Optoelectronic hybrid module for vehicle communication

CN121218487BActive Publication Date: 2026-08-11YANGTZE OPTICAL FIBRE & CABLE CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-09-23
Publication Date
2026-08-11

AI Technical Summary

Technical Problem

首先,光模块虽然具备高速通信的特征,但在一些车载应用场合下依旧需要提供电模块的支撑,在此情况下有必要将光、电模块共同与印刷电路基板进行集成安装;其次,由于车内的空间非常有限,需要将光电模块集成安装在尽可能小的空间内,并且尽量满足未来架构(区域化电子架构)的简化需求,同时考虑制造及安装上的成本因素;再次,车规级振动相对于其他通信应用场合来说要严苛得多,如何满足车载应用抗震要求构成了本领域亟待解决的技术难题之一;最后,车载通信模块还必需提供良好的防水防尘性能,目前的单光或单电模块均无法满足车规级相关要求

Benefits of technology

(1)在集成化安装方面,本发明能够在占用非常小的空间内完成光器件、电器件以及印刷电路基板等组件的一体化集成设计,既可以充分通过光器件提供更好的信号传输性能,又可以通过电器件提供其他的配套功能,两者互不干扰且整体体积很小,较好地满足了小型化和轻量化需求;

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Abstract

This invention belongs to the technical field of vehicle-mounted communication equipment and discloses an optoelectronic composite module for vehicle communication, including an integrated PCB mounting assembly, an optical connection assembly, and an electrical connection assembly. The PCB mounting assembly includes a stacked PCB sub-board and a PCB main board, which are soldered together using pin connectors. The optical connection assembly includes a base; one side of the base is used to assemble optical devices, and the other side is used to assemble the electrical connection assembly, while also being locked and fixed to the PCB main and sub-boards. The electrical connection assembly includes a female connector, which is made of insulating material and metal pins using an insert injection molding method. It internally houses a bushing and a waterproof sealing ring and is locked and fixed to the base. This invention not only achieves optoelectronic composite functionality in a compact and highly integrated manner but also improves assembly strength, stability, and safety, providing reliable waterproof and dustproof performance, effectively meeting automotive-grade vibration and water immersion requirements.
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Description

Technical Field

[0001] This invention belongs to the technical field of vehicle communication equipment, and more specifically, relates to an optoelectronic composite module for vehicle communication. Background Technology

[0002] With the rapid development of intelligent and connected vehicles, the in-vehicle communication module, as a key component for achieving intelligent interconnection, is mainly used for data transmission and information exchange between the vehicle and external networks. Through this module, the vehicle can receive real-time traffic information and remote control commands, while also sending out its own status data such as vehicle speed and fault information.

[0003] Traditional automotive communication modules typically use single-electronic modules. Their working principle involves converting the received signal into an electrical signal, processing it on a PCB board, and then transmitting it to the control unit via an electrical connector. Because these single-electronic modules use copper cable harnesses for signal transmission, their transmission rate and bandwidth are significantly limited, and they also face issues such as high attenuation and EMC (electromagnetic compatibility) problems. In recent years, optical modules have begun to be used in automobiles. They can significantly improve data transmission speed and capacity while enhancing the network security and reliability of automotive communication networks, thus attracting increasing attention from the industry.

[0004] However, further research has revealed the following defects or shortcomings in the aforementioned prior art: First, while optical modules offer high-speed communication capabilities, they still require the support of electrical modules in some automotive applications. In such cases, it is necessary to integrate both optical and electrical modules onto the printed circuit board. Second, due to the limited space within a vehicle, optoelectronic modules need to be integrated and installed in the smallest possible space while also meeting the simplification requirements of future architectures (regionalized electronic architectures), and considering manufacturing and installation costs. Third, automotive-grade vibration is far more stringent than in other communication applications, and meeting the vibration resistance requirements for automotive applications constitutes one of the most pressing technical challenges in this field. Finally, automotive communication modules must also provide excellent waterproof and dustproof performance, and current single-optical or single-electrical modules cannot meet the relevant automotive-grade requirements. Summary of the Invention

[0005] To address one or more of the above-mentioned deficiencies or needs of existing technologies, this invention provides an optoelectronic composite module for vehicle communication. By redesigning its overall structure and making targeted improvements to the specific structural forms and arrangements of several key components, such as PCB mounting components, electrical connection components, and optical connection components, the invention not only achieves optoelectronic composite functions in a compact and highly integrated manner, providing better signal transmission performance, but also achieves significant improvements in assembly strength and stability, safety, and waterproof and dustproof properties. Therefore, it is particularly suitable for specific applications in vehicle communication.

[0006] To achieve the above objectives, according to the present invention, an optoelectronic composite module for vehicle communication is provided. This optoelectronic composite module includes an integrated PCB mounting assembly, an optical connection assembly, and an electrical connection assembly, wherein: The PCB mounting assembly includes upper and lower stacked PCB sub-boards and PCB main board, and the PCB sub-board and the PCB main board are electrically interconnected by soldering with pin connectors; The optical connection assembly includes a base, wherein a conductive sealing ring and a retaining ring are installed on one horizontal side of the base for assembling optical devices, and the other horizontal side of the base is used for assembling with the electrical connection assembly; in addition, the lower side of the base is locked and fixed to the PCB sub-board by a first fastener, and then locked and fixed again by a second fastener that passes through both the PCB sub-board and the PCB main board. The electrical connection assembly includes a female connector, which is made of insulating material and metal pins by insert injection molding. The female connector body formed by the insulating material is locked and fixed to the base by a third fixing member. The metal pins are embedded and fixed in the insulating material. One end of the pins is used for assembly with electrical components, and the other end is soldered to the PCB motherboard for conductivity. In addition, a bushing is provided inside the female connector, and a waterproof sealing ring is used for isolation.

[0007] As a further preferred embodiment, the main body of the female seat is a horizontally extending cylindrical structure, and a first vertical plate structure is formed at the end of the cylindrical structure.

[0008] As a further preferred embodiment, the cylindrical structure is used to assemble both the bushing and the waterproof sealing ring inside, and mounting holes are provided on the edge of the first vertical plate structure for the third fastener to pass through.

[0009] As a further preferred embodiment, the base has a second vertical plate structure that matches the shape of the first vertical plate structure, and the second vertical plate structure also has mounting holes on its edge for the third fixing member to pass through.

[0010] As a further preferred embodiment, conductive foam is installed on the upper side of the base, and then it is assembled with the upper cover by a fourth fastener.

[0011] As a further preferred embodiment, two types of mounting holes are respectively provided on the lower side of the base and on the PCB sub-board, for passing through the first fixing member and the second fixing member.

[0012] As a further preferred embodiment, the outer shell of the base is made of a metal material such as aluminum or stainless steel.

[0013] As a further preferred embodiment of the present invention, the first fixing member, the second fixing member, the third fixing member and the fourth fixing member are all made of fixing screws.

[0014] In summary, the technical solutions conceived by this invention have the following main technical advantages compared with the prior art: (1) In terms of integrated installation, the present invention can complete the integrated design of optical devices, electrical devices and printed circuit boards in a very small space. It can provide better signal transmission performance through optical devices and provide other supporting functions through electrical devices. The two do not interfere with each other and the overall volume is very small, which better meets the requirements of miniaturization and lightweighting. (2) In terms of assembly strength and stability, the present invention uses multiple locking fixation of the optical connection component relative to the PCB main and sub boards, together with the electrical connection component relative to the optical connection component. This method can achieve sufficient assembly strength while highly integrated installation. Furthermore, the product is easy to process and control assembly accuracy, thereby ensuring the stringent requirements of automotive-grade vibration. (3) In terms of safety, the present invention uses insulating materials such as plastic to process the main structure of the electrical connection component, and metal inserts such as metal pins are injection molded in it. After molding, the plastic will wrap around the base of the metal insert, thereby ensuring the conductivity function, providing insulation protection and fixing function, and better controlling the position and perpendicularity of the metal pins when processing the female socket. (4) In terms of waterproofing and dustproofing, the product of the present invention has a small overall exposed area, and the electrical connection components are protected by bushings and waterproof sealing rings, thereby further improving the waterproofing and dustproofing effect and effectively reducing the impact of vehicle wading in water. (5) Compared with existing similar products, the optoelectronic composite module of the present invention can realize optoelectronic composite function in a compact and highly integrated manner, while helping to increase the stability of optical fiber transmission and reception and provide better signal transmission performance. The optoelectronic composite module of the present invention can improve assembly strength, stability and safety, provide reliable waterproof and dustproof effect, effectively meet the vibration and water immersion requirements of automotive grade, and is therefore particularly suitable for specific applications of vehicle communication. Attached Figure Description

[0015] Figure 1 This is an exploded view of the overall structure of the optoelectronic composite module provided by the present invention; Figure 2 This is a schematic diagram of the integrated installation of the three major components of the optoelectronic composite module provided by the present invention; Figure 3 This is an overall structural diagram of the photoelectric composite module after its three major components are integrated and installed according to the present invention; Figure 4 It is based on a more detailed diagram showing the female connector structure of the electrical connection assembly; In all the accompanying drawings, the same reference numerals are used to denote the same elements or structures, wherein: 1-Third fixing component; 2-Bushing; 3-Waterproof sealing ring; 4-Female connector; 5-Fourth fixing component; 6-Top cover; 7-Conductive foam; 8-Base; 9-Conductive sealing ring; 10-Snap ring; 11-Optical component; 12-PCB sub-board; 13-Pin connector; 14-First fixing component; 15-PCB main board; 16-Second fixing component; 17-Electrical connection assembly; 18-Optical connection assembly; 19-PCB mounting assembly; 401-Vertical plate structure; 402-Cylindrical structure; 403-Metal pin; 404-Mounting hole. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0017] It should be understood that expressions such as "comprising" and "may include" as used in this application indicate the existence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In this application, terms such as "comprising" and / or "having" may be interpreted as indicating a specific characteristic, number, operation, constituent element, component, or combination thereof, but should not be interpreted as excluding the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.

[0018] It should be understood that the terms “center,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “inner,” “outer,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0019] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0020] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0021] Figure 1 This is an exploded view of the overall structure of the optoelectronic composite module provided by the present invention. The optoelectronic composite module can realize the integrated installation of optical devices, electrical devices and printed circuit boards, etc. In the process of integration design, the space constraints of automotive applications and the requirements of automotive-grade vibration and water immersion are fully considered.

[0022] like Figure 1 and Figure 2 As shown, the optoelectronic composite module includes an integrated PCB mounting assembly 19, an optical connection assembly 18, and an electrical connection assembly 17, which will be explained in detail below.

[0023] The PCB mounting assembly 19 includes upper and lower stacked PCB sub-boards 12 and PCB main board 15, and the PCB sub-board 12 and PCB main board 15 are electrically interconnected by soldering with pin connectors 13; in this way, not only can the printed circuit boards be bonded and installed, but it is also easy to process and manufacture, and the cost is low.

[0024] For the optical connection assembly 18, it mainly includes a base 8, wherein the horizontal side of the base 8 ( Figure 1The conductive sealing ring 9 and retaining ring 10 are installed on the right side of the base 8, which are used to assemble the optical device 11. The other side of the base 8 is horizontal. Figure 1 (Seen on the left in the middle) is used for assembly with electrical connection assembly 17. Figure 2 The image shows that the two are directly in contact. In addition, the lower side of the base 8 is first fastened to the PCB sub-board 12 by a first fastener 14, such as a fixing screw, and then fastened to both the PCB sub-board 12 and the PCB main board 15 by a second fastener 16, which also passes through the PCB sub-board 12 and the PCB main board 15.

[0025] In this way, the interlocking fixation between the base 8 and the PCB main board 15 and the PCB sub-board 12 can better meet the automotive-grade vibration requirements. In addition, since holes are directly drilled in the PCB sub-board 12, allowing the base 8 to pass directly through and be locked to the PCB main board 15, the intermediate fixing layers can be reduced, resulting in higher product strength.

[0026] More specifically, see Figure 1 Conductive foam 7 is also installed on the upper side of the base 8, and then assembled with the top cover 6 by a fourth fastener 5, for example, in the form of a fixing screw. In addition, two kinds of mounting holes are opened on the lower side of the base 8 and the PCB sub-board 12, respectively for the first fastener 14 and the second fastener 16 to pass through.

[0027] According to a preferred embodiment of the present invention, the left side of the base 8 is preferably a vertical plate structure, and mounting holes are provided on the edge of the vertical plate structure for a third fastener 1 to pass through. The third fastener 1 is also, for example, in the form of a fixing screw, and is used to lock and fix the electrical connection assembly 17.

[0028] The electrical connection assembly 17 mainly includes a female connector 4. In this invention, the female connector 4 is preferably made of insulating material and metal pins using an insert injection molding method. The insulating material, for example, is plastic, used to form the main body of the female connector, which is then locked to the base 8 by a third fixing member 1. At the same time, the metal pins are embedded and fixed in the insulating material, with one end used for assembly with electrical components and the other end soldered to the PCB motherboard 15 for conductivity. In this way, both electrical and optical components can achieve connection and conduction with the printed circuit board, thereby realizing optoelectronic interconnection and transmission.

[0029] More specifically, according to another preferred embodiment of the present invention, the main body of the female base, made of insulating material, is a horizontally extending cylindrical structure 402. At the end of this cylindrical structure 402, a vertical plate structure 401 is formed. This vertical plate structure 401 maintains a shape match with the vertical plate structure of the base 8, and mounting holes 404 are also provided on its edge for the third fixing member 1 to pass through. A metal pin 403 is embedded and fixed in the insulating material; one end is used for assembly with electrical components, and the other end is soldered to the PCB motherboard for conductivity. Furthermore, the cylindrical structure 402 is used to assemble both the bushing 2 and the waterproof sealing ring 3 inside, so that the waterproof sealing ring 3 is reliably installed inside the cylindrical structure, forming a compressible, sealed structure that achieves the required waterproof effect.

[0030] It should be noted that the female connector 4 is formed in one piece using an insert injection molding process, combining insulating material (e.g., plastic) and metal inserts (e.g., metal pins). This process utilizes a specialized mold. The mold's internal design includes a metal pin fixing structure. When the mold is closed and molten plastic is injected into the cavity, the plastic wraps around the end of the metal pin, further ensuring the pin's position and perpendicularity. In this way, the resulting female connector not only passes more smoothly through the PCB motherboard for soldering, providing conductivity, but the plastic wrapping around the metal pin also provides insulation and fixation.

[0031] The working principle of the optoelectronic composite module according to the present invention will be explained in detail below.

[0032] As described above, the optoelectronic composite module of the present invention is an integrated module that combines optical communication and electrical communication (or power supply) functions. Its working principle can be summarized as follows: at the transmitting end, the electrical signal is converted into an optical signal for data transmission, and DC power is injected simultaneously for parallel transmission through a connector; at the receiving end, the optical signal is converted back into an electrical signal, and power is distributed to the remote device.

[0033] The specific working process is as follows: The receiving device's electrical signal input PCB sub-board 12 generates the digital electrical signal to be transmitted, which is then input to the optical device 11 for conversion into an optical signal and coupled into an optical fiber for transmission. Simultaneously, an external DC power supply is directly connected to the module's power interface, and the signal is transmitted through wires connected to the PCB main board 15 and the female connector 4. In this way, light and electricity are "combined" at the module's output.

[0034] In summary, the optoelectronic composite module of the present invention, through redesign of its overall structure and targeted improvements to the specific structural forms and arrangements of several key components such as PCB mounting components, electrical connection components, and optical connection components, not only achieves optoelectronic composite functions in a compact and highly integrated manner, but also improves assembly strength, stability, and safety compared to similar products, provides reliable waterproof and dustproof effects, and effectively meets automotive-grade vibration and water immersion requirements. Therefore, it is particularly suitable for in-vehicle communication applications and has good practical value and application prospects.

[0035] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An optoelectronic composite module for vehicle-mounted communication, characterized in that, The optoelectronic composite module includes an integrated PCB mounting assembly (19), an optical connection assembly (18), and an electrical connection assembly (17), wherein: The PCB mounting assembly (19) includes upper and lower stacked PCB sub-boards (12) and PCB main board (15), and the PCB sub-boards (12) and the PCB main board (15) are electrically interconnected by soldering with pin connectors (13); The optical connection assembly (18) includes a base (8), wherein a conductive sealing ring (9) and a retaining ring (10) are installed on one horizontal side of the base (8) for assembling the optical device (11), and the other horizontal side of the base (8) is used for assembling with the electrical connection assembly (17); in addition, the lower side of the base (8) is locked and fixed to the PCB sub-board (12) by a first fastener (14), and then locked and fixed again by a second fastener (16) that passes through both the PCB sub-board (12) and the PCB main board (15); The electrical connection assembly (17) includes a female connector (4), which is made of insulating material and metal pins by insert injection molding. The female connector body formed by the insulating material is locked and fixed to the base (8) by a third fixing member (1). The metal pin is embedded and fixed in the insulating material. One end of the pin is used for assembly with electrical components, and the other end is soldered to the PCB motherboard (15) for conduction. In addition, a bushing (2) is provided inside the female connector (4), and a waterproof sealing ring (3) is used for isolation.

2. The optoelectronic composite module as described in claim 1, characterized in that, The main body of the female base is a horizontally extending cylindrical structure, and a first vertical plate structure is formed at the end of the cylindrical structure.

3. The optoelectronic composite module as described in claim 2, characterized in that, The cylindrical structure is used to assemble both the bushing (2) and the waterproof sealing ring (3) inside. The first vertical plate structure has mounting holes on its edge for the third fastener (1) to pass through.

4. The optoelectronic composite module as described in claim 3, characterized in that, The base (8) has a second vertical plate structure that matches the shape of the first vertical plate structure. The second vertical plate structure also has mounting holes on its edge for the third fastener (1) to pass through.

5. The optoelectronic composite module as described in claim 4, characterized in that, The base (8) is fitted with conductive foam (7) on its upper side and then assembled with the top cover (6) by the fourth fastener (5).

6. The optoelectronic composite module according to any one of claims 1-5, characterized in that, Two types of mounting holes are respectively opened on the lower side of the base (8) and the PCB sub-board (12) for passing through the first fixing member (14) and the second fixing member (16).

7. The optoelectronic composite module as described in any one of claims 1-6, characterized in that, The outer shell of the base (8) is made of metal materials such as aluminum or stainless steel.

8. The optoelectronic composite module as described in claim 5, characterized in that, The first fixing member (14), the second fixing member (16), the third fixing member (1) and the fourth fixing member (5) are all fixed screws.

Citation Information

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