一种基于模板的降低接收侧解析复杂度的方法
By encapsulating slice boundary information in a template during data transmission in integrated circuit communication, the problem of high parsing complexity on the receiving side is solved, data timing is simplified, and chip operating frequency and module performance are improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 博茵微电子(北京)有限公司
- Filing Date
- 2025-09-19
- Publication Date
- 2026-07-17
AI Technical Summary
In integrated circuit communication, the receiving side faces high complexity in parsing and timing during data interconnection, which affects the chip's operating frequency and module performance.
During data transmission, the sending side encapsulates data FLIT and a template containing slice boundary information, which is then converted into a physical layer transmission via a gearbox. The receiving side uses the template to quickly confirm the slice boundaries, simplifying the parsing process.
This reduces the complexity of parsing slice boundaries on the receiving side, simplifies data timing, and improves the performance of the bridging module and the chip's operating frequency.
Smart Images

Figure CN121166201B_ABST