Wafer teaching leveling device applied to loading cavity in vacuum environment

Abstract

The embodiment of the application discloses a wafer teaching leveling device applied to a loading cavity in a vacuum environment. The wafer teaching leveling device applied to the loading cavity in the vacuum environment comprises a leveling mechanism, a dynamic sealing mechanism, a loading mechanism and a teaching mechanism. The leveling mechanism comprises a leveling plate, at least three first guide sleeves and a corresponding number of leveling struts. The first guide sleeves are arranged on a top cover of the loading cavity, the leveling struts are arranged in the first guide sleeves, and the leveling struts have telescopic functions. The leveling plate is arranged on the top end of the leveling struts, and the center part of the leveling plate is provided with a first mounting hole. The wafer teaching leveling device applied to the loading cavity in the vacuum environment improves the leveling efficiency and accuracy, and greatly improves the application range of leveling.

Description

Technical Field

[0001] The present invention relates to the field of chip manufacturing technology, and in particular to a wafer teaching and leveling device for a loading cavity in a vacuum environment. Background Technology

[0002] In chip manufacturing, wafers need to be transported between various processes to facilitate their flow. To protect the wafers and prevent contamination, they must be transported under vacuum. Simultaneously, to avoid inaccurate wafer positioning due to movement during transport and high damage rates caused by collisions between the wafer transport mechanism and the wafer, wafer positioning is necessary before transport or in case of abnormalities. For example, if wafer movement occurs during transport or the accuracy of the wafer transport equipment decreases, the wafer needs to be re-inspected and repositioned to ensure that the wafer transport (primarily horizontal positioning) meets production requirements.

[0003] However, current wafer transport methods mostly involve vacuum transport within loading cavities. Existing loading cavities rely on manual inspection, positioning, and adjustment of wafers through observation windows. This process is inefficient and inaccurate, requiring production line shutdowns and consuming significant time for each adjustment. Furthermore, when the loading cavity itself experiences horizontal issues, the wafer's position (primarily horizontal) cannot be adjusted by adjusting the wafer support, hindering efficient adjustment of problematic wafers and severely impacting production schedules. Summary of the Invention

[0004] This invention provides a wafer teaching and leveling device for a loading cavity in a vacuum environment. Addressing the shortcomings of existing methods for leveling wafers placed in a loading cavity when their horizontal position exceeds the allowable range, which suffers from low efficiency and poor accuracy, and is particularly difficult to adapt to situations where wafers require fine-tuning due to problems with the loading cavity itself, this invention adopts a novel design approach that combines internal and external detection and leveling. This not only improves leveling efficiency and accuracy but also significantly expands its applicability.

[0005] The present invention provides a wafer teaching and leveling device for a loading cavity in a vacuum environment. The FOUP box is located in the loading cavity to accommodate the wafer and includes: a leveling mechanism, a dynamic sealing mechanism, a loading mechanism and a teaching mechanism. The leveling mechanism includes: a leveling plate, at least three first guide sleeves and a corresponding number of leveling supports; the first guide sleeves are disposed on the top cover of the loading cavity, the leveling supports are disposed inside the first guide sleeves, and the leveling supports have a telescopic function; the leveling plate is disposed on the top of the leveling supports, and the center of the leveling plate is provided with a first mounting hole. The dynamic sealing mechanism includes: a first sealing cylinder, a first bellows, a second sealing cylinder, a third sealing cylinder, a second bellows, and a fourth sealing cylinder; The cover plate of the loading cavity is provided with a second mounting hole, the first sealing cylinder is disposed at the lower part of the adjusting plate, the second sealing cylinder is disposed at the second mounting hole, the upper end of the first bellows is disposed on the first sealing cylinder, and the lower end of the first bellows is disposed on the second sealing cylinder. The loading mechanism includes: a second guide sleeve, a loading rod, a rotating nut, and a handle; The second guide sleeve is disposed in the first mounting hole, and the second guide sleeve is provided with a third mounting hole. The loading rod is disposed in the third mounting hole, the third sealing cylinder is disposed at the bottom of the loading rod, and the fourth sealing cylinder is disposed at the bottom of the adjusting plate. The two ends of the second bellows are respectively connected to the second sealing cylinder and the fourth sealing cylinder. The rotating nut is located above the adjusting plate and is rotatably disposed on the loading rod. The handle is disposed on the rotating nut. The teaching mechanism includes: a magnetically coupled actuator, a teaching pin, and a teaching wafer; the FOUP box is disposed at the bottom of the loading rod, the loading rod has a hollow structure inside, the magnetically coupled actuator is disposed at the top of the loading rod, the teaching pin is disposed within the hollow structure and on the magnetically coupled actuator; a first teaching hole is provided at the top center of the FOUP box, the teaching wafer can be disposed inside the FOUP box, the teaching wafer has a second teaching hole, and the teaching pin corresponds to the positions of the first teaching hole and the second teaching hole.

[0006] Optionally, the leveling support includes: a leveling column and a first actuating mechanism, wherein the first actuating mechanism is disposed on the top cover and the leveling column is disposed on the first actuating mechanism.

[0007] Optionally, the first actuation mechanism includes: a first magnetic coupling component, a spring, and a second magnetic coupling component; The first magnetic coupling component is disposed on the top cover, the second magnetic coupling component is disposed at the bottom of the leveling column, and the spring is disposed between the first magnetic coupling component and the second magnetic coupling component. The first magnetic coupling component and the second magnetic coupling component attract or repel each other after being energized.

[0008] Optionally, it further includes: a teaching light source and an amplifier, wherein the teaching light source is disposed on the teaching pin, the bottom of the FOUP box is provided with a third mounting hole, and the amplifier is disposed in the third mounting hole.

[0009] Optionally, it further includes: a detector, wherein the bottom of the loading cavity is provided with a fourth mounting hole, and the detector is disposed in the fourth mounting hole.

[0010] Optionally, it also includes a color plate disposed below the amplifier.

[0011] Optionally, it further includes: a rotating mechanism, wherein the teaching pin is disposed on the rotating mechanism, and the rotating mechanism is disposed on the magnetically coupled actuator.

[0012] Optionally, the amplifier is provided with an arcuate surface.

[0013] Optionally, the top cover is provided with multiple observation windows.

[0014] Optionally, it also includes a handle disposed on the top cover.

[0015] The beneficial effects of the wafer teaching and leveling device for a loading cavity in a vacuum environment provided by this invention are as follows: By adopting the above structure, wafer teaching and adjustment can be performed efficiently and accurately, improving the efficiency of teaching and adjustment, without affecting the vacuum environment in the loading cavity, avoiding wafer contamination, and reducing wafer damage rate. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a first-view perspective perspective view of the wafer teaching and leveling device applied to a loading cavity in a vacuum environment in an embodiment of the present invention; Figure 2 This is a second-view perspective perspective of a wafer teaching and leveling device applied to a loading cavity in a vacuum environment, as described in an embodiment of the present invention. Figure 3 This is a third-view perspective view of a wafer teaching and leveling device applied to a loading cavity in a vacuum environment, as described in an embodiment of the present invention. Figure 4 This is a bottom view of a wafer teaching and leveling device applied to a loading cavity in a vacuum environment, as described in an embodiment of the present invention. Figure 5 This is a top view of a wafer teaching and leveling device applied to a loading cavity in a vacuum environment, as described in an embodiment of the present invention. Figure 6 This is a cross-sectional view (AA) of a wafer teaching and leveling device applied to a loading cavity in a vacuum environment, as described in an embodiment of the present invention. Figure 7 This is a BB cross-sectional view of a wafer teaching and leveling device applied to a loading cavity in a vacuum environment, as described in an embodiment of the present invention. Figure 8 This is a partially enlarged view (I) of the wafer teaching and leveling device applied to a loading cavity in a vacuum environment according to an embodiment of the present invention; Figure 9 This is a partial enlarged view II of the wafer teaching and leveling device applied to the loading cavity in a vacuum environment in an embodiment of the present invention; Figure 10 This is a partial enlarged view (III) of the wafer teaching and leveling device applied to the loading cavity in a vacuum environment according to an embodiment of the present invention; Figure 11 IV is a partially enlarged view of the wafer teaching and leveling device applied to the loading cavity in a vacuum environment in an embodiment of the present invention; Figure 12 This is a partially enlarged view V of the wafer teaching and leveling device applied to the loading cavity in a vacuum environment in an embodiment of the present invention; Figure 13 This is a partially enlarged view (VI) of a wafer teaching and leveling device applied to a loading cavity in a vacuum environment, as described in an embodiment of the present invention. Figure 14 This is a schematic diagram illustrating the principle of non-destructive teaching using a wafer teaching and leveling device applied to a loading cavity in a vacuum environment, as described in this embodiment of the invention.

[0018] Numbering on the map: 1. FOUP box; 101. Wafer rack; 102. Observation window; 103. First sealing step; 2. Loading cavity; 201. Inlet / outlet; 202. Loading cavity; 203. Top cover; 204. Second mounting hole; 3. Leveling mechanism; 301. Leveling support; 3011. Leveling column; 3012. First actuation mechanism; 302. First guide sleeve; 303. Adjusting plate; 304. First mounting hole; 4. First dynamic sealing mechanism; 401. First sealing cylinder; 402. First bellows; 403. Second sealing cylinder; 4'. Second dynamic sealing structure; 404. Third seal 405. Second bellows; 406. Fourth sealing cylinder; 5. Loading mechanism; 501. Handle; 502. Rotary nut; 503. Second guide sleeve; 504. Third mounting hole; 6. Teaching mechanism; 601. Teaching wafer; 602. First teaching hole; 603. Teaching needle; 604. Teaching light source; 605. Cable routing hole; 606. Magnetic coupling actuator; 607. Coupling guide rail; 608. Amplifier; 609. Detector; 610. First fixing member; 611. Second fixing member; 612. Arc surface; 7. Wafer box; 8. Wafer; 9. Clamp; 10. Loading rod. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0021] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances. The technical solutions of this invention are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments.

[0022] Figure 1 This is a first-view perspective perspective view of the wafer teaching and leveling device applied to a loading cavity in a vacuum environment, as described in an embodiment of the present invention. Figure 2 This is a second-view perspective perspective view of the wafer teaching and leveling device applied to a loading cavity in a vacuum environment, as described in an embodiment of the present invention. Figure 3 This is a third-view perspective view of a wafer teaching and leveling device applied to a loading cavity in a vacuum environment, as described in an embodiment of the present invention. Figure 4 This is a bottom view of a wafer teaching and leveling device applied to a loading cavity in a vacuum environment, as described in an embodiment of the present invention. Figure 5 This is a top view of a wafer teaching and leveling device applied to a loading cavity in a vacuum environment, as described in an embodiment of the present invention. Figure 6 This is a cross-sectional view (AA) of a wafer teaching and leveling device applied to a loading cavity in a vacuum environment, as described in an embodiment of the present invention. Figure 7This is a BB cross-sectional view of a wafer teaching and leveling device applied to a loading cavity in a vacuum environment, as described in an embodiment of the present invention. Figure 8 This is a partially enlarged view (I) of a wafer teaching and leveling device applied to a loading cavity in a vacuum environment, as described in an embodiment of the present invention. Figure 9 This is a partially enlarged view (II) of the wafer teaching and leveling device applied to a loading cavity in a vacuum environment, as described in an embodiment of the present invention. Figure 10 This is a partially enlarged view (III) of the wafer teaching and leveling device applied to a loading cavity in a vacuum environment according to an embodiment of the present invention. Figure 11 IV is a partially enlarged view of the wafer teaching and leveling device applied to the loading cavity in a vacuum environment according to an embodiment of the present invention. Figure 12 This is a partially enlarged view V of the wafer teaching and leveling device applied to a loading cavity in a vacuum environment, as described in an embodiment of the present invention. Figure 13 This is a partially enlarged view (VI) of a wafer teaching and leveling device applied to a loading cavity in a vacuum environment, as described in an embodiment of the present invention. Figure 14 This is a schematic diagram illustrating the principle of non-destructive teaching using a wafer teaching and leveling device applied to a loading cavity in a vacuum environment, as described in this embodiment of the invention.

[0023] like Figures 1 to 14 As shown, the wafer teaching and leveling device for a loading cavity in a vacuum environment provided by the present invention has a FOUP box 1 located in the loading cavity 202 of the loading cavity 2 for accommodating a wafer 8. The wafer teaching and leveling device for a loading cavity in a vacuum environment includes: a leveling mechanism 3, a dynamic sealing mechanism, a loading mechanism 5, and a teaching mechanism 6.

[0024] To improve the efficiency and accuracy of leveling, the leveling mechanism 3 includes: a leveling plate, at least three first guide sleeves 302, and a corresponding number of leveling supports 301. Figures 1 to 3 As shown, there are three first guide sleeves 302 and three leveling supports 301. The first guide sleeves 302 are mounted on the top cover 203 of the loading cavity by screws. The leveling supports 301 have independent telescopic functions. "Independent" means that the telescopic lengths of the three leveling supports 301 can be different. "Telescopic function" means that the distance between the top of the leveling support 301 and the top cover 203 of the loading cavity 2 can be adjusted by changing the length of the leveling support 301. The first guide sleeve 302 has a hollow structure, and the leveling support 301 is placed inside the first guide sleeve 302. The function of the first guide sleeve 302 is to fix the direction of the leveling support 301, so that the leveling support 301 can only move along the axial direction of the first guide sleeve. The adjusting plate 303 is placed on the top of the leveling support 301. The connection between the adjusting plate 303 and the leveling support 301 has multiple degrees of freedom of adjustment capability. One possible connection method is a hinge connection, specifically a horizontally rotatable vertical hinge connection. It should be noted that in Figure 6 In this design, the top of the leveling support 301 is connected to the leveling plate 303 via a nut. In reality, the top of the leveling support 301 and the nut-covered portion on the upper part of the leveling plate are separate; that is, the connection between the leveling support 301 and the leveling plate 303 is hinged. The lower part of the leveling plate 303 is part of the hinged portion of the leveling support 301, while the upper part of the leveling plate 303 is another part of the hinged portion that mates with the leveling support. Both are components of the leveling support 301. The center of the leveling plate 303 has a first mounting hole 304, which is used to install subsequent mechanisms.

[0025] like Figure 2 As shown, the dynamic sealing mechanism includes a first dynamic sealing structure and a second dynamic sealing structure. The first dynamic sealing structure, also known as the outer sealing structure, includes a first sealing cylinder 401, a first bellows 402, and a second sealing cylinder 403. The second dynamic sealing structure, also known as the inner sealing structure, includes a third sealing cylinder 404, a second bellows 405, and a fourth sealing cylinder 406.

[0026] The top cover 203 of the loading cavity 202 is provided with a second mounting hole 204. The first sealing cylinder 401 is provided at the lower part of the adjusting plate 303, and the second sealing cylinder 403 is provided at the second mounting hole 204. The upper and lower ends of the first bellows 402 are respectively provided on the first sealing cylinder 401 and the second sealing cylinder 403.

[0027] The loading mechanism 5 includes a second guide sleeve 503, a loading rod 10, a rotating nut 502, and a handle 501. The second guide sleeve 503 is disposed on the first mounting hole 304. It should be noted that the second guide sleeve 503 and the rotating nut 502 should maintain a sealed state through the first mounting hole 304, that is, the two also form a dynamic seal.

[0028] The second guide sleeve 503 is provided with a third mounting hole 504. The loading rod 10 is set in the third mounting hole 504. The third sealing cylinder 404 is set at the bottom of the loading rod 10. The fourth sealing cylinder 406 is set at the bottom of the adjusting plate 303. The upper and lower ends of the second bellows 405 are respectively set on the third sealing cylinder 404 and the fourth sealing cylinder 406, forming the second dynamic sealing structure 4', i.e., the inner seal.

[0029] The bottom of the loading rod 10 is connected to the FOUP box 1, which contains the wafer 8. The loading rod 10 is used to move the FOUP box up and down. The handle 501 is connected to the rotating nut 502, which is used to rotate the nut 502. The rotating nut 502 has an internal thread, and the outer surface of the loading rod 10 has an external thread. The internal and external threads cooperate with each other. Rotating the handle 501 can make the loading rod move the FOUP box up and down. To prevent pressure loss due to pressure changes caused by the rotating nut 502 disengaging, a groove and a clamp 9 can be provided at the top position where the rotating nut 502 contacts the second guide sleeve 503. The clamp 9 is fixed on the second guide sleeve 503, so that the rotating nut 502 and the second guide sleeve 503 maintain a dynamic seal and do not disengage.

[0030] The teaching mechanism includes: a magnetically coupled actuator 606, a teaching pin 603, and a teaching wafer 601; the FOUP box 1 is located at the bottom of the loading rod 10, and the loading rod 10 has a hollow structure inside (such as...). Figure 6 The diagram shows a hollow circular cylinder. The magnetic coupling actuator 606 is located at the top of the loading rod 10, and the teaching pin 603 is located inside the hollow structure and on the magnetic coupling actuator 606. A first teaching hole 602 is located at the top center of the FOUP box 1. The teaching wafer 601 can be located inside the FOUP box 1. A second teaching hole (usually located at the center of the wafer, not shown in the figure) is located on the teaching wafer 601. The teaching pin corresponds to the positions of the first teaching hole and the second teaching hole.

[0031] The core working principle of this invention is as follows: multiple leveling supports 301 cooperate with each other to adjust the leveling plate 303, and adjust the horizontal position of the wafer in the FOUP box through the loading mechanism and loading rod, so that the position of the wafer is kept within a preset range from the horizontal position of the robot arm to be docked, so that even if the wafer is in a non-permissible horizontal range, it can still cooperate with the robot arm to perform the picking action; similarly, when it is necessary to place the wafer, the FOUP box in the loading cavity can also be adjusted to place the wafer to be placed in a preset spatial position, so that the wafer can be smoothly adjusted to maintain a horizontal state after placement without collision.

[0032] Optionally, such as Figure 8 As shown, the leveling support includes a leveling column 3011 and a first actuation mechanism 3012. The first actuation mechanism 3012 is disposed on the top cover 203, and the leveling column 3011 is disposed on the first actuation mechanism 3012. The first actuation mechanism 3012 is used to generate a force between the leveling column 3011 and the top cover 203 to adjust the height of the leveling column 3011.

[0033] Optionally, the first actuation mechanism 3012 includes: a first magnetic coupling component, a spring, and a second magnetic coupling component; The first magnetic coupling component is disposed on the top cover 203, the second magnetic coupling component is disposed at the bottom of the leveling column 3011, and the spring is disposed between the first magnetic coupling component and the second magnetic coupling component. After being energized, the first magnetic coupling component and the second magnetic coupling component attract or repel each other. The height of the leveling column 3011 is adjusted by adjusting the elastic force of the spring.

[0034] Optionally, it also includes: a teaching light source 604 and an amplifier 608, wherein the teaching light source 604 is disposed on the teaching pin 603, and the bottom of the FOUP box 1 is provided with a third mounting hole, and the amplifier 608 is disposed in the third mounting hole. Figure 6 , Figure 7 , Figure 9 and Figure 14 As shown, the amplifier is used to amplify the light emitted from the teaching light source 604 (such as a detection laser). Since the light spot distribution distance D is greater than d, based on D and d and the distance between the teaching light source 604 and the amplifier 608, it is possible to calculate whether the position of the teaching wafer 601 meets the requirements and exceeds the maximum allowable offset. Then, it is possible to calculate whether the teaching wafer is in a horizontal state and how to adjust the relevant mechanisms accordingly.

[0035] Optionally, it also includes a detector 609, wherein a fourth mounting hole is provided at the bottom of the loading cavity 202, and the detector 609 is disposed in the fourth mounting hole. It should be noted that an auxiliary mounting bracket is required for mounting the detector 609. Figure 4 The second fastener 611 shown can be a support plate adapted to the fourth mounting hole.

[0036] Optionally, it also includes: a color plate, such as Figure 10 As shown, the color plate is Figure 10 The first fixing member 610 serves to fix the amplifier 608. To meet the requirements for detecting light propagation, the first fixing member 610 should be made of a transparent material (such as glass). The color plate is also made of a transparent material; for example, different colors can be used for different diameter ranges. By placing the color plate below the amplifier 608, the different colors can be used to observe and determine whether the teaching wafer is level.

[0037] Optionally, it also includes: a rotating mechanism, such as Figure 6 and Figure 7 As shown, the teach pendant 603 is mounted on a rotating mechanism, which in turn is mounted on a magnetically coupled actuator. The magnetically coupled actuator drives the teach pendant 603 to move up and down. The rotating mechanism, such as a disc driven by a motor, can rotate the teach pendant 603, thereby making the teach light source rotate in a circular shape. The distribution of the circular area is then used to determine whether the teach wafer 601 is horizontal.

[0038] Optionally, the amplifier is provided with an arcuate surface 612, such as Figure 10 As shown, by setting the arc-shaped surface 612, a simple optical amplifier is provided.

[0039] Optionally, the top cover is provided with multiple observation windows 102, such as Figure 2 As shown, this is for the user's convenience in observing.

[0040] Optionally, it also includes a handle, which is disposed on the top cover 203 for convenient user movement.

[0041] The beneficial effects achieved by the above-described embodiments of the present invention using the above-described technical solution are as follows: by adopting the above-described structure, the detection, teaching and adjustment of wafers can be carried out efficiently and accurately, improving the efficiency of teaching and adjustment, without affecting the vacuum environment in the loading cavity, avoiding contamination of the wafer, and reducing the wafer damage rate; at the same time, since wafer leveling can be performed under the simulation of wafer transportation conditions, the applicable range is wider.

[0042] In this invention, unless otherwise explicitly specified and limited, the first feature being "on" or "under" the second feature can mean that the first feature and the second feature are in direct contact, or that the first feature and the second feature are in indirect contact through an intermediate medium.

[0043] Furthermore, "above," "on top of," and "above" the first feature in relation to the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "under," and "beneath" the first feature in relation to the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0044] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0045] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer teaching and leveling device for use in a loading cavity under vacuum conditions, wherein the FOUP box is located within the loading cavity to accommodate the wafer, characterized in that, include: Leveling mechanism, dynamic sealing mechanism, loading mechanism, and teaching mechanism; The leveling mechanism includes: a leveling plate, at least three first guide sleeves and a corresponding number of leveling supports; the first guide sleeves are disposed on the top cover of the loading cavity, the leveling supports are disposed inside the first guide sleeves, and the leveling supports have a telescopic function; the leveling plate is disposed on the top of the leveling supports, and the center of the leveling plate is provided with a first mounting hole. The dynamic sealing mechanism includes: a first sealing cylinder, a first bellows, a second sealing cylinder, a third sealing cylinder, a second bellows, and a fourth sealing cylinder; The cover plate of the loading cavity is provided with a second mounting hole, the first sealing cylinder is disposed at the lower part of the adjusting plate, the second sealing cylinder is disposed at the second mounting hole, the upper end of the first bellows is disposed on the first sealing cylinder, and the lower end of the first bellows is disposed on the second sealing cylinder. The loading mechanism includes: a second guide sleeve, a loading rod, a rotating nut, and a handle; The second guide sleeve is disposed in the first mounting hole, and the second guide sleeve is provided with a third mounting hole. The loading rod is disposed on the third mounting hole. The third sealing cylinder is disposed at the bottom of the loading rod, and the fourth sealing cylinder is disposed at the bottom of the adjusting plate. The two ends of the second bellows are respectively connected to the third sealing cylinder and the fourth sealing cylinder. The rotating nut is located above the adjusting plate and is rotatably disposed on the loading rod. The handle is disposed on the rotating nut. The teaching mechanism includes: a magnetically coupled actuator, a teaching pin, and a teaching wafer; the FOUP box is disposed at the bottom of the loading rod, the loading rod has a hollow structure inside, the magnetically coupled actuator is disposed at the top of the loading rod, the teaching pin is disposed within the hollow structure and on the magnetically coupled actuator; a first teaching hole is provided at the top center of the FOUP box, the teaching wafer is disposed inside the FOUP box, the teaching wafer has a second teaching hole, and the teaching pin corresponds to the positions of the first teaching hole and the second teaching hole.

2. The wafer teaching and leveling device according to claim 1, characterized in that, The leveling support includes a leveling column and a first actuating mechanism, wherein the first actuating mechanism is disposed on the top cover and the leveling column is disposed on the first actuating mechanism.

3. The wafer teaching and leveling device according to claim 2, characterized in that, The first actuating mechanism includes: a first magnetic coupling component, a spring, and a second magnetic coupling component; The first magnetic coupling component is disposed on the top cover, the second magnetic coupling component is disposed at the bottom of the leveling column, and the spring is disposed between the first magnetic coupling component and the second magnetic coupling component. The first magnetic coupling component and the second magnetic coupling component attract or repel each other after being energized.

4. The wafer teaching and leveling device according to claim 1, characterized in that, Also includes: The teaching light source and amplifier are provided. The teaching light source is disposed on the teaching pin. The bottom of the FOUP box is provided with a third mounting hole, and the amplifier is disposed in the third mounting hole.

5. The wafer teaching and leveling device according to claim 4, characterized in that, Also includes: The detector is provided with a fourth mounting hole at the bottom of the loading cavity, and the detector is disposed in the fourth mounting hole.

6. The wafer teaching and leveling device according to claim 5, characterized in that, Also includes: A color plate, which is positioned below the amplifier.

7. The wafer teaching and leveling device according to claim 6, characterized in that, Also includes: A rotating mechanism, wherein the teaching pin is mounted on the rotating mechanism, and the rotating mechanism is mounted on the magnetically coupled actuator.

8. The wafer teaching and leveling device according to claim 7, characterized in that, The amplifier has an arc-shaped surface.

9. The wafer teaching and leveling apparatus according to any one of claims 1 to 8, characterized in that, The top cover is equipped with multiple observation windows.

10. The wafer teaching and leveling device according to claim 9, characterized in that, Also includes: A handle is provided on the top cover.

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