is used to illuminate the rectangular cleaning area, and the calculated... Therefore, by increasing the output power, the duration of a single cleaning cycle can be reduced to free up the equilibrium time. Specifically, the method is to first determine whether the maximum output power is used. If the irradiation can fully release the equilibrium duration, and if not, then release at the maximum release intensity, i.e., set the output power to the maximum output power. If possible, reduce the balance duration from the single-zone duration limit according to the required balance duration to increase output power.

[0188] Refer to the schematic diagram of the remote control module. Figure 2Its principle is "network communication + programmable power supply". Remotely, it relies on industrial network protocols (such as TCP / IP) to transmit digital control commands and status feedback between the control center and field actuators. Scheduling relies on intelligent algorithms generated by the remote center to generate optimized commands. Power supply voltage control relies on the programmable switching power supply built into the field plasma generator, which receives minute control signals to precisely adjust the high-power output.

[0189] When a group switching command is executed, the inter-group switching control strategy is implemented, and the plasma generator is remotely controlled to irradiate the rectangular cleaning area between different groups.

[0190] Get the group where the current cleaning task is located, and denote it as group one;

[0191] Get and group by one interval The unwashed group within the rectangular cleaning area is designated as Group Two;

[0192] When group one cannot meet the current group cleaning conditions, i.e. Then place group one to cool down;

[0193] The plasma generator is remotely controlled to complete the cleaning task of Group 2. The cleaning task performed on Group 2 is the same as that of Group 1.

[0194] When group 1 matches Since Group 1 has the characteristic of high internal temperature and can achieve rapid and efficient heating, the cleaning task of Group 1 is completed first. Within Group 1, Rectangle 1 and Rectangle 2 are re-selected to complete the remaining cleaning tasks.

[0195] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0196] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A method for remote plasma generator power supply voltage scheduling, characterized in that, include: The plasma beam generated by the plasma generator is used to irradiate the surface of the circuit board for cleaning. The pattern of the plasma beam mapped on the circuit board is rectangular. Different rectangles can be obtained by adjusting the plasma beam. The copper traces on the circuit board are extracted and divided into multiple trace clusters, and a rectangular cleaning area is designed for each trace cluster. Set the initial power of the plasma generator; A strategy for calculating thermal conduction distance is implemented by irradiating a single copper trace with a plasma beam and calculating the thermal diffusion length along the copper trace based on the initial temperature of the circuit board. Two plasma generators are configured for each wiring cluster; For any cluster of traces: A rectangular grouping irradiation strategy was implemented, with rectangular cleaning zones grouped by thermal diffusion length. Plasma generators at both ends were controlled to irradiate with initial power, and the temperature of each rectangular cleaning zone within the group was measured. Set a maximum cleaning time for a single zone to limit the cleaning time of each rectangular cleaning zone within the group; The two unwashed rectangular cleaning areas with the highest temperatures within the group are denoted as Rectangle 1 and Rectangle 2, respectively. To determine the critical temperature required for pollutants to be heated and evaporated by a plasma beam; If a plasma beam is used to irradiate rectangle one and rectangle two, a proportional estimation temperature determination strategy is executed to estimate the temperature of each rectangular cleaning zone and determine whether to execute a group switching command based on the temperature. When the remotely controlled plasma generator irradiates rectangles one and two: The power scheduling control strategy is implemented to remotely schedule the power supply voltage of the two plasma generators to control the output power, thereby adjusting the duration of a single cleaning cycle and completing the group cleaning task. When a group switching command is executed, the inter-group switching control strategy is implemented, and the plasma generator is remotely controlled to irradiate the rectangular cleaning area between different groups.

2. The remote plasma generator power supply voltage scheduling method according to claim 1, characterized in that, The copper traces of the extracted circuit board are divided into multiple trace clusters, and a rectangular cleaning area is designed for each trace cluster, including: Set reference interval and floating error Calculate the reference interval. ; Get any two adjacent copper traces and set multiple location points between the adjacent copper traces; Measure the spacing between adjacent copper traces at each location point. When the spacing at all locations is within the reference spacing range, the adjacent copper traces are classified into the same trace cluster. For any trace cluster, obtain the width of the trace cluster perpendicular to the trace direction. ; Adjust the width of the rectangle mapped onto the circuit board by the plasma beam control to be equal to the width of the trace cluster, and obtain the maximum length of the rectangle. ; The length and width of the rectangular cleaning area are respectively and ; Obtain the length of the trace cluster along the trace direction. ,calculate ,in, This represents the number of rectangular cleaning areas on the wiring cluster.

3. The remote plasma generator power supply voltage scheduling method according to claim 2, characterized in that, The strategy for calculating the heat conduction distance involves irradiating a single copper trace with a plasma beam and calculating the heat diffusion length along the copper trace based on the initial temperature of the circuit board, including: The plasma generator is controlled to irradiate a single copper trace with initial power, and the center of the rectangular cleaning area is located on the single copper trace. Measuring the initial temperature of a single copper trace and plasma beam temperature ; Obtain the position point x from the center of the rectangular cleaning area on a single copper trace; Calculate the temperature at the given location point at time t. , ,in, The thermal diffusivity of copper describes the rate at which heat diffuses along copper traces. It is a function of heat loss with distance; when When the thermal diffusion length is set to .

4. The remote plasma generator power supply voltage scheduling method according to claim 3, characterized in that, The execution of the rectangular group irradiation strategy, which groups rectangular cleaning zones by thermal diffusion length, controls the plasma generators at both ends to irradiate at initial power, and measures the temperature of each rectangular cleaning zone within the group, includes: calculate ,Will The number of rectangular cleaning areas covered by the thermal diffusion length; The rectangular cleaning areas of the wiring clusters are grouped, with each group including... A continuous rectangular cleaning area; The rectangular cleaning area is cleaned using plasma beams in groups, specifically as follows: Multiple points were set up in each rectangular cleaning area within the group, and the contaminant thickness at each point was measured. The average contaminant thickness of all rectangular cleaning areas was calculated, and the result was recorded as the average contaminant thickness. ; Two plasma generators were controlled to clean the rectangular cleaning areas at both ends of the group at initial power for a duration of [duration missing]. , ,in, This represents the initial power of the plasma generator. Energy transfer efficiency is the proportion of effective energy from the plasma beam to the contaminant surface. It is the critical temperature; For pollutant density, For the specific heat of pollutants, The area of ​​the rectangular cleaning area; This represents the energy required to evaporate a pollutant with a thickness of d. The temperature of the rectangular cleaning zone is measured at each point, and the average of all temperatures in a single rectangular cleaning zone is calculated as the temperature of that single rectangular cleaning zone.

5. The remote plasma generator power supply voltage scheduling method according to claim 4, characterized in that, If a plasma beam is used to irradiate rectangle one and rectangle two, a proportional estimation temperature determination strategy is implemented to estimate the temperature of each rectangular cleaning zone, including: A proportional temperature estimation strategy is applied to rectangle 1. The rectangular cleaning areas are numbered sequentially along the routing direction, with rectangle one numbered as follows: ; Get the current temperature of rectangle 1 , ; calculate ,in, This represents the heating margin for rectangle one; Using plasma beam irradiation of rectangle one to control the temperature of rectangle one and increase the temperature rise margin, estimate the temperature rise value of other rectangular cleaning areas in the group caused by this irradiation. When cleaning rectangle one, the rectangular cleaning area will be... The temperature rise value is denoted as ; The calculation formula is: ,in, It is a function of heat loss with distance; A proportional temperature estimation strategy is applied to rectangle two, where rectangle two is numbered as follows: , This represents the heating margin for rectangle two; When cleaning rectangle two, the rectangular cleaning area will be... The temperature rise value is denoted as ; The calculation formula is: ; Perform a unit-time cooling test to calculate the cooling rate of the copper trace. ; calculate ,in, For cooling value, This is the maximum duration for a single zone; Obtain the rectangular cleaning area Current temperature ; calculate ,in, Rectangular cleaning area Temperature after the single-zone duration limit.

6. The remote plasma generator power supply voltage scheduling method according to claim 5, characterized in that, The step of determining whether to execute a group switching command based on temperature includes: The unit-time cooling measurement experiment calculates the cooling rate of the copper trace, specifically as follows: The temperature rise at the irradiation point was controlled by irradiating a single copper trace with a plasma beam. Then stop irradiation; The temperature at the irradiation point naturally cooled down to the initial temperature. Duration ,but ; Set zone temperature threshold ; like Execute group switching commands and remotely control the plasma generator to perform inter-group cleaning; like Then, the plasma generator can be remotely controlled to irradiate rectangle one and rectangle two.

7. The remote plasma generator power supply voltage scheduling method according to claim 6, characterized in that, The execution power scheduling control strategy remotely schedules the power supply voltage of the two plasma generators to control the output power, thereby adjusting the duration of a single cleaning cycle and completing the group cleaning task, including: The group cleaning task is defined as a total cleaning time for each group not exceeding [a certain value]. ; Set the balance duration; Accumulate excess cleaning time into a balanced time, and release the balanced time by adjusting the output power; Set the maximum output power of the plasma generator. ; For the rectangular cleaning area being irradiated by the plasma generator, obtain its temperature rise margin. ; Calculate the required output power of the plasma generator based on the heating margin and the upper limit of the single-zone duration. ; ； like Set the output power to ; Calculate the duration of a single cleaning cycle for a rectangular cleaning area. , , ; calculate ,in, To balance the duration, ; like ,but Determine if the compensation duration is greater than 0; like This can be achieved by increasing the output power to release the balance time, specifically as follows: If the output power is set to ,Compare and Size: like If increasing the output power is insufficient to fully release the equilibrium time, then the output power is set to... ; like If the output power is sufficient to fully release the equilibrium time, then the output power for the full release equilibrium time is calculated. , .

8. The remote plasma generator power supply voltage scheduling method according to claim 7, characterized in that, When the group switching command is executed, the inter-group switching control strategy is implemented, and the plasma generator is remotely controlled to irradiate the rectangular cleaning area between different groups, including: Get the group where the current cleaning task is located, and denote it as group one; Get and group by one interval The unwashed group within the rectangular cleaning area is designated as Group Two; The plasma generator was remotely controlled to complete the cleaning task for Group Two; When group 1 matches Then, in the unwashed rectangular cleaning area of ​​group one, rectangle one and rectangle two are selected, and the plasma generator is controlled to complete the cleaning tasks of rectangle one and rectangle two.

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