A blanking assembly for low hardness metals, cutting apparatus and cutting method

Abstract

The application discloses a pressure assembly for low-hardness metal, a cutting device and a cutting method. The pressure assembly is used for applying pressure to the low-hardness metal during the cutting operation of the low-hardness metal. The pressure assembly comprises a lifting driving mechanism and a pressure plate. The pressure plate comprises a support layer used for being mounted to an output end of the lifting driving mechanism, a transition layer arranged on the support layer, an elastic layer arranged on the transition layer, and a piezoelectric film arranged on the elastic layer. The piezoelectric film is used for directly contacting the low-hardness metal and collecting pressure information between the pressure plate and the low-hardness metal during the pressing of the low-hardness metal. The lifting driving mechanism is configured to be capable of adjusting the lifting moving distance of the pressure plate according to the pressure information. The application can adjust the pressure of the pressure plate on the low-hardness metal according to the pressure information during the cutting of the low-hardness metal, reduce the occurrence probability of plastic flow problems, and reduce defects such as machining size out of control, edge bulging and local depression.

Description

Technical Field

[0001] This application relates to the field of metal processing technology, specifically to a pressure assembly, cutting equipment, and cutting method for low-hardness metals. Background Technology

[0002] Low-hardness metals (such as indium, pure tin, and soft pure aluminum, with Vickers hardness of only 1.2~1.5HV) are increasingly widely used in high-end fields such as semiconductor packaging, flexible electronics, precision sensing, and medical devices due to their excellent ductility, malleability, and special physicochemical properties. Taking indium as an example, its low melting point, high thermal conductivity, and good intermetallic bonding ability make it a common bonding material between semiconductor chips and heat dissipation substrates, as well as a conductive connection layer in flexible circuits. These applications place extremely stringent requirements on the dimensional accuracy and surface quality of indium after processing.

[0003] However, the high plasticity and low yield strength of low-hardness metals present them with technical challenges in cutting and processing that far exceed those of ordinary metals (such as steel and copper alloys). Existing cutting equipment and processes are unable to meet the requirements of precision machining, and plastic flow problems are very likely to occur during the cutting process, resulting in quality defects such as uncontrolled processing dimensions, "edge bulging" or "local depressions" in the cut low-hardness metals. Summary of the Invention

[0004] This application aims to address one of the technical problems in related technologies to a certain extent. To this end, this application provides a blanking assembly, cutting equipment, and cutting method for low-hardness metals.

[0005] To achieve the above objectives, this application adopts the following technical solution: a pressure assembly for low-hardness metals, used to apply pressure to the low-hardness metal during cutting operations. The pressure assembly includes a lifting drive mechanism and a pressure plate. The pressure plate includes a support layer for mounting to the output end of the lifting drive mechanism, a transition layer disposed on the support layer, an elastic layer disposed on the transition layer, and a piezoelectric film disposed on the elastic layer. The piezoelectric film is used to directly contact the low-hardness metal to be cut and to collect pressure information between the pressure plate and the low-hardness metal during the pressing process. The lifting drive mechanism is configured to adjust the lifting and lowering distance of the pressure plate according to the pressure information.

[0006] The application of this application has the following beneficial effects: the pressure plate can elastically deform, reducing the probability of plastic flow in low-hardness metals during the pressing process. Simultaneously, the piezoelectric film allows for the collection of pressure information between the pressure plate and the low-hardness metal during the pressing process. By pre-collecting deformation data under different pressures for target metals of different hardness, the correlation between pressure information and the degree of deformation of the low-hardness metal can be obtained. This allows for adjusting the lifting and lowering distance of the pressure plate (i.e., adjusting the pressure value of the pressure plate on the low-hardness metal) based on the pressure information during the cutting process, ensuring that the pressure applied by the pressure plate is in a balanced state that "both stabilizes the low-hardness metal for easy cutting and prevents significant plastic flow during cutting."

[0007] Optionally, the elastic layer is a plate made of silicone-based nanoporous material, the transition layer is a shape memory alloy mesh layer, and the support layer is a honeycomb aluminum plate.

[0008] Optionally, the piezoelectric film is bonded to the surface of the elastic layer opposite to the transition layer, the elastic layer is bonded to the transition layer, and the transition layer is bonded to the support layer.

[0009] Optionally, a flexible heating element is provided on the side of the support layer opposite to the transition layer. The flexible heating element is used to heat the transition layer through the support layer to restore the preset shape of the transition layer.

[0010] Optionally, the pressing assembly further includes a displacement detection unit, which is used to detect the lifting and moving information of the pressing plate. The lifting drive mechanism is also configured to determine the position information of the pressing plate based on the lifting and moving information.

[0011] Optionally, the displacement detection unit is a contact grating ruler, which includes a grating ruler body fixedly disposed relative to the lifting drive mechanism and a reading head disposed on the grating ruler body, the reading head being fixedly installed to the support layer.

[0012] Furthermore, this application also provides a cutting device for low-hardness metals, the cutting device including a frame, a loading and unloading assembly, a cutting blade assembly, and a pressing assembly as described in any of the above technical solutions. The loading and unloading assembly, the cutting blade assembly, and the pressing assembly are all disposed on the frame. The cutting blade assembly includes a linear driver and a cutting blade that is driven by the linear driver to move vertically. The loading and unloading assembly is used to transfer low-hardness metals relative to the cutting blade assembly and the pressing assembly. The frame is provided with a first mounting frame and a second mounting frame arranged side by side and spaced apart. The pressing assembly is disposed on the first mounting frame, and the cutting blade assembly is disposed on the second mounting frame.

[0013] The reasoning process for the beneficial effects of the cutting equipment provided in this application and the aforementioned pressing assembly is similar, and will not be repeated here.

[0014] Optionally, the cutting device further includes a first horizontal drive mechanism and a second horizontal drive mechanism. The first horizontal drive mechanism is connected to the first mounting frame and is used to drive the first mounting frame to move horizontally. The second horizontal drive mechanism is connected to the second mounting frame and is used to drive the second mounting frame to move horizontally.

[0015] Furthermore, this application also provides a method for cutting low-hardness metals, implemented using the cutting equipment described in the above technical solution, the cutting method comprising:

[0016] Before cutting low-hardness metal, the pressure plate is driven downward by the lifting drive mechanism, so that the piezoelectric film comes into contact with the surface of the low-hardness metal and gradually increases the pressure to the set pressure F.

[0017] After maintaining the set pressure F for a set time, the linear actuator drives the cutting blade to move downward, so that the cutting blade contacts the surface of the low-hardness metal.

[0018] The linear actuator continues to drive the cutting blade downward. As the cutting blade cuts into the low-hardness metal to a set distance, the lifting drive mechanism is controlled to drive the pressure plate upward according to the pressure information collected by the piezoelectric film, so that the stage pressure f between the piezoelectric film and the low-hardness metal is reduced during this process.

[0019] The cutting blade continues to move downward via the linear driver. Before the cutting blade completely cuts through the low-hardness metal, the lifting drive mechanism is controlled to drive the pressure plate to move back and forth at a set frequency and with a set pressure.

[0020] The cutting method provided in this application is similar to the reasoning process of the beneficial effects of the aforementioned pressing assembly, and will not be repeated here.

[0021] Optionally, the matching relationship between the stage pressure f and the set pressure F satisfies the following formula:

[0022] ;

[0023] Wherein, h is the initial thickness dimension of the low-hardness metal, and the The thickness of a low-hardness metal after maintaining the set pressure F for a set time is the difference between its initial thickness h and the thickness h of the metal.

[0024] These features and advantages of this application will be disclosed in detail in the following specific embodiments and accompanying drawings. The best embodiments or means of this application will be shown in detail in conjunction with the accompanying drawings, but are not intended to limit the technical solutions of this application. In addition, each of these features, elements and components appearing in the following text and drawings is multiple and is labeled with different symbols or numbers for convenience, but all represent parts with the same or similar structure or function. Attached Figure Description

[0025] The following description, in conjunction with the accompanying drawings, further illustrates this application:

[0026] Figure 1 This is a schematic diagram of the structure of a pressing assembly provided in an embodiment of this application;

[0027] Figure 2 This is a schematic diagram of the pressure plate;

[0028] Figure 3 A schematic diagram of a cutting device using the pressing assembly provided in this embodiment;

[0029] Figure 4 A structural schematic diagram of the cutting equipment from another perspective;

[0030] Figure 5 This is an exploded view of the cutting equipment.

[0031] The components include: 1. Pressing assembly; 10. Lifting drive mechanism; 11. Pressing plate; 110. Support layer; 111. Transition layer; 112. Elastic layer; 113. Piezoelectric film; 114. Flexible heating element; 12. First contact grating ruler; 13. First mounting bracket; 2. Frame; 3. Loading and unloading assembly; 30. Support platform; 31. Support plate; 4. Cutting assembly; 40. Linear driver; 41. Cutting blade; 42. Second contact grating ruler; 43. Second mounting bracket; 5. First horizontal drive mechanism; 6. Second horizontal drive mechanism. Detailed Implementation

[0032] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described are intended to explain this application and should not be construed as limiting it.

[0033] The terms "an embodiment," "example," or "trademark" used in this specification refer to a particular feature, structure, or characteristic described in connection with the embodiment itself that may be included in at least one embodiment disclosed in this application. The phrase "in an embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment.

[0034] In the description of this application, it should be understood that the terms "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In the description of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0035] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "connected," "linked," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a connection through an intermediary, or a connection within two elements or an interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0036] This embodiment provides a pressure clamping assembly for low-hardness metals. This assembly can be applied to cutting equipment for low-hardness metals; specifically, it applies pressure to the low-hardness metal during cutting operations. Figure 1 and Figure 2 As shown, the pressing assembly 1 includes a lifting drive mechanism 10 and a pressing plate 11. The pressing plate 11 includes a support layer 110 for mounting to the output end of the lifting drive mechanism 10, a transition layer 111 disposed on the support layer 110, an elastic layer 112 disposed on the transition layer 111, and a piezoelectric film 113 disposed on the elastic layer 112. The piezoelectric film 113 is used to directly contact the low-hardness metal to be cut and to collect pressure information between the pressing plate 11 and the low-hardness metal during the pressing process. The lifting drive mechanism 10 is configured to adjust the lifting distance of the pressing plate 11 according to the pressure information.

[0037] The rigid plate used in the existing scheme for applying pressure to low-hardness metal is replaced with a pressure plate 11 with elastic deformation capability in this embodiment. The pressure plate 11 in this embodiment also includes a piezoelectric film 113. The pressure plate 11 has elastic deformation capability, which reduces the probability of plastic flow in the low-hardness metal during the pressing process. Simultaneously, the piezoelectric film 113 directly converts the pressure signal into an electrical signal through the "piezoelectric effect," enabling pressure detection. This allows for the collection of pressure information between the pressure plate 11 and the low-hardness metal during the pressing process. By pre-collecting deformation data under different pressures for target metals of different hardness, the correlation between pressure information and the degree of deformation of the low-hardness metal can be obtained. In this way, the lifting and lowering distance of the pressure plate 11 can be adjusted according to the pressure information during the cutting of low-hardness metal (that is, the pressure value of the pressure plate 11 on the low-hardness metal can be adjusted), so that the pressure of the pressure plate 11 on the low-hardness metal is in a balanced state that "can stabilize the low-hardness metal to facilitate the cutting operation, and will not cause obvious plastic flow of the low-hardness metal during the cutting process".

[0038] Specifically, in this embodiment, the elastic layer 112 is a plate made of silicone-based nanoporous material, the transition layer 111 is a shape memory alloy mesh layer, and the support layer 110 is a honeycomb aluminum plate. Since the pressure plate 11 inevitably comes into partial contact with the low-hardness metal to be cut, the rigid material of the pressure plate will inevitably cause deformation of the part of the low-hardness metal in contact with the pressure plate, which will lead to plastic flow of the low-hardness metal due to stress concentration. Even the edge of the rigid pressure plate may cut into the interior of the low-hardness metal, causing damage to unplanned cutting parts. In this embodiment, a pressure plate 11 with elastic deformation capability is used to press down on the low-hardness metal. Specifically, the elastic layer 112 near the low-hardness metal is a plate made of silicone-based nanoporous material, which has the characteristics of low hardness and good elasticity, and can effectively suppress the plastic flow of the low-hardness metal after being pressed onto it.

[0039] Furthermore, the transition layer 111, which serves as an intermediate structure, is a shape memory alloy mesh layer. It can achieve local dynamic deformation through its own mesh structure to adapt to the local micro-deformation of low-hardness metal during the cutting process, thus avoiding the problem that the pressure plate 11 is partially suspended and cannot fully contact the low-hardness metal. This can further reduce the probability of plastic flow.

[0040] The function of the honeycomb aluminum plate is to uniformly transmit the driving force of the lifting drive mechanism 10 to the transition layer 111, the elastic layer 112 and the piezoelectric film 113, so as to avoid the problem that the pressure on the low hardness metal at different positions on the pressure plate 11 is significantly different.

[0041] In this embodiment, the piezoelectric film 113 is bonded to the surface of the elastic layer 112 opposite to the transition layer 111. The elastic layer 112 is bonded to the transition layer 111, and the transition layer 111 is bonded to the support layer 110. Considering the characteristics of different materials, the transition layer 111 and the support layer 110 are bonded using an epoxy structural adhesive to achieve high strength and aging resistance. The elastic layer 112 and the transition layer 111, as well as the piezoelectric film 113 and the elastic layer 112, are bonded using silicone adhesives to ensure adaptability to the elastic changes of the elastic layer 112.

[0042] Furthermore, the transition layer 111 is a shape memory alloy mesh layer, which has a shape memory effect. Even if the alloy mesh undergoes significant deformation, it can recover to a preset shape under temperature excitation. Utilizing this characteristic, the transition layer 111 can be heated after each cutting operation to restore it to the preset shape, thereby ensuring that the piezoelectric film 113 fully adheres to the low-hardness metal to be cut in a horizontal state at the initial stage of the next cutting operation. To this end, in this embodiment, a flexible heating element 114 is also provided on the side of the support layer 110 opposite to the transition layer 111. The flexible heating element 114 is used to heat the transition layer 111 through the support layer 110 to restore the preset shape of the transition layer 111. Since the support layer 110 is a honeycomb aluminum plate, it has good thermal conductivity, allowing the heat generated by the flexible heating element 114 to be quickly conducted to the transition layer 111.

[0043] like Figure 1 As shown, the pressing assembly 1 provided in this embodiment also includes a displacement detection unit. The displacement detection unit is used to detect the lifting and lowering movement information of the pressing plate 11. The lifting drive mechanism 10 is also configured to determine the position information of the pressing plate 11 based on the lifting and lowering movement information. That is, the lifting drive mechanism 10 adjusts the lifting and lowering movement of the pressing plate 11 according to the pressure information. At the same time, the displacement detection unit can detect the position information of the pressing plate 11 and determine the lifting and lowering stroke of the pressing plate 11, thereby achieving more precise position control of the pressing plate 11. In addition, the degree of deformation of the low-hardness metal due to the pressure applied by the pressing plate 11 can also be calculated based on the position information of the pressing plate 11.

[0044] Specifically, in this embodiment, the displacement detection unit is a contact grating ruler. For ease of description, the contact grating ruler used in the pressing assembly 1 is referred to as the first contact grating ruler 12. The first contact grating ruler 12 includes a grating ruler body fixedly disposed relative to the lifting drive mechanism 10 and a reading head disposed on the grating ruler body. The reading head is fixedly installed to the support layer 110. The contact grating ruler has the characteristics of high measurement accuracy and strong anti-contamination ability. Compared with non-contact displacement measurement products, the contact grating ruler is more durable in applications involving cutting low-hardness metals.

[0045] It should be noted that the pressing assembly 1 can be assembled by setting the first mounting bracket 13 during application. The grating ruler body and the lifting drive mechanism 10 in the first contact grating ruler 12 are fixedly installed on the first mounting bracket 13 to achieve the relative fixed setting of the two.

[0046] The pressing assembly 1 provided in this embodiment can be applied to cutting equipment, combined with Figure 3 , Figure 4 and Figure 5 As shown, the cutting equipment includes a frame 2, a loading / unloading assembly 3, a cutting blade assembly 4, and a pressing assembly 1 provided in this embodiment. The loading / unloading assembly 3, the cutting blade assembly 4, and the pressing assembly 1 are all mounted on the frame 2. The cutting blade assembly 4 includes a linear driver 40 and a cutting blade 41 that is driven by the linear driver 40 to move vertically. In this embodiment, both the lifting drive mechanism 10 and the linear driver 40 are electric cylinders, which have the advantages of high control precision and good stability. The loading / unloading assembly 3 in this embodiment includes a support platform 30 and a support plate 31. The support platform 30 is movably mounted on the frame 2 via a slide (not shown in the figure), and the support plate 31 is used to place the low-hardness metal to be cut, thereby allowing the low-hardness metal to be transferred relative to the cutting blade assembly 4 and the pressing assembly 1.

[0047] A first mounting frame 13 and a second mounting frame 43 are arranged side by side and spaced apart on the frame 2. The material pressing assembly 1 is arranged on the first mounting frame 13, and the cutting assembly 4 is arranged on the second mounting frame 43.

[0048] It is easy to understand that, in order to achieve accurate detection of the position of the cutting blade 41, the cutting blade assembly 4 in this embodiment also includes a second contact grating ruler 42 disposed on the second mounting bracket 43. Similarly, the grating ruler body in the second contact grating ruler 42 is fixed to the second mounting bracket 43, and the reading head in the second contact grating ruler 42 is fixedly installed with the upper end face of the cutting blade 41.

[0049] Furthermore, the cutting equipment also includes a first horizontal drive mechanism 5 and a second horizontal drive mechanism 6. The first horizontal drive mechanism 5 is connected to the first mounting frame 13 and is used to drive the first mounting frame 13 to move horizontally. The second horizontal drive mechanism 6 is connected to the second mounting frame 43 and is used to drive the second mounting frame 43 to move horizontally. By setting the first horizontal drive mechanism 5 and the second horizontal drive mechanism 6, the cutting blade assembly 4 and the pressing assembly 1 can be easily driven to move relative to the support plate 31, thereby facilitating the switching and adjustment of the pressing position and the cutting position.

[0050] This embodiment also provides a cutting method for cutting low-hardness metals using the cutting equipment, the cutting method including the following steps:

[0051] Step S100: Before cutting the low-hardness metal, the lifting drive mechanism 10 drives the pressure plate 11 downward, causing the piezoelectric film 113 to contact the surface of the low-hardness metal and gradually increase the pressure to the set pressure F. This process can eliminate the tiny internal gaps in the low-hardness metal, improving its positional stability during cutting and reducing blade sticking. Taking the cutting of indium as an example, the set pressure is a selected value between 5N and 10N.

[0052] Step S200: After maintaining the set pressure F for a set time, the linear actuator 40 drives the cutting blade 41 downwards, causing the cutting blade 41 to contact the surface of the low-hardness metal. This step is a preparatory action before cutting. The force used is indium, and the set time is a selected value between 3s and 6s.

[0053] Step S300: Continue to drive the cutting blade 41 downwards via the linear actuator 40. As the cutting blade 41 cuts into the low-hardness metal to a set distance, the lifting drive mechanism 10 drives the pressure plate 11 upwards based on the pressure information collected by the piezoelectric film 113, thereby reducing the stage pressure f between the piezoelectric film 113 and the low-hardness metal during this process. After the cutting blade 41 cuts into the low-hardness metal, a cut appears on the low-hardness metal near the pressure plate 11, and the internal stress of the low-hardness metal is released towards the cut. If the pressure value between the pressure plate 11 and the low-hardness metal remains unchanged, the portion of the low-hardness metal located below the pressure plate 11 will plastically flow towards the side where the cut is located. By precisely controlling the change in the pressure value applied to the low-hardness metal (reducing the pressure), plastic flow caused by excessive stress can be avoided, while maintaining a certain pressure on the low-hardness metal to prevent displacement during the cutting process.

[0054] Step S400: Continue to drive the cutting blade 41 downwards via the linear actuator 40. Before the cutting blade 41 completely cuts through the low-hardness metal, control the lifting drive mechanism 10 to drive the pressure plate 11 to reciprocate at a set frequency and pressure. This step is the finishing process of cutting. During this process, pulse vibration cutting is used to prevent tearing at the end of the cut and ensure a smooth cut. Taking the cutting of indium as an example, the set frequency is a selected value between 5Hz and 8Hz, and the set pressure change is a selected value between ±0.3N and ±0.6N.

[0055] Furthermore, the matching relationship between the stage pressure f and the set pressure F mentioned in step S300 satisfies the following formula:

[0056] ;

[0057] Where h is the initial thickness of the low-hardness metal (obtained by measurement before cutting). The thickness h is the difference between the thickness of the low-hardness metal after maintaining a set pressure F for a set time and its initial thickness h. The thickness h of the low-hardness metal after maintaining a set pressure F for a set time can be obtained through prior experiments. That is, the greater the degree of deformation of the low-hardness metal, the smaller the value of the stage pressure f should be.

[0058] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Those skilled in the art should understand that this application includes, but is not limited to, the contents described in the accompanying drawings and the specific embodiments above. Any modifications that do not depart from the functional and structural principles of this application will be included within the scope of the claims.

Claims

1. A pressure assembly for low-hardness metals, used to apply pressure to the low-hardness metal during a cutting operation using a cutting blade, characterized in that, The pressing assembly includes a lifting drive mechanism and a pressing plate. The pressing plate includes a support layer for mounting to the output end of the lifting drive mechanism, a transition layer disposed on the support layer, an elastic layer disposed on the transition layer, and a piezoelectric film disposed on the elastic layer. The piezoelectric film is used to directly contact the low-hardness metal to be cut and to collect pressure information between the pressure plate and the low-hardness metal during the pressing process. The lifting drive mechanism is configured to drive the pressure plate downward before cutting the low-hardness metal, so that the piezoelectric film contacts the surface of the low-hardness metal and gradually increases the pressure to the set pressure F. The lifting drive mechanism is also configured to adjust the lifting and lowering distance of the pressure plate according to the pressure information; The lifting drive mechanism is also configured to drive the pressure plate to move up according to the pressure information during the process of the cutting blade cutting into the low-hardness metal to a set distance, so as to reduce the stage pressure f between the piezoelectric film and the low-hardness metal during the process. The lifting drive mechanism is also configured to drive the pressure plate to reciprocate at a set frequency and with a set pressure change before the cutting blade completely cuts through the low-hardness metal.

2. The pressing assembly as described in claim 1, characterized in that, The elastic layer is a plate made of silicone-based nanoporous material, the transition layer is a shape memory alloy mesh layer, and the support layer is a honeycomb aluminum plate.

3. The pressing assembly as described in claim 2, characterized in that, The piezoelectric film is bonded to the surface of the elastic layer away from the transition layer, the elastic layer is bonded to the transition layer, and the transition layer is bonded to the support layer.

4. The pressing assembly as described in claim 2, characterized in that, A flexible heating element is provided on the side of the support layer away from the transition layer. The flexible heating element is used to heat the transition layer through the support layer to restore the preset shape of the transition layer.

5. The pressing assembly as described in any one of claims 1 to 4, characterized in that, The pressing assembly also includes a displacement detection unit, which is used to detect the lifting and moving information of the pressing plate. The lifting drive mechanism is also configured to determine the position information of the pressing plate based on the lifting and moving information.

6. The pressing assembly as described in claim 5, characterized in that, The displacement detection unit is a contact grating ruler, which includes a grating ruler body fixedly disposed relative to the lifting drive mechanism and a reading head disposed on the grating ruler body. The reading head is fixedly installed to the support layer.

7. A cutting device for low-hardness metals, characterized in that, The cutting equipment includes a frame, a loading and unloading assembly, a cutting assembly, and a pressing assembly as described in any one of claims 1 to 6. The loading and unloading assembly, the cutting assembly, and the pressing assembly are all disposed on the frame. The cutting assembly includes a linear driver and a cutting blade that is driven by the linear driver and can move up and down. The loading and unloading assembly is used to transfer low-hardness metal relative to the cutting assembly and the pressing assembly. The frame is provided with a first mounting frame and a second mounting frame arranged side by side and spaced apart. The pressing assembly is located on the first mounting frame and the cutting assembly is located on the second mounting frame.

8. The cutting device as described in claim 7, characterized in that, The cutting equipment further includes a first horizontal drive mechanism and a second horizontal drive mechanism. The first horizontal drive mechanism is connected to the first mounting frame and is used to drive the first mounting frame to move horizontally. The second horizontal drive mechanism is connected to the second mounting frame and is used to drive the second mounting frame to move horizontally.

9. A method for cutting low-hardness metals, implemented using the cutting equipment as described in claim 7 or 8, characterized in that, The cutting method includes: Before cutting low-hardness metal, the pressure plate is driven downward by the lifting drive mechanism, so that the piezoelectric film comes into contact with the surface of the low-hardness metal and gradually increases the pressure to the set pressure F. After maintaining the set pressure F for a set time, the linear actuator drives the cutting blade to move downward, so that the cutting blade contacts the surface of the low-hardness metal. The linear actuator continues to drive the cutting blade downward. As the cutting blade cuts into the low-hardness metal to a set distance, the lifting drive mechanism is controlled to drive the pressure plate upward according to the pressure information collected by the piezoelectric film, so that the stage pressure f between the piezoelectric film and the low-hardness metal is reduced during this process. The cutting blade continues to move downward via the linear driver. Before the cutting blade completely cuts through the low-hardness metal, the lifting drive mechanism is controlled to drive the pressure plate to move back and forth at a set frequency and with a set pressure.

10. The cutting method as described in claim 9, characterized in that, The matching relationship between the stage pressure f and the set pressure F satisfies the following formula: ； Wherein, h is the initial thickness dimension of the low-hardness metal, and the The difference between the thickness of a low-hardness metal after maintaining the set pressure F for a set time and the initial thickness h.

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