A pin laser welding device for optoelectronic device processing

Abstract

The application discloses a pin laser welding device for photoelectronic device processing and relates to the technical field of photoelectronic device processing, which comprises a supporting table, a welding device movably connected to the upper portion of the supporting table, and a workbench mounted on the upper portion of the supporting table, wherein a fixing assembly is arranged on the workbench, the fixing assembly comprises a circular plate mounted on the inner side of the workbench, a rotating plate rotatably connected to the upper portion of the circular plate, a plurality of conveying rods movably connected to the inner sides of the circular plate and the rotating plate, a first suction head movably connected to the upper portion of each conveying rod, a third connecting pipe commonly mounted between the conveying rods and the first suction head, a driving unit and a suction unit arranged on the workbench, and a limiting plate mounted on the upper portion of the first suction head, so that the plurality of suction heads can move positions according to the shape of the substrate, all the suction heads can be simultaneously fixed to the substrate, the suction area is increased, the firmness of the suction is improved, and the fixing effect on the substrate is enhanced.

Description

Technical Field

[0001] This invention relates to the field of optoelectronic device processing technology, and in particular to a pin laser welding device for optoelectronic device processing. Background Technology

[0002] Laser welding equipment for optoelectronic device manufacturing is a specialized device that uses a high-energy-density laser beam as a heat source to precisely and efficiently weld the pins of optoelectronic devices to circuit boards or other connecting parts. It achieves micron-level welding precision, meeting the stringent requirements of optoelectronic devices for pin welding position and size, ensuring the electrical performance and reliability of the devices. Laser welding is fast, enabling the welding of a large number of pins in a short time, improving production efficiency and reducing production costs. There is no mechanical contact between the laser beam and the welding area, avoiding the mechanical stress and thermal deformation that may occur in traditional welding methods, reducing damage to optoelectronic devices, and improving device quality and lifespan. Laser welding produces narrow welds with a high aspect ratio, high weld joint strength, and fewer defects such as porosity and cracks, ensuring good electrical connection and mechanical stability between the pins and the circuit board. It can weld pins of various optoelectronic devices made of different materials, such as gold, silver, copper, and aluminum, as well as pins of different thicknesses and shapes, exhibiting strong versatility and adaptability.

[0003] In conventional welding devices, the first adsorption head is fixed in position. When facing an irregularly shaped substrate, it is impossible to flexibly adjust the position according to the substrate outline. This results in some substrate surfaces not being covered by the first adsorption head, which significantly reduces the actual adsorption area. Furthermore, when placing the substrate, there may be a gap between the substrate and the worktable. This gap will affect the suction action and weaken the suction effect. Therefore, a lead laser welding device for optoelectronic device processing is proposed. Summary of the Invention

[0004] The purpose of this invention is to solve the problems in the prior art where the position of the first adsorption head is fixed, and when facing an irregularly shaped substrate, the position cannot be flexibly adjusted according to the substrate outline. This results in part of the substrate surface not being covered by the first adsorption head, which significantly reduces the actual adsorption area. Furthermore, when placing the substrate, there may be a gap between the substrate and the worktable, which affects the suction action and weakens the suction effect. Therefore, this invention proposes a lead laser welding device for processing optoelectronic devices.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A laser pin welding apparatus for processing optoelectronic devices includes a support platform. A welding device is movably connected to the upper part of the support platform. A worktable is mounted on the upper part of the support platform. A fixing assembly is provided on the worktable. The fixing assembly includes a circular plate mounted on the inner side of the worktable, a rotating plate rotatably connected to the upper part of the circular plate, multiple conveying rods movably connected to the inner sides of the circular plate and the rotating plate, a first suction head movably connected to the upper part of the conveying rods, a third connecting pipe jointly installed between the conveying rods and the first suction head, a driving unit and a suction unit provided on the worktable, and a limit plate mounted on the upper part of the first suction head. The unit drives the rotating plate to rotate, which in turn drives multiple conveying rods and first suction heads to move simultaneously toward the center of the worktable. The limiting plate is in contact with the edge of the substrate to ensure that the substrate is tightly attached to the worktable, further enhancing the fixation effect on the substrate. The positions of the multiple first suction heads correspond to the edge shape of the substrate. The suction unit drives the first suction heads to perform suction to fix the substrate, allowing the multiple first suction heads to move according to the shape of the substrate, ensuring that all first suction heads can simultaneously adsorb and fix the substrate, increasing the adsorption area, improving the firmness of adsorption, and enhancing the fixation effect on the substrate.

[0006] The above technical solution further includes: The suction unit includes a square groove on the inner side of the workbench, a suction device installed inside the square groove, a first connecting pipe installed at the output end of the suction device, a connecting box installed at the end of the first connecting pipe away from the suction device, and a plurality of second connecting pipes installed on the upper part of the connecting box. The end of the second connecting pipe away from the connecting box is fixedly connected to the conveying rod. The suction device transmits the suction force to the first suction head through the first connecting pipe, the connecting box, the second connecting pipes, the conveying rod, and the third connecting pipe.

[0007] A sliding block is installed at the bottom of the rotating plate, and multiple support columns are installed on the inner side of the square groove. The ends of the multiple support columns are fixedly connected to the circular plate. The sliding block is slidably connected to the circular plate, and the rotating plate rotates through the sliding block.

[0008] The drive unit includes a servo motor installed inside a square slot, a gear installed at the output end of the servo motor, and a rack installed on the side of the rotating plate. The gear and the rack mesh with each other, and when the gear rotates, it drives the rotating plate to rotate through the rack.

[0009] The drive unit also includes a plurality of second guide grooves on the inner side of the circular plate and a plurality of first guide grooves on the inner side of the rotating plate. The plurality of first guide grooves and second guide grooves are slidably connected to the conveying rods. When the rotating plate rotates, it guides the conveying rods through the first guide grooves and drives the plurality of conveying rods to move along the second guide grooves respectively.

[0010] A square plate is installed at the bottom of the first adsorption head, and a telescopic rod is installed on the side of the square plate. The end of the telescopic rod away from the square plate is fixedly connected to the conveying rod, and the telescopic rod supports the movement of the conveying rod.

[0011] The upper part of the workbench is provided with multiple sliding grooves, and the first adsorption head is slidably disposed inside the sliding groove, and the first adsorption head can move along the sliding groove.

[0012] A second adsorption head is installed on the upper part of the connecting box. The second adsorption head, the first adsorption head, and the worktable are all on the same horizontal plane, ensuring that the substrate can contact the worktable.

[0013] The limiting plate has a trapezoidal cross-section. The inclined surface of the limiting plate drives the substrate to move downward, ensuring that it fits against the worktable.

[0014] The size of the sliding groove opening is adapted to the size of the first adsorption head, and both the sliding groove and the first adsorption head have convex cross-sections to ensure the stability of the movement of the first adsorption head.

[0015] The present invention has the following beneficial effects: In this invention, by setting a fixing component, multiple first adsorption heads can move their positions according to the shape of the substrate, ensuring that all first adsorption heads can simultaneously adsorb and fix the substrate, increasing the adsorption area, improving the firmness of adsorption, and enhancing the fixing effect on the substrate.

[0016] In this invention, the inclined surface of the limiting plate drives the substrate to move downward, ensuring that the substrate is in close contact with the worktable, thereby further fixing the substrate. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of a laser pin welding device for processing optoelectronic devices proposed in this invention. Figure 2 This is a schematic diagram of the overall side first cross-sectional structure of the present invention; Figure 3 This is a schematic diagram of the overall side second sectional view structure in this invention; Figure 4 for Figure 1 Enlarged schematic diagram of the structure at point A in the middle; Figure 5 for Figure 2 Enlarged schematic diagram of the structure at point B; Figure 6 for Figure 2 Enlarged schematic diagram of the structure at point C; Figure 7 for Figure 3 Enlarged schematic diagram of the structure at point D.

[0018] In the diagram: 1. Support platform; 2. Welding device; 3. Workbench; 4. Square groove; 5. Support column; 6. Circular plate; 7. Rotating plate; 8. Rack; 9. Servo motor; 10. Gear; 11. First guide groove; 12. Second guide groove; 13. Suction device; 14. First connecting pipe; 15. Connecting box; 16. Second connecting pipe; 17. Conveying rod; 18. Third connecting pipe; 19. First suction head; 20. Sliding groove; 21. Square plate; 22. Telescopic rod; 23. Second suction head; 24. Limiting plate; 25. Sliding block. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] like Figure 1 - Figure 7 As shown, the present invention proposes a laser pin welding device for processing optoelectronic devices, comprising a support platform 1, a welding device 2 movably connected to the upper part of the support platform 1, a worktable 3 mounted on the upper part of the support platform 1, and a fixing assembly on the worktable 3. The fixing assembly includes a circular plate 6 mounted on the inner side of the worktable 3, a rotating plate 7 rotatably connected to the upper part of the circular plate 6, multiple conveying rods 17 movably connected to the inner sides of the circular plate 6 and the rotating plate 7, a first suction head 19 movably connected to the upper part of the conveying rods 17, a third connecting pipe 18 mounted between the conveying rods 17 and the first suction head 19, and a driving unit and a suction unit mounted on the worktable 3. A limiting plate 24 is installed on the upper part of the first adsorption head 19. The driving unit drives the rotating plate 7 to rotate. The rotating plate 7 drives multiple conveying rods 17 and the first adsorption head 19 to move simultaneously toward the center position of the worktable 3. The limiting plate 24 is in contact with the edge of the substrate to ensure that the substrate is tightly attached to the worktable 3, which further enhances the fixing effect of the substrate. The position distribution of the multiple first adsorption heads 19 corresponds to the edge shape of the substrate. The suction unit drives the first adsorption heads 19 to perform suction to fix the substrate, ensuring that all first adsorption heads 19 can simultaneously adsorb and fix the substrate, increasing the adsorption area, improving the firmness of adsorption, and enhancing the fixing effect of the substrate.

[0021] The suction unit includes a square groove 4 on the inner side of the workbench 3. A suction device 13 is installed on the inner side of the square groove 4. A first connecting pipe 14 is installed at the output end of the suction device 13. A connecting box 15 is installed at the end of the first connecting pipe 14 away from the suction device 13. A plurality of second connecting pipes 16 are installed on the upper part of the connecting box 15. The end of the second connecting pipe 16 away from the connecting box 15 is fixedly connected to the conveying rod 17. The suction device 13 transmits the suction force to the first suction head 19 through the first connecting pipe 14, the connecting box 15, the second connecting pipes 16, the conveying rod 17 and the third connecting pipe 18.

[0022] A sliding block 25 is installed at the bottom of the rotating plate 7, and multiple support columns 5 are installed on the inner side of the square groove 4. The ends of the multiple support columns 5 are fixedly connected to the circular plate 6. The sliding block 25 is slidably connected to the circular plate 6, and the rotating plate 7 rotates through the sliding block 25.

[0023] The drive unit includes a servo motor 9 installed inside the square slot 4, a gear 10 installed at the output end of the servo motor 9, and a rack 8 installed on the side of the rotating plate 7. The gear 10 and the rack 8 mesh with each other, and when the gear 10 rotates, it drives the rotating plate 7 to rotate through the rack 8.

[0024] The driving unit also includes a plurality of second guide grooves 12 on the inner side of the circular plate 6 and a plurality of first guide grooves 11 on the inner side of the rotating plate 7. The plurality of first guide grooves 11 and second guide grooves 12 are slidably connected to the conveying rods 17. When the rotating plate 7 rotates, it guides the conveying rods 17 through the first guide grooves 11 and drives the plurality of conveying rods 17 to move along the second guide grooves 12 respectively.

[0025] A square plate 21 is installed at the bottom of the first adsorption head 19, and a telescopic rod 22 is installed on the side of the square plate 21. The end of the telescopic rod 22 away from the square plate 21 is fixedly connected to the conveying rod 17, and the telescopic rod 22 supports the movement of the conveying rod 17 through its telescopicity.

[0026] The upper part of the workbench 3 is provided with multiple sliding grooves 20, and the first adsorption head 19 is slidably disposed inside the sliding groove 20. The first adsorption head 19 can move along the sliding groove 20.

[0027] The upper part of the connecting box 15 is equipped with a second adsorption head 23. The second adsorption head 23, the first adsorption head 19 and the worktable 3 are all on the same horizontal plane, ensuring that the substrate can contact the worktable 3.

[0028] The limiting plate 24 has a trapezoidal cross section. The inclined surface of the limiting plate 24 drives the substrate to move downward, ensuring that it fits against the worktable 3.

[0029] The size of the opening of the sliding groove 20 is adapted to the size of the first adsorption head 19. Both the sliding groove 20 and the first adsorption head 19 have convex cross sections to ensure the stability of the movement of the first adsorption head 19.

[0030] In this embodiment, when welding is required, the substrate and electronic components can be placed on the worktable 3, and then the servo motor 9 is started. The servo motor 9 drives the gear 10 to rotate, and the gear 10 rotates, which in turn drives the rotating plate 7 to rotate via the rack 8. At this time, the rotating plate 7 rotates along the circular plate 6 via the sliding block 25. When the rotating plate 7 rotates, it can guide the conveying rods 17 through the first guide groove 11, thereby driving multiple conveying rods 17 to move along the second guide groove 12 towards the center position of the worktable 3. At the same time, it drives the first suction head 19 to move along the sliding groove 20 until the limiting plate 24 contacts the edge of the substrate. The inclined surface of the limiting plate 24 drives the substrate to move downward to ensure that it is in contact with the worktable 3. If the edge of the substrate is irregularly shaped, it is already in contact with the worktable 3. The conveying rod 17 at the corresponding position of the limiting plate 24 in contact with the substrate continues to move. The telescopic support of the telescopic rod 22 supports the movement of the conveying rod 17, thereby making the position distribution of the multiple first adsorption heads 19 correspond to the shape of the substrate. Then, the suction device 13 is started. The suction device 13 transmits the suction force to the first adsorption head 19 and the second adsorption head 23 through the first connecting pipe 14, the connecting box 15, the second connecting pipe 16, the conveying rod 17 and the third connecting pipe 18. The substrate is adsorbed by the first adsorption head 19 and the limiting plate 24, thereby fixing the substrate. This ensures that all the first adsorption heads 19 can simultaneously adsorb and fix the substrate, increasing the adsorption area, improving the firmness of adsorption, and enhancing the fixing effect on the substrate. Then, laser welding is performed by the welding device 2.

[0031] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A laser pin bonding apparatus for processing optoelectronic devices, comprising a support stage (1), characterized in that, A welding device (2) is movably connected to the upper part of the support platform (1). A workbench (3) is installed on the upper part of the support platform (1). A fixing assembly is provided on the workbench (3). The fixing assembly includes a circular plate (6) installed on the inner side of the workbench (3), a rotating plate (7) rotatably connected to the upper part of the circular plate (6), multiple conveying rods (17) movably connected to the inner sides of the circular plate (6) and the rotating plate (7), a first suction head (19) movably connected to the upper part of the conveying rods (17), a third connecting pipe (18) installed between the conveying rods (17) and the first suction head (19), a driving unit and a suction unit provided on the workbench (3). A limit plate (24) is installed on the upper part of the first suction head (19). The driving unit drives the rotating plate (7) to rotate. The rotating plate (7) drives the multiple conveying rods (17) and The first suction head (19) moves towards the center of the workbench (3) at the same time. The limiting plate (24) is in contact with the edge of the substrate. The positions of the multiple first suction heads (19) correspond to the edge shape of the substrate. The suction unit drives the first suction head (19) to perform suction to fix the substrate. The suction unit includes a square groove (4) opened on the inner side of the workbench (3). A suction device (13) is installed on the inner side of the square groove (4). A first connecting pipe (14) is installed at the output end of the suction device (13). A connecting box (15) is installed at the end of the first connecting pipe (14) away from the suction device (13). Multiple second connecting pipes (16) are installed on the upper part of the connecting box (15). The end of the second connecting pipe (16) away from the connecting box (15) is fixedly connected to the conveying rod (17). The drive unit includes multiple second guide grooves (12) opened on the inner side of the circular plate (6), and multiple first guide grooves (11) opened on the inner side of the rotating plate (7). The multiple first guide grooves (11) and second guide grooves (12) are slidably connected to the conveying rod (17). A square plate (21) is installed at the bottom of the first adsorption head (19), and a telescopic rod (22) is installed on the side of the square plate (21). The end of the telescopic rod (22) away from the square plate (21) is fixedly connected to the conveying rod (17).

2. The lead laser welding apparatus for processing optoelectronic devices according to claim 1, characterized in that, The bottom of the rotating plate (7) is equipped with a sliding block (25), and multiple support columns (5) are installed on the inner side of the square groove (4). The ends of the multiple support columns (5) are fixedly connected to the circular plate (6), and the sliding block (25) is slidably connected to the circular plate (6).

3. The lead laser welding apparatus for processing optoelectronic devices according to claim 2, characterized in that, The drive unit also includes a servo motor (9) installed inside the square slot (4), a gear (10) is installed at the output end of the servo motor (9), and a rack (8) is installed on the side of the rotating plate (7), and the gear (10) meshes with the rack (8).

4. The lead laser welding apparatus for processing optoelectronic devices according to claim 1, characterized in that, The upper part of the workbench (3) is provided with multiple sliding grooves (20), and the first adsorption head (19) is slidably disposed inside the sliding groove (20).

5. A lead laser welding apparatus for processing optoelectronic devices according to claim 2, characterized in that, The upper part of the connecting box (15) is equipped with a second adsorption head (23), and the second adsorption head (23), the first adsorption head (19) and the worktable (3) are all on the same horizontal plane.

6. The lead laser welding apparatus for processing optoelectronic devices according to claim 1, characterized in that, The cross-section of the limiting plate (24) is trapezoidal.

7. The lead laser welding apparatus for processing optoelectronic devices according to claim 4, characterized in that, The size of the opening of the sliding groove (20) is adapted to the size of the first adsorption head (19), and the cross-sections of the sliding groove (20) and the first adsorption head (19) are both convex.

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