Method of manufacturing a package substrate

Abstract

A method for manufacturing a package substrate, a core plate body is arranged in a slot of a support member, a cladding layer is filled into the slot, the cladding layer clads the core plate body, then a wiring structure is formed on the support member, thus the design of the support member ensures the demand of high yield.

Description

Technical Field

[0001] This invention relates to a semiconductor packaging process, and more particularly to a method for manufacturing a packaging substrate. Background Technology

[0002] With the booming development of the electronics industry, electronic products are becoming thinner and smaller in form, and are moving towards high performance, high functionality, and high speed in terms of function. Therefore, in order to meet the requirements of high integration and miniaturization of semiconductor devices, packaging substrates with designs such as thinness, low warpage, and high-density wiring are often used in packaging processes.

[0003] However, in the existing packaging substrate manufacturing methods, the use of various heterogeneous materials makes it difficult to disperse structural stress, causing warping problems and making it difficult to improve yield.

[0004] Therefore, overcoming the problems of the existing technology has become an urgent issue that needs to be addressed. Summary of the Invention

[0005] The purpose of this invention is to provide a method for manufacturing a packaging substrate to solve at least one of the above-mentioned problems.

[0006] In view of the deficiencies of the prior art, the present invention provides a method for manufacturing a packaging substrate, comprising: disposing at least one core plate in a slot of a support member on a carrier member, wherein the core plate defines opposing first and second sides, and is disposed on the carrier member with its second side thereon, and the core plate has a plurality of conductive posts penetrating the core plate, and the support member is a frame including a plurality of borders, the plurality of borders being arranged to form the slot; forming a covering layer on the carrier member, such that the covering layer fills the slot, and the covering layer covers the core plate to fix the core plate, wherein the conductive posts on the first side of the core plate are exposed. The following steps are performed: 1. Remove the carrier to obtain a substrate module; 2. Attach a substrate module to each opposite side of a bonding layer, with each core plate having its second side disposed on the bonding layer; 3. Form a substrate on each substrate module, such that the substrate covers the first side of the core plate; 4. Form a wiring structure electrically connecting the conductive pillar on the first side of each core plate via the substrate; 5. Remove the bonding layer; 6. Form a solder resist layer on the wiring structure and the second side of the core plate, such that the wiring structure and the conductive pillar are exposed to the solder resist layer; 7. Remove the support member and its structure; 8. Remove the cladding layer on the side of the core plate.

[0007] In the aforementioned manufacturing method, the frame of the support member is a composite type, and the frame is straight or L-shaped. For example, the support member is a non-continuous frame type, with multiple intervals formed between the frames.

[0008] In the aforementioned manufacturing method, the frame of the support member is separate, and the frame is straight or L-shaped, with concave or convex portions at both ends. For example, the support member is a continuous frame type, with multiple intervals formed between each frame, and the convex portion is exposed in each interval.

[0009] In the aforementioned manufacturing method, at least one spanning support is formed in the slot.

[0010] In the aforementioned manufacturing method, the core plate is made of glass.

[0011] In the aforementioned manufacturing method, the coating layer is ink or adhesive.

[0012] In the aforementioned manufacturing method, the substrate includes an insulating layer and a metal layer bonded to the insulating layer, such that the insulating layer is pressed onto the first side of the core board, and the wiring structure is fabricated by means of the metal layer.

[0013] In the aforementioned manufacturing method, the wiring structure includes at least one insulating layer disposed on the core plate and a wiring layer formed on the insulating layer and electrically connected to the conductive post.

[0014] As can be seen from the above, in the manufacturing method of the packaging substrate of the present invention, the structural strength in the process is mainly enhanced by the support member to disperse stress and avoid warping problems, thus ensuring the requirement of high yield, and the requirement of high capacity is ensured according to the size or number of core plates in the slot. Attached Figure Description

[0015] Figures 1A to 1I This is a cross-sectional schematic diagram of the manufacturing method of the packaging substrate of the present invention.

[0016] Figure 2A for Figure 1A A top view of the support component.

[0017] Figure 2B for Figure 2A A partial top-view plan view.

[0018] Figure 2C for Figure 1A A top-view plan view of the core plate.

[0019] Figure 2D for Figure 1B A top-view plan view.

[0020] Figure 2E for Figure 1H A top-down plan view of the process.

[0021] Figure 2F for Figure 1I A top-view plan view.

[0022] Figure 3A for Figure 2A A top view of another embodiment.

[0023] Figure 3B for Figure 3A A partial top-view plan view.

[0024] Figure 4A for Figure 2A A top view of another embodiment.

[0025] Figure 4B for Figure 2D A top view of another embodiment.

[0026] Figure 5A for Figure 3A A top view of another embodiment. Figure 5B for Figure 2D A top plan view of another embodiment.

[0027] The attached figures are labeled as follows:

[0028] 1 Packaging substrate

[0029] 1a Baseboard Module

[0030] 10 Core Plate

[0031] 10a First side

[0032] 10b Second side

[0033] 100 conductive pillars

[0034] 101 Line Layer

[0035] 11. Coating layer

[0036] 13. Solder resist layer

[0037] 130 opening

[0038] 14 Wiring Structure

[0039] 140 wiring layer

[0040] 30 concavity

[0041] 31 convex part

[0042] 6. Substrate

[0043] 61 Metal layer

[0044] 62 Insulation layer

[0045] 7. Bonding layer

[0046] 8 Support components

[0047] 8a, 8b borders

[0048] 80 slotting

[0049] 81 interval

[0050] 82 stents

[0051] 9. Bearing components

[0052] t width

[0053] L Cutting Path

[0054] cl Protrusion length

[0055] d. Depth. Detailed Implementation

[0056] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0057] It should be understood that the structures, proportions, sizes, etc., shown in the accompanying drawings are only for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the conditions under which the invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by the invention, should still fall within the scope of the disclosed technical content. Furthermore, the terms such as "above," "first," "second," and "one" used in this specification are merely for clarity of description and are not intended to limit the scope of the invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention's implementation.

[0058] Figures 1A to 1I This is a cross-sectional schematic diagram of the manufacturing method of the packaging substrate 1 of the present invention.

[0059] like Figure 1A As shown, at least one core plate 10 is disposed in the slot 80 of the support member 8 on a carrier member 9.

[0060] In this embodiment, the core plate 10 defines a first side 10a and a second side 10b, with the second side 10b disposed on the carrier 9. The core plate 10 is made of a high-hardness dielectric material, such as glass, ceramic, BT, FR4, or other organic materials. For example, multiple through holes are formed by laser penetration through the first side 10a and the second side 10b of the core plate 10, and metal material is formed in the multiple through holes to serve as conductive pillars 100. A circuit layer 101 electrically connecting the multiple conductive pillars 100 can be formed on the first side 10a and / or the second side 10b of the core plate 10.

[0061] Furthermore, the support member 8 is a non-continuous frame type, such as... Figure 2A or Figure 4A As shown, its border 8a is a composite type, as... Figure 2B The shown straight or L-shaped slots 80 are arranged to form the required size of the slots as needed. For example, multiple intervals 81 are formed between the edges 8a of the support member 8, with a width t ≥ 0.1 mm. Alternatively, the support member 8 can be a continuous edge frame, such as... Figure 3A or Figure 5A As shown, its border 8b is split, as... Figure 3B The straight or L-shaped sections shown have recesses 30 or protrusions 31 at both ends to connect the various frame sections 8b as needed to form slots 80, and to expose the protrusions 31 in each of the intervals 81. Specifically, the protruding length cl of the protrusion 31 can be greater than the depth d of the recess 30, so that when the protrusion 31 of one frame section 8b engages with the recess 30 of another frame section 8b, a portion of the length of the protrusion 31 is still exposed.

[0062] In addition, the core board 10 can be a full panel, such as... Figure 2C The shown panel is 100mm x 100mm or 510mm x 515mm, and the size of the slot 80 of the support member 8 can be adjusted according to the specifications of the core plate 10. For example, at least one spanning bracket 82 is formed in the slot 80, such as... Figure 2D or Figure 3A As shown, the slot 80 can accommodate two core boards 10. Alternatively, the slot 80 may lack a support 82, allowing the slot 80 to accommodate four core boards 10, as shown. Figure 4B or Figure 5B As shown.

[0063] Furthermore, the support member 8 can be made of any high-toughness material, such as a Young's modulus of at least 70 GPa and up to 650 GPa. Examples include 70, 80, 90, 100, 110, 120, 130, 140, 150, 160, 170, 180, 190, 200, 230, 250, 270, 300, 330, 350, 370, 400, 430, 450, 470, 500, 530, 550, 570, 600, 630, or 650 GPa. Materials include steel (Young's modulus approximately 80 GPa to 190 GPa), ceramics (Young's modulus ≥ 100 GPa), and glass (Young's modulus approximately 70–80 GPa). The ceramic material can be selected from alumina (300-400 GPa), zirconium oxide (200-250 GPa), silicon carbide (400-450 GPa), or tungsten carbide (450-650 GPa). The glass can be selected from borosilicate glass or quartz glass.

[0064] Therefore, by individually molding the frame 8a, 8b, various required support members 8 can be easily assembled and arranged for the core plate 10 to be disposed in the slot 80. It should be understood that multiple core plates 10 can be embedded in the slot 80 as needed, and there is no limit to the number.

[0065] like Figure 1B As shown, a covering layer 11 is formed on the carrier 9 to fill the slot 80, so that the covering layer 11 covers the core plate 10 to fix the core plate 10, wherein the conductive post 100 and the circuit layer 101 on the first side 10a of the core plate 10 are exposed on the covering layer 11.

[0066] In this embodiment, the covering layer 11 is made of ink or other adhesive material, which is a temporary fixing material in the process. For example, the ink is first applied to the support member 8 and the core plate 10 by dispersion, screen printing or any other method, and then a leveling process is performed by polishing so that the end face of the conductive post 100 and the surface of the circuit layer 101 are flush with the surface of the covering layer 11, so that the conductive post 100 and the circuit layer 101 on the first side 10a of the core plate 10 are exposed to the covering layer 11.

[0067] Therefore, by filling the groove 80 with ink or glue to surround the core plate 10, the fragile core plate 10 can be protected during operation or processing, thereby reducing the risk of damage such as cracking or breakage. Thus, the configuration of the covering layer 11 can ensure good operability and low risk of damage.

[0068] like Figure 1C As shown, the carrier 9 is removed to obtain the substrate module 1a, which exposes the second side 10b of the core plate 10.

[0069] like Figure 1D As shown, a substrate module 1a is bonded to each of the opposite sides of a bonding layer 7, and the core plate 10 is disposed on the bonding layer 7 with its second side 10b.

[0070] In this embodiment, the bonding layer 7 is a double-capacity bonding material, such as a thermal release film.

[0071] like Figure 1E As shown, a substrate 6 is formed on each substrate module 1a by lamination, such that the substrate 6 covers the first side 10a of the core plate 10.

[0072] In this embodiment, the substrate 6 includes an insulating layer 62 and a metal layer 61 bonded to the insulating layer 62, such that the insulating layer 62 of the substrate 6 is pressed onto the first side 10a of the core plate 10, and the conductive pillars 100 and the circuit layer 101 on the first side 10a of the core plate 10 are bonded to the insulating layer 62 of the substrate 6. For example, the metal layer 61 is a copper layer, and the insulating layer 62 of the substrate 6 is a dielectric material, such as Ajinomoto build-up film (ABF), prepreg (PP), or other dielectric materials.

[0073] Therefore, by using the insulating layer 62 as a buffer structure to disperse pressure, the problem of the core plate 10 breaking when the substrate 6 is pressed down can be avoided, thus reducing the risk of the core plate 10 breaking during the process.

[0074] like Figure 1F As shown, a patterned circuit layering operation is performed in a symmetrical manner to form a wiring structure 14 electrically connected to the conductive pillar 100 (or circuit layer 101) on the first side 10a of each core board 10 via the substrate 6.

[0075] In this embodiment, the wiring structure 14 includes at least one insulating layer 62 disposed on the core board 10 and a wiring layer 140 formed on the insulating layer 62 and electrically connected to the conductive pillar 100 (or circuit layer 101). For example, the wiring layer 140 is formed by patterning the metal layer 61 of the substrate 6, so multiple substrates can be stacked as needed to produce the required number of wiring layers.

[0076] Furthermore, the wiring layer 140 can be fabricated using a build-up process, such as electroplating metal (e.g., copper) or other methods. For example, the wiring layer 140 can be made of copper, such as using a redistribution layer (RDL) specification.

[0077] Therefore, the core board 10 is facilitated to perform fan-out wiring by means of the bonding layer 7.

[0078] like Figure 1G As shown, the bonding layer 7 is removed, exposing the second side 10b of the core plate 10, which serves as the ball-planting side.

[0079] like Figure 1H As shown, a solder resist layer 13 with multiple openings 130 is formed on the second side 10b of the wiring structure 14 and the core board 10, respectively, so that the wiring layer 140 and the conductive pillars 100 (or circuit layer 101) of the second side 10b are exposed through the multiple openings 130.

[0080] like Figure 1I As shown, remove the support member 8 and its structure, as follows. Figure 2E As shown, the covering layer 11 is then removed to form an asymmetric packaging substrate 1.

[0081] In this embodiment, when removing the covering layer 11 on the side of the core plate 10, it can be done along the cutting path L (e.g., Figure 2E As shown, a cutting process is performed to obtain the required size of the packaging substrate 1, such as... Figure 2F As shown.

[0082] Therefore, by using this support member 8 to enhance the structural strength during the process, stress is dispersed and warping is avoided, thus ensuring the requirement of high yield.

[0083] In summary, the manufacturing method of the packaging substrate 1 of the present invention, through the above-described process, can ensure the requirement of high yield, and according to the size or number of core plates 10 in the slot 80, can ensure the requirement of high capacity.

[0084] The above embodiments are illustrative of the principles and effects of the present invention and are not intended to limit the invention. Those skilled in the art can make modifications to the above embodiments without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the claims.

Claims

1. A method for manufacturing a packaging substrate, characterized in that, include: At least one core plate is disposed in a slot of a support member on a carrier member, wherein the core plate has a first side and a second side opposite to each other, and is disposed on the carrier member with its second side thereon, and the core plate has a plurality of conductive posts penetrating the core plate, and the support member is a frame containing a plurality of frames, the plurality of frames being arranged to form the slot. A covering layer is formed on the carrier so that the covering layer fills the slot and covers the core plate to fix the core plate, wherein the conductive post on the first side of the core plate is exposed in the covering layer. Remove the carrier to obtain the baseboard module; A substrate module is attached to each of the opposite sides of a bonding layer, and each core plate is disposed on the bonding layer with its second side attached thereto. A substrate is formed on each of the substrate modules, such that the substrate covers the first side of the core plate. A wiring structure electrically connected to the conductive pillar is formed on the first side of each core plate using the substrate. Remove the bonding layer; A solder resist layer is formed on the second side of the wiring structure and the core board respectively, so that the wiring structure and the conductive post are exposed to the solder resist layer; Remove the support and its structure; and Remove the cladding layer from the side of the core plate.

2. The method for manufacturing the packaging substrate as described in claim 1, characterized in that, The support component has a modular frame, which is either straight or L-shaped.

3. The method for manufacturing the packaging substrate as described in claim 2, characterized in that, The support is a non-continuous frame with multiple gaps between the frames.

4. The method for manufacturing the packaging substrate as described in claim 1, characterized in that, The support has a separate frame, which is straight or L-shaped, with recesses or protrusions at both ends.

5. The method for manufacturing the packaging substrate as described in claim 4, characterized in that, The support member is a continuous frame with multiple gaps between the frames, and the protrusions are exposed in the gaps.

6. The method for manufacturing the packaging substrate as described in claim 1, characterized in that, The slot forms at least one span of support.

7. The method for manufacturing the packaging substrate as described in claim 1, characterized in that, The core plate is made of glass.

8. The method for manufacturing the packaging substrate as described in claim 1, characterized in that, The coating layer is made of ink or adhesive.

9. The method for manufacturing the packaging substrate as described in claim 1, characterized in that, The substrate includes an insulating layer and a metal layer bonded to the insulating layer, such that the insulating layer is pressed onto a first side of the core board, and the wiring structure is made by means of the metal layer.

10. The method for manufacturing the packaging substrate as described in claim 1, characterized in that, The wiring structure includes at least one insulating layer disposed on the core board and a wiring layer formed on the insulating layer and electrically connected to the conductive post.

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