高隔离度多路射频连接器

By combining zinc-based structural functional alloy foam and metal isolation plate design, the problems of signal crosstalk and external interference in multi-channel RF connectors are solved, realizing a multi-channel RF connector with high isolation, improving signal transmission quality and system reliability.

CN121192459BActive Publication Date: 2026-07-17SHENZHEN SINRUI TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENZHEN SINRUI TECH CO LTD
Filing Date
2025-09-29
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing multi-channel RF connectors suffer from signal crosstalk and external interference during signal transmission, especially at high frequencies. They cannot effectively achieve independent transmission and full shielding for each channel, resulting in a decline in signal quality. Furthermore, existing solutions increase the size and cost of the equipment.

Method used

The high-isolation multi-channel RF connector, made of zinc-based structural functional alloy foam, includes an independent cavity design, a metal isolation plate, and a sealing component. By utilizing the high porosity and conductivity of the zinc-based structural functional alloy foam, combined with the metal isolation plate and sealing component, each conductor can transmit in an independent cavity. The shielding structure of the metal isolation plate and sealing component reduces EMI/RFI interference.

Benefits of technology

It significantly improves signal isolation during transmission, reduces EMI/RFI interference, is suitable for high-frequency multi-channel applications, enhances signal stability and system reliability, and reduces equipment size and cost.

✦ Generated by Eureka AI based on patent content.

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Abstract

本发明的实施例提供了一种高隔离度多路射频连接器。该高隔离度多路射频连接器,包括至少两个接头、金属隔离板和保护组件;所述保护组件包括至少两个导体、至少两个腔道和壳体;至少两个所述腔道开设在所述壳体的内部,至少两个所述导体分别容纳在对应的至少两个所述腔道内;至少两个所述导体的一端分别与至少两个所述接头连接,至少两个所述导体的另一端穿过所述壳体并突出于所述壳体一部分,壳体的材料为锌基结构功能合金泡沫。涉及连接器领域。各导体在独立腔道中传输,利用壳体的整体屏蔽和金属隔离板的局部隔离,显著降低EMI / RFI干扰,提高了信号在传输过程中的隔离度,适用于高频多通道应用。
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