A new type of temperature controller

Abstract

This invention relates to the technical field of temperature control components and discloses a novel temperature controller, including a temperature control component. An air duct component is fixedly installed within the temperature control component, and a cooling recirculation component is fixedly installed above the air duct component. The air duct component includes a vertical heat sink and a heat dissipation component. The vertical heat sink facilitates heat conduction, and the heat dissipation component utilizes wind power to agitate and dissipate heat from the heat-conducting liquid inside the vertical heat sink. The multi-path air duct structure of this invention, through the cooperation of branch pipes and isolation baffles, achieves precise airflow distribution, allowing the air generated by the fan module to simultaneously meet the three major needs of semiconductor cooling chip heat dissipation, temperature control box cooling, and reciprocating hammer component drive. This avoids the idle wind power caused by a single air duct serving only a single function. Compared with traditional single-path air ducts, the wind power utilization rate is improved, indirectly reducing the fan's operating energy consumption.

Description

Technical Field

[0001] This invention belongs to the technical field of temperature control components, and more specifically, relates to a novel temperature controller. Background Technology

[0002] In the current field of temperature control, the temperature controller, as the core device for temperature regulation, directly affects the normal operation and lifespan of the controlled equipment. However, existing temperature controllers have many shortcomings in practical use. When the temperature controller is exposed to a high-temperature environment for a long time, the high temperature will interfere with the stability of the circuit current of its internal chip. This can easily lead to the equipment running continuously without stopping, resulting in a large amount of energy waste, and may also damage the controlled equipment due to continuous high temperatures. At the same time, the chip will activate a protective frequency reduction mechanism under high-temperature conditions, which makes the temperature controller unable to respond to temperature changes in a timely manner, seriously affecting the temperature control accuracy and efficiency.

[0003] Traditional thermostats typically employ single-fan cooling or simple heat sinks for heat dissipation, resulting in limited effectiveness and difficulty in handling prolonged high-temperature conditions. Furthermore, condensation generated during the cooling process cannot be effectively managed; condensation buildup not only affects heat dissipation efficiency but can also corrode internal components, further shortening the device's lifespan. In addition, existing thermostats suffer from poor coordination between their cooling and heat dissipation components, failing to form an efficient cooling circulation system and leading to overall poor temperature control performance. Therefore, developing a new type of thermostat capable of efficient cooling and heat dissipation, effectively handling condensation, and ensuring stable operation over extended periods is a pressing issue.

[0004] Therefore, in view of this, we will study and improve the existing structure and its shortcomings to provide a new type of thermostat, in order to achieve a more practical and valuable purpose. Summary of the Invention

[0005] This invention provides a novel temperature controller to overcome the aforementioned defects in the prior art.

[0006] The purpose and function of this novel temperature controller are achieved by the following specific technical means: A novel temperature controller includes a temperature control component, an air duct component fixedly installed inside the temperature control component, and a cooling refrigeration component fixedly installed above the air duct component. The air duct assembly includes a vertical tube heat sink and a heat dissipation component. The vertical tube heat sink enables heat conduction, and the heat dissipation component uses wind power to agitate and dissipate heat from the heat-conducting liquid inside the vertical tube heat sink. The cooling reflux assembly contains a cooling component, and a first condenser plate and a drainage component are installed above the cooling component. The drainage component is in contact with the first condenser plate. The cooling component cools down the first condenser plate and begins to conduct cooling to the first condenser plate. Subsequently, the drainage component cleans the condensate produced by the cooling of the first condenser plate and allows it to flow into the interior of the vertical tube heat sink for reflux cooling.

[0007] A further technical solution includes a cooling reflux assembly comprising a shield, a side outlet on the outer side of the shield, an upper outlet array on the top of the shield, a sealed cavity inside the upper outlet, a cooling assembly installed within the wall of the sealed cavity, the cooling assembly comprising an equipment box, a semiconductor cooling chip fixedly installed inside the equipment box, a fan module fixedly connected to the heating surface of the semiconductor cooling chip, and a fan module fixedly connected to the cooling surface of the semiconductor cooling chip, the air duct assembly further comprising a branch pipe, and the fan module communicating internally with the branch pipe.

[0008] In a further technical solution, the air duct assembly includes a branch pipe, and two circular through holes are provided through the surface of the branch pipe. The circular through hole provided at the top is connected to the air outlet of the fan module. An isolation baffle is fixedly connected to the bottom of the branch pipe, and the isolation baffle separates the air duct inside the branch pipe. The circular through hole provided at the bottom is connected to the inside of the temperature control box.

[0009] In a further technical solution, the shielding cover has a cavity inside, a cooling component is installed inside the cavity, a condensation component is fixedly installed above the cooling component, the condensation component includes a condensation guide head, a drainage component is provided inside the condensation guide head, and the drainage component is fixedly installed above the semiconductor cooling chip.

[0010] A further technical solution includes a drainage assembly comprising a pad, with hinges symmetrically arranged on the outer side of the pad, and a compressed air canister fixedly installed above the hinges. The symmetrically arranged hinges are respectively hinged to a first hammer rod and a second hammer rod. The first hammer rod includes a rod body, with a first condensing plate, a second condensing plate, and a third condensing plate on the surface of the rod body. A compression spring is provided between the first condensing plate, the second condensing plate, and the third condensing plate. A folded compression plate is connected between the third condensing plate and the rod body. A through hole is provided inside the rod body. Cooling feet are provided at the bottom of the first condensing plate, the second condensing plate, and the third condensing plate, and the cooling feet are fixedly connected to the cooling surface of the semiconductor cooling chip.

[0011] A further technical solution is provided, wherein a vertical limiting rod and a telescopic expansion tube are fixedly provided above the extrusion tank, the surface of the vertical limiting rod is provided with a through hole, a bearing is installed on the through hole, a reciprocating hammer assembly is fixedly installed inside the bearing, the reciprocating hammer assembly includes a connecting rod, one end of the connecting rod is provided with a wind turbine impeller, and an exhaust opening is provided below the wind turbine impeller, the exhaust opening being connected to the interior of the refrigeration assembly.

[0012] In a further technical solution, an elliptical cam is fixedly connected to the other end of the connecting rod. An extrusion assembly is provided below the elliptical cam, and a guide rod is provided below the extrusion assembly. A spring is provided between the guide rod and the upper end of the extrusion assembly. The other end of the guide rod passes through the interior of the extrusion gas tank. A piston plate is provided inside the extrusion gas tank, and the piston plate is connected to the guide rod. An exhaust hole is provided inside the extrusion gas tank, and the exhaust hole communicates with the through hole inside the rod body.

[0013] In a further technical solution, the telescopic expansion tube is fixedly connected to the vertical limiting rod. The telescopic expansion tube is divided into three sections. An extension guide rod is provided inside the telescopic expansion tube. A bottom ring is provided at the bottom of each section of the telescopic expansion tube. The bottom ring is fixedly connected to the extension guide rod. A reset spring is provided between the connection of each section and the connection of the previous section. Multiple sets of grooves are provided on the surface of each section of the telescopic expansion tube.

[0014] A further technical solution includes a circular groove on the surface of the vertical heat sink plate, on which a heat sink assembly is fixedly connected. The heat sink assembly includes an outer ring sleeve, within which a mounting bracket is fixedly installed. A rotating shaft is rotatably mounted in the middle of the mounting bracket. A rotating blade is provided at the front end of the rotating shaft, and a rotating brush is provided at the rear end of the rotating shaft. A movable sealing ring is provided at the connection between the rotating brush and the vertical heat sink plate. The end of the rotating brush penetrates the interior of the vertical heat sink plate. Vertical guide tubes are also fixedly connected to both sides of the isolation baffle plate. One end of the vertical guide tube communicates with the interior of the shielding cover, and the other end of the vertical guide tube communicates with the vertical heat sink plate.

[0015] In a further technical solution, the temperature control component includes a temperature control box, an interior cavity, an installation bracket inside the cavity, a temperature controller fixedly mounted on the installation bracket, a junction box fixedly mounted below the temperature controller, a hinged door on the outside of the temperature control box, a ventilation slot on the door, and circular ventilation holes on both sides of the temperature control box, the circular ventilation holes corresponding to the heat dissipation component.

[0016] Compared with the prior art, the present invention has the following beneficial effects: This invention discloses a novel temperature controller with a multi-path airflow structure. This multi-path airflow structure, through the cooperation of branch pipes and isolation baffles, achieves precise airflow distribution. This allows the air generated by the fan module to simultaneously meet the three major needs: heat dissipation for the semiconductor cooling chip, cooling of the temperature control box, and driving of the reciprocating hammer assembly. This avoids the idle airflow caused by a single airflow serving only one function. Compared to traditional single-path airflow systems, the airflow utilization rate is improved, indirectly reducing the fan's operating energy consumption. Simultaneously, the vertical ducts on both sides of the isolation baffles provide dedicated return channels for condensate, effectively avoiding path loss and leakage risks caused by disordered condensate flow within the device. This improves the transmission efficiency of condensate from generation to entry into the vertical duct heat sink, reduces corrosion of internal components caused by turbulent condensate flow, and extends the device's service life.

[0017] This invention discloses a novel temperature controller that incorporates semiconductor cooling. Through an innovative design that combines semiconductor cooling with multiple condenser plates, the device achieves multifaceted efficiency improvements. The semiconductor cooling plate is bidirectionally connected to the fan module, effectively solving the heat dissipation problem of the heating surface and preventing the cooling plate from overheating and reducing cooling efficiency. It also assists in the diffusion of cold air from the cooling surface, expanding the coverage area. Simultaneously, the multi-condenser plate design further increases the cold air conduction area, improving overall cooling efficiency compared to the traditional single-condenser plate structure. Furthermore, the temperature fluctuation range during cooling can be precisely controlled, ensuring accurate temperature control. In terms of structural adaptability, the compression springs and folded compression plates between the condenser plates flexibly adapt to thermal expansion and contraction caused by temperature changes, avoiding problems such as breakage and deformation of traditional condenser plates due to temperature stress. This extends the maintenance cycle of the condenser plate assembly and significantly reduces downtime maintenance costs caused by condenser plate damage.

[0018] This invention discloses a novel thermostat that achieves multiple benefits through an innovative design that incorporates a "cleaning-recirculation-heat dissipation" cycle for condensate. The dual cleaning method of "air blowing + mechanical tapping" thoroughly removes condensate adhering to the surface of the condenser fins, effectively avoiding the problem of reduced heat exchange efficiency caused by condensate buildup, ensuring the condenser fins can continuously and efficiently conduct cold air and maintain stable cooling performance. Simultaneously, the directional recirculation design enables condensate recovery, avoiding water waste compared to the traditional method of directly discharging condensate, and converting the condensate into an auxiliary heat dissipation medium. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0021] Figure 1 This is a schematic diagram of the overall appearance and structure of the present invention; Figure 2 This is a schematic diagram of the overall front view of the present invention; Figure 3 This is a schematic diagram of the overall isometric structure of the present invention; Figure 4 This is a schematic diagram of the overall appearance structure of the air duct assembly and the cooling refrigeration recirculation assembly in this invention; Figure 5 This is a top view schematic diagram of the overall structure of the air duct assembly and the cooling recirculation assembly in this invention; Figure 6 For the present invention Figure 5 A magnified structural diagram of point A in the middle.

[0022] Figure 7 This is a schematic cross-sectional view of the air duct assembly and the cooling recirculation assembly in this invention. Figure 8 For the present invention Figure 7 A magnified schematic diagram of the local structure; Figure 9 This is a schematic diagram of the external structure of the condensation component and the air duct component in this invention; Figure 10 This is a side sectional view of the condensation assembly and the air duct assembly in this invention; Figure 11 This is a schematic diagram of the external structure of the condensation component and the drainage component in this invention; Figure 12 For the present invention Figure 11 A magnified structural diagram of point A in the middle.

[0023] Explanation of reference numerals in the attached figures: 1. Temperature control assembly; 11. Temperature control box; 12. Junction box; 13. Mounting bracket; 14. Thermostat; 15. Closing door; 16. Ventilation slot; 2. Air duct assembly; 21. Branch pipe; 211. Isolation baffle; 212. Vertical duct; 22. Vertical duct heat sink; 23. Heat dissipation assembly; 231. Outer ring; 232. Rotating brush; 233. Rotating shaft; 234. Movable sealing ring; 3. Refrigeration reflux assembly; 31. Shielding cover; 32. Side exhaust port; 33. Top exhaust port; 4. Condensing assembly; 41. First condenser fin; 42. Second condenser fin; 43. Third condenser fin; 44. Condensing guide; 45. Cooling feet; 5. Refrigeration components; 51. Equipment box; 52. Semiconductor refrigeration chip; 53. Fan module; 6. Drainage assembly; 61. First hammer rod; 611. Rod body; 612. Folding compression plate; 613. Compression spring; 62. Second hammer rod; 63. Vertical limiting rod; 64. Telescopic expansion tube; 7. Reciprocating hammer assembly; 71. Pneumatic impeller; 72. Connecting shaft; 73. Elliptical cam; 74. Extrusion assembly; 75. Extrusion gas tank; 76. Pad plate. Detailed Implementation

[0024] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of the invention.

[0025] In the description of this invention, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0027] As attached Figure 1 To be continued Figure 12 As shown: The present invention provides a novel temperature controller, including a temperature control component 1, an air duct component 2 fixedly installed inside the temperature control component 1, and a cooling refrigeration recirculation component 3 fixedly installed above the air duct component 2; The air duct assembly 2 includes a vertical tube heat sink 22 and a heat dissipation assembly 23. The vertical tube heat sink 22 has a heat-conducting liquid channel inside, which realizes efficient heat conduction through the heat-conducting liquid. The heat dissipation assembly 23 uses wind power to drive the internal components to rotate, which agitates the heat-conducting liquid inside the vertical tube heat sink 22, breaks the static thermal resistance of the liquid, and improves the heat dissipation efficiency. The cooling reflux assembly 3 is equipped with a cooling assembly 5 inside. A first condenser plate 41 and a drainage assembly 6 are installed above the cooling assembly 5. The drainage assembly 6 is in contact with the first condenser plate 41. After the cooling assembly 5 cools down, it achieves directional cooling through the heat conduction structure to the first condenser plate 41. Then, the drainage assembly 6 cleans the condensate produced by the cooling of the first condenser plate 41 and guides the condensate into the interior of the vertical tube heat sink 22, where it mixes with the heat conduction liquid to achieve reflux cooling and improve the utilization rate of cooling capacity.

[0028] Preferred options are shown in the appendix. Figure 7 To be continued Figure 8 The cooling refrigeration assembly 3 includes a shield 31, with a side outlet 32 ​​on the outside of the shield 31 and an upper outlet 33 arrayed on the top of the shield 31. The upper outlet 33 has a sealed cavity inside, and a cooling assembly 5 is installed inside the wall of the sealed cavity. The cooling assembly 5 includes an equipment box 51, with a semiconductor cooling chip 52 fixedly installed inside the equipment box 51. A fan module 53 (for discharging heat from the heating surface) is fixedly connected to the heating surface of the semiconductor cooling chip 52, and a cooling foot 45 is fixedly connected to the cooling surface of the semiconductor cooling chip 52. The air duct assembly 2 also includes a branch pipe 21, with the fan module 53 communicating with the branch pipe 21 to allow heat from the heating surface to be directionally discharged through the branch pipe 21.

[0029] Preferred options are shown in the appendix. Figure 4 To be continued Figure 8 The air duct assembly 2 includes a branch pipe 21. Two circular through holes are provided on the surface of the branch pipe 21. The upper circular through hole is connected to the air outlet of the fan module 53 for introducing cooling-related airflow. The lower circular through hole is connected to the interior of the temperature control box 11 for realizing airflow circulation inside the temperature control box 11. An isolation baffle plate 211 is fixedly connected to the lower part of the branch pipe 21. The isolation baffle plate 211 divides the air duct inside the branch pipe 21 into a "cooling airflow channel" and a "heat dissipation airflow channel" to avoid mixing of hot and cold airflows and reducing efficiency.

[0030] Preferred options are shown in the appendix. Figure 7 To be continued Figure 8 The shielding cover 31 has a cavity inside, and a cooling component 5 is installed inside the cavity. A condensing component 4 is fixedly installed above the cooling component 5. The condensing component 4 includes a condensing guide head 44 and a first condensing plate 41. The condensing guide head 44 is fixed above the cooling foot 45 of the semiconductor cooling plate 52 and is used to transfer cold energy. A drainage component 6 is sleeved on the outside of the condensing guide head 44. The drainage component 6 is positioned by the condensing guide head 44 and fixedly installed above the semiconductor cooling plate 52 to ensure a tight fit with the condensing structure.

[0031] Preferred options are shown in the appendix. Figure 7 To be continued Figure 12 The drainage assembly 6 includes a pad 76, which is sleeved on the outside of the condenser guide head 44. Symmetrical hinges are arranged on the outer side of the pad 76. A compressed air tank 75 is fixedly installed above the hinges. The symmetrically arranged hinges are respectively hinged to a first hammer rod 61 and a second hammer rod 62 (both have the same structure to ensure balanced condensate treatment). The first hammer rod 61 includes a rod body 611. The surface of the rod body 611 is provided with a first condenser plate 41, a second condenser plate 42, and a third condenser plate 43 (multi-plate design increases the condensation area). The first condenser plate 41... A compression spring 613 is provided between the second condenser plate 42 and the third condenser plate 43 to buffer the deformation of the condenser plate caused by temperature changes. A folding compression piece 612 is provided between the third condenser plate 43 and the rod body 611 to further adapt to structural deformation. A through hole is provided inside the rod body 611 (for condensate drainage). The bottom of the first condenser plate 41, the second condenser plate 42 and the third condenser plate 43 is provided with a cooling foot 45. The cooling foot 45 is fixedly connected to the cooling surface of the semiconductor refrigeration chip 52 to ensure that the cooling capacity is stably transferred to each condenser plate.

[0032] Preferred options are shown in the appendix. Figure 11 To be continued Figure 12 A vertical limiting rod 63 and a telescopic expansion tube 64 are fixedly provided above the compressed air tank 75. The surface of the vertical limiting rod 63 is provided with a through hole, and a bearing is installed on the through hole. A reciprocating hammer assembly 7 is fixedly installed inside the bearing to reduce the friction of the assembly movement. The reciprocating hammer assembly 7 includes a connecting rod 72. One end of the connecting rod 72 is provided with a wind turbine impeller 71. The bottom of the wind turbine impeller 71 is provided with an exhaust opening, which is connected to the interior of the refrigeration assembly 5, so that the airflow discharged from the refrigeration assembly 5 can drive the wind turbine impeller 71 to rotate, realizing "one source for multiple uses".

[0033] Preferred options are shown in the appendix. Figure 11 To be continued Figure 12 The other end of the connecting rod 72 is fixedly connected to an elliptical cam 73. A pressing assembly 74 is provided below the elliptical cam 73. A guide rod is provided below the pressing assembly 74. A spring (for resetting the pressing assembly 74) is provided between the guide rod and the upper end of the pressing assembly 74. The other end of the guide rod passes through the interior of the pressing gas tank 75. A piston plate is provided inside the pressing gas tank 75. The piston plate is connected to the guide rod. When the elliptical cam 73 rotates, it pushes the pressing assembly 74 and the guide rod, causing the piston plate to move up and down, changing the air pressure inside the pressing gas tank 75. An exhaust hole is provided inside the pressing gas tank 75. The exhaust hole communicates with the through hole inside the rod body 611, so that the airflow inside the gas tank can push the condensate to flow along the through hole of the rod body 611.

[0034] Preferred options are shown in the appendix. Figure 11 The telescopic expansion tube 64 is fixedly connected to the vertical limiting rod 63. The telescopic expansion tube 64 is divided into three sections (to adapt to different degrees of thermal expansion and contraction). An extension guide rod is provided inside the telescopic expansion tube 64. A bottom ring is provided at the bottom of each section of the telescopic expansion tube 64. The bottom ring is fixedly connected to the extension guide rod. A reset spring is provided between the connection of each section and the connection of the previous section to ensure that it can return to the initial state after expansion and contraction. Multiple sets of slots are provided on the surface of each section of the telescopic expansion tube 64, which not only assists in heat dissipation but also reduces airflow resistance and avoids affecting the movement of the reciprocating hammer assembly 7.

[0035] Preferred options are shown in the appendix. Figure 4 To be continued Figure 6 The surface of the vertical tube heat sink 22 is provided with a circular groove, and a heat sink component 23 is fixedly connected to the circular groove. The heat sink component 23 includes an outer ring 231 (component shell, to ensure installation stability). A mounting bracket is fixedly installed inside the outer ring 231. A rotating shaft 233 is rotatably provided in the middle of the mounting bracket. The front end of the rotating shaft 233 is provided with rotating blades (driven by airflow). The rear end of the rotating shaft 233 is provided with a rotating brush 232. A movable sealing ring 234 is provided at the connection between the rotating brush 232 and the vertical tube heat sink 22 (to prevent leakage of heat transfer liquid). The end of the rotating brush 232 penetrates the interior of the vertical tube heat sink 22 and agitates the heat transfer liquid with the rotating shaft 233. Vertical guide tubes 212 are also fixedly connected to both sides of the isolation baffle 211. One end of the vertical guide tube 212 is connected to the interior of the shield 31, and the other end of the vertical guide tube 212 is connected to the vertical tube heat sink 22, realizing the directional flow of condensate from the shield 31 to the vertical tube heat sink 22.

[0036] Preferred options are shown in the appendix. Figure 1 To be continued Figure 3 The temperature control component 1 includes a temperature control box 11, which has an internal cavity (forming an independent temperature control space). An installation frame 13 is installed inside the cavity, and a temperature controller 14 (the core of equipment temperature control, monitoring the internal temperature) is fixedly installed on the installation frame 13. A junction box 12 (for storing cables and standardizing wiring) is fixedly installed below the temperature controller 14. A hinged door 15 is provided on the outside of the temperature control box 11 (for easy equipment maintenance). A ventilation slot 16 is provided on the closed door 15. Circular ventilation holes are provided on both sides of the temperature control box 11. The circular ventilation holes correspond to the heat dissipation component 23, ensuring that the heat discharged by the heat dissipation component 23 can be quickly discharged through the ventilation holes and ventilation slots 16, forming an airflow circulation.

[0037] Specific usage of this invention: When using this device, first install it outside the temperature control chamber (ensure sufficient ventilation space for the device and avoid external environment obstructing the side exhaust port 32 and the top exhaust port 33). Then connect the temperature control sensor connector to the temperature controller 14 installed in this device (to achieve real-time data interaction between the internal temperature of the temperature control chamber and the device). During subsequent use, the temperature controller 14 needs to maintain a stable working environment. Because the internal chip of the temperature controller 14 is sensitive to temperature, if it is in a high-temperature environment for a long time, it will interfere with the current stability of the internal circuit of the chip. This may not only cause the device to run continuously without stopping (causing energy waste), but may also damage the controlled device due to overheating. In addition, high temperature will trigger the chip's protective frequency reduction, causing the temperature controller 14 to be unable to respond to changes in the temperature of the temperature control chamber in a timely manner, affecting the temperature control accuracy.

[0038] When the device is started, the semiconductor cooling chip 52 located inside the cooling assembly 5 starts synchronously. At this time, the heating surface of the semiconductor cooling chip 52 begins to heat up, and the cooling surface enters the cooling state. The cooling surface, through the cooling foot 45 fixedly connected to it, directionally conducts the cold energy to the first condenser 41, the second condenser 42, and the third condenser 43, providing low-temperature conditions for condensation. At the same time, the fan module 53 connected to the heating surface of the semiconductor cooling chip 52 starts to rotate. The airflow generated by the fan module 53 comes into contact with the isolation baffle 211 below the distribution pipe 21, and due to the separation effect of the isolation baffle 211, three directional airflows are formed: The first airflow: After being blown out directly from the fan module 53, it is blocked by the isolation baffle 211 and discharged outward along the "heat dissipation airflow channel" inside the branch pipe 21. Finally, it is discharged to the outside of the equipment through the side outlet 32 ​​of the shielding cover 31, taking away the heat generated by the heating surface of the semiconductor cooling chip 52. The second airflow: after being guided by the isolation baffle plate 211, it turns and blows into the temperature control box 11 along the "cooling airflow channel" inside the branch pipe 21, providing cooling airflow for the temperature controller 14 inside the temperature control box 11, and preventing the temperature controller 14 from heating up due to its own operation or external heat accumulation. The third airflow blows downwards to the bottom wall of the branch pipe 21, then turns upwards, passes through the internal cavity of the shield 31, and finally blows towards the wind turbine 71 of the reciprocating hammer assembly 7, providing power to the reciprocating hammer assembly 7.

[0039] During the continuous cooling process of the semiconductor cooling chip 52, the cold energy is continuously conducted to the first condenser chip 41, the second condenser chip 42, and the third condenser chip 43 through the cooling foot 45, causing the surface temperature of the three condenser chips to drop rapidly. Water vapor in the air condenses on the surface of the condenser chips to form condensate. Initially, the condensate accumulates on the surface of each condenser chip. Subsequently, some of the condensate drips onto the pad 76 of the drainage assembly 6 fitted outside the condenser head 44 due to gravity. It is then guided by the pad 76 to the interior of the condenser head 44. The condensate inside the condenser head 44 flows directionally into the heat-conducting liquid channel of the vertical tube heat sink 22 through the vertical conduit 212 connected to it. The condensate entering the channel mixes with the internal heat-conducting liquid. The temperature of the heat-conducting liquid is reduced by utilizing the low-temperature characteristics of condensate, while the heat transfer plate 22, made of metal, quickly conducts the heat of the mixed liquid to the surface. At the same time, after the second airflow enters the temperature control box 11, it flows to the heat dissipation component 23 through the circular ventilation holes on both sides of the temperature control box 11. The airflow drives the rotating blades at the front end of the rotating shaft 233 inside the outer ring 231 of the heat dissipation component 23 to rotate, which in turn drives the rotating brush 232 at the rear end of the rotating shaft 233 to rotate synchronously. The rotating brush 232 stirs the mixed liquid in the heat-conducting liquid channel of the vertical tube heat transfer plate 22, breaks the static thermal resistance of the liquid, accelerates the heat dissipation, and finally the airflow carrying heat is discharged from the temperature control box 11 through the ventilation slot 16 of the closed door 15.

[0040] Furthermore, when the third airflow blows towards the impeller 71, part of the airflow forms a reflux zone inside the cavity formed by the condenser guide head 44 and the exhaust assembly 6. The reflux airflow sweeps away the condensate accumulated on the surfaces of the first condenser plate 41, the second condenser plate 42, and the third condenser plate 43, causing the condensate to quickly detach from the condenser plate surface and fall into the condenser guide head 44. After merging with the initially dripping condensate, they flow together into the vertical tube heat sink 22 through the vertical guide tube 212, forming a "condensation-guide-cooling" cooling cycle. At the same time, the semiconductor refrigeration chip 52 indirectly conducts some of the cold energy to the metal shell of the temperature control box 11 through the metal structure such as the refrigeration foot 45 and the condenser assembly 4, assisting in the overall cooling of the temperature control box 11 and further providing a stable environment for the temperature controller 14.

[0041] When the third airflow drives the wind turbine 71 to rotate, the wind turbine 71 drives the connecting rod 72, which is fixedly connected to it, to rotate synchronously. The elliptical cam 73 at the other end of the connecting rod 72 rotates accordingly. During the rotation, the protruding part of the elliptical cam 73 periodically squeezes the extrusion component 74 below. With the reset action of the spring between the extrusion component 74 and the guide rod, the extrusion component 74 drives the guide rod to achieve reciprocating downward movement. The end of the guide rod away from the extrusion component 74 passes through the interior of the extrusion tank 75 and is fixedly connected to the piston plate inside the extrusion tank 75. Therefore, the reciprocating downward movement of the guide rod will drive the piston plate to move up and down in the extrusion tank 75, changing the air pressure inside the extrusion tank 75. When the piston plate is pressed down, the air pressure inside the extrusion tank 75 increases. The internal air is introduced into the through hole inside the rod body 611 through the exhaust hole, and then discharged from the through hole into the gap between the first condenser plate 41, the second condenser plate 42 and the third condenser plate 43, for further blowing. The condensate is removed from the surface of the condenser plate to ensure complete removal. Simultaneously, the rotating shaft 72, through a linkage structure (cooperating with the bearing of the vertical limit rod 63), drives the extension guide rod inside the telescopic expansion tube 64 to move up and down reciprocally. The extension guide rod drives the bottom ring of each segment of the telescopic expansion tube 64 to move synchronously, allowing the three segments of the telescopic expansion tube 64 to periodically expand and compress under the action of the return spring. When the telescopic expansion tube 64 expands and compresses, its outer wall will make slight contact and compression with the adjacent first condenser plate 41, second condenser plate 42, or third condenser plate 43, physically lifting the condenser plate and causing the condensate adhering to its surface to fall off quickly. If too much condensate is generated, exceeding the capacity of the vertical tube heat sink 22, the excess condensate will be discharged through the pre-installed drain pipe on the back of the shield 31 (connected to the bottom of the condenser guide head 44), preventing condensate from accumulating inside the equipment and causing component damage.

[0042] The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and to design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A novel temperature controller, comprising a temperature control component (1), wherein an air duct component (2) is fixedly installed within the temperature control component (1), characterized in that: A cooling return assembly (3) is fixedly installed above the air duct assembly (2); The air duct assembly (2) includes a vertical tube heat sink (22) and a heat dissipation assembly (23). The vertical tube heat sink (22) has a heat-conducting liquid channel inside. The vertical tube heat sink (22) conducts heat through the heat-conducting liquid. The heat dissipation assembly (23) includes a rotating brush (232), a rotating shaft and a movable sealing ring. The end of the rotating brush (232) extends into the heat-conducting liquid channel. A movable sealing ring is provided between the rotating brush and the vertical tube heat sink to prevent leakage. The heat dissipation assembly (23) uses wind power to drive the rotating brush (232) to stir and dissipate heat in the heat-conducting liquid inside the vertical tube heat sink (22). The refrigeration reflux assembly (3) is equipped with a refrigeration assembly (5). A first condenser plate (41) and a drain assembly (6) are installed above the refrigeration assembly (5). The drain assembly (6) is in contact with the first condenser plate (41). The refrigeration assembly (5) cools down and conducts cooling to the first condenser plate (41) through a heat-conducting structure. Then the drain assembly (6) cleans the condensate generated by the cooling of the first condenser plate (41) and makes the condensate flow into the heat-conducting liquid channel of the vertical tube heat sink plate (22) for refrigeration.

2. The novel temperature controller according to claim 1, characterized in that: The cooling reflux assembly (3) includes a shield (31), a side outlet (32) is provided on the outside of the shield (31), an upper outlet (33) is arrayed on the top of the shield (31), a sealed cavity is provided inside the upper outlet (33), a cooling assembly (5) is installed in the wall of the sealed cavity, the cooling assembly (5) includes an equipment box (51), a semiconductor cooling chip (52) is fixedly installed inside the equipment box (51), a fan module (53) is fixedly connected to the heating surface of the semiconductor cooling chip (52), and a cooling foot (45) is fixedly connected to the cooling surface of the semiconductor cooling chip (52). The air duct assembly (2) also includes a branch pipe (21), and the fan module (53) is internally connected to the branch pipe (21).

3. A novel temperature controller according to claim 2, characterized in that: Two circular through holes are provided through the surface of the branch pipe (21). The circular through hole provided above is connected to the air outlet of the fan module (53). An isolation baffle plate (211) is fixedly connected to the lower part of the branch pipe (21). The isolation baffle plate (211) divides the internal air duct of the branch pipe (21) into a cooling airflow channel and a heat dissipation airflow channel. The circular through hole provided below is connected to the inside of the temperature control box (11) of the temperature control component (1). The circular through hole corresponds to the heat dissipation airflow channel.

4. A novel temperature controller according to claim 3, characterized in that: The shield (31) has a cavity inside, and a cooling component (5) is installed inside the cavity. A condensing component (4) is fixedly installed above the cooling component (5). The condensing component (4) includes a condensing guide (44) and a first condensing plate (41). The condensing guide (44) is fixed above the cooling foot (45) of the semiconductor cooling plate (52). A drain component (6) is sleeved on the outside of the condensing guide (44). The drain component (6) is fixedly installed above the semiconductor cooling plate (52) through the condensing guide (44).

5. A novel temperature controller according to claim 4, characterized in that: The drainage assembly (6) includes a pad (76), which is sleeved on the outside of the condenser guide (44). A hinge is symmetrically arranged on the outside of the pad (76), and a compressed gas tank (75) is fixedly installed above the hinge. The symmetrically arranged hinges are respectively hinged to a first hammer rod (61) and a second hammer rod (62) with identical structures. The first hammer rod (61) includes a rod body (611), and the surface of the rod body (611) is provided with a first condenser plate (41) and a second condenser plate (42). 2) and the third condenser plate (43), a compression spring (613) is provided between the first condenser plate (41), the second condenser plate (42) and the third condenser plate (43), a folding compression plate (612) is provided between the third condenser plate (43) and the rod body (611), a condensate guide hole is provided inside the rod body (611), and the bottom of the first condenser plate (41), the second condenser plate (42) and the third condenser plate (43) are fixedly connected to the cooling foot (45).

6. A novel temperature controller according to claim 5, characterized in that: A vertical limiting rod (63) and a telescopic expansion tube (64) are fixedly provided above the compressed air tank (75). The surface of the vertical limiting rod (63) is provided with a through hole. A bearing is installed on the through hole. A reciprocating hammer assembly (7) is fixedly installed inside the bearing. The reciprocating hammer assembly (7) includes a connecting rod (72). One end of the connecting rod (72) is provided with a wind turbine impeller (71). An exhaust opening is provided below the wind turbine impeller (71). The exhaust opening is connected to the interior of the refrigeration assembly (5).

7. A novel temperature controller according to claim 6, characterized in that: The other end of the connecting rod (72) is fixedly connected to an elliptical cam (73). Below the elliptical cam (73) is a compression assembly (74). Below the compression assembly (74) is a guide rod. A spring is provided between the guide rod and the upper end of the compression assembly (74). The other end of the guide rod passes through the interior of the compression gas tank (75). Inside the compression gas tank (75) is a piston plate. The piston plate is connected to the guide rod. Inside the compression gas tank (75) is an exhaust hole. The exhaust hole communicates with the through hole inside the rod body (611).

8. A novel temperature controller according to claim 7, characterized in that: The telescopic expansion tube (64) is fixedly connected to the vertical limiting rod (63). The telescopic expansion tube (64) is divided into three sections. An extension guide rod is provided inside the telescopic expansion tube (64). A bottom ring is provided at the bottom of each section of the telescopic expansion tube (64). The bottom ring is fixedly connected to the extension guide rod. A reset spring is provided between the connection of each section and the connection of the previous section. Multiple sets of slots are provided on the surface of each section of the telescopic expansion tube (64).

9. A novel temperature controller according to claim 8, characterized in that: The surface of the vertical tube heat sink (22) is provided with a circular groove, and a heat sink assembly (23) is fixedly connected to the circular groove. The heat sink assembly (23) includes an outer ring (231), and a mounting bracket is fixedly installed inside the outer ring (231). A rotating shaft (233) is rotatably provided in the middle of the mounting bracket. A rotating blade is provided at the front end of the rotating shaft (233), and a rotating brush (232) is provided at the rear end of the rotating shaft (233). A movable sealing ring (234) is provided at the connection between the rotating brush (232) and the vertical tube heat sink (22). The end of the rotating brush (232) penetrates the interior of the vertical tube heat sink (22). Vertical guide tubes (212) are also fixedly connected to both sides of the isolation baffle (211). One end of the vertical guide tube (212) is connected to the interior of the shield (31), and the other end of the vertical guide tube (212) is connected to the vertical tube heat sink (22).

10. A novel temperature controller according to claim 9, characterized in that: The temperature control component (1) includes a temperature control box (11), which has a cavity inside. A mounting bracket (13) is installed inside the cavity. A temperature controller (14) is fixedly installed on the mounting bracket (13). A junction box (12) is fixedly installed below the temperature controller (14). A closed door (15) is hinged to the outside of the temperature control box (11). A ventilation slot (16) is provided on the closed door (15). Circular ventilation holes are provided on both sides of the temperature control box (11). The circular ventilation holes correspond to the heat dissipation component (23).

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