Back-to-back loudspeaker structure

Abstract

The application discloses a back-to-back loudspeaker structure, and relates to the technical field of loudspeakers, wherein the back-to-back loudspeaker structure comprises a support, a magnetic circuit assembly, a vibration assembly and a circuit assembly, the support is formed with a mounting hole; the magnetic circuit assembly comprises a magnetic conductor, two magnets and two Hals; the magnetic conductor is arranged on the hole wall of the mounting hole, each magnet and the corresponding Hal and the magnetic conductor form a magnetic circuit space; the vibration assembly comprises two voice coils and two sound membranes, each sound membrane and the support and the magnetic conductor form a sound cavity, and each voice coil is located in a magnetic circuit space; the circuit assembly comprises two flexible circuit boards which are electrically connected, each flexible circuit board is electrically connected with a voice coil; the support is further formed with a connecting hole which is communicated with the two sound cavities; the outer peripheral wall of the support is provided with a wiring hole which is communicated with the connecting hole, each flexible circuit board is inserted into the connecting hole and passes through the connecting hole, and is exposed on the wiring hole to be electrically connected with external elements.

Description

Technical Field

[0001] This invention relates to the field of loudspeaker technology, and in particular to a back-to-back loudspeaker structure. Background Technology

[0002] With portable electronic devices becoming increasingly thinner and lighter, miniature loudspeakers need to provide higher sound pressure levels and better low-frequency response within a smaller rear cavity space. In order to overcome the bottlenecks of traditional single-driver loudspeakers in terms of magnetic circuit size, diaphragm travel, and heat dissipation capacity, a double-sided resonant structure has emerged in the industry: two loudspeaker units are arranged back to back along a shared magnetic circuit, in order to superimpose the output sound power without increasing the size of the single unit.

[0003] To achieve synchronous driving of two speaker units, it is usually necessary to set solder pads or wires for each speaker unit, and then lead them out to the main board of the device through an integrated plastic-coated internal solder terminal board and bracket, resulting in a complex speaker structure and high processing difficulty. Summary of the Invention

[0004] The main objective of this invention is to propose a back-to-back speaker structure, which aims to simplify the dual-speaker structure and reduce the manufacturing difficulty of the dual-speaker structure.

[0005] To achieve the above objectives, the present invention proposes a back-to-back speaker structure, comprising:

[0006] The bracket has mounting holes;

[0007] A magnetic circuit assembly includes a magnetic conductor, two magnets, and two washer; the magnetic conductor is disposed on the wall of the mounting hole, the two magnets are respectively disposed on opposite sides of the magnetic conductor along the axial direction of the bracket, and each washer is disposed at the end of a magnet away from the magnetic conductor; each magnet, the corresponding washer, and the magnetic conductor enclose a magnetic circuit space.

[0008] A vibration assembly, comprising two voice coils and two diaphragms, each diaphragm being disposed at the periphery of both ends of the mounting hole, each diaphragm, together with the bracket and the magnetic conductor, forming a sound cavity; each voice coil being disposed on one of the diaphragms, with the end of each voice coil furthest from the diaphragm located within the corresponding magnetic circuit space; and

[0009] The circuit assembly includes two electrically connected flexible circuit boards, each of which is electrically connected to a voice coil; the bracket also has a connection hole that connects the two acoustic cavities; the outer peripheral wall of the bracket has a wiring hole that communicates with the connection hole, and each flexible circuit board extends into the corresponding opening of the connection hole, passes through the connection hole, and is exposed in the wiring hole for electrical connection with external components. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0011] Figure 1 A schematic diagram of an embodiment of the back-to-back speaker structure provided by the present invention;

[0012] Figure 2 An exploded view of a back-to-back speaker structure;

[0013] Figure 3 This is a schematic diagram of the circuit components in a back-to-back speaker structure.

[0014] Figure 4 This is a schematic diagram of another embodiment of the back-to-back speaker structure;

[0015] Figure 5 for Figure 4 Sectional view along AA;

[0016] Figure 6 for Figure 4 A cross-sectional view along BB.

[0017] Explanation of icon numbers:

[0018]

[0019]

[0020] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0022] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0023] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0024] In existing technologies, miniature loudspeakers often employ a double-sided vibration structure to improve acoustic performance in order to meet the demand for thinner and lighter portable devices. Traditional solutions require individual solder pads or wires for each vibration unit, with external connections achieved through an integrated plastic-coated terminal block and bracket. This discrete wiring leads to structural complexity, increases assembly processes and material costs, and the multi-soldering design is prone to poor contact, reducing product reliability.

[0025] To address these issues, designers discovered that the core problem with traditional dual-sided loudspeakers lies in the redundancy caused by discrete wiring. Analysis revealed that integrating the circuit connections of the two voice coils into a single interface could eliminate redundant pads and wires. Further consideration revealed that the foldable nature of flexible circuit boards, combined with pre-installed routing channels within the bracket, allows for integrated wiring of the dual voice coil circuitry. The final solution was to construct circuit channels using shared connection holes and wiring holes, utilizing the flexible circuit board to achieve synchronous driving of the two voice coils throughout the bracket.

[0026] Accordingly, the present invention proposes a back-to-back speaker structure 1000. Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 as well as Figure 6 This is a schematic diagram of an embodiment of the back-to-back speaker structure 1000 provided by the present invention.

[0027] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 as well as Figure 5 This invention proposes a back-to-back speaker structure 1000, including a support 1, a magnetic circuit assembly, a vibration assembly, and a circuit assembly. The support 1 has a mounting hole 1a. The magnetic circuit assembly includes a magnetic conductor 21, two magnets 22, and two washer 23. The magnetic conductor 21 is disposed on the wall of the mounting hole 1a, and the two magnets 22 are respectively disposed on opposite sides of the magnetic conductor 21 along the axial direction of the support 1. Each washer 23 is disposed at the end of a magnet 22 away from the magnetic conductor 21. Each magnet 22, the corresponding washer 23, and the magnetic conductor 21 enclose a magnetic circuit space 21a. The vibration assembly includes two voice coils 31 and two diaphragms 32, each diaphragm 32 being disposed on the wall of the mounting hole 1a. At both ends, each diaphragm 32, together with the support 1 and the magnetic conductor 21, forms a sound cavity 1d; each voice coil 31 is disposed on a diaphragm 32, and the end of each voice coil 31 away from the diaphragm 32 is located in the corresponding magnetic circuit space 21a; the circuit assembly includes two electrically connected flexible circuit boards 41, each flexible circuit board 41 being electrically connected to a voice coil 31; the support 1 also forms a connection hole 1b, which connects the two sound cavities 1d; the outer peripheral wall of the support 1 has a wiring hole 1c that communicates with the connection hole 1b, and each flexible circuit board 41 extends into the corresponding opening of the connection hole 1b, passes through the connection hole 1b, and is exposed in the wiring hole 1c for electrical connection with external components.

[0028] Among them, the magnetic conductor 21 refers to a ring-shaped component with magnetic conductivity, which can be made of ferrite material and is used to construct a symmetrically distributed magnetic circuit system. The combination of magnet 22 and washer 23 refers to a stacked structure of permanent magnet and magnetic conductor sheet, which can be a combination of neodymium iron boron magnet 22 and low carbon steel washer 23, used to form a uniform magnetic field on both sides of the magnetic conductor 21. The flexible circuit board 41 refers to a bendable conductive circuit substrate, which can be an FPC board with polyimide substrate, used to replace traditional wires to realize the circuit connection of dual voice coil 31. The connection hole 1b refers to a through hole that penetrates the body of the bracket 1 and is used to provide a wiring channel for the flexible circuit board 41. The wiring hole 1c refers to an opening opened on the side wall of the bracket 1, which can be a rectangular groove structure, used to concentrate the power connection area of ​​the exposed flexible circuit board 41.

[0029] Specifically, the bracket 1 serves as the structural carrier, with its mounting holes 1a accommodating the magnetic conductor 21 to form the core of the magnetic circuit. Magnets 22 and washer 23 are symmetrically mounted on both sides of the magnetic conductor 21, forming two independent magnetic circuit spaces 21a. The diaphragm 32 is fixed to the edges of both ends of the mounting holes 1a, together with the bracket 1 and the magnetic conductor 21, forming a sealed acoustic cavity 1d. The root of the voice coil 31 is fixed to the diaphragm 32, with its free end extending into the corresponding magnetic circuit space 21a, driving the diaphragm 32 to vibrate under the action of the magnetic field. Two flexible circuit boards 41 are respectively connected to the two voice coils 31, converging through the connection holes 1b inside the bracket 1 to the wiring hole 1c, forming a unified external contact. This layout allows the dual voice coil 31 driving circuit to be integrated inside the bracket 1, eliminating the need for external solder pads or discrete wires. The assembly method involves sequentially mounting the magnetic conductor 21, two magnets 22, and two washer 23 onto the magnetic conductor 21. Then, two flexible circuit boards 41 are inserted into the connection holes 1b from both ends of the bracket 1. After insertion, both flexible circuit boards 41 are exposed in the wiring holes 1c. The voice coil 31 and the diaphragm 32 are then assembled. Finally, the circuit can be connected to external components through the wiring holes 1c. This design eliminates the need for the bracket 1 to be integrally molded with the internally soldered terminal board. Electrical connection to external components can be achieved simply by opening two holes on the bracket 1, thereby simplifying the dual-speaker structure and reducing the processing difficulty.

[0030] Please refer to Figure 2 and Figure 5 In one embodiment of the present invention, the mounting hole 1a is a stepped hole, which includes a first hole segment 1a1 and two second hole segments 1a2 connected to each other. The two second hole segments 1a2 are located at both ends of the first hole segment 1a1. The magnetic conductor 21 is disposed on the hole wall of the first hole segment 1a1, and each diaphragm 32 is disposed on the periphery of a second hole segment 1a2. The two openings of the connecting hole 1b are respectively located on the two stepped surfaces of the mounting hole 1a.

[0031] The first hole segment 1a1 refers to the central channel extending along the axial direction of the bracket 1, which can be implemented using a cylindrical or rectangular cross-section structure, and is used to fix the position of the magnetic conductor 21. The second hole segment 1a2 refers to the extended areas located on both sides of the first hole segment 1a1 and communicating with the first hole segment 1a1, which can be implemented using an annular groove 21c structure with a diameter larger than the first hole segment 1a1, and is used to provide a mounting surface for the diaphragm 32. The stepped surface refers to the stepped transition area formed within the mounting hole 1a, which can be formed using a stepped hole processing technology.

[0032] Specifically, the magnetic conductor 21 is embedded in the wall of the first hole segment 1a1, forming the central support structure of the magnetic circuit assembly. Two second hole segments 1a2 are symmetrically distributed on both sides of the first hole segment 1a1, and the diaphragm 32 is fixed at the annular edge of the second hole segment 1a2, so that the vibrating assembly and the magnetic circuit assembly are aligned axially. The two openings of the connecting hole 1b are set on the two stepped surfaces of the mounting hole 1a. The flexible circuit board 41 is led out from the voice coil 31 and bent along the vertical direction of the stepped surface, extending through the connecting hole 1b to the wiring hole 1c. This layout allows the acoustic cavity 1d space required for the vibration of the diaphragm 32 to be effectively expanded by the outward expansion structure of the second hole segment 1a2. At the same time, the height difference of the stepped surface provides a clear routing direction for the flexible circuit board 41, avoiding spatial interference with the magnetic circuit assembly.

[0033] By using a segmented mounting hole 1a design, the magnet 21 and the diaphragm 32 are arranged in independent segments, which not only ensures the axial alignment of the magnetic circuit and the vibration unit, but also releases a larger acoustic cavity 1d volume for the diaphragm 32 to vibrate through the extended structure of the second segment 1a2. In addition, the connecting hole 1b provided on the stepped surface allows the flexible circuit board 41 to be bent and passed through directly without detours, simplifying the circuit connection path for the synchronous drive of the dual voice coils 31. This solves the problems of limited acoustic cavity 1d space and complex circuit wiring in double-sided vibrating loudspeakers, optimizes the spatial layout of the diaphragm 32 and the magnet 21, and enables the diaphragm 32 and the voice coil 31 to obtain a larger amplitude range.

[0034] Please refer to Figure 2 , Figure 3 as well as Figure 5 In one embodiment of the present invention, each flexible circuit board 41 includes an open-loop portion 411 and a bent portion 412; the two open-loop portions 411 are respectively disposed on the corresponding stepped surfaces in the mounting hole 1a and electrically connected to the corresponding voice coil 31; the two bent portions 412 are respectively disposed on the corresponding open-loop portions 411; each bent portion 412 bends through the corresponding opening in the connecting hole 1b and extends into the wiring hole 1c.

[0035] The open-loop portion 411 refers to an annular flexible circuit board 41 with an opening, which can be made by laminating a polyimide substrate with copper foil circuitry. Its annular shape matches the contour of the stepped surface of the mounting hole 1a. The bending portion 412 refers to a bendable circuit board area extending from the middle of the open-loop portion 411. It can be made using a flexible substrate, and its bending path is consistent with the axial direction of the connecting hole 1b, so that the bent circuitry can extend along the internal channels of the bracket 1 to the wiring hole 1c.

[0036] Specifically, the open-loop portion 411 is fixed to the stepped surface of the mounting hole 1a by adhesive or snap-fit, and its annular opening surrounds the lead-out end of the voice coil 31. Electrical connection with the electrode of the voice coil 31 is achieved by welding or conductive adhesive. The bent portion 412 extends from the edge of the open-loop portion 411 toward the connecting hole 1b, and bends at a preset angle during the assembly of the bracket 1, so that the main body of the bent portion 412 enters the internal channel of the connecting hole 1b. The two bent portions 412 start from the stepped surfaces on both sides of the mounting hole 1a, pass through the openings at both ends of the connecting hole 1b, and converge in the wiring hole 1c, forming a continuous conductive path from the voice coil 31 to the external components.

[0037] By combining the open-loop portion 411 and the bent portion 412 of the flexible circuit board 41, the circuit wiring is concealed by using the pre-formed channels inside the bracket 1, eliminating the need for a separate terminal board structure and reducing the soldering process and wire insertion steps. This achieves integrated wiring of the two voice coil 31 circuits inside the bracket 1, avoiding assembly interference problems caused by exposed wires. At the same time, the external component connection operation is simplified by centralizing the external connection points through the wiring hole 1c, reducing the process complexity and production cost of speaker assembly.

[0038] Please refer to Figure 1 and Figure 3 In one embodiment of the present invention, one end of a bent portion 412 away from the corresponding open ring portion 411 is stacked with one end of another bent portion 412 away from the corresponding open ring portion 411, and the stacked portion of the two bent portions 412 is exposed in the wiring hole 1c.

[0039] Specifically, the two bent portions 412 extend from the open loop portion 411 within the mounting hole 1a, and after bending, pass through the two openings of the connecting hole 1b and enter the wiring hole 1c, with their ends arranged in an overlapping manner. The stacked portion forms a single contact area within the wiring hole 1c, allowing the connection terminals of external components to directly contact the stacked portion, thus completing the synchronous electrical connection of the two flexible circuit boards 41.

[0040] By stacking the ends of the bent portion 412 to form a common electrical contact area, synchronous conduction can be achieved with only a single connection point. This realizes a compact layout of the wiring structure of the flexible circuit board 41, solves the problems of assembly complexity and low space utilization caused by independent leads of dual speaker units, and ensures the stability and reliability of electrical connections.

[0041] Please refer to Figure 1 and Figure 3 In one embodiment of the present invention, a bend 412 is provided with a protruding plate 4121 at one end away from the corresponding open ring 411 in the circumferential direction of the bracket 1. The protruding plate 4121 is exposed in the wiring hole 1c for electrical connection with external components.

[0042] The circumferential direction refers to the circumferential extension direction around the central axis of the bracket 1. Specifically, this can be achieved by opening a wiring hole 1c on the outer circumferential wall of the bracket 1 and extending it along the tangential direction, so that the protruding plate 4121 expands outward along the circumferential tangential direction. The protruding plate 4121 refers to the plate-like structure formed by extending outward from the end of the bent portion 412. Specifically, this can be achieved by using laser cutting or stamping processes to form a local extended area at the end of the bent portion 412. The surface of the extended area has a conductive layer to form a contact surface.

[0043] Specifically, after the bent portion 412 of the flexible circuit board 41 passes through the connection hole 1b, its end extends along the circumferential tangent direction of the bracket 1 to form a protrusion 4121. During assembly, this protrusion 4121 is constrained within the wiring hole 1c, with its conductive layer directly exposed to the inner wall contact area of ​​the wiring hole 1c. When an external connector is inserted into the wiring hole 1c, the connector's conductive contacts form surface contact with the conductive layer of the protrusion 4121, completing the electrical connection through elastic pressing. Since the extension direction of the protrusion 4121 is consistent with the circumferential direction of the bracket 1, a stable contact interface is formed using the redundant space in the circumferential direction, provided that the axial space is not occupied.

[0044] By directly forming the contact surface of the protruding plate 4121 at the end of the bending part 412, the welding process and lead wire routing space requirements are eliminated, realizing direct electrical contact between the flexible circuit board 41 and external components. This eliminates the need for traditional welding terminals and lead wire structures, reducing the number of connection points by more than 50%.

[0045] Please refer to Figure 2 and Figure 5 In one embodiment of the present invention, the mounting hole 1a further includes two third hole segments 1a3, each third hole segment 1a3 being connected to one end of a second hole segment 1a2 away from the first hole segment 1a1; each diaphragm 32 is disposed on the hole wall of the corresponding third hole segment 1a3.

[0046] The third hole segment 1a3 refers to the extended channel that connects to the end of the second hole segment 1a2. Specifically, it can be implemented using a stepped channel structure, with a diameter larger than that of the second hole segment 1a2 to form a stepped surface.

[0047] Specifically, the third aperture segment 1a3 extends outward from the end of the second aperture segment 1a2 to form a stepped expansion structure, and the diaphragm 32 is fixed in the annular groove at the end of the third aperture segment 1a3. When the vibration assembly is working, the diaphragm 32 vibrates axially within the expanded space formed by the third aperture segment 1a3, and its vibration stroke is no longer limited by the aperture of the second aperture segment 1a2. Since the two third aperture segments 1a3 are located at the two axial ends of the support 1, the distribution range of the sound cavity 1d is extended to the outside of the third aperture segment 1a3, forming a symmetrical independent cavity structure.

[0048] By adding a third hole segment 1a3, the installation position of the diaphragm 32 is moved to the end of the third hole segment 1a3, so that the two sound cavities 1d occupy the independent space outside the third hole segment 1a3 respectively, forming an axially symmetrical distribution. This achieves the symmetrical expansion of the sound cavity 1d space in the axial direction, and makes the sound cavities 1d of the two vibration units uniformly distributed in a limited space.

[0049] Please refer to Figure 2 and Figure 6 In one embodiment of the present invention, the bracket 1 is further provided with an airflow guiding hole 1e, which connects the two sound chambers 1d.

[0050] The airflow guide hole 1e refers to a through-hole structure penetrating the body of the support 1. Specifically, it can be implemented using a circular, elliptical, or polygonal cross-section channel, with the channel's axis parallel to or at an angle to the axis of the support 1. This channel allows the gas within the two sound cavities 1d to form a dynamic exchange path during vibration, balancing the instantaneous air pressure difference generated when the diaphragms 32 on both sides vibrate. The sound cavity 1d refers to the sealed space enclosed by the diaphragm 32, the support 1, and the magnet 21. Specifically, it can be implemented using a symmetrical cavity structure, with the cavity volume adjusted according to the effective vibration area of ​​the diaphragm 32.

[0051] Specifically, when one diaphragm 32 vibrates outward to compress the corresponding acoustic cavity 1d, the other diaphragm 32 vibrates inward to expand the corresponding acoustic cavity 1d. At this time, the high-pressure airflow in the compression cavity flows to the expansion cavity through the guide hole, reducing the pressure gradient between the two cavities. This process eliminates the motion resistance of the diaphragm 32 caused by the pressure difference, making the driving force of the voice coil 31 more efficiently converted into the displacement of the diaphragm 32. At the same time, the airflow exchange effect of the guide hole avoids the mutual cancellation of sound wave phases, maintains the phase consistency of the sound pressure output, effectively eliminates the travel limitation of the diaphragm 32 caused by the pressure imbalance of the two acoustic cavities 1d, and improves the linearity and stability of the low-frequency sound pressure output.

[0052] Please refer to Figure 2 , Figure 5 as well as Figure 6 In one embodiment of the present invention, a mounting groove 21b is formed on each of the opposite sides of the magnetic conductor 21 along the axial direction of the bracket 1; each magnet 22 is disposed on the bottom wall of the corresponding mounting groove 21b, and the peripheral wall of each mounting groove 21b, together with the corresponding magnet 22 and the corresponding washer 23, forms a magnetic circuit space 21a.

[0053] The mounting groove 21b refers to the recessed area machined on both sides of the magnetic conductor 21 along its axial direction. It can be achieved by mechanical stamping or precision casting, and its depth matches the thickness of the magnet 22. The bottom wall of the groove refers to the plane at the bottom of the mounting groove 21b that contacts the magnet 22, and the peripheral wall of the groove refers to the vertical wall surrounding the magnet 22 on the side of the mounting groove 21b. Together with the washer 23 and the magnet 22, they form a closed magnetic circuit boundary, constraining the magnetic field distribution path.

[0054] Specifically, the cross-section of the magnetic conductor 21 along the axial direction of the bracket 1 is H-shaped. Precisely sized mounting grooves 21b are machined on both sides of the magnetic conductor 21. After the magnet 22 is embedded into the bottom wall of the groove, the vertical sidewalls of the mounting groove 21b form a radial constraint on the magnet 22. When the washer 23 is assembled onto the outer surface of the magnet 22, its edge is flush with the top of the groove's peripheral wall, and the three together construct a closed annular magnetic circuit channel. This structure replaces the traditional adhesive fixing method with groove geometric constraints, giving the magnet 22 dual axial and radial constraints, ensuring the coaxial assembly accuracy of the two magnets 22 and the magnetic conductor 21, and giving the magnetic circuit spaces 21a on both sides a symmetrical geometric shape.

[0055] Please refer to Figure 2 In one embodiment of the present invention, the periphery of the two openings of the first hole segment 1a1 is provided with a stop protrusion 1a11 in the radial direction of the bracket 1, and the periphery of the openings of the two mounting grooves 21b is formed with a groove 21c. Each stop protrusion 1a11 is engaged in a groove 21c to confine the magnetic conductor 21 within the first hole segment 1a1.

[0056] The stop protrusion 1a11 refers to a protruding structure extending radially outward from the periphery of the opening of the first hole 1a1 along the bracket 1, used to form a mechanical engagement with the groove 21c of the mounting groove 21b of the magnetic conductor 21. The groove 21c refers to a recessed structure formed at the periphery of the opening of the mounting groove 21b of the magnetic conductor 21, which can be formed by stamping or milling, and is used to accommodate the stop protrusion 1a11 at the opening of the bracket 1. The engagement refers to achieving spatial constraint through the complementary geometry of the stop protrusion 1a11 and the groove 21c. Specifically, a rectangular protrusion and a U-shaped groove 21c can be used to physically limit the magnetic conductor 21 in both the axial and radial directions.

[0057] Specifically, when the magnetic conductor 21 is inserted into the first hole 1a1 of the bracket 1, the stop protrusions 1a11 at the two side openings of the bracket 1 are respectively embedded into the grooves 21c of the mounting slots 21b on both sides of the magnetic conductor 21. Since the stop protrusions 1a11 extend radially outward, their sidewalls form surface contact with the inner sidewalls of the grooves 21c, preventing the magnetic conductor 21 from moving in the axial direction of the bracket 1; at the same time, the top of the stop protrusions 1a11 contacts the bottom surface of the grooves 21c, restricting the displacement of the magnetic conductor 21 in the radial direction. This bidirectional constraint allows the magnetic conductor 21 to be fixed without the aid of adhesives or screws, and it will not shift due to inertia in a vibration environment.

[0058] The self-locking snap-fit ​​structure achieves mechanical fixation of the magnetic conductor 21, which eliminates the curing waiting time of the adhesive process and avoids the use of additional fasteners. This ensures reliable fixation of the magnetic conductor 21 within the bracket 1, effectively preventing the magnetic circuit components from shifting due to vibration or assembly errors. At the same time, the glue-free assembly process improves production efficiency and product consistency.

[0059] Please refer to Figure 1 , Figure 2 , Figure 5 as well as Figure 6 In one embodiment of the present invention, the bracket 1 includes an upper frame 11 and a lower frame 12, which are detachably connected and form an installation hole 1a, a connection hole 1b and a wiring hole 1c. A positioning post 111 protrudes from the side of the upper frame 11 facing the lower frame 12, and a positioning hole 12a is formed on the side of the lower frame 12 facing the upper frame 11. The positioning post 111 is inserted into the positioning hole 12a.

[0060] The detachable connection refers to the separate assembly of the upper and lower frame bodies 12 through mechanical connection, specifically using snap-fit, screw, or magnetic adsorption structures. This design allows the bracket 1 to be disassembled into independent components, facilitating individual processing and subsequent maintenance. The positioning post 111 and positioning hole 12a refer to the alignment structure set on the contact surface of the upper and lower frame bodies 12, specifically using the cooperation of a cylindrical protrusion and a circular groove 21c. This structure guides the upper and lower frame bodies 12 to be accurately positioned along a predetermined direction during assembly, ensuring that the axis of the mounting hole 1a is aligned with the axis of the connecting hole 1b.

[0061] Specifically, the upper frame 11 and the lower frame 12 are detachably connected to form a complete support body 1. The mounting hole 1a, connecting hole 1b, and wiring hole 1c are enclosed by the two frame parts. During assembly, the positioning pin 111 is inserted into the positioning hole 12a to form a physical limit, eliminating the radial and circumferential displacement deviations of the upper and lower frame 12, and ensuring the installation position accuracy of the sound cavity 1d and the magnetic circuit assembly. The split structure allows the upper and lower frame 12, which have complex internal cavities, to be processed separately, reducing the difficulty of mold development and the complexity of injection molding processes. When maintenance or replacement of parts is required, the detachable connection allows the upper and lower frame 12 to be quickly separated, avoiding the defect of traditional one-piece structures that must be scrapped as a whole.

[0062] By designing a split bracket 1, the complex internal cavity is decomposed into a combined structure of upper and lower brackets 12, which significantly reduces the complexity of the mold. At the same time, the cooperation between the positioning pin 111 and the positioning hole 12a simplifies the assembly process while ensuring structural accuracy. This solves the assembly difficulties caused by the one-piece molding of the bracket 1 in traditional back-to-back speakers. The split structure reduces the processing complexity and enables modular assembly and maintenance. Meanwhile, the positioning structure ensures assembly accuracy and avoids sealing failure of the sound cavity 1d or circuit connection failure caused by misalignment.

[0063] It should be noted that the back-to-back speaker structure 1000 in this invention has two vibration modes: one is when the current directions of the upper and lower voice coils 31 are the same, and the upper and lower vibration directions are opposite; the other is when the current directions of the upper and lower voice coils 31 are opposite, and the upper and lower vibration directions are the same. The two vibration modes are determined by the consistency of the winding direction of the upper and lower voice coils 31. In the first vibration mode, the upper and lower vibrations are opposite, and the forces cancel each other out, reducing the vibration of the overall structure, achieving the effect of canceling vibration and reducing noise. At the same time, when the upper and lower speakers vibrate downwards simultaneously, the pushing air pressures act in balance with each other, suppressing the downward displacement to a certain extent. When vibrating upwards, the compressed air pressure simultaneously pushes the voice coils 31 to vibrate upwards, increasing the upward displacement to a certain extent. In addition, the radiated sound waves in the other two directions can widen the coverage of the sound field and enhance the sense of space. In the second vibration mode, the upper and lower vibration directions are the same, and the sound waves are superimposed in the same direction. While increasing the sound pressure level, the directivity of the speaker is enhanced, and the penetration is stronger. In addition, the same vibration direction can avoid internal air pressure conflicts, making the diaphragm vibration smoother and reducing the cancellation of low frequencies.

[0064] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A back-to-back speaker structure, characterized in that, include: The bracket has mounting holes; A magnetic circuit assembly includes a magnetic conductor, two magnets, and two washer; the magnetic conductor is disposed on the wall of the mounting hole, the two magnets are respectively disposed on opposite sides of the magnetic conductor along the axial direction of the bracket, and each washer is disposed at the end of a magnet away from the magnetic conductor; each magnet, the corresponding washer, and the magnetic conductor enclose a magnetic circuit space. A vibration assembly includes two voice coils and two diaphragms. Each diaphragm is disposed at the periphery of both ends of the mounting hole, and each diaphragm, together with the bracket and the magnetic conductor, forms a sound cavity. Each voice coil is disposed on one of the diaphragms, and the end of each voice coil away from the diaphragm is located in the corresponding magnetic circuit space. as well as The circuit assembly includes two electrically connected flexible circuit boards, each of which is electrically connected to a voice coil; the bracket also has a connection hole that connects the two acoustic cavities; the outer peripheral wall of the bracket has a wiring hole that communicates with the connection hole, and each flexible circuit board extends into the corresponding opening of the connection hole, passes through the connection hole, and is exposed in the wiring hole for electrical connection with external components.

2. The back-to-back speaker structure as described in claim 1, characterized in that, The mounting hole is a stepped hole, and the mounting hole includes a first hole segment and two second hole segments that are connected to each other, with the two second hole segments located at both ends of the first hole segment; The magnetic conductor is disposed on the wall of the first hole segment, and each of the diaphragms is disposed on the periphery of a second hole segment; the two openings of the connecting hole are respectively located on the two stepped surfaces of the mounting hole.

3. The back-to-back speaker structure as described in claim 1, characterized in that, Each of the flexible circuit boards includes an open-loop portion and a bent portion; the two open-loop portions are respectively disposed on the corresponding stepped surfaces in the mounting holes and are electrically connected to the corresponding voice coils; the two bent portions are respectively disposed on the corresponding open-loop portions; each bent portion bends through the corresponding opening in the connection hole and extends into the wiring hole.

4. The back-to-back speaker structure as described in claim 3, characterized in that, One end of the bent portion away from the corresponding open loop portion is stacked with the other end of the bent portion away from the corresponding open loop portion, and the stacked portion of the two bent portions is exposed in the wiring hole.

5. The back-to-back speaker structure as described in claim 4, characterized in that, One end of the bent portion away from the corresponding open ring portion has a protruding plate protruding in the circumferential direction of the bracket. The protruding plate is exposed in the wiring hole for electrical connection with external components.

6. The back-to-back speaker structure as described in claim 2, characterized in that, The mounting hole further includes two third hole segments, each of the third hole segments being connected to one end of a second hole segment away from the first hole segment; each diaphragm is disposed on the hole wall of the corresponding third hole segment.

7. The back-to-back speaker structure as described in claim 2, characterized in that, The bracket is also provided with an airflow passage, which connects the two sound chambers.

8. The back-to-back speaker structure as described in claim 2, characterized in that, The magnetic conductor has a mounting groove formed on each of its opposite sides along the axial direction of the bracket. Each of the magnets is disposed on the bottom wall of the corresponding mounting groove, and the peripheral wall of each mounting groove, together with the corresponding magnet and the corresponding washer, forms a magnetic circuit space.

9. The back-to-back speaker structure as described in claim 8, characterized in that, The periphery of the two openings of the first hole section is provided with a stop protrusion in the radial direction of the bracket, and the periphery of the openings of the two mounting grooves is formed with a groove. Each stop protrusion is engaged in a groove to confine the magnetic conductor within the first hole section.

10. The back-to-back speaker structure as described in any one of claims 1 to 9, characterized in that, The bracket includes an upper frame and a lower frame, which are detachably connected and enclose the mounting hole, the connection hole, and the wiring hole. The upper frame has a protruding positioning post on the side facing the lower frame, and the lower frame has a positioning hole on the side facing the upper frame, with the positioning post inserted into the positioning hole.

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