基于分布式麦克风阵列协同定位的三维-TDOA定位方法
By using an adaptive positioning method with a distributed microphone array, combined with quantum entangled state sensors and deep learning models, and optimizing TDOA estimation, the problem of insufficient accuracy of traditional positioning technology in complex environments is solved, and high-precision three-dimensional positioning is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SOUTHWESTERN INST OF PHYSICS
- Filing Date
- 2025-09-25
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional positioning technologies suffer from insufficient positioning accuracy in complex environments, severe noise interference, and inadequate data fusion and collaborative positioning mechanisms, making it difficult to achieve high-precision three-dimensional positioning.
An adaptive localization method based on a distributed microphone array is adopted, which combines quantum entangled state sensors, deep learning models, blockchain data fusion and reinforcement learning algorithms to optimize TDOA estimation and localization strategies, and performs three-dimensional spatial search through quantum annealing algorithm.
It achieves sub-centimeter-level positioning accuracy, resists complex electromagnetic interference and noise, is suitable for various indoor and outdoor environments, and has high versatility and expandability.
Smart Images
Figure CN121186707B_ABST