Method for manufacturing magnetic suction case for electronic device
Patent Information
- Application Number
- CN202511492928.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-20
- Publication Date
- 2026-09-29
- Estimated Expiration
- 2045-10-20
AI Technical Summary
[0004]针对上述现有技术的不足,本发明所要解决的技术问题是:提供一种电子设备用磁吸壳体制造方法以解决现有磁吸壳体加工出后密度大导致重量较重的问题
[0015]本发明的电子设备用磁吸壳体制造方法,至少具有如下有益效果:通过由外至内密度由高至低排列布置,使外层料片形成外层结构后保持基本的外层强度,其余部分则与外层料片相互配合增加强度和便于垫片和磁块的设置,且能够在很大程度上降低整体重量;密度更低的填充料片结合内层料片使产品大幅度减重,实现产品的轻量化,同时又具有足够的强度支撑。
Smart Images

Figure CN121133113B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electronic device accessories, and in particular to a method for manufacturing a magnetic housing for electronic devices. Background Technology
[0002] As market demands change and technology advances, electronic devices, such as tablet computers, are seeing increasingly diverse floating magnetic keyboard cases (or back panels). These have evolved from simple auxiliary keyboards to more sophisticated designs like the Apple Magic Keyboard Floating Magnetic Keyboard, UGREEN's Floating Magnetic Keyboard, Baseus Floating Magnetic Keyboard, WIWU Magic Keyboard Floating Magnetic Keyboard, and Gemma's Floating Magnetic Keyboard. Floating magnetic keys achieve rapid attachment and fixation to the tablet computer through built-in magnets, ensuring the tablet remains securely fixed in a specific location, such as a desktop or stand, without slipping or moving.
[0003] Existing magnetic housings are usually injection molded from plastic materials, but plastic products have low strength and are easily deformed. Another type of magnetic housing is usually made of multi-layer electronic glass fiber cloth through a lamination process, but the magnetic housings produced by this method have a higher density and are heavier. When using the finished product, the heavy weight can lead to a poor user experience and does not meet market development trends. Summary of the Invention
[0004] In view of the shortcomings of the prior art, the technical problem to be solved by the present invention is to provide a method for manufacturing a magnetic housing for electronic devices to solve the problem that the existing magnetic housings have high density and are therefore heavy.
[0005] To solve the above-mentioned technical problems, one technical solution adopted by the present invention is: a method for manufacturing a magnetic housing for electronic devices, comprising the following steps: S1. Sheet preparation: Two sets of outer sheet materials for forming an outer layer structure, an inner sheet material for forming an inner layer structure located in the outer layer structure, and a magnetic suction part are provided. The density of the inner sheet material is less than that of the outer sheet material. The inner sheet material includes an outer sheet material for forming a peripheral structure and a filler sheet material with a density less than that of the outer sheet material and the outer sheet material and used to form a filler plate. The filler sheet material is used to be disposed inside the outer sheet material. S2. Sheet forming: Stack the prepared sheets in sequence to form a stack and place it on the hot press plate. After hot pressing the stack for a certain time, it is formed into a lightweight board. S3. Shaping and processing: The lightweight board is shaped and processed to produce the product.
[0006] Furthermore, step S1 includes the following sub-steps: S11. Preparation of semi-finished sheet material: Select raw materials of different densities to prepare outer sheet material and outer sheet material respectively, so as to form multiple sheet material with suitable shape. Each sheet material has multiple forming areas, and the multiple forming areas on each sheet material are distributed in a rectangular array. S12. Preparation of molding sheet: Prepare multiple filler sheets and magnetic parts that are the same number as the molding area on the single half-finished sheet.
[0007] Furthermore, in step S1: the density of the outer layer sheet is greater than the density of the inner layer sheet; The outer layer sheet includes a first sheet, a second sheet, a third sheet, and a fourth sheet, wherein the density of the first sheet = the density of the fourth sheet > the density of the second sheet = the density of the third sheet ≥ the density of the outer sheet > the density of the filler sheet; The outer sheet includes a fifth sheet, a sixth sheet, and a seventh sheet, wherein the density of the sixth sheet is greater than the density of the fifth sheet and equal to the density of the seventh sheet. The density of the first material is 1.50–1.8 g / cm³. 3 The density of the second and sixth flakes is 1.10–1.54 g / cm³. 3 The density of the fifth material sheet is 0.6–0.8 g / cm³. 3 The density of the filler sheet is 0.089–0.131 g / cm³. 3 .
[0008] Furthermore, in step S1: the volume percentage of the outer layer sheet is less than the volume percentage of the inner layer sheet; The volume ratio of the first and fourth sheet materials is less than the volume ratio of the fifth and seventh sheet materials, which is less than the volume ratio of the second, third, and sixth sheet materials, which is less than the volume ratio of the filler sheet materials. The density of both the first and fourth material sheets is 1.60 g / cm³. 3 The density of the second, third, and sixth flakes is 1.24 g / cm³. 3 The density of both the fifth and seventh flakes is 0.7 g / cm³. 3 The density of the filler sheet is 0.11 g / cm³. 3 The volume percentage of the first and fourth sheet is 9.23%, the volume percentage of the fifth and seventh sheet is 11.99%, the volume percentage of the second, third and sixth sheet is 23.99%, and the volume percentage of the filler sheet is 53.4%.
[0009] Furthermore, in step S1: The magnetic attraction part is set according to the number of forming areas on a single sheet of material and each part includes a pad and a magnetic block; Each of the fifth, sixth, and seventh sheet materials has an inner hole area with the same shape as the filler sheet in each forming area. Each forming area of the sixth sheet material has a first mounting hole for the gasket to be embedded therein. Each forming area of the fifth and second sheet materials has a second mounting hole and a third mounting hole for the magnetic block to be embedded therein, respectively.
[0010] Furthermore, in step S1: at least one extension is formed on at least one side of the filler sheet, and the inner hole region is adapted to be opened in the filler sheet.
[0011] Furthermore, step S2 includes the following sub-steps: S21. Stacking: After placing each material sheet in sequence on a stacking fixture to form a stack, cover both sides of the stack with release film and then transfer it to a steel plate. S22. Hot pressing: Multiple layers of material stacks are placed together with steel plates in a hot press plate and pressed tightly by an upper cover plate for a certain period of time to form a lightweight plate after cooling.
[0012] Furthermore, in step S21: the fourth sheet, the third sheet, the seventh sheet, the sixth sheet, the spacer, the fifth sheet, the filler sheet, the magnetic block, the second sheet, and the first sheet are stacked in sequence; Two positioning holes are formed on each semi-finished material sheet, and a positioning groove is formed on the fourth material sheet; the stacking fixture is respectively formed with positioning cavities for each material sheet to pass through in sequence and for positioning the four corners of each material sheet, a first positioning post that passes through each positioning groove after each material sheet is positioned in the positioning cavity, and a second positioning post that passes through the positioning groove after each material sheet is positioned in the positioning cavity.
[0013] Furthermore, in step S22: 8 to 10 layers of material stacks are stacked in the hot press plate, with a steel plate between each layer of material stacks, and after the multiple layers of material stacks are stacked, buffer pads are placed outside the material stacks on both sides before hot pressing.
[0014] Furthermore, step S3 includes the following sub-steps: S31. Cutting process: Cut the lightweight board with the connection between each forming area as the cutting dividing line to form multiple forming boards. S32. Appearance processing: Using CNC equipment to process the product shape on the molding plate until the product is formed.
[0015] The magnetic housing manufacturing method for electronic devices of the present invention has at least the following beneficial effects: by arranging the outer layer sheet in a high-low density manner from the outside to the inside, the outer layer sheet maintains basic outer layer strength after forming the outer layer structure, while the remaining parts cooperate with the outer layer sheet to increase strength and facilitate the setting of pads and magnets, and can greatly reduce the overall weight; the lower density filler sheet combined with the inner layer sheet greatly reduces the weight of the product, achieving product lightweighting, while still having sufficient strength support. Attached Figure Description
[0016] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a flowchart of the manufacturing method of the present invention; Figure 2 This is a flowchart of the sub-steps of step S1 of the present invention; Figure 3 This is a schematic diagram of the structure of a to h in step S1 of the present invention; Figure 4 A flowchart of the sub-steps of step S2 in the invention; Figure 5 This is a schematic diagram of the stacked fixtures in step S2 of the present invention; Figure 6 This is a schematic diagram showing the arrangement of the various material sheets stacked on the stacking fixture in step S2 of the present invention; Figure 7 This is an exploded view of the hot bearing plate of the present invention; Figure 8 This is a flowchart of the sub-steps of step S3 of the present invention; Figure 9 This is a schematic diagram of the formed plate after processing in step S31 of the present invention; Figure 10 This is a schematic diagram of the magnetic housing of the present invention; Figure 11 This is a schematic diagram of the magnetic housing of the present invention (from another angle); Figure 12 This is an exploded view of the magnetic housing of the present invention; Figure 13 This is an exploded view of the magnetic housing of the present invention (from another angle); Figure 14 for Figure 13 An enlarged view of part A shown; Figure 15 for Figure 13 An enlarged view of part B shown. The meanings of the labels in the attached diagram are as follows: First semi-cured plate 1, first upper semi-cured plate 11, first lower semi-cured plate 12, second semi-cured plate 2, second upper semi-cured plate 21, third mounting hole 22, second lower semi-cured plate 23, second clearance area 31, perforation 32, fourth mounting hole 33, first clearance area 34, inner hole area 35, clearance cavity 351, smooth plate 4, hinge area 41, second mounting hole 42, third semi-cured plate 5, first mounting hole 51, filling plate 6, extension 61, magnetic suction part 7, gasket 71, magnetic block 72, stacking fixture 8, fixture plate 81, positioning block 82, first positioning post 83, second positioning post 84, clearance through hole 85, hot pressure plate 9, locking strip 91, steel plate 92, top cover plate 93. Detailed Implementation
[0017] The invention will now be further described with reference to the accompanying drawings.
[0018] Although the numerical ranges and parameter settings presented in this invention are approximations, the numerical settings in specific instances are reported as precisely as possible. Any numerical value, however, inherently contains certain inevitable errors arising from the standard deviation found in the respective test measurements. Similarly, as used herein, the term "about" generally refers to within 10%, 5%, 1%, or 0.5% of a given value or range. Alternatively, the term "about" means within an acceptable average standard error that can be conceived by one of ordinary skill in the art. Except in instances of operation / work, or unless expressly stated otherwise, all numerical ranges, totals, values, and percentages, such as those for material quantities, durations, temperatures, operating conditions, amounts, and other similarities disclosed herein, should be understood to be modified by the term "about" in all cases. Therefore, unless otherwise stated, the numerical parameter settings set forth in this invention and the appended claims are approximations that can be changed upon request. At a minimum, each numerical parameter should be interpreted based on the number of significant figures reported and the application of ordinary rounding techniques. A range herein may be expressed as from one endpoint to another or between two endpoints. All scopes disclosed herein include endpoints unless otherwise stated.
[0019] Furthermore, the technical parts described in this invention and the appended claims are primarily the improved technical parts of this invention, and do not limit the object protected by this invention to only having these technical parts. Other known essential components (structures and / or methods) and / or non-essential components of the object protected, besides the technical parts described in this invention and the appended claims, are not included in this invention and the appended claims because they do not fall within the scope of improvements of this invention; however, this does not mean that the object protected by this invention does not possess these known components.
[0020] Please see Figures 1 to 15 The method for manufacturing a magnetic housing for electronic devices according to the present invention includes the following steps: S1. Sheet preparation: Two sets of outer sheet materials for forming an outer layer structure, an inner sheet material for forming an inner layer structure located in the outer layer structure, and a magnetic suction part 7 are provided. The density of the inner sheet material is less than that of the outer sheet material. The inner sheet material includes an outer sheet material for forming a peripheral structure and a filler sheet material with a density less than that of the outer sheet material and the outer sheet material and used to form a filler plate 6. The filler sheet material is used to be disposed in the outer sheet material.
[0021] Step S1 includes the following sub-steps: S11. Preparation of semi-finished material sheets: Select raw materials of different densities to prepare outer layer material sheets and peripheral material sheets respectively, so as to form multiple material sheets with suitable shapes. Each of the material sheets has multiple forming areas, and the multiple forming areas on each material sheet are distributed in a rectangular array.
[0022] In step S11: each sheet is rectangular, and multiple forming areas on each sheet are arranged in a rectangular array. In one embodiment, six forming areas are formed on each sheet, and the six forming areas are divided into two rows and three columns.
[0023] In this embodiment, the density of the outer layer sheet is greater than that of the inner layer sheet, so that the outer layer structure has higher strength to form a protective layer. The outer layer sheet includes a first sheet, a second sheet, a third sheet, and a fourth sheet, all of uniform rectangular sheet structure, and the peripheral sheet includes a fifth sheet, a sixth sheet, and a seventh sheet, all of uniform rectangular sheet structure, and therefore each has a long side and a wide side. Figure 3 In the diagram, a is the first material piece, b is the second material piece, c is the fifth material piece, d is the sixth material piece, e is the seventh material piece, f is the third material piece, g is the filler material piece, and h is the fourth material piece.
[0024] Preferred, 2.0 g / cm 3 > The density of the first material sheet = the density of the fourth material sheet > the density of the second material sheet = the density of the third material sheet ≥ the density of the outer material sheets > the density of the filler material sheet; wherein, the maximum density of the first material sheet is less than 2.0 g / cm³. 3 The density of the second sheet equals the density of the sixth sheet, which in turn equals the density of the fifth sheet, which equals the density of the seventh sheet. The densities of the first and fourth sheets are both 1.50–1.8 g / cm³. 3 Preferably, it is 1.6–1.8 g / cm³. 3 The first and fourth sheets are made of WH316-1080RC6C10 titanium white halogen-free roll material, with a single sheet thickness of 0.075±0.018mm and a resin content of 61%. The second, third, and sixth sheets all have a density of 1.10~1.34g / cm³. 3 The preferred concentration is 1.10–1.24 g / cm³.3 The raw material specifications are PP-2116 epoxy fast-curing resin and titanium white halogen-free roll material, with a single sheet pressing density of 0.22±0.018 and a resin content of 61%. Preferably, the total volume ratio of the first and fourth sheets with higher density is lower than that of the second, third, and sixth sheets, so that the first and fourth sheets with higher density are in the minority, while the second, third, and sixth sheets with relatively lower density are in the majority, thereby reducing the weight without changing the overall volume.
[0025] Preferably, the density of both the fifth and seventh material pieces is 0.6–0.8 g / cm³. 3 Preferably, it is 0.7–0.8 g / cm³. 3 The fifth sheet is made of GF smooth board and titanium white halogen-free board, with a single sheet thickness of 0.42±0.05mm. The seventh sheet is also made of GF smooth board and titanium white halogen-free board, with a single sheet thickness of 0.30±0.05mm, and is a type of PP board.
[0026] S12. Preparation of Molding Sheets: Prepare multiple sets of the aforementioned filler sheets and magnetic suction parts, matching the number of molding areas on the single half-finished sheet. The filler sheets are AF110 foam with a density of 0.11 ± 0.021 g / cm³. 3 The density of the filler flakes is 0.089–0.131 g / cm³. 3 .
[0027] In steps S11 and S12, the fifth and seventh sheet materials are configured together as the low-density portion, the second, third, and sixth sheet materials are configured together as the medium-density portion, and the first and fourth sheet materials are configured together as the high-density portion. The volume percentage of the high-density portion < the volume percentage of the low-density portion < the volume percentage of the medium-density portion < the volume percentage of the filler sheet.
[0028] In this step, each molding area of the fifth, sixth, and seventh sheet has an inner hole area with the same shape as the filler sheet. To improve the bonding force between the filler sheet and the inner layer sheet, and to maximize the volume ratio of the filler sheet to reduce the product weight, at least one extension 61 is formed on at least one side of the filler sheet. The inner hole area is adapted to the filling sheet. In this embodiment, two extensions 61 extend along both sides of the filler sheet. Each extension 61 is spaced apart and can be staggered to ensure a stronger and more stable bonding force between the filler sheet and the inner layer sheet. A clearance cavity 351 is formed on each inner hole area corresponding to the position of the extension 61. The shape and size of the clearance cavity 351 are consistent with the extension 61 so that the filler sheet can be just embedded in the inner hole area and the clearance cavity 351. The clearance cavity 351 is staggered with the magnetic part 7, and the spaced extensions 61 provide position and space for the installation of the magnetic part 7.
[0029] In a preferred embodiment, the density of both the first and fourth sheet is 1.60 g / cm³. 3 The thickness of a single sheet is 0.075 mm; the density of the second, third, and sixth sheets is 1.24 g / cm³. 3 The thickness of a single sheet is 0.22 mm; the density of the fifth and seventh sheets is 0.7 g / cm³. 3 The single-sheet thickness of the fifth sheet is 0.42 mm, and the single-sheet thickness of the seventh sheet is 0.30 mm; the density of the filler sheet is 0.11 g / cm³. 3 The thickness of a single sheet is the sum of the thicknesses of the fifth, sixth, and seventh sheets. Based on this, the volume of each sheet is calculated and then divided by the total volume of the product. The volume percentage of the high-density portion is approximately 9.23%, the medium-density portion is approximately 23.99%, the low-density portion is approximately 11.99%, the filler plate 6 is approximately 53.4%, and the remaining 1.39% is the volume percentage of the magnetic suction part 7. This allows the high-density portion to maintain basic strength and protective capabilities in the outer layer, reducing weight by minimizing its volume percentage. However, a small volume percentage of the high-density portion also affects overall strength. Therefore, the medium-density portion has a higher volume percentage than the low-density and high-density portions, thus improving overall strength and ensuring the overall strength of the magnetic suction shell meets product usage requirements. Maximizing the volume percentage of the filler plate 6 and combining it with the inner structure achieves product lightweighting.
[0030] The number of magnetic suction units 7 corresponds to the number of molding areas on a single sheet. For example, if the first sheet has six molding areas, then there are also six magnetic suction units 7. Each magnetic suction unit 7 includes a spacer 71 and a magnetic block 72. In one embodiment, four spacers 71 are provided, and they are of different sizes and shapes. The density of each spacer 71 is approximately 880 g / m³. 2 For example, the density of each gasket 71 is 880 g / m³. 2 Magnetic block 72 is a magnet used in magnetically attached electronic devices.
[0031] Each forming area of the seventh sheet has a first mounting hole 51 for inserting a gasket 71; each forming area of the fifth sheet has a second mounting hole 42 for inserting a magnetic block 72; and each forming area of the second sheet has a third mounting hole 22 for inserting a magnetic block 72. Sheets a to f and h are all defined as semi-finished sheets. Positioning through holes can be provided at the edge of each forming area in each semi-finished sheet to facilitate positioning of each forming area during subsequent processing. The length and width of sheet h are slightly larger than the other semi-finished sheets. It should be noted that the thickness of the gasket 71 is equal to the thickness of the sixth sheet, and the thickness of the magnetic block 72 is equal to the sum of the thicknesses of the second and fifth sheets.
[0032] S2, please refer to Figures 4 to 6 Sheet forming: The prepared sheets are stacked in sequence to form a stack and placed on the hot press plate 9. The stack is hot-pressed for a certain time to form a lightweight plate.
[0033] Step S2 includes the following sub-steps: S21, Stacking: After placing each material sheet in sequence on a stacking fixture 8 to form a stack, cover both sides of the stack with release film and transfer it to a steel plate 92.
[0034] In step S21: the fourth sheet, third sheet, seventh sheet, sixth sheet, spacer 71, fifth sheet, filler sheet, magnetic block 72, second sheet, and first sheet are stacked sequentially. Two positioning holes are formed on each semi-finished sheet, with the two positioning holes on each semi-finished sheet being diagonally distributed for quick positioning. A positioning groove is formed on one side of the fourth sheet, penetrating the fourth sheet along its thickness direction and extending outwards parallel to the fourth sheet, and the positioning groove is semi-circular. The positioning groove is located on the portion of the fourth sheet that is larger than the other semi-finished sheets without overlapping with them.
[0035] Please see Figure 5 and Figure 6The stacking fixture 8 includes a fixture plate 81 and four L-shaped positioning blocks 82 protruding from the top surface of the fixture plate 81. The four positioning blocks 82 are distributed and spaced apart from each other, corresponding to the four corner positions of the material pieces. The inner sides of the four positioning blocks 82 form a cuboid cavity. The cavity formed by the inner sides of the four positioning blocks 82 is configured as a positioning cavity, which is used for each formed material piece to be inserted into sequentially to block the sides of each formed material piece, so as to position each material piece from the four corners. The fixture plate 81 has a first positioning post 83 protruding at the position corresponding to the positioning hole for inserting into the two positioning holes on each semi-finished material piece, and a second positioning post 84 protruding at the position corresponding to the positioning groove for inserting into the positioning groove. The first positioning post 83 and the second positioning post 84 are both cylindrical. The two first positioning posts 83 are inserted into the corresponding first positioning holes to position each semi-finished material piece, preventing the material pieces from moving or deflecting in the horizontal direction. The second positioning post 84 is partially inserted into the positioning groove to provide positioning and also serves as a foolproof (i.e., error-proof) function. Preferably, multiple clearance holes 85 can be opened on the jig plate 81 located in the positioning cavity to facilitate the ejection of the material stack from below the clearance holes 85 after the material pieces are stacked in the positioning cavity to form a material stack, and also to reduce the interference of the jig plate 81 on the material pieces. It should be noted that when stacking the material pieces, the material pieces h can be located at the bottom or top, and the stacking order can be set as needed. After stacking, release film (not shown in the figure) is covered on both sides of the material stack to facilitate the adhesion between different magnetic shells after molding during subsequent processing.
[0036] S22, please refer to Figure 7 Hot pressing: Multiple layers of material stacks are stacked together with steel plate 92 in hot press plate 9 and pressed together by an upper cover plate 93 for a certain period of time to form a lightweight plate. After cooling, each material sheet and magnetic suction part are connected together to form a lightweight plate.
[0037] In step S22: the hot press plate 9 can be the hot press plate 9 on a vacuum multilayer hot press-800T. Eight to ten layers of material stacks are placed on the hot press plate 9, with a steel plate 92 placed between each stack. The steel plate 92 is 1.6mm thick to separate the stacks. To restrict the movement of the steel plates 92, locking strips 91 are provided on each side of the hot press plate 9 to block the steel plates 92. After placing buffer pads outside the two outermost stacks, the top cover plate 93 of the hot press presses each stack onto the hot press plate 9 and starts the press, performing hot pressing on the stacks. The average forming time for each stack is approximately 19.5 seconds. If the stack exceeds 10 layers, the forming time will increase significantly; if it is less than 8 layers, the production efficiency of the finished product will be affected. The number of stacks in this embodiment allows the forming time of each lightweight sheet to be within a suitable time. Among them, the vacuum multilayer hot press has a power / voltage of 130KW*2 for the hot press and 15KW for the cold press.
[0038] S3, please refer to Figures 8 to 9 Shaping and processing: The process of shaping lightweight boards to produce finished products.
[0039] Step S3 includes the following sub-steps: S31. Cutting process: Cut the lightweight board by using the connection between each forming area as the cutting dividing line to form multiple forming boards.
[0040] In step S31, the cutting dividing lines divide the lightweight board into six areas, each corresponding to a forming area. The cutting machine is used to cut the lightweight board along the cutting dividing lines to cut out six rectangular forming boards.
[0041] S32. Appearance processing: Using CNC equipment to process the product shape on the molding plate until the product is formed.
[0042] In step S32, after the molding plate is transferred to the corresponding positioning fixture, the molding plate is positioned through the positioning holes. First, the first lower semi-cured plate 12 is made to face upwards and the square fourth mounting hole 33 and through hole 32 are machined by CNC equipment. Then, the molding plate is flipped so that the first upper semi-cured plate 11 faces upwards and the first clearance area 34, the second clearance area 31 and the hinge area 41 are machined by CNC equipment to form the hinge groove. The remaining details of the magnetic housing are further processed by CNC until the product, i.e. the magnetic housing, is formed.
[0043] It should be noted that quality inspection is required after the lightweight panels are formed and shaped to screen out unqualified products and lightweight panels.
[0044] Please see Figures 10 to 15 The processed magnetic housing includes two outer layers formed by pressure molding, an inner layer between the two outer layers, and a magnetic part 7 within the inner layer.
[0045] Please see Figure 11 and Figure 12The outer layer structure includes two first semi-cured plates 1 and two second semi-cured plates 2 located between the two first semi-cured plates 1. The inner layer structure is stacked between the two second semi-cured plates 2, so that the two first semi-cured plates 1 and the two second semi-cured plates 2 are symmetrically distributed on both sides of the inner layer structure. Specifically, one first semi-cured plate 1 and one second semi-cured plate 2 are located on one side of the inner layer structure, and the other first semi-cured plate 1 and the other second semi-cured plate 2 are located on the other side of the inner layer structure and are symmetrically distributed, so that the two sides of the magnetic housing remain uniform and reduce the risk of product deformation. One first semi-cured plate 1 is configured as the first upper semi-cured plate 11, and the second semi-cured plate 2 located on the same side as the first upper semi-cured plate 11 is configured as the second upper semi-cured plate 21. The first upper semi-cured plate 11 and the second upper semi-cured plate 21 are used to form or accommodate hinges. Therefore, on the first upper semi-cured plate 11 and the second upper semi-cured plate 21, at the position corresponding to the hinge (one of the long sides), a second clearance area 31 is formed after CNC machining. The second clearance area 31 is a U-shaped notch to allow for hinge installation later. Both the first upper semi-cured plate 11 and the second upper semi-cured plate 21 have overlapping perforations 32 along their thickness direction. These perforations 32 are located near one corner of the first and second semi-cured plates 1 and 2, corresponding to the camera, so that when an electronic device, such as a tablet, is magnetically attached to the magnetic housing, the camera is aligned with the perforation 32 without affecting its use. Therefore, the perforations 32 and the second clearance area 31 are distributed on both sides along the width direction. The second upper semi-cured plate 21 has a third mounting hole 22, which, along with the inner layer structure, is filled with the magnetic part 7. This allows the first semi-cured plate 1 to block the magnetic part 7, creating a gap of approximately 0.06 mm between the magnetic part 7 and the side of the first upper semi-cured plate 11 facing away from the second upper semi-cured plate 21, thus satisfying the magnetic strength requirements of the magnetic part 7.
[0046] Another first semi-cured plate 1 is configured as a first lower semi-cured plate 12, and another second semi-cured plate 2 is configured as a second lower semi-cured plate 23. The first lower semi-cured plate 12 and the second lower semi-cured plate 23 are both formed with the aforementioned perforations 32, and fourth mounting holes 33 overlapping along the thickness direction are also formed on the first lower semi-cured plate 12 and the second lower semi-cured plate 23, and the fourth mounting holes 33 are distributed approximately diagonally to the perforations 32.
[0047] Please see Figure 12 and Figure 13 The inner structure is lighter than the outer structure, allowing the outer structure to maintain its strength while reducing the overall weight of the inner structure. The inner structure has the same shape as the outer structure and overlaps with it, both being rectangular. The inner structure includes an outer structure and a filling plate 6 that is embedded within the outer structure and is lighter than both the outer and outer structures. The magnetic part 7 is embedded within the outer structure.
[0048] The peripheral structure includes two identical polished plates 4 and a third semi-cured plate 5 located between the two polished plates 4. The outer edge contours of the two polished plates 4 and the third semi-cured plate 5 are substantially consistent with the outer edge contour of the second upper semi-cured plate 21. A hinge region 41 is formed on one side of one of the polished plates 4 for mounting a hinge. The hinge region 41 is recessed relative to the polished plate 4 to form a shallow, elongated groove, providing support for the hinge mounting. Multiple equally spaced protrusions are provided along the longitudinal direction of the hinge region 41. A first clearance region 34, substantially consistent with the second hinge region 41, is recessed on the other polished plate 4 and the third semi-cured plate 5 corresponding to the hinge region 41. Both the first clearance region 34 and the second clearance region 31 penetrate the plate along the thickness direction, allowing the hinge to be mounted on the polished plate 4 located in the middle.
[0049] The two bare plates 4 and the third semi-cured plate 5 each have an inner hole region 35 that is the same shape as the filler plate 6. The inner hole regions 35 together form a receiving cavity that is consistent with the outer contour of the filler plate 6 so that the filler plate 6 can be just embedded in it. The two bare plates 4, the third semi-cured plate 5 and the filler plate 6 installed in the receiving cavity are thermoformed together with the outer layer structure to position the filler plate 6 and ensure the positional accuracy and connection strength of the filler plate 6.
[0050] The first upper semi-cured plate 11 is formed from the first sheet material, the second upper semi-cured plate 21 is formed from the second sheet material, one smooth plate 4 is formed from the fifth sheet material, the third semi-cured plate 5 is formed from the sixth sheet material, another smooth plate 4 is formed from the seventh sheet material, the second lower semi-cured plate 23 is formed from the third sheet material, the filler plate 6 is a filler sheet, and the first lower semi-cured plate 12 is formed from the fourth sheet material. Therefore, the filler plate 6 accounts for approximately 53.4% of the volume, allowing the inner structure to be thermoformed with the third semi-cured plate 5 and the outer structure through a large volume of foam. The integrated material density is 2.0 g / cm³ compared to the first-generation product. 3 Compared to reducing the weight of the magnetic housing by approximately 70%, achieving product lightweighting, and saving costs to a certain extent, the specific volume ratio relative to the inner structure is set according to actual conditions. Correspondingly, the bare plate 4 is the low-density part, the third semi-cured plate 5 and the second semi-cured plate 2 together are the medium-density part, and the first semi-cured plate 1 is the high-density part. This allows the high-density part to maintain basic strength and protection capabilities in the outer layer, reducing weight by minimizing its volume ratio. However, a small volume ratio of the high-density part will also affect the overall strength. Therefore, the volume ratio of the medium-density part is higher than that of the low-density and high-density parts, which can improve the overall strength and make the overall strength of the magnetic housing meet the product usage requirements. The volume ratio of the filler plate 6 is maximized and combined with the inner structure to achieve product lightweighting.
[0051] The third prepreg 5 has a first mounting hole 51 for the gasket 71 to be filled in. The shape and size of the first mounting hole 51 are consistent with the shape and size of the gasket 71, so that the gasket 71 fills the first mounting hole 51 completely. A second mounting hole 42 is provided on the 0.42mm thick smooth plate 4. The second mounting hole 42 and the third mounting hole 22 completely overlap in the thickness direction, and the total thickness (or depth) is consistent with the thickness of the magnetic block 72, so that the magnetic block 72 can fill the second mounting hole 42 completely. The first mounting hole 51 and the second mounting hole 42 provide mounting space for the gasket 71 and the magnetic block 72 respectively and position them to ensure the positional accuracy of the magnetic part 7. After thermoforming, it also facilitates the firm bonding of the magnetic part 7 to the inner and outer layer structures. It should be noted that the term "prepreg" is a technical term, which refers to a prepreg composed of resin and reinforcing materials.
[0052] Compared with the prior art, the magnetic housing manufacturing method for electronic devices of the present invention ensures the strength of the magnetic housing by maintaining a symmetrical outer layer structure and reducing the risk of deformation. The density from the outside to the inside decreases, which can ensure the strength of the magnetic housing. At the same time, by increasing the volume ratio of the filling plate 6, the product weight is reduced, thereby reducing costs.
Claims
1. A method for manufacturing a magnetic housing for electronic devices, characterized in that, Includes the following steps: S1. Sheet preparation: Two sets of outer sheet materials for forming an outer layer structure, an inner sheet material for forming an inner layer structure located in the outer layer structure, and a magnetic suction part are provided. The density of the inner sheet material is less than that of the outer sheet material. The inner sheet material includes an outer sheet material for forming a peripheral structure and a filler sheet material with a density less than that of the outer sheet material and the outer sheet material and used to form a filler plate. The filler sheet material is used to be disposed inside the outer sheet material. The outer layer sheet includes a first sheet, a second sheet, a third sheet, and a fourth sheet, wherein the density of the first sheet = the density of the fourth sheet > the density of the second sheet = the density of the third sheet ≥ the density of the outer sheet > the density of the filler sheet; The outer sheet includes a fifth sheet, a sixth sheet, and a seventh sheet, wherein the density of the sixth sheet is greater than the density of the fifth sheet and equal to the density of the seventh sheet. S2. Sheet forming: Stack the prepared sheets in sequence to form a stack and place it on the hot press plate. After hot pressing the stack for a certain time, it is formed into a lightweight board. S3. Shaping and processing: The lightweight board is shaped and processed to produce the product.
2. The method for manufacturing a magnetic housing for electronic devices as described in claim 1, characterized in that, Step S1 includes the following sub-steps: S11. Preparation of semi-finished sheet material: Select raw materials of different densities to prepare outer sheet material and outer sheet material respectively, so as to form multiple sheet material with suitable shape. Each sheet material has multiple forming areas, and the multiple forming areas on each sheet material are distributed in a rectangular array. S12. Preparation of molding sheet: Prepare multiple filler sheets and magnetic parts that are the same number as the molding area on the single half-finished sheet.
3. The method for manufacturing a magnetic housing for electronic devices as described in claim 1 or 2, characterized in that, In step S1: The density of the first material is 1.50–1.8 g / cm³. 3 The density of the second and sixth flakes is 1.10–1.34 g / cm³. 3 The density of the fifth material sheet is 0.6–0.8 g / cm³. 3 The density of the filler sheet is 0.089–0.131 g / cm³. 3 .
4. The method for manufacturing a magnetic housing for electronic devices as described in claim 3, characterized in that, In step S1: the volume percentage of the outer layer sheet is less than the volume percentage of the inner layer sheet; The volume ratio of the first and fourth sheet materials is less than the volume ratio of the fifth and seventh sheet materials, which is less than the volume ratio of the second, third, and sixth sheet materials, which is less than the volume ratio of the filler sheet materials. The density of both the first and fourth material sheets is 1.60 g / cm³. 3 The density of the second, third, and sixth flakes is 1.24 g / cm³. 3 The density of both the fifth and seventh flakes is 0.7 g / cm³. 3 The density of the filler sheet is 0.11 g / cm³. 3 The volume percentage of the first and fourth sheet is 9.23%, the volume percentage of the fifth and seventh sheet is 11.99%, the volume percentage of the second, third and sixth sheet is 23.99%, and the volume percentage of the filler sheet is 53.4%.
5. The method for manufacturing a magnetic housing for electronic devices as described in claim 3, characterized in that, In step S1: The magnetic attraction part is set according to the number of forming areas on a single sheet of material and each part includes a pad and a magnetic block; Each of the fifth, sixth, and seventh sheet materials has an inner hole area with the same shape as the filler sheet in each forming area. Each forming area of the sixth sheet material has a first mounting hole for the gasket to be embedded therein. Each forming area of the fifth and second sheet materials has a second mounting hole and a third mounting hole for the magnetic block to be embedded therein, respectively.
6. The method for manufacturing a magnetic housing for electronic devices as described in claim 5, characterized in that, In step S1: at least one extension is formed on at least one side of the filler sheet, and the inner hole region is adapted to be opened in the filler sheet.
7. The method for manufacturing a magnetic housing for electronic devices as described in claim 5, characterized in that, Step S2 includes the following sub-steps: S21, Stacking: After placing each material sheet in sequence on a stacking fixture to form a stack, cover both sides of the stack with release film and then transfer it to a steel plate. S22. Hot pressing: Multiple layers of material stacks are placed together with steel plates in a hot press plate and pressed tightly by an upper cover plate for a certain period of time to form a lightweight plate after cooling.
8. The method for manufacturing a magnetic housing for an electronic device as described in claim 7, characterized in that, In step S21: the fourth sheet, the third sheet, the seventh sheet, the sixth sheet, the spacer, the fifth sheet, the filler sheet, the magnetic block, the second sheet, and the first sheet are stacked in sequence; Two positioning holes are formed on each semi-finished material sheet, and a positioning groove is formed on the fourth material sheet; the stacking fixture is respectively formed with positioning cavities for each material sheet to pass through in sequence and for positioning the four corners of each material sheet, a first positioning post that passes through each positioning groove after each material sheet is positioned in the positioning cavity, and a second positioning post that passes through the positioning groove after each material sheet is positioned in the positioning cavity.
9. The method for manufacturing a magnetic housing for an electronic device as described in claim 7, characterized in that, In step S22: 8 to 10 layers of material stacks are stacked in the hot press plate, with a steel plate between each layer of material stacks. After the multiple layers of material stacks are stacked, buffer pads are placed outside the material stacks on both sides before hot pressing.
10. The method for manufacturing a magnetic housing for an electronic device as described in claim 5, characterized in that, Step S3 includes the following sub-steps: S31. Cutting process: Cut the lightweight board with the connection between each forming area as the cutting dividing line to form multiple forming boards. S32. Appearance processing: Using CNC equipment to process the product shape on the molding plate until the product is formed.
Citation Information
Patent Citations
Electronic equipment protective shell and manufacturing method thereof
CN117162521A
Manufacturing method of magnetic type protective backboard
CN119408213A