Construction method for interlayer electrical connection of stretchable electronic system
By employing room temperature chemical copper plating and rigid island design in three-dimensional stretchable integrated circuits, the mechanical stability and electrical reliability issues of traditional interlayer interconnect technology under high tensile strain are solved, achieving efficient interlayer electrical connection and improving the tensile strength and electrical stability of three-dimensional stretchable circuits.
CN121123115APending Publication Date: 2025-12-12NORTHWESTERN POLYTECHNICAL UNIV
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Patent Information
- Application Number
- CN202511157284.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-19
- Publication Date
- 2025-12-12
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Figure CN121123115A_ABST
Abstract
The invention discloses a construction method for interlayer electric connection of a stretchable electronic system, and relates to the technical field of flexible electronics. The invention provides an effective scheme for constructing a vertical interconnection path based on a through hole metallization process mainly aiming at the problem of interlayer interconnection stability of a three-dimensional stretchable electronic system. And a high-reliability vertical interconnection structure is formed in the rigid island region through mechanical punching and chemical copper plating processes, so that stable conduction of the stretchable three-dimensional integrated circuit under a complex deformation condition is realized.
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