Thermostatic system and method for deep space simulation equipment

Abstract

This invention provides a temperature control system and method for deep space simulation equipment, including a thermal interface structure, a cryogenic subsystem, and a heating structure. The cryogenic subsystem can cool the thermal interface structure, and the heating structure can heat the thermal interface structure. The cryogenic subsystem includes a cryogenic refrigeration component and a gas cooling component. The cryogenic refrigeration component unidirectionally transfers cold energy to the thermal interface structure, and the gas cooling component uses cooling gas to cool the thermal interface structure. By combining gas cooling and electric heating, continuous temperature control in the range of 300K to 423K is achieved. By combining cryogenic refrigeration and electric heating, continuous temperature control in the range of 38K to 300K is achieved. Compared with existing space environment simulation equipment, its temperature range is extended to 38K to 423K, which can complete the extreme temperature environment required for deep space exploration, including the lunar polar regions and Mars. At the same time, based on the integrated heat transfer of conduction and convection, the cryogenic subsystem has a compact structure and does not require the use of liquid nitrogen or liquid helium, which is energy-saving and environmentally friendly.

Description

Technical Field

[0001] This invention relates to the field of deep space exploration simulation equipment technology, and more specifically, to a temperature control system and method for deep space simulation equipment. Background Technology

[0002] Deep space exploration is an important field in my country's aerospace systems engineering. The space environment that the probes need to experience in subsequent lunar and Mars exploration missions will be extended to 48K to 400K. Furthermore, it is necessary to conduct motion performance tests on the probes under continuous arbitrary temperature conditions within this extreme temperature range to improve their operational reliability. Therefore, a space environment simulation test system capable of continuous stepless temperature adjustment in a vacuum environment to reach extreme temperature ranges has become a key means to verify the functions, performance, and reliability of deep space probes.

[0003] Currently, domestic and international deep space exploration environmental test systems can only achieve high and low temperature vacuum environments, and their structures are relatively complex. The use of consumable working fluids such as liquid nitrogen results in high operating costs, and the space environment temperature range that can be simulated is narrow, leading to insufficient system reliability. At the same time, there are no publicly reported high and low temperature environment test systems with drive / load capabilities in the vacuum extreme temperature range.

[0004] Existing Chinese patent application CN113371236B specifically relates to a dual heat sink structure for liquid nitrogen and a GM-type cryogenic refrigerator. The outer liquid nitrogen heat sink provides auxiliary cooling to the inner GM cryogenic refrigerator heat sink. The liquid nitrogen pathway to the outer heat sink is connected and disconnected via a solenoid valve controlled by heat sink temperature feedback, achieving a wide temperature range of 20K to 400K. However, this system requires two sets of heat sink structures and a liquid nitrogen storage tank for supply, making it relatively complex. Furthermore, the heating element is directly mounted on the inner heat sink, which is directly connected to the cold-end refrigeration components of the GM refrigerator. This exposes the cold-end components to a high-temperature heating environment, making them highly susceptible to damage and malfunction.

[0005] Existing Chinese patent application document CN101576359A discloses a component for a cryogenic process system of a space environment simulation test equipment, specifically relating to a liquid nitrogen / alcohol dual-medium compatible heat sink system for space environment simulation test equipment. This heat sink system allows liquid nitrogen and alcohol to share the same flow channel, achieving an adjustable temperature range from 110K to 232K. However, this system requires a liquid nitrogen storage tank for liquid supply, making it relatively complex and limiting its temperature range.

[0006] There is an urgent need for a temperature control system that can continuously and stably regulate the temperature within the required temperature range. Summary of the Invention

[0007] In view of the deficiencies in the prior art, the purpose of this invention is to provide a temperature control system and method for deep space simulation equipment.

[0008] According to the present invention, a temperature control system for a deep space simulation device includes a thermal interface structure, a cryogenic subsystem, and a heating structure. The cryogenic subsystem can cool the thermal interface structure, and the heating structure can heat the thermal interface structure. The cryogenic subsystem includes a cryogenic refrigeration component and a gas cooling component. The cryogenic refrigeration component unidirectionally transfers cold energy to the thermal interface structure, and the gas cooling component uses cooling gas to cool the thermal interface structure.

[0009] Preferably, the cryogenic refrigeration component includes a cryogenic refrigerator and a unidirectional cold energy transfer structure, wherein the cold head of the cryogenic refrigerator is connected to the thermal interface structure through the unidirectional cold energy transfer structure.

[0010] Preferably, the unidirectional cold energy transfer structure includes a stainless steel tube structure with embedded sapphire crystal, and copper plates are provided at both ends of the stainless steel tube structure with embedded sapphire crystal. The copper plate at one end of the stainless steel tube structure with embedded sapphire crystal is connected to the cold head of the low-temperature refrigerator, and the copper plate at the other end of the stainless steel tube structure with embedded sapphire crystal is connected to the thermal interface structure.

[0011] Preferably, the gas cooling assembly includes a cooling gas pipeline structure, a cooling gas inlet distributor, and a cooling gas outlet distributor. The cooling gas pipeline structure is wrapped around the outer wall of the thermal interface structure. Cooling gas enters the cooling gas pipeline structure through the cooling gas inlet distributor and then flows out through the cooling gas outlet distributor.

[0012] Preferably, the gas cooling assembly further includes an inlet gas path solenoid valve, an outlet gas path solenoid valve, a four-way valve, a first gas temperature sensor, and a second gas temperature sensor; the inlet gas path solenoid valve is connected to the inlet of the cooling gas inlet distributor via the four-way valve, the first gas temperature sensor is connected to the inlet of the cooling gas inlet distributor via the four-way valve, and the outlet of the cooling gas inlet distributor is connected to the inlet of the cooling gas pipeline structure; the outlet gas path solenoid valve is connected to the outlet of the cooling gas outlet distributor via the four-way valve, the second gas temperature sensor is connected to the outlet of the cooling gas outlet distributor via the four-way valve, and the inlet of the cooling gas inlet distributor is connected to the outlet of the cooling gas pipeline structure.

[0013] Preferably, the thermal interface structure includes at least two temperature regulation zones, each of which is provided with at least one set of low-temperature refrigeration components and at least one cooling gas pipeline structure.

[0014] Preferably, the thermal interface structure includes a stage, a hexagonal copper heat sink, a copper plate, and a heat flow copper strip. The stage is fixedly disposed inside the hexagonal copper heat sink, and the heat flow copper strip connects the copper plate, the hexagonal copper heat sink, and the stage to form a heat flow path.

[0015] Preferably, the heating structure includes a heating strip disposed within a hexagonal copper heat sink, and the heating strip is in contact with and connected to the hexagonal copper heat sink and / or the heat flow copper strip or copper plate.

[0016] Preferably, cooling within the temperature range of 300K to 423K is achieved through the gas cooling assembly;

[0017] Cooling within the temperature range of 38K to 300K is achieved through the aforementioned cryogenic refrigeration component;

[0018] The heating structure is used for heating within an adjustable temperature range.

[0019] According to the present invention, a temperature control method for a deep space simulation device is provided, the temperature control method comprising:

[0020] Cooling method for the temperature range of 300K to 423K: Cooling gas enters the cooling gas pipeline structure through the cooling gas inlet distributor and then flows out through the cooling gas outlet distributor;

[0021] Cooling method in the temperature range of 38K to 300K: The cold head of the low-temperature refrigerator outputs cooling power stably, keeping the temperature at the interface between it and the unidirectional cold energy transfer structure stable at 0K. Its cold energy is transferred to the thermal interface structure through the characteristic of the unidirectional cold energy transfer structure that the cold conduction capacity increases linearly below 300K.

[0022] The process of stabilizing at any temperature from 38K to 423K is achieved by offsetting the heat provided by the heating structure with the cold energy in different temperature zones.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] 1. This invention achieves continuous temperature regulation in the range of 300K to 423K by combining air cooling and electric heating, and achieves continuous temperature regulation in the range of 38K to 300K by combining a GM cryogenic refrigerator with electric heating. Compared with existing space environment simulation equipment, its temperature range is extended to 38K to 423K, which can complete the extreme temperature environment required for deep space exploration, including the lunar polar region and Mars. At the same time, based on the cryogenic subsystem with integrated heat transfer of conduction and convection, its structure is compact and does not require the use of liquid nitrogen or liquid helium, which is energy-saving and environmentally friendly.

[0025] 2. This invention achieves independent and precise temperature control of the upper and lower parts of the thermal interface structure through the GM low-temperature refrigeration unit placed above and below the tank and the partitioned heating structure, ensuring temperature uniformity ≤3K and temperature control accuracy of ±0.1K.

[0026] 3. By adopting a unidirectional cold energy transfer structure, the cold energy of the GM cryogenic refrigerator can be transferred unidirectionally from the cold head of the refrigerator to the thermal interface structure, while avoiding the heat of the heating structure being transferred back to the cold head of the refrigerator through the thermal interface structure, thereby ensuring that the GM cryogenic refrigerator can work continuously and stably for a long time. Attached Figure Description

[0027] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0028] Figure 1 This is a schematic diagram illustrating the overall structure of the cryogenic subsystem, which is the main feature of this invention.

[0029] Figure 2 This is a cross-sectional view that mainly illustrates the overall structure of the experimental system in this invention;

[0030] Figure 3 This is an axial schematic diagram illustrating the overall structure of the experimental system, which is the main feature of this invention.

[0031] Figure 4 This is a schematic diagram illustrating the cooling gas pipeline structure on the outer wall of the hexagonal copper heat sink, which is the main feature of this invention.

[0032] Figure 5 This is a schematic diagram illustrating the copper plate structure on the hexagonal copper heat sink, which is the main feature of this invention.

[0033] Figure 6 This is a schematic diagram illustrating the thermal interface structure of the present invention.

[0034] As shown in the figure:

[0035] Detailed Implementation

[0036] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the invention in any way. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all fall within the protection scope of the present invention.

[0037] It should be noted that in the technical solution of this application, the Z-axis represents the height direction, the X-axis represents the axial direction of the tank structure 1, and the Y-axis represents the radial direction of the tank structure 1.

[0038] Example 1

[0039] like Figures 1 to 6As shown, a temperature control system for a deep space simulation device according to the present invention includes a thermal interface structure 4, a cryogenic subsystem 2, and a heating structure 3. The cryogenic subsystem 2 can cool the thermal interface structure 4, and the heating structure 3 can heat the thermal interface structure 4. The cryogenic subsystem 2 includes a cryogenic refrigeration component and a gas cooling component. The cryogenic refrigeration component unidirectionally transfers cold energy to the thermal interface structure 4, and the gas cooling component uses cooling gas to cool the thermal interface structure 4.

[0040] Specifically, the cryogenic refrigeration component includes a cryogenic refrigerator 2.1 and a unidirectional cold energy transfer structure 2.2. The cold head of the cryogenic refrigerator 2.1 is connected to the thermal interface structure 4 through the unidirectional cold energy transfer structure 2.2. The unidirectional cold energy transfer structure 2.2 includes a stainless steel tube structure with embedded sapphire crystal. Both ends of the stainless steel tube structure with embedded sapphire crystal are provided with copper plates. One end of the copper plate of the stainless steel tube structure with embedded sapphire crystal is connected to the cold head of the cryogenic refrigerator 2.1. The copper plate and the cold head of the cryogenic refrigerator 2.1 can be screwed together. The other end of the stainless steel tube structure with embedded sapphire crystal is connected to the thermal interface structure 4. Specifically, the copper plate is screwed to the copper plate 4.1 of the thermal interface structure 4. In a preferred embodiment, the cryogenic refrigerator 2.1 is a GM type cryogenic refrigerator 2.1, whose extreme low temperature can reach ≤30K.

[0041] More specifically, the gas cooling assembly includes a cooling gas piping structure 2.5, a cooling gas inlet distributor 2.3, and a cooling gas outlet distributor 2.4. The cooling gas piping structure 2.5 is wrapped around the outer wall of the thermal interface structure 4. Cooling gas enters the cooling gas piping structure 2.5 through the cooling gas inlet distributor 2.3 and then flows out through the cooling gas outlet distributor 2.4.

[0042] The gas cooling assembly also includes an inlet gas path solenoid valve 2.10, an outlet gas path solenoid valve 2.11, a four-way connector 2.8, a first gas temperature sensor 2.7, and a second gas temperature sensor 2.6. The inlet gas path solenoid valve 2.10 is connected to the inlet of the cooling gas inlet distributor 2.3 via the four-way connector 2.8. The first gas temperature sensor 2.7 is connected to the inlet of the cooling gas inlet distributor 2.3 via the four-way connector 2.8. The outlet of the cooling gas inlet distributor 2.3 is connected to the inlet of the cooling gas pipeline structure 2.5. The outlet gas path solenoid valve 2.11 is connected to the outlet of the cooling gas outlet distributor 2.4 via the four-way connector 2.8. The second gas temperature sensor 2.6 is connected to the outlet of the cooling gas outlet distributor 2.4 via the four-way connector 2.8. The inlet of the cooling gas inlet distributor 2.3 is connected to the outlet of the cooling gas pipeline structure 2.5.

[0043] In one feasible implementation, the cooling gas inlet distributor 2.3 is fixedly installed to the tank structure 1 via a mounting flange. The lower end of the mounting flange of the cooling gas inlet distributor 2.3 is welded to the tank structure 1. The cooling gas inlet distributor 2.3 is screwed to the four-way connector 2.8. The outlet of the cooling gas inlet distributor 2.3 is located inside the tank structure 1 and is welded to the pipeline structure. The outer wall of the cooling gas pipeline structure 2.5 is bent and welded to the outer side of the wall of the thermal interface structure 4. The installation method of the cooling gas outlet distributor 2.4 is the same as that of the cooling gas inlet distributor 2.3.

[0044] More specifically, the thermal interface structure 4 includes a stage 4.4, a hexagonal copper heat sink 4.3, a copper plate 4.1, and a heat flow copper strip 4.2. The stage 4.4 is fixedly disposed inside the hexagonal copper heat sink 4.3, and the heat flow copper strip 4.2 connects the copper plate 4.1, the hexagonal copper heat sink 4.3, and the stage 4.4 to form a heat flow path. One copper plate 4.1 is fixedly installed on each of the upper and lower sides inside the hexagonal copper heat sink 4.3, and the stage 4.4 is fixedly installed on the lower copper plate 4.1. Several evenly distributed heat flow copper strips 4.2 are screwed around the copper plate 4.1, connecting the copper plate 4.1 to the hexagonal copper heat sink and the stage 4.4 to form a heat flow path.

[0045] Furthermore, the thermal interface structure 4 includes at least two temperature regulation zones, each temperature regulation zone being equipped with at least one set of cryogenic refrigeration components, and each temperature regulation zone being equipped with at least one cooling gas pipeline structure 2.5. In one feasible embodiment, the upper and lower halves of the hexagonal copper screen heat sink 4.3 respectively constitute two temperature regulation zones. The cooling gas inlet distributor 2.3 and the cooling gas outlet distributor 2.4 are respectively connected to two cooling gas pipeline structures 2.5. The outer wall of one cooling gas pipeline structure 2.5 is bent and welded to the outer side of the upper wall of the hexagonal copper screen heat sink 4.3, and the outer wall of the other cooling gas pipeline structure 2.5 is bent and welded to the outer side of the lower wall of the hexagonal copper screen heat sink 4.3. One cryogenic refrigeration component is fixedly installed on each of the upper and lower sides of the hexagonal copper screen heat sink 4.3, and the copper plates of the two cryogenic refrigeration components are screwed to the corresponding copper plates 4.1.

[0046] The GM cryogenic refrigerator 2.1, which is positioned above and below the tank, and the partitioned heating structure 3, enable independent and precise temperature control of the upper and lower parts of the thermal interface structure 4, ensuring a temperature uniformity of ≤3K and a temperature control accuracy of ±0.1K.

[0047] More specifically, the heating structure 3 includes a heating strip 3.1, which is disposed within the hexagonal copper heat sink 4.3, and the heating strip 3.1 contacts and is connected to the hexagonal copper heat sink 4.3 and / or the heat flow copper strip 4.2 and copper plate 4.1. A temperature sensor is provided on the hexagonal copper heat sink 4.3 to collect temperature data.

[0048] In a preferred embodiment, cooling within the 300K to 423K temperature range is achieved through a gas cooling component, cooling within the 38K to 300K temperature range is achieved through a cryogenic refrigeration component, and the heating structure 3 is used for heating within the adjustable temperature range. The heating structures 3 in different temperature adjustment zones are each individually controlled.

[0049] This application's technical solution innovatively designs a unidirectional cold energy transfer structure 2.2, utilizing the high thermal conductivity at low temperatures and low thermal conductivity at high temperatures of sapphire. This structure is combined with a GM cryogenic refrigerator 2.1 and simultaneously used in conjunction with compressed cooling air to construct a novel cryogenic subsystem 2 based on integrated heat exchange through conduction and convection. The cryogenic subsystem 2 and the heating structure 3 are nested and connected to the inner side of the tank structure 1 via a thermal interface structure 4, enabling temperature regulation within the tank structure 1.

[0050] According to the present invention, a temperature control method for a deep space simulation device is provided, the temperature control method comprising:

[0051] Cooling method for the temperature range of 300K to 423K: Cooling gas enters the cooling gas pipeline structure 2.5 through the cooling gas inlet distributor 2.3 and then flows out through the cooling gas outlet distributor 2.4;

[0052] Cooling method in the temperature range of 38K to 300K: The cold head of the low-temperature refrigerator 2.1 outputs cooling power stably, keeping the temperature at the interface between it and the unidirectional cold energy transfer structure 2.2 stable at 30K. Its cold energy is transferred to the thermal interface structure 4 through the characteristic of the unidirectional cold energy transfer structure 2.2 with linearly increasing cold conduction capacity below 300K.

[0053] During the stabilization process at any temperature from 38K to 423K, the heat provided by heating structure 3 is balanced with the cold energy in different temperature zones.

[0054] Specifically, the continuous cooling process in the 300K to 423K range is accomplished by the cooling capacity provided by compressed air in the cryogenic subsystem 2. Further, ambient temperature compressed air with a back pressure of 4-6 bar enters the cooling gas inlet distributor 2.3 through a four-way connector 2.8. The distributor then splits into two streams, one entering the upper cooling gas pipeline structure 2.5 and the other the lower cooling gas pipeline structure 2.5, both located on the outer side of the hexagonal copper heat sink 4.3. Finally, the two streams of high-temperature compressed air, after heat exchange, converge at the cooling gas outlet distributor 2.4 and exit the system through the four-way connector 2.8. Both four-way connectors 2.8 are equipped with one active and one standby temperature sensor to collect the inlet and outlet temperatures of the cooling gas and feed them back to the control system 7. The control system 7 determines whether to connect or disconnect the gas path solenoid valve based on the temperature difference between the inlet and outlet temperatures. As the cooling process progresses, the gas path valve is disconnected when the temperature difference is less than 1°C.

[0055] The continuous cooling in the 38K to 300K range is accomplished by the cooling capacity provided by the GM cryogenic refrigerator 2.1 in the cryogenic subsystem 2. Furthermore, the cold head of the cryogenic refrigerator 2.1 stably outputs cooling power to maintain the temperature at its interface with the unidirectional cooling capacity transfer structure 2.2 at 30K. Its cooling capacity is transferred to the thermal interface structure 4 through the linearly increasing heat conduction capacity of the unidirectional cooling capacity transfer structure 2.2 below 300K, and then transferred to the hexagonal copper screen heat sink 4.3 and / or the stage 4.4 through the heat flow copper strip 4.2. The cooling capacity is transferred to the device under test through the hexagonal copper screen heat sink 4.3 and / or the stage 4.4 via heat exchange through radiation and conduction, respectively.

[0056] The stabilization process at any temperature between 38K and 423K is achieved by offsetting the heat provided by heating structure 3 with the cooling capacity of different temperature zones. Furthermore, the control system 7 automatically adjusts the power output of the heater using PID control to achieve temperature stability with a temperature control accuracy of ±0.1℃. The heating process between 38K and 423K is also the same as the temperature stabilization process, achieved by automatically adjusting the power output of the heater using PID control.

[0057] It should be noted that the control system 7 of the technical solution of this application is located outside the tank structure 1.

[0058] The technical solution of this application achieves continuous temperature regulation in the range of 300K to 423K by combining gas cooling and electric heating, and achieves continuous temperature regulation in the range of 38K to 300K by combining GM cryogenic refrigerator 2.1 with electric heating. Compared with existing space environment simulation equipment, its temperature range is extended to 38K to 423K, which can complete the extreme temperature environment required for deep space exploration, including the lunar polar region and Mars. At the same time, the cryogenic subsystem 2 based on integrated heat conduction and convection heat exchange has a compact structure and does not require the use of liquid nitrogen or liquid helium, which is energy-saving and environmentally friendly.

[0059] Example 2

[0060] Based on Embodiment 1, this application also provides a drive loading system for a deep space simulation device, including a servo motor, a first electromagnetic clutch, a gear transmission device, a brake, a second electromagnetic clutch, an angle torque sensor, a flexible coupling, a rigid coupling, and a loading head. The output shaft of the servo motor is engaged or disengaged from the gear transmission device and the second electromagnetic clutch via the first electromagnetic clutch. The brake is connected to the gear transmission device. The loading head extends into the tank structure 1 and is connected to the device under test. The flexible coupling and the rigid coupling are both disposed between the output shafts of the loading head and the second electromagnetic clutch, and the angle torque sensor is disposed on the flexible coupling.

[0061] The technical solution of this application utilizes two electromagnetic clutch devices and a gear transmission device to disconnect and connect the servo motor and brake to the shaft system respectively, thereby completing the switching and combination of drive and load functions and working modes.

[0062] Specifically, it also includes a loading platform, which serves as the supporting foundation for the driving loading system. A loading platform support mechanism is installed below the loading platform, and the upper surface of the loading platform is kept at the same horizontal level as the upper surface of the platform 4.4 inside the tank structure 1 where the device to be tested is placed. It should be noted that the loading platform support mechanism is a mechanical support with leveling function.

[0063] It also includes a tooling structure, with a positioning slot on the upper surface of the loading platform. The length direction of the positioning slot is the same as the axial direction of the drive loading system, and the tooling structure is screwed into the positioning slot. In one feasible embodiment, the tooling structure includes a servo motor tooling, an electromagnetic clutch device tooling, a brake tooling, and a flexible coupling tooling. The servo motor is fixedly connected to the servo motor tooling, the second electromagnetic clutch device is fixedly mounted on the electromagnetic clutch device tooling, the brake is fixedly mounted on the brake tooling, and the flexible coupling is fixedly mounted on the flexible coupling tooling.

[0064] More specifically, the gear transmission device includes a large gear and a small gear, the large gear meshing with the small gear, the output shaft of the first electromagnetic clutch device being coaxially connected to the large gear, and the output shaft of the brake being coaxially connected to the small gear.

[0065] In one feasible implementation, the upper surface of the loading platform and the upper surface of the loading platform 4.4 inside the tank structure 1 are leveled and kept at the same horizontal reference by the loading platform support mechanism. The servo motor fixture is screwed into the positioning slot on the upper surface of the loading platform to ensure that the servo motor shaft is coaxial with the tank structure 1 in the Y direction. The output shaft of the servo motor passes through the servo motor fixture and is nested and connected to the mounting hole of the input end drive wheel of the first electromagnetic clutch device. The output shaft of the first electromagnetic clutch device is nested and connected to the large gear hole of the gear transmission device and the mounting hole of the input end drive wheel of the second electromagnetic clutch device connected to the electromagnetic clutch device fixture. By controlling the on and off of the coil in the first electromagnetic clutch device, the output shaft of the first electromagnetic clutch device is controlled to switch between engaged and disengaged states, thereby controlling the power output of the servo motor to the brake and the second electromagnetic clutch device. The output shaft of the second electromagnetic clutch device passes through the flexible coupling fixture and is connected to the flexible coupling. The on and off of the coil in the second electromagnetic clutch device is controlled to switch the output shaft of the second electromagnetic clutch device to switch between engaged and disengaged states, thereby controlling the connection or disengagement state between the device under test and the drive loading system inside the tank structure 1. The brake is connected to the output shaft of the first electromagnetic clutch via a gear transmission device, and the braking torque it applies is transmitted through the output shaft of the first electromagnetic clutch device.

[0066] It should be further explained that the rigid coupling includes a coupling mounting housing and a coupling shaft. The coupling shaft can rotate relative to the coupling mounting housing. A coupling mounting flange is integrally formed on the coupling mounting housing. Mounting positions are reserved on the tank structure 1. These mounting positions on the tank structure 1 allow the coupling mounting flange of the coupling mounting housing to be fixedly connected to it via fasteners. Simultaneously, the mounting positions on the tank structure 1 allow the coupling shaft to rotate and extend into the interior of the tank structure 1. It should also be noted that the coupling shaft can be directly and coaxially fixedly connected to the loading head, or it can be coaxially fixedly connected to the loading head via existing connecting parts such as couplings. The combination of the elastic and rigid couplings in this application's technical solution provides elastic compensation for axial changes caused by large temperature differences inside and outside the tank structure 1, and also compensates for assembly tolerances, thus solving the problem of axial torque transmission error.

[0067] After the drive loading system is aligned with the shaft system of the device under test, it is screwed together by the bushing structure of the loading head and the mounting bolts. Both the drive mode and the loading mode are transmitted to the device under test inside the tank structure 1 through the shaft system.

[0068] Furthermore, a thermal interface structure 4 is provided inside the tank structure 1, and a stage 4.4 is disposed inside the thermal interface structure 4. The loading head extends into the stage 4.4 inside the thermal interface structure 4.

[0069] Furthermore, the driving mode is as follows: the first electromagnetic clutch is engaged, the second electromagnetic clutch is engaged, and the servo motor is connected to the loading head via a transmission mechanism. The loading mode is as follows: the first electromagnetic clutch is disengaged, the second electromagnetic clutch is engaged, and the brake is connected to the loading head via a gear transmission mechanism.

[0070] In a preferred embodiment, a set of driving loading systems is respectively provided on both sides of the tank structure 1 at any opposite sides. The driving loading system includes single-side driving and loading on the other side, double-side driving, or double-side loading. In a feasible embodiment, the loading platforms of the two driving loading systems are respectively installed on the left and right sides of the tank structure 1, i.e., on both sides in the Y direction.

[0071] The single-sided drive mode is achieved by connecting the servo motor to the clutch and shaft system. Further, the first electromagnetic clutch and the second electromagnetic clutch are activated to ensure the servo motor is connected to the shaft system. Angle data is collected and input into the control system 7, which then adjusts the servo motor's output speed to form a PID closed-loop control. The single-sided loading mode is achieved by connecting the brake to the clutch and shaft system via a gear transmission device. Further, the first electromagnetic clutch is disengaged and the second electromagnetic clutch is activated to ensure the brake is connected to the shaft system via the gear transmission device. Torque data is collected and input into the control system 7, which then adjusts the brake's output torque to form a PID closed-loop control. Switching between single-sided drive and loading functions is achieved by activating and deactivating the first and second electromagnetic clutches. Through the coordination of single-sided drive and loading functions, a single-sided drive with loading on the other side and a double-sided loading mode can also be achieved.

[0072] According to the present invention, a driving and loading method for simulating a device is provided. The loading method includes: connecting a loading head to the device under test, and controlling the disconnection or connection of a first electromagnetic clutch device and a second electromagnetic clutch device to drive or load the device.

[0073] This application's technical solution utilizes a dual-clutch structure to achieve switching between single-sided drive and loading functions. It also employs a dual-sided symmetrical drive loading system to achieve single-sided drive with simultaneous loading on the other side, or simultaneous loading on both sides. Furthermore, this application's technical solution uses an elastic coupling structure to elastically compensate for axial changes caused by large temperature differences between the inside and outside of the tank structure 1, thus solving the problem of axial torque transmission error.

[0074] It should be noted that the control system 7 of the technical solution of this application is located outside the tank structure 1.

[0075] Example 3

[0076] Based on Embodiment 1 or Embodiment 2, the technical solution of this application also provides a deep space exploration simulation test system, such as... Figures 1 to 6As shown, the device includes a tank structure 1, a cryogenic subsystem 2, a heating structure 3, a thermal interface structure 4, a vacuum pumping subsystem 5, and a drive and loading system. The tank structure 1 includes a sealable cavity. The thermal interface structure 4 is installed within the sealable cavity of the tank structure 1. A stage 4.4 for carrying the device under test is provided within the thermal interface structure 4. The vacuum pumping subsystem 5 can evacuate the sealable cavity of the tank structure 1. The cryogenic subsystem 2 can cool the thermal interface structure 4, the heating structure 3 can heat the thermal interface structure 4, and the drive and loading system can drive and / or load the device under test on the stage 4.4.

[0077] The vacuum pumping subsystem 5 can be equipped with conventional vacuum pumping equipment that can achieve vacuuming of the sealable cavity inside the tank structure 1.

[0078] The cryogenic subsystem 2 includes a cryogenic refrigeration component and a gas cooling component. The cryogenic refrigeration component includes a cryogenic refrigerator 2.1 and a unidirectional cooling capacity transfer structure 2.2. The cold head of the cryogenic refrigerator 2.1 is connected to the thermal interface structure 4 via the unidirectional cooling capacity transfer structure 2.2, and the cryogenic refrigerator 2.1 unidirectionally transfers cooling capacity to the thermal interface structure 4 through the unidirectional cooling capacity transfer structure 2.2. The gas cooling component includes a cooling gas piping structure 2.5, a cooling gas inlet distributor 2.3, and a cooling gas outlet distributor 2.4. The cooling gas piping structure 2.5 is wrapped around the outer wall of the thermal interface structure 4. Cooling gas enters the cooling gas piping structure 2.5 through the cooling gas inlet distributor 2.3 and then flows out through the cooling gas outlet distributor 2.4.

[0079] The unidirectional cooling capacity transfer structure 2.2 includes a stainless steel tube structure embedded with sapphire crystal. Both ends of the sapphire-embedded stainless steel tube structure are equipped with copper plates. One copper plate at one end of the sapphire-embedded stainless steel tube structure is connected to the cold head of the cryogenic refrigerator 2.1, and the other copper plate at the other end is connected to the thermal interface structure 4. Utilizing the high thermal conductivity of sapphire at low temperatures and low thermal conductivity at high temperatures, the cooling capacity generated by the cryogenic refrigerator 2.1 is unidirectionally transferred to the thermal interface structure 4. This achieves cooling of the thermal interface structure 4 while preventing the high-temperature heat from the thermal interface structure 4 from being transferred to the cryogenic refrigerator 2.1, thus improving the protection of the cryogenic refrigerator 2.1.

[0080] The thermal interface structure 4 includes at least two temperature regulation zones, each of which is equipped with at least one set of cryogenic refrigeration components and at least one cooling gas pipeline structure 2.5. The thermal interface structure 4 also includes a hexagonal copper heat sink 4.3, a copper plate 4.1, and a heat flow copper strip 4.2. A stage 4.4 is fixedly disposed inside the hexagonal copper heat sink 4.3. The heat flow copper strip 4.2 connects the copper plate 4.1, the hexagonal copper heat sink 4.3, and the stage 4.4 to form a heat flow path. In one feasible embodiment, the thermal interface structure 4 is fixedly installed inside the tank structure 1 by a heat insulation bracket 4.5. Specifically, the heat insulation bracket 4.5 is made of heat insulation material, such as epoxy resin. The heat insulation bracket 4.5 is fixed to the bottom of the inner wall of the tank structure 1, and the hexagonal copper heat sink 4.3 is fixedly placed on the heat insulation bracket 4.5. The hexagonal copper heat sink 4.3 can be fixedly connected to the heat insulation bracket 4.5 by screws or other fasteners. On the one hand, the heat interface structure 4 is fixedly installed inside the tank structure 1, and on the other hand, the heat interface structure 4 is thermally isolated from the outer wall of the tank structure 1.

[0081] The heating structure 3 includes a heating strip 3.1, which is disposed within the hexagonal copper heat sink 4.3 and is in contact with and connected to the hexagonal copper heat sink 4.3 and / or the heat flow copper strip 4.2 and copper plate 4.1. It should be noted that a temperature sensor is also installed on the hexagonal copper heat sink 4.3, which can measure the temperature of the outer wall of the hexagonal copper heat sink 4.3 in real time, facilitating the adjustment of the temperature of the thermal interface structure 4 by the heating structure 3 in conjunction with the cryogenic subsystem 2.

[0082] The drive loading system includes a servo motor, a first electromagnetic clutch, a gear transmission device, a brake, a second electromagnetic clutch, and a loading shaft system. The output shaft of the servo motor engages or disengages with the gear transmission device and the second electromagnetic clutch via the first electromagnetic clutch. The brake is connected to the gear transmission device, and the second electromagnetic clutch is connected to the loading shaft system. The drive loading system also includes a loading platform. The loading platform, servo motor, first electromagnetic clutch, gear transmission device, brake, and second electromagnetic clutch are all located outside the tank structure 1, with the servo motor mounted on the loading platform. The loading shaft system includes a flexible coupling, a rigid coupling, and a loading head. The loading head extends into the thermal interface structure 4, and the flexible coupling and rigid coupling are positioned between the output shafts of the loading head and the second electromagnetic clutch.

[0083] A set of driving loading systems is set on each of the two opposite sides of the tank structure 1.

[0084] According to the present invention, a deep space exploration simulation test method is provided, the test method comprising: placing the device under test on the stage 4.4 and connecting the drive loading system to the device under test; activating the vacuum pumping subsystem 5 to evacuate the sealable cavity of the tank structure 1 to the required test pressure; evacuation: starting the test detection system and activating the vacuum pumping subsystem 5 to reduce the pressure inside the tank from the test chamber ambient pressure to the required test pressure of 10. -3 Pa. Activate the cryogenic subsystem 2 and / or heating structure 3, and adjust the environment within the sealable cavity of the tank structure 1 to the target temperature, which is between 38K and 423K, through the thermal interface structure 4; activate the drive loading system to drive and / or load the device under test.

[0085] It should be noted that the control system 7 of the technical solution of this application is located outside the tank structure 1.

[0086] This application proposes a novel multi-functional environmental simulation and testing system for continuous temperature control in the extreme temperature range of a vacuum environment. This system can meet the testing requirements of various deep space exploration mechanisms, providing continuous temperature control within extreme temperature ranges and driving and / or loading functions. The system achieves continuous and stable temperature control over a wide temperature range from 38K to 423K under vacuum. Simultaneously, the dual-sided driving and loading system addresses the multi-functional testing and testing needs of deep space exploration, including driving and / or loading capabilities. This system boasts advantages such as a wide temperature range, multiple functions, compact structure, and energy efficiency, making it suitable for simulating extreme temperature environments and operating conditions in lunar polar regions and other space environments such as Mars.

[0087] The technical solution of this application achieves a vacuum degree better than 1.3×10⁻⁶. -3 With stepless temperature regulation capability in the 38K~423K range under Pa, and the ability to operate in any combination of dual-side drive and / or loading modes, this is a test and detection system adapted to the cryogenic, high-temperature, vacuum, dual-side drive and / or loading functions required for deep space exploration.

[0088] This application's technical solution differs from previous liquid-cooled heat sink structures based on convection heat transfer used in space environment simulations. Utilizing the high thermal conductivity of sapphire at low temperatures and low thermal conductivity at high temperatures, an innovative unidirectional cold energy transfer structure 2.2 is designed. This structure, combined with a GM cryogenic refrigerator 2.1 and compressed cooling air, constructs a novel cryogenic subsystem 2 based on integrated heat transfer via conduction and convection. Simultaneously, two electromagnetic clutches and a gear transmission device are used to disconnect and connect the servo motor and brake to the shaft system, enabling switching and combination of drive and loading functions. The cryogenic subsystem 2 and heating structure 3 are nested within the tank structure 1 via a thermal interface structure 4. The vacuum pumping subsystem 5 is connected to the outside of the tank structure 1. A dual-sided drive / loading subsystem extends through both the inside and outside of the tank, while the control system 7 is located on the outside of the tank.

[0089] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0090] Specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. Unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

Claims

1. A temperature control system for a deep space simulation device, characterized in that, It includes a thermal interface structure, a cryogenic subsystem, and a heating structure. The cryogenic subsystem can cool down the thermal interface structure, and the heating structure can heat up the thermal interface structure. The cryogenic subsystem includes a cryogenic refrigeration component and a gas cooling component. The cryogenic refrigeration component transfers cold energy unidirectionally to the thermal interface structure, and the gas cooling component uses cooling gas to cool the thermal interface structure. The cryogenic refrigeration component includes a cryogenic refrigerator and a unidirectional cold energy transfer structure. The cold head of the cryogenic refrigerator is connected to the thermal interface structure through the unidirectional cold energy transfer structure. The unidirectional cold energy transfer structure includes a stainless steel tube structure with embedded sapphire. Both ends of the stainless steel tube structure with embedded sapphire are provided with copper plates. One end of the copper plate of the stainless steel tube structure with embedded sapphire is connected to the cold head of the low-temperature refrigerator, and the other end of the copper plate of the stainless steel tube structure with embedded sapphire is connected to the thermal interface structure. The gas cooling assembly includes a cooling gas pipeline structure, a cooling gas inlet distributor, and a cooling gas outlet distributor, wherein the cooling gas pipeline structure is wrapped around the outer wall of the thermal interface structure. Cooling gas enters the cooling gas pipeline structure through the cooling gas inlet distributor and then flows out through the cooling gas outlet distributor.

2. The temperature control system for deep space simulation equipment as described in claim 1, characterized in that, The gas cooling assembly also includes an inlet gas path solenoid valve, an outlet gas path solenoid valve, a four-way valve, a first gas temperature sensor, and a second gas temperature sensor. The inlet gas solenoid valve is connected to the inlet of the cooling gas inlet distributor via a four-way valve, the first gas temperature sensor is connected to the inlet of the cooling gas inlet distributor via a four-way valve, and the outlet of the cooling gas inlet distributor is connected to the inlet of the cooling gas pipeline structure. The outlet gas solenoid valve is connected to the outlet of the cooling gas outlet distributor via a four-way valve, the second gas temperature sensor is connected to the outlet of the cooling gas outlet distributor via a four-way valve, and the inlet of the cooling gas inlet distributor is connected to the outlet of the cooling gas pipeline structure.

3. The temperature control system for deep space simulation equipment as described in claim 1, characterized in that, The thermal interface structure includes at least two temperature regulation zones, each of which is provided with at least one set of low-temperature refrigeration components and at least one cooling gas pipeline structure.

4. The temperature control system for deep space simulation equipment as described in claim 1, characterized in that, The thermal interface structure includes a stage, a hexagonal copper heat sink, a copper plate, and a heat flow copper strip. The stage is fixedly installed inside the hexagonal copper heat sink, and the heat flow copper strip connects the copper plate, the hexagonal copper heat sink, and the stage to form a heat flow path.

5. The temperature control system for deep space simulation equipment as described in claim 4, characterized in that, The heating structure includes a heating strip, which is disposed within a hexagonal copper heat sink and is in contact with and connected to the hexagonal copper heat sink and / or the heat flow copper strip and copper plate.

6. The temperature control system for deep space simulation equipment as described in claim 1, characterized in that, Cooling within the temperature range of 300K to 423K is achieved through the gas cooling assembly; Cooling within the temperature range of 38K to 300K is achieved through the aforementioned cryogenic refrigeration component; The heating structure is used for heating within an adjustable temperature range.

7. A temperature control method for a deep space simulation device, characterized in that, The temperature control system for deep space simulation equipment according to any one of claims 1-6, the temperature control method includes: Cooling method for the temperature range of 300K to 423K: Cooling gas enters the cooling gas pipeline structure through the cooling gas inlet distributor and then flows out through the cooling gas outlet distributor; Cooling method in the temperature range of 38K to 300K: The cold head of the low-temperature refrigerator outputs cooling power stably, keeping the temperature at the interface between it and the unidirectional cold energy transfer structure stable at 30K. Its cold energy is transferred to the thermal interface structure through the characteristic of the unidirectional cold energy transfer structure that the cold conduction capacity increases linearly below 300K. The process of stabilizing at any temperature from 38K to 423K is achieved by offsetting the heat provided by the heating structure with the cold energy in different temperature zones.

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