Laser processing grinding wheel and method of manufacturing the same

Abstract

The application belongs to the technical field of precision abrasive tool manufacturing, and discloses a laser processing grinding wheel and a preparation method thereof, which are used to solve the problem that the bonding strength between the abrasive layer and the substrate is weak in the prior art, and it is difficult to meet the harsh grinding requirements such as high-speed grinding, heavy-load grinding, and synchronous grinding of large cutting amount of composite materials. The laser processing grinding wheel comprises a grinding wheel substrate and a grinding wheel abrasive layer; wherein the surface of the grinding wheel substrate is provided with an array of inclined blind holes, and the grinding wheel abrasive layer is located on the surface of the grinding wheel substrate and in the array of blind holes; and the raw material of the grinding wheel abrasive layer comprises amine-modified titanate and phthalonitrile resin. The application adopts a large focal point laser to perform 3D photocuring forming on the abrasive layer containing phthalonitrile resin, so that the array of blind holes is fully filled with the abrasive layer with high-temperature resistance, low shrinkage and high strength, and a grinding wheel product with high-strength combination between the abrasive layer and the substrate and capable of being used at high temperature for a long time is obtained.

Description

Technical Field

[0001] This invention relates to the field of precision abrasive manufacturing technology, and in particular to a method for preparing a grinding wheel. Background Technology

[0002] With the continuous emergence of new materials and processes, enterprises have increasingly higher requirements for the quality and efficiency of grinding processes. In particular, applications such as high-speed grinding, heavy-duty grinding, and synchronous grinding of composite materials with large depth of cut all require the abrasive layer of the grinding wheel to have sufficient high temperature resistance and impact resistance, and also place more stringent requirements on the bonding strength between the abrasive layer of the grinding wheel and the substrate.

[0003] UV-curable resins are widely used in printing, packaging, electronics, dentistry, and other industries due to their energy-saving and high-efficiency characteristics. Commercially available UV-curable resins mainly consist of resin monomers and prepolymers, containing active functional groups that can undergo polymerization reactions initiated by photosensitizers under light irradiation. In the abrasive and grinding wheel industry, UV-curable resins are primarily used in the preparation of flexible coated abrasives such as sandpaper. Common UV-curable resins in the abrasive and grinding wheel industry include acrylic resins, epoxy resins, polyimides, phenolic resins, and hybrid resins.

[0004] Phthalonil resin is a novel thermosetting resin (Table 1) with excellent thermal stability and mechanical properties, and has been widely used in aerospace technology, electronic engineering, and mechanical manufacturing. However, without a catalyst, traditional phthalonitrile resin requires nearly 100 hours of heating at 280°C to observe significant gelation, resulting in an extremely long processing time. Currently, research on phthalonitrile resin mainly focuses on reducing its curing temperature, imparting autocatalytic properties, and modifying other resins. Compared to phenolic resins and polyimide resins commonly used in grinding wheel production, phthalonitrile resin has higher heat resistance and abrasive holding power, but its high curing temperature, long curing time, and high production cost severely limit its widespread application.

[0005] Table 1 Existing technologies, such as patent CN105196196A (an electroplated diamond grinding wheel with ordered abrasive arrangement), involve creating ordered blind holes on the substrate surface. The purpose is to improve the holding force of the electroplated diamond wheel coating on the abrasive, the abrasive tip height, and the wheel's lifespan. However, this patent does not explicitly describe the hole-making method, and the small, shallow holes can only accommodate a small portion of a single abrasive particle (hole depth is 20%-30% of the average abrasive particle size), similar to surface blasting or shot peening, thus contributing very little to improving the bonding strength between the abrasive layer and the substrate. Furthermore, in practice, companies use methods such as applying adhesives, adding transition layers, sandblasting, and grooving to increase the bonding strength between the abrasive layer and the substrate. While these methods can improve the bonding strength to some extent, they still fall short when facing demanding grinding requirements such as high-speed grinding, heavy-load grinding, and simultaneous grinding of composite materials with large depths of cut. Therefore, there is an urgent need to propose an innovative grinding wheel preparation method to better meet these demanding grinding scenarios, thereby improving the bonding strength between the abrasive layer and the matrix, and further enhancing the performance and service life of the grinding wheel. Summary of the Invention

[0006] To address the aforementioned technical problems, this invention proposes a laser-processed grinding wheel and its preparation method.

[0007] To achieve the above objectives, the technical solution of the present invention is implemented as follows: A laser-processing grinding wheel includes a grinding wheel substrate and a grinding wheel abrasive layer; wherein, the surface of the grinding wheel substrate is provided with an inclined array of blind holes, and the grinding wheel abrasive layer is located on the surface of the grinding wheel substrate and within the array of blind holes; the raw materials of the grinding wheel abrasive layer include amine-modified titanate and phthalonitrile resin.

[0008] Furthermore, the raw materials of the aforementioned grinding wheel abrasive layer, by mass fraction, include 10-40 wt% abrasive, 10-40 wt% phthalonitrile resin, 1-10 wt% amino-modified titanate and 20-50 wt% auxiliary materials.

[0009] The aforementioned phthalonitrile resins, such as TPN-03 and PN-2524, contain amine groups in their main chain. The resin powder serves three main purposes: First, it is a novel heat-resistant resin powder capable of withstanding the high temperatures of laser 3D photocuring, achieving a glass transition temperature exceeding 300℃ after curing, resulting in excellent grinding performance. Second, the resin melts rapidly during laser processing, and after curing, it exhibits high network cross-linking strength (forming heterocyclic structures such as azinium rings, phthalocyanine rings, and isoindoline rings), providing excellent abrasive holding power and extending grinding wheel life. Third, the resin exhibits almost no volume change before and after curing, allowing it to fill the microporous array effectively and providing strong bonding with the substrate. The amine groups act as catalysts for curing, reducing curing time and temperature, and improving production efficiency. The abrasive coating, being a transition metal, also contributes to increasing the resin cross-linking speed to some extent.

[0010] The aforementioned amine-modified titanates (such as KR-44, GR-311W, etc.) have two main functions: firstly, the multifunctional groups (such as monoalkoxy, amine, and aromatic groups) in the titanate affinity the inorganic particles and resin powder respectively, playing a bridging role and strengthening the bonding strength between the abrasive, auxiliary materials, and resin; secondly, the amine groups in the reinforcing agent can catalyze the resin curing process, which can greatly accelerate the 3D photocuring process of the abrasive layer and improve the strength after curing.

[0011] The aforementioned abrasive is diamond or cubic boron nitride with a surface coating. Furthermore, the coating material is selected from any one of titanium plating, titanium carbide, titanium nitride, titanium aluminum nitride, and titanium carbonitride. The coated abrasive has four main functions: First, the bonding strength between the coated abrasive and resin powder is high, resulting in a long grinding wheel life and good impact resistance. Second, titanium-plated or titanium carbide abrasives can withstand the high temperatures during laser 3D photopolymerization and subsequent grinding, reducing thermal degradation and oxidation of the abrasive. Third, the coating metal has good thermal conductivity, which can improve the heat transfer efficiency of 3D photopolymerization. Fourth, the titanium element on the coating surface has good compatibility with the resin powder (which promotes curing) and the reinforcing agent (containing titanium).

[0012] Furthermore, the aforementioned auxiliary materials include, but are not limited to, at least one of titanium hydride powder, zinc oxide, copper powder, graphite powder, and silicon carbide. The functions of these auxiliary materials include promoting resin curing, reinforcing the resin, improving thermal conductivity, reducing grinding power consumption, and assisting in grinding processes.

[0013] The above-mentioned method for preparing laser-processed grinding wheels includes the following steps: (1) a. Machining the base material to the dimensions shown in the drawing. The base material includes, but is not limited to, titanium alloys and titanium-containing composite materials. The mechanical properties of the base material must ensure the safe use of the grinding wheel. Titanium alloys have low density, high specific strength, and strong high-temperature resistance, making them more suitable for high-speed, high-grinding environments. b. Cleaning and drying the machined base material to ensure its surface is clean and free of foreign matter.

[0014] (2) Fix the substrate after step (1) and use a high-energy laser to drill holes in the substrate, so that the substrate surface forms an array of inclined blind holes. Specifically, fix the substrate on the rotating shaft of the laser device. After starting, the substrate can rotate at a constant speed to ensure that the laser can irradiate all areas to be processed. Then, use a high-energy laser to drill holes in the substrate. The power of the high-energy laser should be sufficient to melt the substrate material (exceeding the melting point of the substrate material by 10-100°). The drilling position is the interface between the substrate and the abrasive layer. The hole is an inclined blind hole with an inclination angle of 10-80° to the vertical direction. Further, the inclination angle to the vertical direction is 20-60°. In order to ensure that the blind hole holds the abrasive layer, the raw material powder of the grinding wheel abrasive layer needs to fully enter the blind hole. The diameter D of the blind hole is... 孔 The diameter of the blind holes is 2-6 times that of the coarsest powder particles in the raw material, and the depth is 1-20 times that of the coarsest powder particles in the raw material. To improve the bonding force, the direction of the blind holes is perpendicular to the force direction of the abrasive layer on the grinding wheel (the resultant force of tangential and axial forces). The inclined blind holes can simultaneously resist the tangential and axial forces experienced by the grinding wheel during use, effectively preventing the grinding wheel from slipping off the ring. For grinding wheels with uncertain grinding force directions, two or more blind hole arrays with different directions can be used to counteract the forces experienced by the grinding wheel during use.

[0015] Furthermore, according to the preset drilling path, the substrate rotates synchronously and the laser moves, resulting in a uniformly distributed array of inclined micropores on the substrate bonding surface. The number and arrangement of the micropores must ensure the bonding strength between the abrasive layer and the substrate, meeting the requirements for high-speed and safe use of the grinding wheel. The formula for estimating the number of micropores N is as follows: In the formula, N 切向 F represents the minimum number of micro-holes required for the grinding wheel to resist the tangential force during grinding. 切向 F is the tangential force experienced by the grinding wheel during the grinding process. 剪切 S represents the shear strength of the abrasive layer in the grinding wheel. 总 S1 is the area of ​​the interface between the grinding wheel and the abrasive layer, S1 is the cross-sectional area of ​​the laser micro-hole, and N is the area of ​​the interface between the grinding wheel and the abrasive layer. 轴向 F represents the minimum number of micro-holes required for the grinding wheel to resist axial forces during grinding. 轴向 S2 is the axial force experienced by the grinding wheel during grinding, S2 is the longitudinal cross-sectional area of ​​the laser micro-hole, N is the minimum number of micro-holes required for the grinding wheel to resist all forces during grinding, Max is the larger of the two, and K is the safety factor (generally 1.1-2.0). The tangential force F experienced by the grinding wheel during grinding is also mentioned. 切向 and axial force F 轴向 All are related to grinding parameters and can be obtained through actual measurement or simulation. The shear strength F of the abrasive layer in the grinding wheel... 剪切 This is based on actual measurements and is related to the abrasive layer formulation of the grinding wheel.

[0016] (3) After the raw materials for the grinding wheel abrasive layer are mixed evenly, they are introduced into the laser 3D printing equipment and layered onto the surface of the substrate and the array of blind holes in step (2). The raw material powder is then cured by laser light to form the grinding wheel abrasive layer, which in turn forms the laser-processed grinding wheel. The laser 3D printing equipment and the subsequent laser light curing can be collectively referred to as the laser 3D light curing equipment. The following text will focus on these aspects and will not elaborate further.

[0017] Specifically, S1. The abrasive layer material is thoroughly mixed and poured into a 3D photocuring device; S2. Place the laser-processed substrate in the forming chamber and locate the origin; S3. The abrasive layer is formed using a laser 3D photopolymerization device. The abrasive powder is fed through nozzles to the substrate surface and the interior of the microporous array. The large focal spot laser increases the irradiation area and reduces the energy density, allowing for rapid melting and curing of the resin powder. Depending on the characteristics of the raw powder, the laser beam diameter is 50 μm-5 mm, and the molten pool (or binder molten pool) temperature is 240℃-290℃. The nozzles feed the material layer by layer, and the laser rapidly cures the resin powder. The binder in the microporous array is firmly bonded to the substrate, achieving an improved bonding strength between the two.

[0018] S4. After passing inspection, it becomes a finished grinding wheel.

[0019] The beneficial effects of this invention are: (1) This invention utilizes a high-energy laser to form an inclined array of blind holes on the mating surface of the grinding wheel, thereby improving the bonding strength between the abrasive layer and the substrate. A large-focus laser is used to perform 3D photopolymerization molding on the abrasive layer containing phthalonitrile resin, so that the blind hole array is fully filled with a high-temperature resistant, low-shrinkage, and high-strength abrasive layer, resulting in a grinding wheel with a high-strength bond between the abrasive layer and the substrate.

[0020] (2) This invention innovatively proposes a 3D photocuring process for phthalonitrile resin powder. The components work synergistically, and the abrasive, reinforcing agent and auxiliary materials promote the rapid curing of the resin powder under the action of laser. This results in the heat resistance of the cured binder being increased by 100℃-150℃ compared with the traditional phenolic binder, the shrinkage being reduced by 50%, and the strength and holding power being increased by about 100%.

[0021] (3) Laser processing for drilling blind holes is simple to operate, and the designability of the blind hole array (array form, hole size, hole direction, number of holes) is good, which can be used for grinding wheels of various specifications and models. During the forming process, the molten abrasive layer can fully enter the inclined blind hole array. After solidification, the abrasive layer has almost no shrinkage, strong bonding force with the substrate, good grinding wheel safety, and can be used for the production of high-speed, complex load grinding wheels.

[0022] (4) The grinding wheel preparation (substrate processing and abrasive layer forming) of the present invention only requires one laser printing equipment, without the need for customized molds and high-temperature heating equipment, and the processing cost is low. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 The diagram shows four typical array arrangement methods (front view combined with the plane).

[0025] Figure 2 This is a schematic diagram of the laser processing of abrasive wheels; where 1 is the 3D photopolymerization device, 2 is the feeding nozzle, 3 is the optical path channel, 4 is the high-energy laser, 5 is the substrate, 6 is the rotating axis, 7 is the array of blind holes (micro-holes), 8 is the raw material powder for the abrasive layer, 9 is the large-focus laser, and 10 is the cured abrasive layer.

[0026] Figure 3 A schematic diagram showing the tangential force, axial force, and resultant force exerted on the abrasive material inside a blind hole.

[0027] Figure 4 This is a 3D photocuring reaction of phthalic acid resin.

[0028] Figure 5 This refers to the synergistic effect between the different components of the grinding wheel.

[0029] Figure 6 This is a comparison of the performance of coated abrasives and ordinary abrasives. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Example 1 The method for preparing the laser-processed grinding wheel in this embodiment is illustrated in the schematic diagram of the processing procedure. Figure 2 As shown, the specific steps are as follows: (1) The TC4 titanium alloy substrate 5 is machined to the dimensions shown in the drawing, and the machined substrate material is washed and dried to make the surface of the substrate material clean and free of foreign matter.

[0032] (2) Fix the substrate on the rotating shaft 6 of the laser device. After startup, the substrate can rotate at a constant speed. Use a high-energy laser 4 to drill holes on the outer circular surface of the substrate to form an inclined array of blind holes (micro-holes) 7. The holes are inclined blind holes with a diameter of 100 μm, a depth of 200 μm, and an inclination angle of 60° to the vertical direction. The size of the micro-holes needs to facilitate the entry of the raw material powder of the subsequent abrasive layer.

[0033] The bonding area S between the abrasive layer and the substrate of the grinding wheel 总 5966 mm 2 The tangential force F experienced by the grinding wheel during the grinding process. 切向 and axial force F 轴向 The shear strength F of the abrasive layer is 25 MPa and 10 MPa, respectively. 剪切 The pressure is 60 MPa. The safety factor K is 1.2.

[0034] A schematic diagram of the tangential force, axial force, and resultant force exerted on the abrasive inside the blind hole is shown below. Figure 3 As shown, → and ↑ represent the force direction of the abrasive layer, S1 is the cross section of the abrasive layer bearing tangential force in the blind hole, and S2 is the cross section of the abrasive layer bearing axial force in the blind hole; to clearly demonstrate the arrangement and angle of the blind holes, the blind holes in the schematic diagram are enlarged and are not at the actual scale. According to the preset drilling path, the substrate is rotated and the laser is moved synchronously to make the substrate bonding surface evenly distributed with an inclined array of microholes. The number of microholes can be calculated according to formulas (1)-(3) to ensure the bonding strength between the abrasive layer and the substrate and to meet the requirements of high-speed and safe use of the grinding wheel.

[0035] According to the preset drilling path ( Figure 1-1 The substrate is rotated synchronously and the laser is moved, so that the substrate bonding surface is uniformly distributed with an inclined array of micropores. According to formulas (1)-(3), the number of micropores is calculated as follows: N 切向 ≈316700, N 轴向 ≈198900, therefore the required tilted micropores N≈380040.

[0036] (3) Weigh out 35 wt% titanium carbide-coated diamond, 25 wt% TPN-03 phthalonitrile resin, 7 wt% KR-44 amine-modified titanate reinforcing agent, 10 wt% titanium hydride powder, 5 wt% zinc oxide, 13 wt% copper powder, and 5 wt% graphite powder as raw materials for the abrasive layer of the grinding wheel. All raw materials are commercially available and have a particle size of less than 30 micrometers.

[0037] (4) Mix the abrasive layer raw material powder 8 from step (3) thoroughly and evenly, and pour it into the 3D photocuring device 1.

[0038] (5) Place the laser-processed substrate in the forming chamber and locate the origin.

[0039] (6) The abrasive layer is formed using a laser 3D photopolymerization device. The abrasive layer raw material powder reaches the substrate surface and the interior of the micropore array through the feeding nozzle 2. The laser beam diameter is 100 μm and the binder melt pool temperature is 250±10℃. The nozzle feeds the material layer by layer, and the laser quickly solidifies the resin powder to form the solidified abrasive layer 10, i.e., the grinding wheel abrasive layer.

[0040] (10) After passing the inspection, it becomes a finished grinding wheel (specification: 6A2-200*30*30*10*10mm).

[0041] Example 2 The method for preparing the laser-processed grinding wheel in this embodiment includes the following steps: (1) The TC11 titanium alloy substrate 5 is machined to the dimensions shown in the drawing, and the machined substrate material is washed and dried to make the surface of the substrate material clean and free of foreign matter.

[0042] (2) Fix the substrate on the rotating shaft 6 of the laser device. After startup, the substrate can rotate at a constant speed. Use a high-energy laser 4 to drill holes on the outer circular surface of the substrate to form an inclined array of blind holes (micro-holes) 7. The holes are inclined blind holes with a diameter of 400 μm, a depth of 2000 μm, and an inclination angle of 20° to the vertical direction. The size of the micro-holes needs to facilitate the entry of the raw material powder of the subsequent abrasive layer.

[0043] The bonding area S between the abrasive layer and the substrate of the grinding wheel 总 7536 mm 2 The tangential force F experienced by the grinding wheel during the grinding process. 切向 and axial force F 轴向 The shear strength F of the abrasive layer is 30 MPa and 15 MPa, respectively. 剪切 The pressure is 65 MPa. The safety factor K is 1.5.

[0044] According to the preset drilling path ( Figure 1-3 The substrate is rotated synchronously and the laser is moved, so that the substrate bonding surface is uniformly distributed with an inclined array of micropores. According to formulas (1)-(3), the number of micropores is calculated as follows: N 切向 ≈27692, N 轴向 ≈8695, therefore the required tilted micropores N≈41538.

[0045] (3) Weigh out 30 wt% of titanium-plated cubic boron nitride, 30 wt% of PN-2524 phthalonitrile resin, 5 wt% of GR-311W amine-modified titanate reinforcing agent, 5 wt% of titanium hydride powder, 5 wt% of zinc oxide, 15 wt% of copper powder, and 10 wt% of silicon carbide as raw materials for the abrasive layer of the grinding wheel. All raw materials are commercially available, and the particle size is less than 130 micrometers.

[0046] (4) Mix the abrasive layer raw material powder 8 from step (3) thoroughly and evenly, and pour it into the 3D photocuring device 1.

[0047] (5) Place the laser-processed substrate in the forming chamber and locate the origin.

[0048] (6) The abrasive layer is formed using a laser 3D photopolymerization device. The abrasive layer raw material powder reaches the substrate surface and the interior of the micropore array through the feeding nozzle 2. The laser beam diameter is 400 μm and the binder melt pool temperature is 260±10℃. The nozzle feeds the material layer by layer, and the laser quickly solidifies the resin powder to form the solidified abrasive layer 10, i.e., the grinding wheel abrasive layer.

[0049] (10) After passing the inspection, it becomes a finished grinding wheel (specification: 11V2-250*70*50*10*5mm).

[0050] 3D photocuring reaction of phthalonitrile resin, such as Figure 4 As shown, in the resin curing reaction formula, functional group R1 is a carbon chain, and its side branches may contain groups that promote curing, such as amine groups. R2 is an inorganic-loving group of the reinforcing agent, such as a monoalkoxy group. R3 is a resin-loving group of the reinforcing agent (amine-modified titanate), which is a group containing amine groups that promotes curing. R4 is the heterocyclic structure with a network crosslinking obtained after resin curing.

[0051] Depend on Figure 5 It can be seen that, macroscopically, both the substrate and abrasive layer formulations with blind hole arrays are titanium-containing or titanium-affinity systems, exhibiting good bonding and impact resistance, meeting the stringent grinding requirements of high-speed grinding, heavy-load grinding, and simultaneous grinding of composite materials with large depths of cut. Microscopically, the powder components in the formulation are also titanium-containing or titanium-affinity systems, with good bonding between different raw material powders. Specifically, the high-temperature resistant resin powder mainly provides support and holding for other powders, forming the system's framework. The abrasive surface has a titanium-containing coating, significantly improving heat resistance and oxidation resistance, making it more compatible with resin laser forming processes and promoting resin powder curing, primarily serving a grinding function. The reinforcing agent is the hub of the binder system, interacting with all other raw material components. The titanium-containing reinforcing agent can accelerate and participate in the curing of the binder, and also has affinity with the coated abrasive and auxiliary powders, achieving a bridging effect throughout the system. The auxiliary materials mainly play a role in promoting resin curing, resin reinforcement, improving thermal conductivity, reducing grinding power consumption, and assisting grinding. They are an indispensable component of the binder system.

[0052] Example 3 The specific steps of the laser-processed grinding wheel preparation method in this embodiment are as follows: (1) The TC4 titanium alloy substrate 5 is machined to the dimensions shown in the drawing, and the machined substrate material is washed and dried to make the surface of the substrate material clean and free of foreign matter.

[0053] (2) Fix the substrate on the rotating shaft 6 of the laser device. After startup, the substrate can rotate at a constant speed. Use a high-energy laser 4 to drill holes on the outer circular surface of the substrate to form an inclined array of blind holes (micro-holes) 7. The holes are inclined blind holes with a diameter of 100 μm, a depth of 200 μm, and an inclination angle of 60° to the vertical direction. The size of the micro-holes needs to facilitate the entry of the raw material powder of the subsequent abrasive layer.

[0054] The bonding area S between the abrasive layer and the substrate of the grinding wheel 总 5966 mm 2 The tangential force F experienced by the grinding wheel during the grinding process. 切向 and axial force F 轴向 The shear strength F of the abrasive layer is 25 MPa and 10 MPa, respectively. 剪切 The pressure is 60 MPa. The safety factor K is 1.2.

[0055] According to the preset drilling path ( Figure 1-1 The substrate is rotated synchronously and the laser is moved, so that the substrate bonding surface is uniformly distributed with an inclined array of micropores. According to formulas (1)-(3), the number of micropores is calculated as follows: N 切向 ≈316700, N 轴向 ≈198900, therefore the required tilted micropores N≈380040.

[0056] (3) Weigh out 40 wt% titanium carbide-coated diamond, 10 wt% TPN-03 phthalonitrile resin, 8 wt% KR-44 amine-modified titanate reinforcing agent, 11 wt% titanium hydride powder, 7 wt% zinc oxide, 15 wt% copper powder, and 9 wt% graphite powder as raw materials for the abrasive layer of the grinding wheel. All raw materials are commercially available and have a particle size of less than 20 micrometers.

[0057] (4) Mix the abrasive layer raw material powder 8 from step (3) thoroughly and evenly, and pour it into the 3D photocuring device 1.

[0058] (5) Place the laser-processed substrate in the forming chamber and locate the origin.

[0059] (6) The abrasive layer is formed using a laser 3D photopolymerization device. The abrasive layer raw material powder reaches the substrate surface and the interior of the micropore array through the feeding nozzle 2. The laser beam diameter is 50 μm and the binder melt pool temperature is 280±10℃. The nozzle feeds the material layer by layer, and the laser quickly solidifies the resin powder to form the solidified abrasive layer 10, i.e., the grinding wheel abrasive layer.

[0060] (10) After passing the inspection, it becomes a finished grinding wheel (specification: 6A2-200*30*30*10*10mm).

[0061] Example 4 The specific steps of the laser-processed grinding wheel preparation method in this embodiment are as follows: (1) The TC4 titanium alloy substrate 5 is machined to the dimensions shown in the drawing, and the machined substrate material is washed and dried to make the surface of the substrate material clean and free of foreign matter.

[0062] (2) Fix the substrate on the rotating shaft 6 of the laser device. After startup, the substrate can rotate at a constant speed. Use a high-energy laser 4 to drill holes on the outer circular surface of the substrate to form an inclined array of blind holes (micro-holes) 7. The holes are inclined blind holes with a diameter of 100 μm, a depth of 200 μm, and an inclination angle of 60° to the vertical direction. The size of the micro-holes needs to facilitate the entry of the raw material powder of the subsequent abrasive layer.

[0063] The bonding area S between the abrasive layer and the substrate of the grinding wheel 总 5966 mm 2 The tangential force F experienced by the grinding wheel during the grinding process. 切向 and axial force F 轴向 The shear strength F of the abrasive layer is 25 MPa and 10 MPa, respectively. 剪切 The pressure is 60 MPa. The safety factor K is 1.2.

[0064] According to the preset drilling path ( Figure 1-1 The substrate is rotated synchronously and the laser is moved, so that the substrate bonding surface is uniformly distributed with an inclined array of micropores. According to formulas (1)-(3), the number of micropores is calculated as follows: N 切向 ≈316700, N 轴向 ≈198900, therefore the required tilted micropores N≈380040.

[0065] (3) Weigh out 10 wt% titanium carbide-coated diamond, 30 wt% TPN-03 phthalonitrile resin, 10 wt% KR-44 amine-modified titanate reinforcing agent, 11 wt% titanium hydride powder, 14 wt% zinc oxide, 16 wt% copper powder, and 9 wt% graphite powder as raw materials for the abrasive layer of the grinding wheel. All raw materials are commercially available and have a particle size of less than 50 micrometers.

[0066] (4) Mix the abrasive layer raw material powder 8 from step (3) thoroughly and evenly, and pour it into the 3D photocuring device 1.

[0067] (5) Place the laser-processed substrate in the forming chamber and locate the origin.

[0068] (6) The abrasive layer is formed using a laser 3D photopolymerization device. The abrasive layer raw material powder reaches the substrate surface and the interior of the micropore array through the feeding nozzle 2. The laser beam diameter is 50 μm and the binder melt pool temperature is 250±10℃. The nozzle feeds the material layer by layer, and the laser quickly solidifies the resin powder to form the solidified abrasive layer 10, i.e., the grinding wheel abrasive layer.

[0069] (10) After passing the inspection, it becomes a finished grinding wheel (specification: 6A2-200*30*30*10*10mm).

[0070] Example 5 The specific steps of the laser-processed grinding wheel preparation method in this embodiment are as follows: (1) The TC11 titanium alloy substrate 5 is machined to the dimensions shown in the drawing, and the machined substrate material is washed and dried to make the surface of the substrate material clean and free of foreign matter.

[0071] (2) Fix the substrate on the rotating shaft 6 of the laser device. After startup, the substrate can rotate at a constant speed. Use a high-energy laser 4 to drill holes on the outer circular surface of the substrate to form an inclined array of blind holes (micro-holes) 7. The holes are inclined blind holes with a diameter of 400 μm, a depth of 2000 μm, and an inclination angle of 20° to the vertical direction. The size of the micro-holes needs to facilitate the entry of the raw material powder of the subsequent abrasive layer.

[0072] The bonding area S between the abrasive layer and the substrate of the grinding wheel 总 7536 mm 2 The tangential force F experienced by the grinding wheel during the grinding process. 切向 and axial force F 轴向 The shear strength F of the abrasive layer is 30 MPa and 15 MPa, respectively. 剪切 The pressure is 65 MPa. The safety factor K is 1.5.

[0073] According to the preset drilling path ( Figure 1-3 The substrate is rotated synchronously and the laser is moved, so that the substrate bonding surface is uniformly distributed with an inclined array of micropores. According to formulas (1)-(3), the number of micropores is calculated as follows: N 切向 ≈27692, N 轴向 ≈8695, therefore the required tilted micropores N≈41538.

[0074] (3) Weigh out 33 wt% of titanium-plated cubic boron nitride, 40 wt% of PN-2524 phthalonitrile resin, 7 wt% of GR-311W amine-modified titanate reinforcing agent, 5 wt% of titanium hydride powder, 5 wt% of zinc oxide, 7 wt% of copper powder, and 3 wt% of silicon carbide as raw materials for the abrasive layer of the grinding wheel. All raw materials are commercially available and have a particle size of less than 130 micrometers.

[0075] (4) Mix the abrasive layer raw material powder 8 from step (3) thoroughly and evenly, and pour it into the 3D photocuring device 1.

[0076] (5) Place the laser-processed substrate in the forming chamber and locate the origin.

[0077] (6) The abrasive layer is formed using a laser 3D photopolymerization device. The abrasive layer raw material powder reaches the substrate surface and the interior of the micropore array through the feeding nozzle 2. The laser beam diameter is 400 μm and the binder melt pool temperature is 260±10℃. The nozzle feeds the material layer by layer, and the laser quickly solidifies the resin powder to form the solidified abrasive layer 10, i.e., the grinding wheel abrasive layer.

[0078] (10) After passing the inspection, it becomes a finished grinding wheel (specification: 11V2-250*70*50*10*5mm).

[0079] Comparative Example 1 The preparation method of the grinding wheel in this comparative example differs from that in Example 1 in that the substrate bonding surface is only a conventional sandblasting surface. The specific preparation steps are as follows: (1) The TC4 titanium alloy substrate is machined to the dimensions shown in the drawing, and the mating surface of the machined substrate is sandblasted to increase the surface roughness of the substrate.

[0080] (2) The substrate is washed and dried to make the surface of the substrate material clean and free of foreign matter.

[0081] (3) Weigh out 35 wt% titanium carbide-coated diamond, 25 wt% TPN-03 phthalonitrile resin, 7 wt% KR-44 amine-modified titanate reinforcing agent, 10 wt% titanium hydride, 5 wt% zinc oxide, 13 wt% copper powder, and 5 wt% graphite powder as raw materials for the abrasive layer of the grinding wheel. All raw materials are commercially available and have a particle size of less than 30 micrometers.

[0082] (4) Mix the abrasive layer raw material powder from step (3) thoroughly and evenly, and pour it into the 3D photocuring device.

[0083] (5) Place the laser-processed substrate in the forming chamber and locate the origin.

[0084] (6) The abrasive layer is formed using a laser 3D photopolymerization device. The abrasive layer raw material powder reaches the substrate surface and the interior of the micropore array through the feeding nozzle 2. The laser beam diameter is 100 μm, and the binder melt pool temperature is 250±10℃. The nozzle feeds the material layer by layer, and the laser quickly solidifies the resin powder to form the solidified abrasive layer, i.e., the grinding wheel abrasive layer.

[0085] (10) After passing the inspection, it becomes a finished grinding wheel (specification: 6A2-200*30*30*10*10mm).

[0086] Both Example 1 and Comparative Example 1 used 6A2-200*30*30*10*10mm type grinding wheels (end-face grinding wheels) with the same formulation and substrate material. The difference was that the substrate mating surface of Example 1 was densely covered with blind holes of 100 μm diameter, 200 μm depth, and tilted at a 60° angle to the vertical direction, while the substrate mating surface of Comparative Example 1 was only a standard sandblasted surface. The rotational tests (GB / T 2493-2013 Rotational Test Method for Grinding Wheels) of Example 1 and Comparative Example 1 were compared, and the results are shown in Table 2.

[0087] Table 2 Comparison of Example 1 and Comparative Example 1 As shown in Table 2, the combination of laser blind hole array and laser 3D curing process greatly improves the grinding wheel rotation safety of Example 1, and can better meet the demanding grinding requirements such as high-speed grinding, heavy-load grinding, and synchronous grinding of composite materials with large depth of cut.

[0088] Comparative Example 2 The preparation method of the grinding wheel in this comparative example differs from that in Example 1 in that it uses ordinary diamond raw material as the abrasive. The specific preparation steps are as follows: (1) The TC4 titanium alloy substrate is machined to the dimensions shown in the drawing, and the machined substrate material is washed and dried to make the surface of the substrate material clean and free of foreign matter.

[0089] (2) Fix the substrate on the rotating shaft of the laser device. After startup, the substrate can rotate at a constant speed. Use a high-energy laser to drill holes on the outer circular surface of the substrate to form an inclined array of blind holes (micropores). The holes are inclined blind holes with a diameter of 100 μm, a depth of 200 μm, and an inclination angle of 60° to the vertical direction. The size of the micropores needs to facilitate the entry of the raw material powder of the subsequent abrasive layer.

[0090] The bonding area S between the abrasive layer and the substrate of the grinding wheel 总 5966 mm 2 The tangential force F experienced by the grinding wheel during the grinding process. 切向 and axial force F 轴向 The shear strength F of the abrasive layer is 25 MPa and 10 MPa, respectively. 剪切 The pressure is 60 MPa. The safety factor K is 1.2.

[0091] According to the preset drilling path ( Figure 1-1 The substrate is rotated synchronously and the laser is moved, so that the substrate bonding surface is uniformly distributed with an inclined array of micropores. According to formulas (1)-(3), the number of micropores is calculated as follows: N 切向 ≈316700, N 轴向 ≈198900, therefore the required tilted micropores N≈380040.

[0092] (3) Weigh out 35 wt% of ordinary diamond raw material, 25 wt% of TPN-03 phthalonitrile resin, 7 wt% of KR-44 amine-modified titanate reinforcing agent, 10 wt% of titanium hydride, 5 wt% of zinc oxide, 13 wt% of copper powder, and 5 wt% of graphite powder as raw materials for the abrasive layer of the grinding wheel. All raw materials are commercially available and have a particle size of less than 30 micrometers.

[0093] (4) Mix the abrasive layer raw material powder from step (3) thoroughly and evenly, and pour it into the 3D photocuring device.

[0094] (5) Place the laser-processed substrate in the forming chamber and locate the origin.

[0095] (6) The abrasive layer is formed using a laser 3D photopolymerization device. The abrasive layer raw material powder is fed to the substrate surface and the interior of the micropore array through the feeding nozzle. The laser beam diameter is 100 μm and the binder melt pool temperature is 250±10℃. The nozzle feeds the material layer by layer, and the laser quickly solidifies the resin powder to form the solidified abrasive layer, i.e., the grinding wheel abrasive layer.

[0096] (10) After passing the inspection, it becomes a finished grinding wheel (specification: 6A2-200*30*30*10*10mm).

[0097] Figure 6 shows micrographs of the surfaces of the grinding wheels prepared in Example 1 and Comparative Example 2. It can be seen that the coated abrasive has good heat resistance and maintains better holding force after laser processing. Comparative Example 2 uses ordinary abrasive, and there is significant abrasive shedding. In practical use, the grinding wheel of Example 1 has a longer lifespan and higher grinding efficiency, and can better meet the demanding grinding requirements of high-speed grinding, heavy-duty grinding, and simultaneous grinding of composite materials with large depths of cut.

[0098] Comparative Example 3 The preparation method of the grinding wheel in this comparative example differs from that in Example 1 in that the resin material used is different. The specific steps are as follows: (1) The TC4 titanium alloy substrate is machined to the dimensions shown in the drawing, and the machined substrate material is washed and dried to make the surface of the substrate material clean and free of foreign matter.

[0099] (2) Fix the substrate on the rotating shaft of the laser device. After startup, the substrate can rotate at a constant speed. Use a high-energy laser to drill holes on the outer circular surface of the substrate to form an inclined array of blind holes (micropores). The holes are inclined blind holes with a diameter of 100 μm, a depth of 200 μm, and an inclination angle of 60° to the vertical direction. The size of the micropores needs to facilitate the entry of the raw material powder of the subsequent abrasive layer.

[0100] The bonding area S between the abrasive layer and the substrate of the grinding wheel 总 5966 mm 2The tangential force F experienced by the grinding wheel during the grinding process. 切向 and axial force F 轴向 The shear strength F of the abrasive layer is 25 MPa and 10 MPa, respectively. 剪切 The pressure is 60 MPa. The safety factor K is 1.2.

[0101] According to the preset drilling path ( Figure 1-1 The substrate is rotated synchronously and the laser is moved, so that the substrate bonding surface is uniformly distributed with an inclined array of micropores. According to formulas (1)-(3), the number of micropores is calculated as follows: N 切向 ≈316700, N 轴向 ≈198900, therefore the required tilted micropores N≈380040.

[0102] (3) Weigh out 35 wt% titanium carbide-coated diamond, 29 wt% phenolic resin, 3 wt% hexamethylenetetramine curing agent, 10 wt% titanium hydride, 5 wt% zinc oxide, 13 wt% copper powder, and 5 wt% graphite powder as raw materials for the abrasive layer of the grinding wheel. All raw materials are commercially available and have a particle size of less than 30 micrometers.

[0103] (4) Mix the abrasive layer raw material powder in step (3) thoroughly and evenly, place the matrix in the molding mold, pour in the mixed raw material powder, spread the material evenly and vibrate it.

[0104] (5) Hot pressing is performed using molding equipment. The hot pressing temperature is 180±10℃. After the mold cools, the abrasive layer solidifies, which is the grinding wheel abrasive layer.

[0105] (6) According to the drawings, the molded abrasive is processed to obtain the final shape and size of the grinding wheel.

[0106] (7) After passing the inspection, it becomes a finished grinding wheel (specification: 6A2-200*30*30*10*10mm).

[0107] The wear ratios of Example 1 and Comparative Example 3 were tested according to standard JB / T 3235 (Method for Determining the Wear Ratio of Polycrystalline Diamond). The wear ratio results showed that the ratio of grinding wheel to workpiece in Example 1 was 1:135, while that in Comparative Example 1 was 1:92. It is evident that the resin system of Example 1 exhibits better heat resistance, lower thermal expansion, better abrasive retention, and a tighter bond with the matrix; its lifespan is significantly longer than that of traditional phenolic resin grinding wheels (Comparative Example 3), with lower overall cost, making it better suited to meet the demanding grinding requirements of high-speed grinding, heavy-duty grinding, and simultaneous grinding of composite materials with large depths of cut.

[0108] Furthermore, regarding the molding process, Example 1 uses laser 3D curing, while Comparative Example 3 uses ordinary high-temperature molding. Given that the molding process of Comparative Example 3 requires customized molds, consumes more energy, and necessitates subsequent machining, the overall production cost of the grinding wheel is higher.

[0109] The phthalonitrile resin system used in this invention has superior heat resistance compared to traditional phenolic resins, and its coefficient of thermal expansion (resistance to heat deformation and abrasive holding power) is superior to that of polyimide resins, thus meeting the processing requirements under conditions of high grinding heat and high grinding vibration. The accompanying laser processing technology ensures sufficient and rapid curing of the binder and improves the bonding strength between the abrasive layer and the substrate.

[0110] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A laser-processed grinding wheel, comprising a grinding wheel substrate and a grinding wheel abrasive layer, characterized in that, The grinding wheel substrate has an inclined array of blind holes on its end face, and the grinding wheel abrasive layer is located on the end face of the grinding wheel substrate and within the array of blind holes. The raw materials of the grinding wheel abrasive layer, by mass fraction, include 10-40 wt% abrasive, 10-40 wt% phthalonitrile resin, 1-10 wt% amino-modified titanate, and 20-50 wt% auxiliary materials. The abrasive is diamond or cubic boron nitride with a coating on its surface, and the coating material is selected from any one of titanium plating, titanium carbide, titanium nitride, titanium aluminum nitride, and titanium carbonitride. The above-mentioned method for preparing laser-processed grinding wheels includes the following steps: (1) The matrix material is processed, cleaned and dried; wherein the matrix material is a titanium alloy or a titanium-containing composite material; (2) Fix the substrate after step (1) and use a high-energy laser to drill holes in the substrate to form an inclined array of blind holes on the end face of the substrate; (3) After the raw materials of the grinding wheel abrasive layer are mixed evenly, they are introduced into the laser 3D printing equipment and layered on the end face of the substrate and the array blind holes in step (2). The raw material powder is cured by laser light to form the grinding wheel abrasive layer, and then the laser-processed grinding wheel is formed.

2. The laser-processed grinding wheel according to claim 1, characterized in that, The phthalonitrile resin is a phthalonitrile resin with amine groups in its main chain.

3. The laser-processed grinding wheel according to claim 2, characterized in that, The auxiliary materials include at least one of titanium hydride powder, zinc oxide, copper powder, graphite powder, and silicon carbide.

4. The laser-processed grinding wheel according to claim 3, characterized in that, The angle of the array blind aperture is 10-80°.

5. The laser-processed grinding wheel according to any one of claims 1-4, characterized in that, The diameter of the array of blind holes is 2-6 times the diameter of the coarsest powder particles in the raw material, and the depth is 1-20 times the diameter of the coarsest powder particles in the raw material.

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