Grinding disc and its use

Abstract

The present application relates to a kind of grinding disc and its application, the grinding disc includes the working layer, transition layer and matrix layer being sequentially stacked, wherein the working layer includes diamond alloy disc body, the diamond alloy disc body includes alloy matrix and diamond particles distributed in the alloy matrix, the alloy matrix includes 50-60% of Fe, 18-22% of Cr, 15-18% of Ni, 2-4% of Mo, 1.5-2.5% of B and 3-5% of WC by mass fraction;The transition layer includes porous inorganic material matrix and ceramic layer attached to the surface of the porous inorganic material matrix;The elastic modulus of the matrix layer is above 20GPa, and the density is 3.0g / cm 3 Within. The grinding disc of the present application has excellent corrosion resistance and wear resistance, and the overall weight is light, which can avoid the imbalance of the grinding disc caused by inertia at high speed.

Description

Technical Field

[0001] This invention relates to the field of machining technology, and in particular to grinding discs and their applications. Background Technology

[0002] As the hardest known material in nature, diamond has always been a major technical challenge for the manufacturing industry in terms of precision machining. Among the existing technologies, cast iron diamond grinding discs have certain advantages in terms of cost, rigidity and thermal conductivity, and are suitable for industrial-grade diamond processing. However, they have also revealed many technical defects in actual applications, such as: (1) insufficient corrosion resistance, which will accelerate failure in aqueous solution conditions; (2) the abrasive shedding rate is as high as 15% or more during high-speed grinding, and the wear rate is high. Not only does it require frequent dressing, but the upper limit of precision is also low, Ra>0.08μm, TTV>3μm; (3) the overall weight is large, and it is easy to become unbalanced due to inertia at high speeds. Summary of the Invention

[0003] Therefore, it is necessary to provide a grinding disc and its application to address the above problems. The grinding disc has excellent corrosion resistance and wear resistance, and is lightweight.

[0004] A grinding disc, comprising a working layer, a transition layer, and a substrate layer stacked sequentially, wherein the grinding disc satisfies the following conditions:

[0005] (1) The working layer includes a diamond alloy disk, wherein the diamond alloy disk includes an alloy matrix and diamond particles distributed in the alloy matrix. By mass fraction, the alloy matrix includes 50%-60% Fe, 18%-22% Cr, 15%-18% Ni, 2%-4% Mo, 1.5%-2.5% B and 3%-5% WC;

[0006] (2) The transition layer includes a porous inorganic material matrix and a ceramic layer attached to the surface of the porous inorganic material matrix;

[0007] (3) The elastic modulus of the matrix layer is above 20 GPa and the density is 3.0 g / cm³. 3 Within.

[0008] In one embodiment, the surface of the working layer facing away from the transition layer is the working surface, and the working surface of the diamond alloy disk is also provided with a grid groove;

[0009] And / or, the diamond particle distribution density in the diamond alloy disk is 4.4 carats / cm³. 3 -8.8 carats / cm 3 ;

[0010] And / or, the diamond particles in the diamond alloy disk have a particle size of 100-200 mesh;

[0011] And / or, the thickness of the diamond alloy disk is 12mm-20mm.

[0012] In one embodiment, the working layer further includes a reinforcing phase, the surface of the working layer opposite to the transition layer is the working surface, and the reinforcing phase is embedded in the working surface of the diamond alloy disk. The reinforcing phase includes a porous skeleton and a metal composite filling the porous skeleton. The porous skeleton includes ceramic material and diamond particles.

[0013] In one embodiment, the mass ratio of ceramic material to diamond particles in the porous framework is 7:3-8:2;

[0014] And / or, the porosity of the porous framework is 30%-60%;

[0015] And / or, the particle size of the ceramic material in the porous framework is 40nm-100nm, and the particle size of the diamond particles is 2μm-5μm;

[0016] And / or, the ceramic material is selected from at least one of silicon carbide, boron carbide, titanium carbide, tungsten carbide, and silicon nitride;

[0017] And / or, by mass fraction, the metal complex consists of 0.5%-1.5% Cr, 0.1%-0.2% Zr, and the balance Cu.

[0018] In one embodiment, the reinforcing phase includes at least two spaced-apart first reinforcing bodies, and the first reinforcing bodies are radially distributed around the center of the grinding disk;

[0019] Alternatively, the reinforcing phase includes at least two spaced-apart second reinforcing bodies that extend circumferentially along the diamond alloy disk and are distributed in a ring shape;

[0020] Alternatively, the reinforcing phase includes at least two spaced-apart first reinforcing bodies and at least two spaced-apart second reinforcing bodies, the first reinforcing bodies being radially distributed around the center of the grinding disk, the second reinforcing bodies being circumferentially distributed along the diamond alloy disk and being annularly distributed, and the first reinforcing bodies and the second reinforcing bodies intersecting each other.

[0021] In one embodiment, the included angle between two adjacent first reinforcements is 36°-60°;

[0022] And / or, the thickness of the first reinforcement is less than or equal to the thickness of the diamond alloy disk, and the width of the first reinforcement is 15mm-25mm;

[0023] And / or, the spacing between two adjacent second reinforcements is 70mm-90mm;

[0024] And / or, the thickness of the second reinforcement is less than or equal to the thickness of the diamond alloy disk, and the width of the second reinforcement is 15mm-25mm.

[0025] In one embodiment, the porous inorganic material matrix in the transition layer is selected from at least one of aluminum foam matrix, magnesium foam matrix, and porous alumina ceramic matrix;

[0026] And / or, the porosity of the porous inorganic material matrix is ​​30%-50%;

[0027] And / or, the ceramic layer is selected from at least one of alumina layer, chromium oxide layer, titanium oxide layer, yttrium oxide layer, and chromium nitride layer;

[0028] And / or, the thickness of the ceramic layer is 20nm-100nm;

[0029] And / or, the thickness of the porous inorganic material matrix is ​​5mm-10mm.

[0030] In one embodiment, the matrix layer is selected from at least one of carbon fiber reinforced PEEK layer, carbon fiber reinforced PEKK layer, carbon fiber reinforced epoxy resin layer or aluminum matrix composite layer;

[0031] And / or, the thickness of the substrate layer is 4mm-8mm.

[0032] In one embodiment, an interface enhancement layer is further provided between the working layer and the transition layer;

[0033] And / or, an adhesive layer is further provided between the transition layer and the substrate layer.

[0034] An application of the aforementioned grinding disc in diamond processing.

[0035] In the grinding disc of this invention, firstly, the alloy matrix of the diamond alloy disc in the working layer is made of Fe, Cr, Ni, Mo, B, and WC in a certain mass ratio. The addition of Cr and Ni elements effectively improves the corrosion resistance of the alloy matrix, and Cr and Ni elements can produce a synergistic effect with Fe, achieving a Fe-Cr-Ni ternary balance. This results in the diamond alloy disc having an annual corrosion rate of less than or equal to 0.1 mm in an aqueous solution with a pH of 2-12, exhibiting excellent corrosion resistance. Simultaneously, the Vickers hardness of WC reaches as high as 240. A WC content of 0.5wt%-8wt% can form a continuous hard network in the alloy matrix, which can effectively resist the cutting and scratching of the material being ground and reduce abrasive wear. On the other hand, B element can agglomerate at the grain boundaries and form low-melting-point compounds with impurities (such as O and S) in the alloy matrix, purifying the grain boundaries and reducing the weakening phase. On the other hand, it can form boride hard phases with other metal elements in the alloy matrix, directly enhancing the hardness of the grain boundaries. Thus, through hard phases and grain boundary strengthening, the wear rate of the grinding disc can be reduced by more than 50%, effectively improving wear resistance and grinding accuracy.

[0036] Secondly, the transition layer and substrate layer used to support the working layer can buffer the mechanical stress generated during the grinding process, and also reduce the overall weight of the grinding disc and prevent aqueous solution penetration. Therefore, the grinding disc of the present invention has excellent corrosion resistance and wear resistance, and is lightweight, which can prevent the grinding disc from becoming unbalanced due to inertia at high speeds. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 This is a schematic diagram of the structure of the grinding disc of the present invention.

[0039] In the figure: 10, working layer; 20, transition layer; 30, matrix layer; 101, diamond alloy disk; 102, reinforcing phase; 102a, first reinforcing body; 102b, second reinforcing body. Detailed Implementation

[0040] To facilitate understanding of the present invention, it will be described in more detail below. However, it should be understood that the present invention can be implemented in many different forms and is not limited to the embodiments or examples described herein. Rather, these embodiments or examples are provided to make the disclosure of the present invention more thorough and complete.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the specification of this invention is for the purpose of describing particular embodiments or examples only and is not intended to limit the invention. The optional scope of the term "and / or" as used herein includes any one of two or more of the related listed items, as well as any and all combinations of the related listed items, including any two related listed items, any more related listed items, or a combination of all related listed items.

[0042] In this invention, numerical ranges are involved. Unless otherwise specified, the numerical ranges are considered continuous and include the minimum and maximum values ​​of the range, as well as every value between the minimum and maximum values. Furthermore, when the range refers to integers, it includes every integer between the minimum and maximum values ​​of the range. Additionally, when multiple ranges are provided to describe features or characteristics, the ranges may be merged. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges to which they are included.

[0043] like Figure 1 As shown, compared with existing cast iron diamond grinding discs, the grinding disc provided by this invention includes a working layer 10, a transition layer 20, and a base layer 30 stacked sequentially. During grinding, the working layer 10 is the primary grinding component. It can be understood that the central area of ​​the grinding disc does not participate in grinding the workpiece; therefore, an opening can be made in the center of the working layer 10 to reduce the flow rate of the grinding fluid and to store the grinding fluid for adjusting the grinding process.

[0044] Specifically, the working layer 10 includes a diamond alloy disk 101, wherein the diamond alloy disk 101 includes an alloy matrix and diamond particles distributed in the alloy matrix. By mass fraction, the alloy matrix includes 50%-60% Fe, 18%-22% Cr, 15%-18% Ni, 2%-4% Mo, 1.5%-2.5% B and 3%-5% WC.

[0045] Fe, as the main element, ensures the mechanical strength of the diamond alloy disk 101 while reducing costs. Cr enhances the stability of the alloy matrix, inhibits pitting corrosion, and forms a dense Cr2O3 film in oxidizing environments, blocking aqueous solution corrosion. Furthermore, when the Cr2O3 film is partially damaged, Cr preferentially oxidizes and repairs the film. Ni expands the γ-phase region, maintains a single-phase austenitic structure (without α' martensite), avoids multiphase cell corrosion, and the single-phase austenitic structure reduces corrosion caused by Cl. - This reduces the risk of stress corrosion cracking (SCC) caused by factors such as [missing information]. Most importantly, these three metallic elements produce a synergistic effect, balancing passivation capability with austenite stability, thus achieving a Fe-Cr-Ni ternary balance. This results in the diamond alloy disc 101 exhibiting an annual corrosion rate of less than or equal to 0.1 mm in aqueous solutions with a pH of 2-12, demonstrating excellent corrosion resistance.

[0046] Meanwhile, WC has a Vickers hardness of up to 2400. A WC content of 5wt%-8wt% can form a continuous hard network in the alloy matrix, which can effectively resist the cutting and scratching of the material being ground and reduce abrasive wear. On the one hand, B element can agglomerate at the grain boundaries and form low-melting-point compounds with impurities (such as O and S) in the alloy matrix, purifying the grain boundaries and reducing weakened phases. On the other hand, it can form boride hard phases with other metal elements in the alloy matrix. The Vickers hardness of these boride hard phases can reach more than 1500, directly enhancing the grain boundary hardness. Thus, through hard phases and grain boundary strengthening, the wear rate of the grinding disc can be reduced by more than 50%, and the service life can be increased by more than 3 times, effectively improving the wear resistance and grinding accuracy of the diamond alloy disc 101.

[0047] It is understood that when the grinding disc is working, the surface of the working layer 10 facing away from the transition layer 20 is the working surface. The working surface of the diamond alloy disc body 101 is also provided with a grid groove. The form of the grid groove is not limited and can be quadrilateral, pentagonal or hexagonal, etc.

[0048] Optionally, the diamond particles in the diamond alloy disk 101 have a particle size of 100-200 mesh and a diamond particle distribution density of 4.4 carats / cm³. 3 The above is further preferred to be 4.4 carats / cm. 3 -8.8 carats / cm 3 This ensures the processing efficiency of the diamond alloy disc 101.

[0049] Optionally, the thickness of the diamond alloy disc 101 is 12mm-20mm.

[0050] To further improve the wear resistance and grinding precision of the working layer 10, and to increase the grinding efficiency of the working layer 10, the working layer 10 also includes a reinforcing phase 102. The reinforcing phase 102 is embedded in the working surface of the diamond alloy disc 101. During grinding, the diamond alloy disc 101 and the reinforcing phase 102 can simultaneously act on the diamond and other materials being ground. The reinforcing phase 102 includes a porous framework and a metal composite filling the porous framework. The porous framework includes ceramic materials and diamond particles.

[0051] Optionally, the mass ratio of ceramic material to diamond particles in the porous framework is 7:3-8:2, and the porosity of the porous framework is 30%-60%.

[0052] Optionally, the ceramic material has a Vickers hardness greater than or equal to 1500 and is selected from at least one of silicon carbide, boron carbide, titanium carbide, tungsten carbide, and silicon nitride. The particle size of the ceramic material is 40nm-100nm, and the particle size of the diamond particles is 2μm-5μm.

[0053] Optionally, the metal bond can be an aluminum metal bond, a copper metal bond, or the like. Preferably, by mass fraction, the metal bond consists of 0.5%-1.5% Cr, 0.1%-0.2% Zr, and the balance Cu.

[0054] It is understood that the reinforcing phase 102 can be randomly embedded in the working surface of the diamond alloy disk 101, or the distribution of the reinforcing phase 102 can be designed to better improve the wear resistance, grinding accuracy and grinding efficiency of the working layer 10.

[0055] For example, the reinforcing phase 102 includes at least two spaced-apart first reinforcing bodies 102a, and the first reinforcing bodies 102a are radially distributed around the center of the grinding disk; or, the reinforcing phase 102 includes at least two spaced-apart second reinforcing bodies 102b, and the second reinforcing bodies 102b extend circumferentially along the diamond alloy disk body 101 and are distributed in a ring shape.

[0056] Preferably, the reinforcing phase 102 includes at least two spaced-apart first reinforcing bodies 102a and at least two spaced-apart second reinforcing bodies 102b. The first reinforcing bodies 102a are radially distributed around the center of the grinding disk, and the second reinforcing bodies 102b extend circumferentially along the diamond alloy disk body 101 and are distributed in a ring shape. The first reinforcing bodies 102a and the second reinforcing bodies 102b intersect each other.

[0057] Furthermore, the included angle between two adjacent first reinforcements 102a is 36°-60°, the thickness of the first reinforcement 102a is less than or equal to the thickness of the diamond alloy disc 101, and the width of the first reinforcement 102a is 15mm-25mm.

[0058] Furthermore, the spacing between two adjacent second reinforcement bodies 102b is 70mm-90mm, the thickness of the second reinforcement body 102b is less than or equal to the thickness of the diamond alloy disk 101, and the width of the second reinforcement body 102b is 15mm-25mm.

[0059] Specifically, the transition layer 20 includes a porous inorganic material matrix and a ceramic layer attached to the surface of the porous inorganic material matrix. The porous inorganic material matrix can buffer mechanical stress, and the ceramic layer can block the permeation of aqueous solutions.

[0060] Optionally, the density of the porous inorganic material matrix is ​​4.5 g / cm³. 3 Within a certain range, and with an annual corrosion rate of less than or equal to 0.01 mm in aqueous solutions with a pH of 3-11, the overall weight of the grinding disc can be reduced while ensuring corrosion resistance.

[0061] Optionally, the porous inorganic material matrix in the transition layer 20 is selected from at least one of foamed aluminum alloy matrix, foamed magnesium alloy matrix, and porous alumina ceramic matrix, wherein the porosity of the porous inorganic material matrix is ​​30%-50% and the thickness is 5mm-10mm.

[0062] Optionally, the ceramic layer is selected from at least one of alumina, chromium oxide, titanium oxide, yttrium oxide, and chromium nitride, and the thickness of the ceramic layer is 20nm-100nm.

[0063] Specifically, the elastic modulus of the matrix layer 30 is above 20 GPa, and the density is 3.0 g / cm³. 3 It can be used to support the transition layer 20 and the working layer 10, and to connect with the machine tool spindle of the grinding equipment, thus playing a role in stress buffering and corrosion protection.

[0064] Optionally, the matrix layer 30 is selected from polymer material layers such as carbon fiber reinforced PEEK layer, carbon fiber reinforced PEKK layer, and carbon fiber reinforced epoxy resin layer, or it can be selected from inorganic material layers such as aluminum-based composite material layer. The thickness of the matrix layer 30 is 4mm-8mm.

[0065] In this invention, the working layer 10 and the transition layer 20 can be fixedly connected by chemical bonding, or by metallurgical or mechanical interlocking. Similarly, the transition layer 20 and the substrate layer 30 can be bonded by hot pressing or by mechanical interlocking.

[0066] Optionally, an interface reinforcement layer is further provided between the working layer 10 and the transition layer 20. The interface reinforcement layer is mainly selected from carbon fiber woven mesh, metal fiber woven mesh or ceramic fiber woven mesh, etc., so as to improve the strength of the grinding disc. It is preferably selected from Ti-C fiber woven mesh, metal fiber woven mesh, ceramic fiber woven mesh, carbon-based fiber woven mesh, etc., which are more compatible with the thermal expansion coefficients of the transition layer 20 and the working layer 10.

[0067] Optionally, an adhesive layer, such as an epoxy-silane coupling agent layer, may be provided between the transition layer 20 and the substrate layer 30 to improve the bonding force between the transition layer 20 and the substrate layer 30.

[0068] The grinding disc of the present invention can be prepared by referring to the following method:

[0069] Preparation of diamond alloy disk 101: Raw materials are weighed according to the composition and mass ratio of the alloy matrix, then mixed with diamond particles, and spherical powder is prepared by gas atomization. After vacuum drying, the powder is pressed into a blank and sintered to obtain a sintered body. The sintered body is then die-cast to obtain the diamond alloy disk. Sintering is carried out in a vacuum environment at a temperature of 800℃-900℃, a sintering pressure of 5MPa-9MPa, and a sintering time of 80min-120min. The die-casting pressure is 160MPa-180MPa, and the pressurization time is 5s-20s.

[0070] Preparation of transition layer 20: A porous inorganic material matrix is ​​provided, and then a ceramic layer is coated on the surface of the porous inorganic material matrix to obtain transition layer 20. Methods for coating the porous inorganic material matrix with a ceramic layer include sol-gel method, anodic oxidation method, physical vapor deposition method, chemical vapor deposition method, thermal spraying method, and arc ion plating method.

[0071] Then, the working layer 10, the transition layer 20, and the substrate layer 30 are assembled in a stacking order to obtain a grinding disc.

[0072] When the grinding disc also includes a reinforcing phase 102, the preparation of the reinforcing phase 102 is further included: ceramic material is mixed with diamond particles and a binder and pressed into a porous preform, then cured and sintered sequentially to obtain a porous framework. Then, molten metal is infiltrated into the porous framework, and after solidification, a reinforcing phase composed of a porous framework and a metal composite is obtained. The binder is selected from polyvinyl alcohol, etc., and its amount is 3%-6% of the total mass of the ceramic material and diamond particles; the pressure during pressing of the porous preform is 100MPa-200MPa; the curing temperature is 200℃-300℃; the sintering is carried out under a protective atmosphere such as argon and nitrogen, at a temperature of 1100℃-1150℃ for 10min-30min; the step of infiltrating the molten metal into the porous framework is carried out under a protective atmosphere such as nitrogen and argon, with the pressure maintained at 5MPa-20MPa.

[0073] Then, a groove is made on the working surface of the diamond alloy disk 101, and the reinforcing phase 102 is fixed in the groove by means of brazing or the like to obtain the working layer 10.

[0074] The present invention also provides an application of the aforementioned grinding disc in diamond processing, which not only has high grinding precision and fast grinding efficiency, but also low wear rate and strong corrosion resistance.

[0075] The technical solution of the present invention will be further described below through specific embodiments. However, those skilled in the art will understand that the following embodiments are only for illustrating the present invention and should not be regarded as limiting the scope of the present invention. Unless otherwise specified, specific conditions in the embodiments are performed under conventional conditions or conditions recommended by the manufacturer. Reagents or instruments used without specified manufacturers are all commercially available conventional products.

[0076] Example 1

[0077] By mass fraction, 56% Fe, 18% Cr, 16% Ni, 3% Mo, 2% B, and 5% WC were weighed and mixed with 100μm diamond particles. Spherical powder was prepared using a gas atomization method. After vacuum drying, the spherical powder was pressed into a blank and sintered under vacuum at 900℃, 6MPa, and 90min to obtain a sintered body. This sintered body was then die-cast at 165MPa for 8s to obtain a 16mm thick diamond alloy disk. The diamond particle density in the diamond alloy disk was 4.4 carats / cm³. 3 .

[0078] Ti-6Al-4V foam with a porosity of 40% and a thickness of 8 mm was provided, and then a 45 nm Al2O3 layer was formed on the foam surface by the sol-gel method.

[0079] A carbon fiber reinforced PEEK layer with a carbon fiber content of 30 vol% (elastic modulus of 25 GPa and density of 1.5 g / cm³) and a thickness of 6 mm was used as the matrix layer.

[0080] The working layer, transition layer, and substrate layer are then assembled in a stacked order to obtain the grinding disc.

[0081] Example 2

[0082] By mass fraction, 50% Fe, 22% Cr, 18% Ni, 4% Mo, 1.5% B, and 4.5% WC were weighed and mixed with 80 μm diamond particles. Spherical powder was prepared using a gas atomization method. After vacuum drying, the spherical powder was pressed into a blank and sintered under vacuum at 850℃, 5 MPa, and 100 min to obtain a sintered body. This sintered body was then die-cast at 170 MPa for 10 s to obtain a diamond alloy disk with a thickness of 18 mm. The diamond particle density in the diamond alloy disk was 4.4 carats / cm³. 3 .

[0083] A magnesium alloy foam with a porosity of 30% and a thickness of 6.5 mm is provided, and then a 55 nm chromium nitride (CrN) layer is formed on the foam surface by arc ion plating (AIP).

[0084] A carbon fiber reinforced PEKK layer with a carbon fiber content of 32 vol% (elastic modulus of 30 GPa and density of 1.53 g / cm³) and a thickness of 5.5 mm was used as the matrix layer.

[0085] The working layer, transition layer, and substrate layer are then assembled in a stacked order to obtain the grinding disc.

[0086] Example 3

[0087] By mass fraction, 60% Fe, 18% Cr, 15% Ni, 2% Mo, 2% B, and 3% WC were weighed and mixed with 50 μm diamond particles. Spherical powder was prepared using a gas atomization method. After vacuum drying, the spherical powder was pressed into a blank and sintered under vacuum at 800℃, 9 MPa, and 120 min to obtain a sintered body. This sintered body was then die-cast at 180 MPa for 5 s to obtain a 20 mm thick diamond alloy disk. The diamond particle density in the diamond alloy disk was 4.4 carats / cm³. 3 .

[0088] A porous alumina ceramic material with a porosity of 50% and a thickness of 7.5 mm was provided, and then a 59 nm Cr2O3 layer was formed on the foam surface by magnetron sputtering.

[0089] A carbon fiber reinforced epoxy resin layer with a carbon fiber content of 37 vol% (elastic modulus of 37 GPa and density of 1.58 g / cm³) and a thickness of 7 mm was used as the matrix layer.

[0090] The working layer, transition layer, and substrate layer are then assembled in a stacked order to obtain the grinding disc.

[0091] Example 4

[0092] The difference between Example 4 and Example 1 lies only in that SiC particles with a diameter of 50 nm and diamond particles with a diameter of 2 μm are mixed at a mass ratio of 7:3, and then 3% polyvinyl alcohol is added. The mixture is then pressed into a porous preform with a porosity of 40% under a pressure of 150 MPa. After curing at 200 °C to remove the polyvinyl alcohol, the preform is placed in a vacuum sintering furnace and sintered at 10 °C / min to 1100 °C under an Ar atmosphere for 30 min to form a porous framework. Then, a metal powder consisting of 1.5 wt% Cr, 0.1 wt% Zr, and the balance Cu is placed on top of the porous framework and heated to 1200 °C in a vacuum furnace to melt it. A pressure of 15 MPa is then applied and held under Ar gas protection for 20 minutes to ensure complete penetration, resulting in a reinforcing phase composed of a porous framework and a metal composite.

[0093] Then, grooves are made on the working surface of the diamond alloy disk. The grooves include at least two spaced first grooves and at least two spaced second grooves. The first grooves are radially distributed with the opening as the center. The width of the first groove is 15 mm and the included angle between two adjacent first grooves is 60°. The second grooves extend along the circumference of the diamond alloy disk and are distributed in a ring shape. The width of the second groove is 15 mm and the distance between two adjacent second grooves is 90 mm. The first grooves and the second grooves intersect each other. Then, the reinforcing phase is fixed in the grooves by brazing.

[0094] Example 5

[0095] The difference between Example 5 and Example 2 lies only in that SiC particles with a diameter of 30 nm and diamond particles with a diameter of 3 μm are mixed at a mass ratio of 8:2, and then 3% polyvinyl alcohol is added. The mixture is then pressed into a porous preform with a porosity of 50% under a pressure of 180 MPa. After curing at 200 °C to remove the polyvinyl alcohol, the preform is placed in a vacuum sintering furnace and sintered at 10 °C / min to 1150 °C under an Ar atmosphere for 10 min to form a porous framework. Then, a metal powder consisting of 0.5 wt% Cr, 0.2 wt% Zr, and the balance Cu is placed on top of the porous framework and heated to 1200 °C in a vacuum furnace to melt it. A pressure of 15 MPa is then applied and held under Ar gas protection for 20 minutes to ensure complete penetration, resulting in a reinforcing phase composed of a porous framework and a metal composite.

[0096] Then, grooves are made on the working surface of the diamond alloy disk. The grooves include at least two spaced first grooves and at least two spaced second grooves. The first grooves are radially distributed with the opening as the center. The width of the first groove is 20 mm and the included angle between two adjacent first grooves is 42°. The second grooves extend along the circumference of the diamond alloy disk and are distributed in a ring shape. The width of the second groove is 20 mm and the distance between two adjacent second grooves is 80 mm. The first grooves and the second grooves intersect each other. Then, the reinforcing phase is fixed in the grooves by brazing.

[0097] Example 6

[0098] The difference between Example 6 and Example 3 lies only in that TiC particles with a diameter of 10 nm and diamond particles with a diameter of 5 μm are mixed at a mass ratio of 7:3, and then 3% polyvinyl alcohol is added. The mixture is then pressed into a porous preform with a porosity of 60% under a pressure of 160 MPa. After curing at 200 °C to remove the polyvinyl alcohol, the preform is placed in a vacuum sintering furnace and sintered at 10 °C / min to 1130 °C under an Ar atmosphere for 20 min to form a porous framework. Then, a metal powder consisting of 0.5 wt% Cr, 0.2 wt% Zr, and the balance Cu is placed on top of the porous framework and heated to 1200 °C in a vacuum furnace to melt it. A pressure of 15 MPa is then applied and held under Ar gas protection for 20 minutes to ensure complete penetration, resulting in a reinforcing phase composed of a porous framework and a metal composite.

[0099] Then, grooves are made on the working surface of the diamond alloy disk. The grooves include at least two spaced first grooves and at least two spaced second grooves. The first grooves are radially distributed with the opening as the center. The width of the first groove is 25 mm and the included angle between two adjacent first grooves is 36°. The second grooves extend along the circumference of the diamond alloy disk and are distributed in a ring shape. The width of the second groove is 25 mm and the distance between two adjacent second grooves is 70 mm. The first grooves and the second grooves intersect each other. Then, the reinforcing phase is fixed in the grooves by brazing.

[0100] Comparative Example 1

[0101] Comparative Example 1 uses a commercially available cast iron diamond grinding disc of model [A325] from Mitsubishi Materials, Japan.

[0102] The performance of the grinding discs in the examples and comparative examples was tested, and the results are shown in Table 1.

[0103] Table 1 Test Results

[0104]

[0105] As shown in Table 1, the grinding disc of the present invention has excellent corrosion resistance and is suitable for use in aqueous solution conditions, such as in the case of auxiliary grinding using diamond micron powder aqueous solution. At the same time, the grinding disc of the present invention has excellent wear resistance, does not require frequent maintenance, which helps to reduce maintenance costs and improve grinding accuracy.

[0106] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0107] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A grinding disc, characterized in that, The grinding disc comprises a working layer, a transition layer, and a substrate layer stacked sequentially, and the grinding disc satisfies the following conditions: (1) The working layer includes a diamond alloy disk, wherein the diamond alloy disk includes an alloy matrix and diamond particles distributed in the alloy matrix. By mass fraction, the alloy matrix includes 50%-60% Fe, 18%-22% Cr, 15%-18% Ni, 2%-4% Mo, 1.5%-2.5% B and 3%-5% WC; (2) The transition layer includes a porous inorganic material matrix and a ceramic layer attached to the surface of the porous inorganic material matrix; (3) the matrix layer has an elastic modulus of 20 GPa or more and a density of 3.0 g / cm 3 3.0 g / cm3, and is selected from at least one of a carbon fiber reinforced PEEK layer, a carbon fiber reinforced PEKK layer, a carbon fiber reinforced epoxy resin layer, or an aluminum matrix composite layer.

2. The grinding disc according to claim 1, characterized in that, The surface of the working layer that is away from the transition layer is the working surface, and the working surface of the diamond alloy disk is also provided with a grid groove. And / or, the diamond particle distribution density in the diamond alloy disk is 4.4 carats / cm³. 3 -8.8 carats / cm 3 ; And / or, the diamond particles in the diamond alloy disk have a particle size of 100-200 mesh; And / or, the thickness of the diamond alloy disk is 12mm-20mm.

3. The grinding disc according to claim 1, characterized in that, The working layer also includes a reinforcing phase. The surface of the working layer facing away from the transition layer is the working surface. The reinforcing phase is embedded in the working surface of the diamond alloy disk. The reinforcing phase includes a porous skeleton and a metal composite filling the porous skeleton. The porous skeleton includes ceramic materials and diamond particles.

4. The grinding disc according to claim 3, characterized in that, The mass ratio of ceramic material to diamond particles in the porous framework is 7:3-8:2; And / or, the porosity of the porous framework is 30%-60%; And / or, the particle size of the ceramic material in the porous framework is 40nm-100nm, and the particle size of the diamond particles is 2μm-5μm; And / or, the ceramic material is selected from at least one of silicon carbide, boron carbide, titanium carbide, tungsten carbide, and silicon nitride; And / or, by mass fraction, the metal complex consists of 0.5%-1.5% Cr, 0.1%-0.2% Zr, and the balance Cu.

5. The grinding disc according to claim 3, characterized in that, The reinforcing phase includes at least two spaced-apart first reinforcing bodies, and the first reinforcing bodies are radially distributed around the center of the grinding disk; Alternatively, the reinforcing phase includes at least two spaced-apart second reinforcing bodies that extend circumferentially along the diamond alloy disk and are distributed in a ring shape; Alternatively, the reinforcing phase includes at least two spaced-apart first reinforcing bodies and at least two spaced-apart second reinforcing bodies, the first reinforcing bodies being radially distributed around the center of the grinding disk, the second reinforcing bodies being circumferentially distributed along the diamond alloy disk and being annularly distributed, and the first reinforcing bodies and the second reinforcing bodies intersecting each other.

6. The grinding disc according to claim 5, characterized in that, The included angle between two adjacent first reinforcements is 36°-60°; And / or, the thickness of the first reinforcement is less than or equal to the thickness of the diamond alloy disk, and the width of the first reinforcement is 15mm-25mm; And / or, the spacing between two adjacent second reinforcements is 70mm-90mm; And / or, the thickness of the second reinforcement is less than or equal to the thickness of the diamond alloy disk, and the width of the second reinforcement is 15mm-25mm.

7. The grinding disc according to claim 1, characterized in that, The porous inorganic material matrix in the transition layer is selected from at least one of the following: aluminum foam matrix, magnesium foam matrix, and porous alumina ceramic matrix. And / or, the porosity of the porous inorganic material matrix is ​​30%-50%; And / or, the ceramic layer is selected from at least one of alumina layer, chromium oxide layer, titanium oxide layer, yttrium oxide layer, and chromium nitride layer; And / or, the thickness of the ceramic layer is 20nm-100nm; And / or, the thickness of the porous inorganic material matrix is ​​5mm-10mm.

8. The grinding disc according to claim 1, characterized in that, The thickness of the substrate layer is 4mm-8mm.

9. The grinding disc according to any one of claims 1 to 8, characterized in that, An interface enhancement layer is also provided between the working layer and the transition layer; And / or, an adhesive layer is further provided between the transition layer and the substrate layer.

10. The application of a grinding disc as described in any one of claims 1 to 9 in diamond processing.

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