一种半片滚轮剔除机构
By using a half-wafer roller rejection mechanism to instantly rotate a magnetic linkage component to reject defective silicon wafers, the problem of low silicon wafer rejection efficiency in existing technologies is solved, and non-destructive and efficient silicon wafer transportation is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NANJING ZHUOSHENG AUTOMATION EQUIP CO LTD
- Filing Date
- 2025-09-04
- Publication Date
- 2026-07-17
AI Technical Summary
Existing silicon wafer rejection mechanisms have difficulty efficiently picking up moving silicon wafers when stationary, resulting in low production efficiency. Furthermore, the silicon wafer transport speed needs to be reduced to avoid breakage, which affects transport efficiency.
The half-wafer roller rejection mechanism includes a load-bearing component, a drive gear, and a magnetic linkage component. It achieves instantaneous rotation rejection of defective silicon wafers through magnetic linkage, avoiding deceleration or stagnation and maintaining transportation efficiency.
This enables the non-destructive removal of defective silicon wafers during transportation, maintains the efficient operation of the transportation mechanism, and avoids a decrease in production efficiency due to speed adjustments.
Smart Images
Figure CN121155939B_ABST