An ultrathin low-impedance tantalum capacitor lead frame and a preparation process of a tantalum capacitor

Abstract

The application relates to a super-thin low-impedance tantalum capacitor lead frame and a preparation process of the tantalum capacitor, and belongs to the tantalum capacitor technical field.The super-thin low-impedance tantalum capacitor lead frame comprises a frame body, a cathode connecting body and an anode limiting body, the frame body is sheet-shaped, two cutting openings are oppositely arranged on the frame body, the two cutting openings are used for respectively aligning the planes where the two opposite sides of a resin shell are located, an opening gap is arranged on the frame body, the opening gap is located between the two cutting openings and is in communication with the two cutting openings, the cathode connecting body and the anode limiting body are located between the two cutting openings, and the opening gap is located between the cathode connecting body and the anode limiting body.The application has the effects of guaranteeing the utilization rate of the product volume, and guaranteeing the relative positions between the anode limiting body and the cathode connecting body during the connection of a tantalum block and the lead frame.

Description

Technical Field

[0001] This application relates to the field of tantalum capacitor technology, and in particular to an ultrathin low-impedance tantalum capacitor lead frame and a fabrication process for tantalum capacitors. Background Technology

[0002] A polymer solid electrolyte tantalum capacitor typically refers to a capacitor with tantalum metal as the anode, a high-molecular conductive polymer as the cathode, and a tantalum pentoxide oxide film as the electrolyte layer.

[0003] In related technologies, polymer solid electrolyte tantalum capacitors mainly include a tantalum block, an anode lead frame, a cathode lead frame, and a resin shell. The tantalum block includes, from the inside out, a tantalum anode block, a tantalum pentoxide oxide film layer, a conductive polymer layer, and a graphite silver paste layer. Tantalum wires are disposed on the tantalum anode block. The resin shell covers the graphite silver paste layer. The anode lead frame is embedded in the resin shell and electrically connected to the tantalum wires on the tantalum block. The cathode lead frame is embedded in the resin shell and electrically connected to the graphite silver paste layer.

[0004] Currently, the anode lead frame and cathode lead frame occupy a large volume in the thickness direction, resulting in a reduced product volume utilization rate. Furthermore, during the connection of the tantalum block to the anode lead frame and cathode lead frame respectively, it is not convenient to control the relative position between the anode lead frame and the cathode lead frame. Summary of the Invention

[0005] To help ensure the utilization rate of product volume, and at the same time, to ensure the relative position between the anode limit body and the cathode connector during the connection of the tantalum block and the lead frame, thereby ensuring production efficiency and quality, this application provides a manufacturing process for an ultra-thin low-impedance tantalum capacitor lead frame and a tantalum capacitor.

[0006] In the first aspect, this application provides an ultra-thin, low-impedance tantalum capacitor lead frame, which adopts the following technical solution: An ultrathin, low-impedance tantalum capacitor lead frame, comprising: The frame body is sheet-shaped and has two opposite cuts. The two cuts are used to align with the planes on opposite sides of the resin shell. The frame body has an opening gap located between the two cuts and communicating with the cuts on both sides. A cathode connector is disposed on the frame body and is used to be embedded in the resin shell and electrically connected to the tantalum block. The anode limit positioner is disposed on the frame body and is used to be embedded in the resin shell and electrically connected to the tantalum wire. The cathode connector and the anode limit positioner are located between two cut openings. The opening gap is located between the cathode connector and the anode limit positioner. When the tantalum block is placed on the frame body, the distance from the side of the tantalum block closest to the anode limit positioner to the anode limit positioner is greater than the distance from the side of the opening gap closest to the anode limit positioner to the anode limit positioner.

[0007] Preferably, the thickness of the cathode connector is less than the thickness of the frame body, and the upper surface of the cathode connector is flush with the upper surface of the frame body.

[0008] Preferably, the frame body has positioning openings on opposite sides, and the arrangement direction of the two positioning openings is parallel to the arrangement direction of the cathode connector and the anode limit position. The cathode connector and the anode limit position are located between the two positioning openings. The two positioning openings correspond one-to-one with the opposite sides of the resin shell in the arrangement direction of the cathode connector and the anode limit position. The edge lines of the resin shell on the opposite sides in the arrangement direction of the cathode connector and the anode limit position cross the corresponding positioning openings.

[0009] Preferably, positioning holes are provided at opposite ends of the frame body, and the two positioning openings are located between the two positioning holes.

[0010] Preferably, the anode body has a slot for the tantalum wire to pass through.

[0011] Preferably, a limiting seat is rotatably provided on the anode limit body, the rotation axis of the limiting seat is perpendicular to the length direction of the tantalum wire, and the limiting seat is used to abut against the end of the tantalum wire away from the tantalum block.

[0012] Preferably, the side of the limiting seat near the tantalum wire is an arc surface, and the arc surface bulges outward toward the direction of the tantalum wire.

[0013] Preferably, the male limit positioner has a connecting groove, and the limiting seat is rotatably disposed in the connecting groove. When the length direction of the limiting seat is perpendicular to the length direction of the male limit positioner, the limiting seat abuts against the bottom wall of the connecting groove.

[0014] Secondly, the fabrication process of an ultrathin low-impedance tantalum capacitor provided in this application adopts the following technical solution: A fabrication process for an ultrathin, low-impedance tantalum capacitor, using the aforementioned lead frame, further includes the following steps: Mixing and molding: Camphor is added to tantalum powder, wherein the camphor is dissolved in an organic solvent. The mixture of tantalum powder and camphor is mixed evenly and then placed in an oven to dry. The dried mixture is then pressed into tantalum anode blocks. Sintering: The formed tantalum anode block is placed in a vacuum sintering furnace for sintering and impurity removal. Tantalum wires are then spot-welded onto the sintered tantalum anode block. The tantalum anode block after wire drawing is electrochemically oxidized to form a tantalum pentoxide oxide film on its surface. Graphite silver paste is formed on the surface of a tantalum anode block with a tantalum pentoxide oxide film layer to form a conductive polymer layer, and conductive graphite and silver paste are coated on the outside of the conductive polymer layer to form a graphite silver paste layer, thus obtaining a tantalum block. The tantalum block is pressed into the frame body and the tantalum wire on the tantalum block is welded to the anode limit body on the frame body. The graphite silver paste layer on the side of the tantalum block away from the tantalum wire is connected to the cathode connector through a conductive adhesive layer. The connected tantalum block and lead frame are placed into the mold and epoxy resin is poured in by molding to form a resin shell. The opposite two edges of the resin shell are aligned with two cutting holes. After the resin shell is cured, the mold is removed. The process involves shaping and trimming along the edges of the epoxy resin casing to obtain the finished solid electrolyte tantalum capacitor.

[0015] Preferably, in the powder mixing and molding step, camphor is dissolved using an alcoholic organic solvent.

[0016] In summary, this application includes the following beneficial technical effects: When connecting the lead frame and the tantalum block, the graphite silver paste layer on the side of the tantalum block away from the tantalum wire is connected to the cathode connector on the frame body through a conductive adhesive layer. The tantalum wire is then laser-welded to the anode limit position on the frame body, ensuring that the distance from the side of the tantalum block closest to the anode limit position is greater than the distance from the side of the opening gap closest to the anode limit position. Next, the connected lead frame and tantalum block are placed in a mold, and a resin shell is molded and potted. The planes on opposite sides of the resin shell are aligned with the two cut openings. After the resin shell has cured, the frame body is cut along the edge of the resin shell. This separates the frame body containing the anode limiter from the frame body containing the cathode connector, forming separate anode and cathode leads. Because the frame body is sheet-like, it occupies a small volume in terms of thickness, allowing for a larger tantalum block volume and more powder capacity within the same resin shell volume, thus ensuring efficient product volume utilization. Simultaneously, since the anode and cathode leads on the frame body remain relatively fixed during the connection process with the tantalum block, the relative positions of the anode limiter and cathode connector are guaranteed, ensuring production efficiency and quality. Attached Figure Description

[0017] Figure 1 This is a horizontal schematic diagram of the overall structure of the lead frame for the ultrathin low-impedance tantalum capacitor in Embodiment 1 of this application.

[0018] Figure 2This is a top view of the overall structure of the lead frame for the ultrathin low-impedance tantalum capacitor in Embodiment 1 of this application.

[0019] Figure 3 This is a bottom view of the overall structure of the lead frame for the ultrathin low-impedance tantalum capacitor in Embodiment 1 of this application.

[0020] Figure 4 This is a schematic diagram of the overall structure of Embodiment 2 of this application.

[0021] Figure 5 yes Figure 4 Enlarged view of section A.

[0022] Explanation of reference numerals in the attached drawings: 1. Frame body; 2. Cutting opening; 3. Resin shell; 4. Opening gap; 5. Cathode connector; 6. Tantalum block; 7. Anode limit positioner; 8. Tantalum wire; 9. Positioning opening; 10. Positioning hole; 11. Placement groove; 12. Limiting seat; 13. Connecting groove. Detailed Implementation

[0023] The following combination Figures 1-5 This application will be described in further detail.

[0024] Example 1:

[0025] This application discloses an ultrathin, low-impedance tantalum capacitor lead frame. (Refer to...) Figure 1 The ultra-thin low-impedance tantalum capacitor lead frame includes a frame body 1, a cathode connector 5, and an anode limit position 7. The frame body 1 is sheet-shaped with a rectangular cross-section and a thickness of less than 0.25 mm. Two cutouts 2 are opened opposite each other on the frame body 1. The arrangement direction of the two cutouts 2 is perpendicular to the length direction of the frame body 1, and the length direction of the cutouts 2 is parallel to the length direction of the frame body 1. The two cutouts 2 are used to align with the planes on opposite sides of the resin shell 3. An opening gap 4 is opened on the frame body 1. The opening gap 4 is located between the two cutouts 2 and communicates with the cutouts 2 on both sides. The design of the cutouts 2 and the opening gap 4 is to facilitate subsequent cutting and shaping of the resin shell 3 to separate the anode side and cathode side of the frame body 1 and avoid the tantalum capacitor from being in a short-circuit state.

[0026] Reference Figure 1 The cathode connector 5 is integrally formed on the frame body 1. The cathode connector 5 is used to be embedded in the resin shell 3 and electrically connected to the graphite silver paste layer on the tantalum block 6, thereby serving as the cathode lead-out. Specifically, the cathode connector 5 and the graphite silver paste layer of the tantalum block 6 are electrically connected through a conductive adhesive layer. The anode limit position 7 is fixed on the frame body 1. The anode limit position 7 is used to be embedded in the resin shell 3 and electrically connected to the tantalum wire 8, thereby serving as the anode lead-out. Specifically, the anode limit position 7 and the tantalum wire 8 are electrically connected through laser welding.

[0027] Reference Figure 1 and Figure 2 Furthermore, the cathode connector 5 and the anode limit position 7 are located between the two cuts 2, and the opening gap 4 is located between the cathode connector 5 and the anode limit position 7. When the tantalum block 6 is placed on the frame body 1, the distance from the side of the tantalum block 6 near the anode limit position 7 to the anode limit position 7 is greater than the distance from the side of the opening gap 4 near the anode limit position 7 to the anode limit position 7.

[0028] When connecting the lead frame and the tantalum block 6, the graphite silver paste layer on the side of the tantalum block 6 away from the tantalum wire 8 is fixed to the cathode connector 5 on the frame body 1 through a conductive adhesive layer. The tantalum wire 8 is laser welded to the anode limit position 7 on the frame body 1, and the distance from the side of the tantalum block 6 near the anode limit position 7 to the anode limit position 7 is kept greater than the distance from the side of the opening gap 4 near the anode limit position 7 to the anode limit position 7. Then, the connected lead frame and tantalum block 6 are placed in the mold, and the resin shell 3 is encapsulated by molding. The two sides of the resin shell 3 are aligned with the two cutting holes 2 respectively. After the resin shell 3 is cured, the frame body 1 is cut along the edge of the resin shell 3, so that the part of the frame body 1 where the anode limit position 7 is located is separated from the part of the frame body 1 where the cathode connector 5 is located, forming separate anode leads and cathode leads.

[0029] Since the entire frame body 1 is sheet-like, it occupies a small volume in the thickness direction. This allows the tantalum block 6 to be larger in volume and hold more powder under the same volume of resin shell 3, which helps to ensure the utilization rate of product volume, improve the product's withstand voltage rating, and enable the miniaturization of tantalum capacitors. At the same time, since the anode lead-out portion and the cathode lead-out portion on the frame body 1 are relatively fixed during the connection process between the lead frame and the tantalum block 6, the relative position between the anode limit positioner 7 and the cathode connector 5 can be guaranteed. After one is connected, the position of the other is completed, ensuring production efficiency and quality.

[0030] Reference Figure 1 The thickness of the cathode connector 5 is less than the thickness of the frame body 1, and the upper surface of the cathode connector 5 is flush with the upper surface of the frame body 1, so that the cathode connector 5 can be completely embedded in the resin shell 3, ensuring the connection effect between the cathode connector 5 and the tantalum block 6.

[0031] Reference Figure 1 and Figure 2 The length direction of the anode limit position 7 is perpendicular to the plane of the frame body 1. The anode limit position 7 is provided with a placement groove 11 for the tantalum wire 8 to pass through. Through the cooperation of the anode limit position 7 and the placement groove 11, it can better contact the tantalum wire 8, improve the structural stability, and effectively reduce the impedance of the capacitor.

[0032] Reference Figure 1 and Figure 3 The frame body 1 has positioning openings 9 on opposite sides. The arrangement direction of the two positioning openings 9 is parallel to the arrangement direction of the cathode connector 5 and the anode limit position 7. The cathode connector 5 and the anode limit position 7 are located between the two positioning openings 9. The two positioning openings 9 correspond one-to-one with the two sides of the resin shell 3 on the arrangement direction of the cathode connector 5 and the anode limit position 7. The edge lines of the resin shell 3 on both sides of the arrangement direction of the cathode connector 5 and the anode limit position 7 cross the corresponding positioning openings 9. That is, the planes of the resin shell 3 on both sides of the arrangement direction of the cathode connector 5 and the anode limit position 7 are aligned with the two positioning openings 9 respectively. The design of the two positioning openings 9 makes it convenient for the clamp to pass through the positioning openings 9 to fix the resin shell 3 relatively during the subsequent cutting and shaping process.

[0033] Reference Figure 3 Positioning holes 10 are provided at opposite ends of the frame body 1. The arrangement direction of the two positioning holes 10 is parallel to the length direction of the frame body 1, and two positioning openings 9 are located between the two positioning holes 10. The two positioning holes 10 facilitate the positioning and fixing of the frame body 1 and provide convenience for the connection between the frame body 1 and the tantalum block 6.

[0034] The implementation principle of the lead frame in Embodiment 1 of this application is as follows: When it is necessary to connect the lead frame and the tantalum block 6, the graphite silver paste layer on the side of the tantalum block 6 away from the tantalum wire 8 is fixed to the cathode connector 5 on the frame body 1 through a conductive adhesive layer. The tantalum wire 8 is placed in the placement groove 11 of the anode limit position 7, and the tantalum wire 8 is fixed to the anode limit position 7 by laser welding. The distance from the side of the tantalum block 6 near the anode limit position 7 to the anode limit position 7 is greater than the distance from the side of the opening gap 4 near the anode limit position 7 to the anode limit position 7. Then, the connected lead frame and tantalum block 6 are placed in the mold, and the resin shell 3 is molded and potted. The resin shell 3 is aligned with two cutting holes 2 on the opposite sides of the length direction perpendicular to the frame body 1, and with two positioning openings 9 on the opposite sides of the length direction of the frame body 1. After the resin shell 3 is cured, the frame body 1 is cut along the edge of the resin shell 3, so that the frame body 1 part where the anode limit position 7 is located is separated from the frame body 1 part where the cathode connector 5 is located, forming separate anode leads and cathode leads.

[0035] Since the entire frame body 1 is sheet-shaped, it occupies a small volume in terms of thickness, thereby reducing the package volume. Alternatively, it allows the tantalum block 6 to be larger in volume and hold more powder under the same volume of resin shell 3, which helps to ensure the utilization rate of product volume and effectively improve the product's withstand voltage rating, making it suitable for miniaturization of chip tantalum capacitors. At the same time, since the anode lead-out portion and the cathode lead-out portion on the frame body 1 are relatively fixed during the connection process between the lead frame and the tantalum block 6, the relative position between the anode limit position body 7 and the cathode connector 5 can be guaranteed, ensuring production efficiency and quality.

[0036] This application also discloses a fabrication process for an ultrathin, low-impedance tantalum capacitor. The fabrication process for the ultrathin, low-impedance tantalum capacitor, using the aforementioned lead frame, further includes the following steps: Step 1: Mixing and molding. Camphor is added to tantalum powder, wherein the camphor is dissolved in an organic solvent. The mixture of tantalum powder and camphor is mixed evenly and then placed in an oven to dry. The dried mixture is pressed into tantalum anode blocks. Step 2: Sintering. Place the formed tantalum anode block into a vacuum sintering furnace for sintering and impurity removal. Spot weld tantalum wire 8 onto the sintered tantalum anode block. Step 3: Energization, the tantalum anode block after wire drawing is electrochemically oxidized to form a tantalum pentoxide oxide film on its surface; Step 4: Graphite silver paste. A conductive polymer layer is formed on the surface of the tantalum anode block with a tantalum pentoxide oxide film. Conductive graphite and silver paste are coated on the outside of the conductive polymer layer to form a graphite silver paste layer, thus obtaining tantalum block 6. Step 5: Molding and mounting. The tantalum block 6 is pressed against the surface of the frame body 1. The tantalum wire 8 on the tantalum block 6 is laser welded to the anode limit position body 7 on the frame body 1. The bottom wall of the graphite silver paste layer on the side of the tantalum block 6 away from the tantalum wire 8 is connected to the cathode connector 5 through a conductive adhesive layer. The connected tantalum block 6 and lead frame are placed into the mold. Liquid epoxy resin is molded and encapsulated to form a resin shell 3. The opposite two sides of the resin shell 3 are aligned with two cutting holes 2 respectively. The other opposite two sides of the resin shell 3 cross the corresponding positioning openings 9 respectively. After the resin shell 3 is cured, the mold is removed. Step 6: Shaping, cutting and trimming along the edge of the resin shell 3 to obtain the finished solid electrolyte tantalum capacitor; Specifically, in step 1, during powder mixing and molding, camphor is dissolved using an alcoholic organic solvent. Using alcohol instead of the traditional dichloromethane organic solvent increases the adhesion of the tantalum powder while improving the powder mixing effect.

[0037] Furthermore, in step 2, the temperature of the vacuum sintering furnace is 1650℃-1700℃, which can improve the strength of the tantalum block 6 and is suitable for ultra-thin tantalum capacitor products.

[0038] Example 2:

[0039] Reference Figure 4 and Figure 5 The difference between this embodiment and Embodiment 1 is that the male limit position body 7 has connecting grooves 13 on both sides, and the placement groove 11 is located between the two connecting grooves 13. A limiting seat 12 is rotatably arranged between the two connecting grooves 13. The rotation axis of the limiting seat 12 is perpendicular to the length direction of the tantalum wire 8. The limiting seat 12 is U-shaped. The rotational connection between the limiting seat 12 and the male limit position body 7 has a certain frictional force. The limiting seat 12 can only rotate under the action of external force. The limiting seat 12 is used to abut against the end of the tantalum wire 8 away from the tantalum block 6. When the length direction of the limiting seat 12 is perpendicular to the length direction of the male limit position body 7, the limiting seat 12 abuts against the bottom wall of the connecting groove 13, thereby limiting the rotation angle of the limiting seat 12.

[0040] Reference Figure 4 and Figure 5 Specifically, the side of the limiting seat 12 closest to the tantalum wire 8 is an arc surface, which bulges outward toward the direction closest to the tantalum wire 8, thus facilitating the rotation of the limiting seat 12 after the position of the tantalum wire 8 is limited.

[0041] The implementation principle of Embodiment 2 of this application is as follows: When the tantalum wire 8 is connected to the anode limit position 7, the limiting seat 12 is rotated in the direction away from the cathode connector 5, so that the limiting seat 12 abuts against the bottom wall of the connecting groove 13. At this time, the length direction of the limiting seat 12 is parallel to the length direction of the frame body 1. Then, the tantalum wire 8 is placed in the placement groove 11, and the end of the tantalum wire 8 abuts against the arc surface of the limiting seat 12, so that the tantalum block 6 can be quickly positioned, effectively improving production efficiency. Then, the limiting seat 12 is rotated in the direction closer to the tantalum block 6, so that the length direction of the limiting seat 12 is parallel to the length direction of the anode limit position 7, so that the tantalum wire 8 can be limited, so that the tantalum wire 8 is not easy to separate from the anode limit position 7 under up and down vibration. At the same time, laser welding can also be used to connect the limiting seat 12 and the tantalum wire 8, improving the welding effect of the tantalum wire 8.

[0042] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A lead frame for an ultrathin, low-impedance tantalum capacitor, characterized in that, include: The frame body (1) is sheet-shaped. Two cutouts (2) are opened opposite each other on the frame body (1). The two cutouts (2) are used to align with the planes on opposite sides of the resin shell (3). An opening gap (4) is opened on the frame body (1). The opening gap (4) is located between the two cutouts (2) and communicates with the cutouts (2) on both sides. A cathode connector (5) is disposed on the frame body (1) and is used to be embedded in the resin shell (3) and electrically connected to the tantalum block (6). Anode limit position (7) is set on frame body (1) and is used to be embedded in resin shell (3) and electrically connected to tantalum wire (8). Cathode connector (5) and anode limit position (7) are located between two cuts (2). Opening gap (4) is located between cathode connector (5) and anode limit position (7). When tantalum block (6) is placed on frame body (1), the distance from the side of tantalum block (6) close to anode limit position (7) to anode limit position (7) is greater than the distance from the side of opening gap (4) close to anode limit position (7) to anode limit position (7). The anode limit position (7) is provided with a placement groove (11) for the tantalum wire (8) to pass through. A limiting seat (12) is rotatably provided on the anode limit position (7). The rotation axis of the limiting seat (12) is perpendicular to the length direction of the tantalum wire (8). The limiting seat (12) is used to abut against the end of the tantalum wire (8) away from the tantalum block (6). A connecting groove (13) is provided on the anode limit position (7). The limiting seat (12) is rotatably provided in the connecting groove (13). When the length direction of the limiting seat (12) is perpendicular to the length direction of the anode limit position (7), the limiting seat (12) abuts against the bottom wall of the connecting groove (13).

2. The ultra-thin low-impedance tantalum capacitor lead frame according to claim 1, characterized in that: The thickness of the cathode connector (5) is less than the thickness of the frame body (1), and the upper surface of the cathode connector (5) is flush with the upper surface of the frame body (1).

3. The ultra-thin low-impedance tantalum capacitor lead frame according to claim 1, characterized in that: The frame body (1) has positioning openings (9) on opposite sides. The arrangement direction of the two positioning openings (9) is parallel to the arrangement direction of the cathode connector (5) and the anode limit position (7). The cathode connector (5) and the anode limit position (7) are located between the two positioning openings (9). The two positioning openings (9) and the resin shell (3) correspond one-to-one on opposite sides of the arrangement direction of the cathode connector (5) and the anode limit position (7). The edge lines of the resin shell (3) on opposite sides of the arrangement direction of the cathode connector (5) and the anode limit position (7) cross the corresponding positioning openings (9).

4. The ultra-thin low-impedance tantalum capacitor lead frame according to claim 3, characterized in that: The frame body (1) has positioning holes (10) at its two opposite ends, and the two positioning openings (9) are located between the two positioning holes (10).

5. The ultra-thin low-impedance tantalum capacitor lead frame according to claim 1, characterized in that: The side of the limiting seat (12) near the tantalum wire (8) is an arc surface, and the arc surface bulges outward toward the direction near the tantalum wire (8).

6. A fabrication process for an ultrathin, low-impedance tantalum capacitor, using the lead frame as described in any one of claims 1-5, characterized in that, It also includes the following steps: The powder is mixed and molded by adding camphor to tantalum powder, wherein the camphor is dissolved in an organic solvent. The mixture of tantalum powder and camphor is mixed evenly and then placed in an oven to dry. The dried mixture is then pressed into tantalum anode blocks. Sintering: The shaped tantalum anode block is placed in a vacuum sintering furnace for sintering and impurity removal. Tantalum wire is spot-welded onto the sintered tantalum anode block (8). The tantalum anode block after wire drawing is electrochemically oxidized to form a tantalum pentoxide oxide film on its surface. Graphite silver paste is used to form a conductive polymer layer on the surface of a tantalum anode block with a tantalum pentoxide oxide film layer. Conductive graphite and silver paste are coated on the outside of the conductive polymer layer to form a graphite silver paste layer, thus obtaining a tantalum block (6). The tantalum block (6) is pressed and abutted against the surface of the frame body (1). The tantalum wire (8) on the tantalum block (6) is welded to the anode limit body (7) on the frame body (1). The graphite silver paste layer on the side of the tantalum block (6) away from the tantalum wire (8) is connected to the cathode connector (5) through a conductive adhesive layer. The connected tantalum block (6) and lead frame are placed into the mold and epoxy resin is potted by molding to form a resin shell (3). The opposite two sides of the resin shell (3) are aligned with the two cutting holes (2). After the resin shell (3) is cured, the mold is removed. The solid electrolyte tantalum capacitor is shaped and trimmed along the edge of the epoxy resin shell (3) to obtain the finished product.

7. The fabrication process of an ultrathin low-impedance tantalum capacitor according to claim 6, characterized in that: In the powder mixing and molding step, camphor is dissolved using an alcoholic organic solvent.

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