改善抛光垫平坦度的方法、双面抛光设备
By setting a rolling structure and performing rolling leveling treatment before the polishing pad is pressed and bonded, combined with a uniform cleaning method, the grid mark problem caused by the polishing pad grooves is solved, improving the polishing quality and the flatness of the silicon wafer.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- XIAN ESWIN MATERIAL TECHNOLOGY CO LTD
- Filing Date
- 2025-11-04
- Publication Date
- 2026-07-17
AI Technical Summary
During chemical mechanical polishing, the grooves on the upper polishing pad cause grid marks on the lower polishing pad, resulting in poor flatness of the silicon wafer edges and affecting the polishing quality.
When the upper and lower polishing pads are pressed together, a rolling structure is set up to roll and level them, including opposite movement and relative rotation. The polishing pads are leveled using rollers, and cleaning is performed through multiple identical nozzles to unify the impact force of the cleaning fluid.
It effectively eliminates the grid marks on the lower polishing pad, improves the flatness of the polishing pad, improves the surface flatness of the silicon wafer, and enhances the uniformity and consistency of the polishing process.
Smart Images
Figure CN121132500B_ABST