A graphene photodetector device

Abstract

The application relates to the technical field of photoelectric detection, and particularly discloses a graphene photoelectric detection device, which comprises a device body and a radiator, the device body is internally provided with a first light absorption layer, a graphene layer and a second light absorption layer, the graphene layer is located between the first light absorption layer and the second light absorption layer, the first light absorption layer is used for absorbing short waves, the second light absorption layer is used for absorbing long waves, the graphene layer is provided with a metal electrode on the surface, the radiator is arranged on the device body, the radiator is connected with a circulating cooling radiator pipe, and the circulating cooling radiator pipe is arranged in the contact area of the graphene layer, the first light absorption layer and the second light absorption layer. By utilizing the wide-spectrum absorption characteristic and high thermal conductivity of the graphene and combining with the carefully designed radiator, the graphene photoelectric detection device can realize real-time monitoring and intelligent regulation and control of the internal temperature of the photoelectric detection device, improve the device performance, prolong the service life and reduce the maintenance cost.

Description

Technical Field

[0001] This invention relates to the field of photoelectric detection technology, and more particularly to a graphene photoelectric detection device. Background Technology

[0002] Photoelectric detection technology, as an important component of modern science and technology, plays a crucial role in various fields such as communication, imaging, and sensing. However, traditional photoelectric detection devices are limited by the light absorption characteristics of single semiconductor materials, resulting in a relatively narrow spectral response range, which is insufficient to meet the growing demand for wide-spectrum detection. Furthermore, under high-intensity or prolonged illumination, photoelectric detection devices generate a large amount of heat during the photoelectric conversion process. Without an effective heat dissipation mechanism, the device temperature will rise sharply, leading to a series of problems such as performance degradation, instability impairment, and even device failure.

[0003] Graphene, a carbon material with a unique two-dimensional structure, has shown great potential in the field of photoelectric detection due to its excellent electrical, optical, and thermal conductivity properties. Graphene not only provides efficient carrier transport channels but can also be combined with various materials to achieve a broad-spectrum response to different wavelengths of light. However, when applying graphene to photoelectric detection devices, effectively managing internal heat accumulation and ensuring the thermal stability of the device under high loads has become a key factor restricting its performance improvement and practical application.

[0004] Although researchers have attempted to address the heat dissipation challenges of graphene photodetectors through external cooling devices or complex heat dissipation structures, these methods generally suffer from limitations such as low heat dissipation efficiency, high structural complexity, and high cost, which restrict their potential for large-scale application. Summary of the Invention

[0005] This invention aims to solve the problem of heat dissipation difficulties in graphene photodetectors under high power density. To this end, this invention provides a graphene photodetector device that utilizes the broad-spectrum absorption characteristics and high thermal conductivity of graphene, combined with a carefully designed heat sink, to achieve real-time monitoring and intelligent control of the internal temperature of the photodetector, thereby improving device performance, extending service life, and reducing maintenance costs.

[0006] This invention provides a graphene photodetector device, the technical solution of which is as follows: It includes a device body and a heat sink. The device body comprises a first light-absorbing layer, a graphene layer, and a second light-absorbing layer, with the graphene layer located between the first and second light-absorbing layers. The first light-absorbing layer absorbs short-wavelength light, and the second light-absorbing layer absorbs long-wavelength light. A metal electrode is disposed on the surface of the graphene layer. The heat sink is disposed on the device body and is connected to a circulating cooling heat pipe. The circulating cooling heat pipe is disposed in the contact area between the graphene layer and the first light absorption layer and the contact area between the graphene layer and the second light absorption layer.

[0007] Furthermore, the first light-absorbing layer is made of single-crystal silicon wafer material, and the second light-absorbing layer is made of quantum dot material.

[0008] Furthermore, the device adopts a back-incidence design, where incident light enters from the first light-absorbing layer.

[0009] Furthermore, the graphene layer may be a single layer of graphene or a multilayer of graphene; when the graphene layer is a multilayer of graphene, an isolation layer is provided between the two layers of graphene.

[0010] Furthermore, the protective layer is located outside the graphene layer, and the protective layer includes one or more protective films and reflective films. The protective film is made of polymer material, and the reflective film is made of metal or metal oxide.

[0011] Furthermore, it also includes: an intelligent heat dissipation module and a temperature sensor. The intelligent heat dissipation module is connected to the temperature sensor and the heat sink respectively. The intelligent heat dissipation module is used to control the operation of the heat sink, and the temperature sensor is used to detect the real-time temperature of the graphene layer. The working process of the intelligent heat dissipation module includes: S1.1: Obtain the temperature of the graphene layer as measured by the temperature sensor; S1.2: Compare the temperature with the normal threshold and the warning threshold to determine the temperature status, specifically: When the temperature is less than or equal to the normal threshold, the temperature status is considered normal. When the temperature is above the normal threshold but below or equal to the warning threshold, the temperature status is warning. When the temperature exceeds the warning threshold, the temperature status is set to emergency. S1.3: Control the operation of the radiator according to the temperature conditions, specifically: When the temperature is normal, maintain the initial power of the radiator. When the temperature status is in warning mode, increase the radiator power. When the temperature condition is critical, the radiator adopts full-power cooling mode.

[0012] Furthermore, the working process of the intelligent heat dissipation module also includes: S2.1: Obtain the operating current and optical power values ​​of the device; S2.2: If the operating current or optical power value exceeds the threshold, increase the reference flow rate of the coolant and / or start the fan.

[0013] Furthermore, the ambient temperature sensor is connected to the intelligent heat dissipation module. The working process of the intelligent heat dissipation module also includes: S3.1: Obtain the ambient temperature measured by the ambient temperature sensor; S3.2: If the ambient temperature exceeds the safe threshold, the warning threshold will be lowered and the adjustment range of the coolant flow rate will be increased.

[0014] Furthermore, the amount of reduction in the warning threshold is the difference between the ambient temperature and the ambient temperature safety threshold, and the adjustment range of the coolant flow rate is the difference multiplied by 4%.

[0015] Furthermore, the working process of the intelligent heat dissipation module also includes: S4.1: Obtain operating current, optical power value, and ambient temperature; S4.2: Based on the operating current, optical power value and ambient temperature, search the heat dissipation performance degradation database to obtain the historical threshold of temperature rise rate; S4.3: Calculate the actual temperature rise rate based on the stated temperature; S4.4: If the actual temperature rise rate exceeds the historical temperature rise rate threshold, increase the adjustment range of the coolant flow rate.

[0016] The above-described one or more technical solutions in the embodiments of the present invention have at least one of the following technical effects: 1. This invention designs a sandwich structure consisting of a first light-absorbing layer, a graphene layer, and a second light-absorbing layer. The first light-absorbing layer absorbs short wavelengths, the second light-absorbing layer absorbs long wavelengths, and the graphene layer provides a high-gain carrier transport channel. The ingenious combination of the two light-absorbing layers and the graphene layer broadens the spectral response range of the device. Furthermore, the high mobility of graphene effectively improves the separation and transport efficiency of photogenerated carriers, thereby significantly enhancing the sensitivity and accuracy of photodetector and broadening the spectral response range.

[0017] 2. The present invention places the circulating cooling heat dissipation pipe in the contact area between the graphene layer and the first light absorption layer, and in the contact area between the graphene layer and the second light absorption layer, thereby effectively improving the heat dissipation capacity.

[0018] 3. This invention utilizes an intelligent heat dissipation module to control the operation of the heat sink. The intelligent heat dissipation module compares the received temperature data with two preset temperature thresholds and adjusts the heat dissipation strategy based on the comparison results to achieve precise control of the internal temperature of the graphene sandwich photodetector, ensuring the stability and efficient operation of the device.

[0019] 4. The intelligent heat dissipation module of this invention employs a dynamic workload response mechanism, an adaptive ambient temperature compensation mechanism, and a heat dissipation performance degradation learning mechanism. Through multi-dimensional parameter collaborative analysis, it achieves dynamic heat dissipation control. By intelligently controlling the heat sink, it precisely adjusts the temperature of the graphene layer, ensuring the stability and efficient operation of the device. Through these three mechanisms, this invention achieves: proactive control: predicting heat dissipation needs based on workload to avoid lag-induced temperature fluctuations; environmental compatibility: dynamically compensating for the negative impact of ambient temperature rise on the heat dissipation system; and lifespan maintenance: adaptively offsetting performance degradation caused by the aging of heat dissipation components.

[0020] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure provided by the present invention.

[0023] Figure 2 This is a top view diagram provided by the present invention.

[0024] Figure 3 This is a flowchart of the intelligent heat dissipation module provided by the present invention controlling the heat sink according to temperature.

[0025] Figure 4 This is a flowchart of the heat dissipation performance degradation learning mechanism of the intelligent heat dissipation module provided by the present invention.

[0026] Figure label: 1. Device body; 2. Heat sink; 3. Metal electrode; 4. First light absorption layer; 5. Second light absorption layer; 6. Circulating cooling heat dissipation pipe; 7. Graphene layer. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention. The following embodiments are used to illustrate this invention but should not be used to limit the scope of this invention.

[0028] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0029] The following is combined Figures 1 to 4 The present invention will be further described in detail below, including a graphene photodetector device: In this embodiment, as Figure 1 and Figure 2 As shown, a graphene photodetector device is provided, comprising a device body 1 and a heat sink 2. A first light-absorbing layer 4, a graphene layer 7, and a second light-absorbing layer 5 are disposed within the device body. The graphene layer is located between the first and second light-absorbing layers, forming a sandwich structure. The graphene layer simultaneously provides a high-gain carrier transport channel for both the first and second light-absorbing layers, and generates heat during photodetection. The first light-absorbing layer is made of a short-wavelength absorbing material and does not absorb long waves; the first light-absorbing layer is used to absorb short waves. The second light-absorbing layer is used to absorb long waves. A metal electrode 3 is disposed on the surface of the graphene layer.

[0030] The heat sink is disposed on the device body and is connected to the coolant inlet and outlet of the circulating cooling heat sink 6. The circulating cooling heat sink is disposed in the contact area between the graphene layer and the first light absorption layer and the contact area between the graphene layer and the second light absorption layer.

[0031] The first light-absorbing layer uses a single-crystal silicon wafer with its thickness precisely calculated to ensure effective absorption of short-wavelength components, such as ultraviolet to visible light, while minimizing unnecessary reflection and transmission losses. The second light-absorbing layer uses quantum dot materials; by adjusting the size and composition of the quantum dots, it achieves wide-range, high-efficiency absorption of long-wavelength components, such as near-infrared light. The specific materials of the first and second light-absorbing layers are selected based on actual application requirements. The ingenious combination of the two light-absorbing layers and the graphene layer not only broadens the spectral response range of the device but also effectively improves the separation and transport efficiency of photogenerated carriers through the high mobility of graphene, thereby significantly improving the sensitivity and accuracy of photodetector detection and broadening the spectral response range. By optimizing the interface structure and material matching between the layers, light loss is reduced, and photoelectric conversion efficiency is improved.

[0032] This device employs a back-incidence design, where incident light first passes through a first light-absorbing layer, then undergoes enhanced carrier transport via a graphene layer, and finally has its long-wavelength portion captured by a second light-absorbing layer. This design fully utilizes the absorption characteristics of each layer, enabling efficient use of incident light from the ultraviolet to near-infrared bands, achieving a broad spectral response from ultraviolet to near-infrared, and improving the spectral coverage and photoelectric conversion efficiency of the photodetector. The high short-wavelength absorption efficiency of the first light-absorbing layer combined with the tunable long-wavelength absorption characteristics of the second light-absorbing layer, along with the excellent conductivity of the graphene layer, together construct a highly efficient, broad-spectral-response photodetector system. The back-incidence design reduces light loss during transmission, further enhancing the device's performance.

[0033] The graphene layer can be a single layer or multiple layers of graphene. Single-layer graphene structures possess excellent electrical properties and mechanical strength, while multi-layer graphene structures allow for adjustments to electrical and optical properties according to specific needs. The graphene layer is prepared using chemical vapor deposition (CVD), specifically including the following steps: First, on a copper, nickel, or other metal catalyst substrate, hydrocarbon gases are introduced and decomposed at high temperature to generate carbon atoms, forming a graphene layer on the catalyst substrate surface. Second, the graphene layer is transferred from the catalyst substrate to the target substrate using methods such as chemical etching or mechanical exfoliation. Finally, according to the device design requirements, the graphene layer is patterned, such as through photolithography, laser etching, or chemical etching, to form a graphene structure with a specific shape and size. When preparing multi-layer graphene structures, the above process can be repeated, with an insulating layer inserted between two graphene layers to avoid interlayer interactions and protect the lower graphene layer from etching and damage.

[0034] The device body also includes a protective layer (not shown in the figure), located outside the graphene layer, to protect the graphene structure from damage by the external environment. The protective layer comprises one or more protective films made of polymer materials with excellent chemical stability and mechanical strength, capable of blocking the intrusion of harmful substances such as oxygen, moisture, and pollutants. The protective film is fixed to the graphene structure through chemical bonding, physical adsorption, or adhesives to ensure the stability and reliability of the protective film. Furthermore, the protective layer may also include one or more reflective films to reflect unabsorbed light, improving the device's photoelectric conversion efficiency. The reflective films are made of metals or metal oxides with high reflectivity, such as aluminum, silver, and titanium dioxide, and are prepared on the outer surface of the protective film using processes such as evaporation, sputtering, or coating.

[0035] This embodiment also includes an intelligent heat dissipation module and a temperature sensor. The intelligent heat dissipation module is connected to both the temperature sensor and the heat sink. The intelligent heat dissipation module controls the operation of the heat sink, and the temperature sensor detects the real-time temperature of the graphene layer. The intelligent heat dissipation module is integrated inside the heat sink. The intelligent heat dissipation module controls the operation of the heat sink by adjusting the flow rate of the coolant by controlling the power of the heat sink's pump and adjusting the temperature of the coolant by controlling the speed of the heat sink's fan. The heat sink is a common type of existing technology, where the heat sink's heat pipes are connected to the circulating cooling heat pipes, and the coolant flows within the heat sink and circulating cooling heat pipes. A pump is installed on the heat sink, and the fan faces the heat sink.

[0036] A high-precision temperature sensor is positioned near or in direct contact with the graphene layer to ensure real-time and accurate temperature measurement. The temperature sensor connects to and transmits data to the intelligent heat dissipation module via wired or wireless means, feeding back real-time temperature data. The intelligent heat dissipation module compares the received temperature data with two preset temperature thresholds and adjusts its heat dissipation strategy based on the comparison results. This achieves precise temperature control within the graphene sandwich photodetector, ensuring device stability and efficient operation.

[0037] The number of temperature sensors can be one or more. When there are multiple temperature sensors, they form a sensor array to accurately collect the real-time temperature of multiple points in the graphene layer. The average of the real-time temperatures of these multiple points is used as the measured temperature of the graphene layer and is used for temperature threshold comparison.

[0038] The intelligent heat dissipation module controls the operation of the heat sink according to a heat dissipation strategy, such as... Figure 3 As shown, the heat sink is used to dissipate heat from the graphene layer, keeping its temperature within a preset suitable range to maintain normal heat dissipation of the device and ensure the stability and efficiency of the photoelectric detection process.

[0039] This embodiment sets two temperature thresholds: a normal threshold and a warning threshold, to intelligently analyze real-time temperature and distinguish between three temperature states: normal, warning, and emergency. When the temperature is within a preset suitable range, i.e., the temperature is less than or equal to the normal threshold, the current heat dissipation strategy remains unchanged. Once the temperature exceeds the normal threshold but does not reach the warning threshold, i.e., the temperature is greater than the normal threshold but less than or equal to the warning threshold, an adjustment program is initiated to initially cool down the device by fine-tuning the parameters of the heat sink, such as increasing the coolant flow rate or the fan speed. If the temperature continues to rise above the warning threshold, i.e., the temperature is greater than the warning threshold, the full-power heat dissipation mode of the heat sink is immediately triggered to ensure device safety.

[0040] The comparison between temperature and temperature threshold can be achieved using the following formula: in, The temperature of the graphene layer. This is the normal threshold. This is the warning threshold.

[0041] In summary, the working process of the intelligent heat dissipation module includes: S1.1: Obtain the temperature of the graphene layer as measured by the temperature sensor; S1.2: Compare the temperature with the normal threshold and the warning threshold to determine the temperature status, specifically: When the temperature is less than or equal to the normal threshold, the temperature status is considered normal. When the temperature is above the normal threshold but below or equal to the warning threshold, the temperature status is warning. When the temperature exceeds the warning threshold, the temperature status is set to emergency. S1.3: Control the operation of the radiator according to the temperature conditions, specifically: When the temperature is normal, maintain the initial power of the radiator and do not adjust the radiator parameters. When the temperature status is in warning mode, increase the radiator power, specifically by increasing the coolant flow rate or increasing the fan speed. When the temperature condition is critical, the radiator adopts full-power cooling mode.

[0042] After increasing the power of the radiator or using the full-power cooling mode, when the temperature is normal, gradually decrease the power of the radiator until it reaches the initial power of the radiator.

[0043] This embodiment achieves fine-tuning of the heat dissipation strategy by subdividing the temperature states, which not only improves the response speed and accuracy of the heat dissipation system, effectively avoids overheating, ensures the safe operation of the device, but also reduces unnecessary energy consumption.

[0044] This embodiment's intelligent heat dissipation module, in addition to its basic function of adjusting the heat sink's operating power based on the graphene layer's temperature, also incorporates a dynamic workload response mechanism, an adaptive ambient temperature compensation mechanism, and a heat dissipation performance degradation learning mechanism. Through multi-dimensional parameter collaborative analysis, it achieves dynamic heat dissipation control. By intelligently controlling the heat sink, it precisely adjusts the graphene layer's temperature, ensuring the device's stability and efficient operation. Through these three mechanisms, this embodiment achieves: proactive control: predicting heat dissipation needs based on workload to avoid lag-induced temperature fluctuations; environmental compatibility: dynamically compensating for the negative impact of ambient temperature rise on the heat dissipation system; and lifespan maintenance: adaptively offsetting performance degradation caused by the aging of heat dissipation components.

[0045] Dynamic load response mechanism: Real-time monitoring of the operating current and input optical power of the photodetector device to establish a load classification model. When high light intensity input or continuous high current operation is detected, the module automatically identifies it as a high load state, increases the reference flow rate of the coolant in the circulating heat pipe in advance, and starts the auxiliary fan of the radiator to counteract the increase in heat generation rate caused by the intensified carrier transport.

[0046] The specific working process of the intelligent heat dissipation module is as follows: S2.1: Obtain the operating current of the device With optical power value ; S2.2: If the operating current or optical power exceeds the threshold, i.e., when or When this occurs, the base coolant flow rate is increased and / or the fan is started, with the priority given to increasing the coolant flow rate. Among these, The operating current threshold. This is the threshold value for optical power. The threshold value should be set according to the actual situation.

[0047] After making the adjustment in step S2.2, if the subsequent operating current or optical power value does not exceed the threshold, restore the reference flow rate of the coolant to the initial value and turn off the fan.

[0048] Ambient temperature adaptive compensation mechanism: An ambient temperature sensor is integrated externally to the device body. The sensor collects ambient temperature data in real time and sends it to the intelligent heat dissipation module. When the ambient temperature exceeds a preset safe threshold, the intelligent heat dissipation module dynamically lowers the temperature warning threshold and simultaneously increases the adjustment range of the coolant flow rate to compensate for the reduction in heat dissipation efficiency caused by the high-temperature environment.

[0049] The specific working process of the intelligent heat dissipation module is as follows: S3.1: Obtain the ambient temperature measured by the ambient temperature sensor; S3.2: Adjust the warning threshold and coolant flow rate adjustment range based on the ambient temperature and the ambient temperature safety threshold. If the ambient temperature exceeds the ambient temperature safety threshold, lower the warning threshold and increase the coolant flow rate adjustment range. In this embodiment, the amount of reduction in the warning threshold is the difference between the ambient temperature and the ambient temperature safety threshold, and the coolant flow rate adjustment range is the difference multiplied by 4%. For example, if the ambient temperature safety threshold is 35℃, and the ambient temperature is 40℃, the difference is 5, automatically lowering the warning threshold by 5℃ and increasing the coolant flow rate adjustment range by 20%. When the ambient temperature does not exceed the ambient temperature safety threshold, the warning threshold and coolant flow rate adjustment range use the initial values.

[0050] Heat dissipation performance degradation learning mechanism: By recording the aging characteristics of the heat pipe, such as the thermal conductivity degradation curve, through long-term operating data (including temperature rise rate, operating current, optical power value, and ambient temperature), a heat dissipation performance degradation database is established. When the actual temperature rise rate under the same operating conditions (including operating current, optical power value, and ambient temperature) is higher than the historical baseline value, the system automatically determines the heat dissipation performance degradation and actively increases the baseline flow rate of the coolant to ensure stable heat dissipation efficiency.

[0051] like Figure 4 As shown, the working process of the intelligent heat dissipation module also includes: S4.1: Obtain temperature, operating current, optical power value and ambient temperature. Alternatively, the data obtained in steps S1.1, S2.1 and S3.1 can be used directly. S4.2: Based on the operating current, optical power value and ambient temperature, search the heat dissipation performance degradation database to obtain the historical threshold of temperature rise rate; the historical threshold of temperature rise rate is determined based on the historical benchmark value of temperature rise rate. S4.3: Calculate the actual temperature rise rate based on the temperature; S4.4: If the actual temperature rise rate exceeds the historical temperature rise rate threshold, the reference flow rate of the coolant will be increased. Otherwise, the original reference flow rate of the coolant will remain unchanged. For example: if 1.1 times the historical temperature rise rate threshold is used as the historical temperature rise rate threshold, and the actual temperature rise rate exceeds the historical temperature rise rate threshold by more than 10%, the over-limit adjustment mode will be triggered, increasing the reference flow rate of the coolant by 1.5 times.

[0052] The intelligent heat dissipation module accurately calculates the actual temperature rise rate by analyzing real-time temperature change trends. When an abnormal actual temperature rise rate is detected, even if the current temperature has not yet reached the preset threshold (normal threshold, warning threshold), it can predict the heat dissipation demand in advance and dynamically adjust the cooling strategy of the heat dissipation module. In this embodiment, the dynamic adjustment of the cooling strategy of the heat dissipation module is to increase the reference flow rate of the coolant. Depending on the actual situation, it can also be achieved by adjusting the circulation path or activating backup heat dissipation units.

[0053] The intelligent heat dissipation module incorporates a smart algorithm and implements a triple mechanism to adaptively adjust the temperature threshold based on the specific application scenario and historical temperature data of the device. The module not only compares the current temperature with the preset threshold but also incorporates factors such as the heating rate for comprehensive evaluation. When the internal temperature of the device approaches or is expected to exceed the safety threshold, the intelligent heat dissipation module can automatically trigger an early warning signal, notifying the user or system administrator via visual, audible, or remote communication methods. This allows time for further heat dissipation measures to be taken, ensuring the continuity and stability of the photoelectric detection process.

[0054] The intelligent heat dissipation module also possesses learning capabilities, optimizing the adjustment strategies of parameters such as flow rate based on long-term operating data to achieve an optimal balance between heat dissipation efficiency and energy efficiency. The intelligent heat dissipation module can respond to temperature changes within milliseconds, enabling smooth and continuous adjustment of the coolant flow rate; it improves the response speed and adjustment accuracy of the heat dissipation system, ensuring stable heat dissipation of devices at different temperatures; and by optimizing the coolant flow rate, it achieves the best balance between heat dissipation efficiency and energy efficiency, reducing operating costs.

[0055] In practical use, when incident light shines on the device, the graphene layer utilizes its excellent optical transparency and electrical properties to convert light energy into electrical energy. Simultaneously, different material layers in the light-absorbing layer assembly absorb light of different wavelengths and further convert the light energy into electrical signals through the generation and separation of electron-hole pairs. A temperature sensor monitors the internal temperature of the device in real time. Once the temperature exceeds a preset threshold, the intelligent heat dissipation module activates a corresponding heat dissipation strategy, using a heat sink to physically dissipate heat and maintain the device's operating temperature within a safe range.

[0056] This embodiment improves the heat dissipation efficiency and photoelectric conversion efficiency of the device by optimizing the heat dissipation system and light absorption layer design, thereby significantly enhancing the sensitivity and accuracy of photoelectric detection. The introduction of an intelligent heat dissipation module and a triple mechanism enables the device to operate stably under various conditions, avoiding performance degradation or damage due to overheating. Adaptive flow rate adjustment and intelligent heat dissipation strategies achieve an optimal balance between heat dissipation efficiency and energy consumption ratio, reducing the device's operating costs. The wide-spectrum response light absorption layer design and back-incidence photoelectric detection strategy of this embodiment enable the device to be applied to a wider range of photoelectric detection fields, meeting the needs of different application scenarios.

[0057] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A device for graphene photodetection, characterized in that, include: Device body and heat sink, The device body comprises a first light-absorbing layer, a graphene layer, and a second light-absorbing layer, with the graphene layer located between the first and second light-absorbing layers. The first light-absorbing layer absorbs short-wavelength light, and the second light-absorbing layer absorbs long-wavelength light. A metal electrode is disposed on the surface of the graphene layer. The heat sink is disposed on the device body and is connected to a circulating cooling heat pipe. The circulating cooling heat pipe is disposed in the contact area between the graphene layer and the first light absorption layer and the contact area between the graphene layer and the second light absorption layer.

2. A graphene photodetector device as claimed in claim 1, wherein, The first light-absorbing layer is made of single-crystal silicon wafer material, and the second light-absorbing layer is made of quantum dot material.

3. A graphene photoelectric detection device as described in claim 1 or 2, characterized in that, The device adopts a back-incidence design, with incident light entering from the first light-absorbing layer.

4. The graphene photoelectric detection device as described in claim 1, characterized in that, The graphene layer may be a single layer of graphene or a multilayer of graphene; when the graphene layer is a multilayer of graphene, an isolation layer is provided between the two layers of graphene.

5. A graphene photoelectric detection device as described in claim 1 or 4, characterized in that, The protective layer is located outside the graphene layer. The protective layer includes one or more protective films and reflective films. The protective film is made of polymer material, and the reflective film is made of metal or metal oxide.

6. The graphene photoelectric detection device as described in claim 1, characterized in that, It also includes: an intelligent heat dissipation module and a temperature sensor. The intelligent heat dissipation module is connected to the temperature sensor and the heat sink respectively. The intelligent heat dissipation module is used to control the operation of the heat sink, and the temperature sensor is used to detect the real-time temperature of the graphene layer. The working process of the intelligent heat dissipation module includes: S1.1: Obtain the temperature of the graphene layer as measured by the temperature sensor; S1.2: Compare the temperature with the normal threshold and the warning threshold to determine the temperature status, specifically: When the temperature is less than or equal to the normal threshold, the temperature status is considered normal. When the temperature is above the normal threshold but below or equal to the warning threshold, the temperature status is warning. When the temperature exceeds the warning threshold, the temperature status is set to emergency. S1.3: Control the operation of the radiator according to the temperature conditions, specifically: When the temperature is normal, maintain the initial power of the radiator. When the temperature status is in warning mode, increase the radiator power. When the temperature condition is critical, the radiator adopts full-power cooling mode.

7. The graphene photoelectric detection device as described in claim 6, characterized in that, The working process of the intelligent heat dissipation module also includes: S2.1: Obtain the operating current and optical power values ​​of the device; S2.2: If the operating current or optical power value exceeds the threshold, increase the reference flow rate of the coolant and / or start the fan.

8. The graphene photoelectric detection device as described in claim 6, characterized in that, The ambient temperature sensor is connected to the intelligent heat dissipation module. The working process of the intelligent heat dissipation module also includes: S3.1: Obtain the ambient temperature measured by the ambient temperature sensor; S3.2: If the ambient temperature exceeds the safe threshold, the warning threshold will be lowered and the adjustment range of the coolant flow rate will be increased.

9. The graphene photoelectric detection device as described in claim 8, characterized in that, The amount by which the warning threshold is lowered is the difference between the ambient temperature and the ambient temperature safety threshold, and the adjustment range of the coolant flow rate is the difference multiplied by 4%.

10. The graphene photoelectric detection device as described in claim 6, characterized in that, The working process of the intelligent heat dissipation module also includes: S4.1: Obtain operating current, optical power value, and ambient temperature; S4.2: Based on the operating current, optical power value and ambient temperature, search the heat dissipation performance degradation database to obtain the historical threshold of temperature rise rate; S4.3: Calculate the actual temperature rise rate based on the temperature of the graphene layer; S4.4: If the actual temperature rise rate exceeds the historical temperature rise rate threshold, increase the adjustment range of the coolant flow rate.

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