Modular composite pod continuous bonding and curing apparatus and method

CN121224147BActive Publication Date: 2026-09-22SHANGHAI COMPOSITES SCI & TECH CO LTD
View PDF 2 Cites 0 Cited by

Patent Information

Application Number
CN202511654080.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-11-12
Publication Date
2026-09-22
Estimated Expiration
2045-11-12

AI Technical Summary

Technical Problem

现有技术中复合材料豆荚杆均为上下瓣膜单独成型后上下瓣膜再次胶接,由于胶接装置限制无法实现连续超长尺寸复合材料豆荚杆胶接,单一加热加压装置无法满足胶膜固化所需的固化温度压力变化需求,生产效率低

Benefits of technology

1、本发明通过不同数量单固化模块组合实现复合材料豆荚杆连续胶接,同时可满足不同胶接速度,实现超长复合材料豆荚杆的高效胶接,

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN121224147B_ABST
    Figure CN121224147B_ABST
Patent Text Reader

Abstract

The application provides a modular composite pod rod continuous bonding and curing device and method, and belongs to the field of composite pod rod forming. The device is connected by a plurality of single curing modules, and the single curing modules correspond to the single modules of the pod rod one by one. The pod rod moves forward intermittently in the device and is continuously bonded and cured. The single curing module comprises a pneumatic pressure cylinder, an upper curing plate, an upper shape pressing plate, a lower shape pressing plate and a lower curing plate. The pneumatic pressure cylinder drives the upper curing plate and the upper shape pressing plate to move up and down to adjust the bonding pressure. The shape pressing plate can be in a flat state or a natural state to adapt to different bonding requirements. The lower shape pressing plate is provided with a limiting pin to constrain the movement of the pod rod, and the upper shape pressing plate is provided with an avoiding groove. Adjacent modules are connected and locked through the lower curing plate connecting pin and the quick release buckle, so that the flatness is ensured. The application can realize efficient bonding of the super-long pod rod, the bonding quality is stable, the size precision is high, and different process requirements can be met.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This invention belongs to the field of composite material bean pod stem molding, specifically, it relates to a modular composite material bean pod stem continuous bonding and curing device and method. Background Technology

[0002] With the development of space technology applications, especially the rapid development of space station technology and deep space exploration technology in recent years, the demand for space equipment such as ultra-long antennas and ultra-large solar arrays is increasing. Foldable, rollable, and deployable mechanisms are fundamental to these space devices. Due to limitations in rocket payload capacity and fairing size, various lightweight, rollable, and deployable structures are constantly emerging, among which composite material pod-shaped rods exhibit the best performance. Composite material pod-shaped rods possess both the advantages of high specific stiffness and high specific strength of carbon fiber and their unique dual... The structure offers advantages such as the ability to retract during launch and unfold upon arrival in space, while also enabling multiple controlled retractions and unfoldings in space. Existing technologies for composite pod rods involve separately molding the upper and lower lobes and then bonding them together. Due to limitations in the bonding equipment, continuous ultra-long composite pod rods cannot be bonded. A single heating and pressurizing device cannot meet the temperature and pressure variations required for adhesive film curing, resulting in low production efficiency. Furthermore, it suffers from uneven bonding pressure, poor bonding quality, difficulty in controlling the size of the bonding area, and a tendency to crack after multiple retractions and unfoldings. Summary of the Invention

[0003] To address the shortcomings of existing technologies, the purpose of this invention is to provide a modular composite material pod stem continuous bonding and curing device and method.

[0004] The modular composite material pod stem continuous bonding and curing device provided by the present invention is characterized in that it is composed of multiple single curing modules connected together. The composite pod stalks that need to be bonded and cured are processed into individual modules. Each composite pod stalk module corresponds to a single curing module position. Multiple composite pod stalk modules are intermittently forward and continuously bonded and cured together in the modular composite pod stalk continuous bonding and curing device to form a complete composite pod stalk. Each of the single curing modules includes, from top to bottom, a pneumatic pressure cylinder, an upper curing plate, an upper shape pressure plate, a lower shape pressure plate, and a lower curing plate.

[0005] Preferably, the pneumatic pressure cylinder is fixedly installed above the upper fixed plate; Each composite material pod stalk module is wrapped and glued together by upper and lower shaped pressure plates on both sides. Adjacent single curing modules are connected by a lower curing plate connecting pin disposed on the lower curing plate.

[0006] Preferably, the adjacent single-curing modules are quickly positioned and locked together by a lower curing plate connecting pin and a quick-release buckle.

[0007] Preferably, the lower shaped pressure plate is provided with a side limiting pin for the composite material pod rod to constrain the intermittent movement of the single module of the composite material pod rod; Preferably, the distance between two adjacent side limit pins of the composite material pod rods on the lower shaped pressure plate is no more than 50mm; the upper shaped pressure plate is correspondingly provided with clearance grooves for the limit pins.

[0008] Preferably, the upper curing plate and the lower curing plate are arranged alternately with electric heating tubes and water-cooled copper tubes on the same horizontal plane.

[0009] Preferably, the upper shape pressure plate and the lower shape pressure plate are either flattened adhesive-cured pressure plates or naturally adhesive-cured pressure plates.

[0010] Preferably, the pneumatic pressure cylinder drives the upper curing plate and the upper shaped pressure plate to move up and down, so that after the upper shaped pressure plate and the lower shaped pressure plate press the composite material pod rod tightly, the pressure on the composite material pod rod is adjusted by adjusting the pneumatic pressure.

[0011] Preferably, after adjacent single curing modules are positioned and locked by the lower curing plate connecting pin, the flatness of the upper surface of the lower curing plate of the adjacent single curing modules is less than 0.1mm.

[0012] The modular composite material bean pod stem continuous bonding and curing method provided by the present invention is implemented using the modular composite material bean pod stem continuous bonding and curing device provided by the present invention, comprising: Step S1: Based on the dimensions of the composite pod stem and the bonding process requirements, determine whether the composite pod stem should be flattened or bonded in a natural state, and select the appropriate upper and lower shaped pressure plates. Step S2: Based on the width of the composite material pod rod, set the side limiting pin of the composite material pod rod on the lower shaped pressure plate, and set the corresponding clearance groove on the upper shaped pressure plate; Step S3: Determine the required number of single-curing modules based on preparation parameters such as the bonding speed of the composite pod stalk, the length of a single composite pod stalk module, and the curing time required for the adhesive film; Step S4: Position the individual curing modules together using the connecting pins on the lower curing plate and fix them with the quick-release buckles on the side. After connection, the flatness of the upper surface of the lower curing plate of all individual curing modules is less than 0.1mm; forming a complete modular composite material pod rod continuous adhesive bonding and curing device. Step S5: Set the temperature and pressure of each single curing module according to the film curing regime to ensure that the temperature and pressure can rise, maintain, and fall during the forward movement of the composite material pod rod; Step S6: The composite pod stem is intermittently and continuously bonded and cured into a complete composite pod stem in the complete modular composite pod stem continuous bonding and curing device.

[0013] Compared with the prior art, the present invention has the following beneficial effects: 1. This invention achieves continuous bonding of composite material pod stalks by combining different numbers of single-curing modules, while also meeting different bonding speed requirements, thus enabling efficient bonding of ultra-long composite material pod stalks. 2. By setting different single curing modules and different combinations of temperature and pressure, this invention can adapt to different film curing regimes and has a wide range of applications; 3. By adjusting the bonding parameters, the composite material pod stem adhesive film bonded by the continuous bonding and curing device can achieve high degree of curing, stable and reliable bonding quality, uniform adhesive film thickness, and controllable bonding area size; the relative positional accuracy of the upper and lower lobes of the composite material pod stem is high, and the dimensional accuracy is high. 4. By replacing pressure plates of different sizes and specifications, this invention can achieve the bonding of composite pod stems with different cross-sectional dimensions. Attached Figure Description

[0014] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 This is a schematic diagram of a single module of the modular composite material bean pod stem continuous bonding and curing device of the present invention; Figure 2 This is a schematic diagram of the modular composite material bean pod stem continuous bonding and curing device assembly of the present invention.

[0015] The diagram shows: Detailed Implementation

[0016] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the invention in any way. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all fall within the protection scope of the present invention.

[0017] like Figure 1 and Figure 2As shown, this embodiment of the invention provides a modular composite material pod stem continuous bonding and curing device, which is composed of multiple single curing modules connected together. The composite material pod stem is processed into individual modules, with each composite material pod stem module corresponding to a single curing module position. Multiple composite material pod stem modules are intermittently forward and continuously bonded and cured together in the modular composite material pod stem continuous bonding and curing device to form a complete composite material pod stem.

[0018] Each single curing module includes, from top to bottom, a pneumatic pressure cylinder 5, an upper curing plate 1, an upper shape pressure plate, a lower shape pressure plate, and a lower curing plate 2; The pneumatic pressure cylinder 5 is fixedly installed above the upper fixed plate 1. Each composite material pod rod module is wrapped and bonded by upper and lower shaped pressure plates on both sides. Adjacent single-cured modules are connected by lower curing plate connecting pins 6 on the lower curing plate 2. Specifically, adjacent single-cured modules are quickly positioned and locked by the lower curing plate connecting pins 6 and quick-release buckles. The lower shaped pressure plate is provided with side limit pins of the composite material pod rod to constrain the intermittent movement of the composite material pod rod module. Specifically, in the continuous bonding and curing device for composite material pod rods, the distance between two adjacent side limit pins of the composite material pod rod on the lower shaped pressure plate is no more than 50mm. The upper shaped pressure plate is correspondingly provided with clearance grooves for the aforementioned limit pins.

[0019] Furthermore, electric heating tubes and water-cooled copper tubes are arranged alternately on the same horizontal plane in the upper curing plate 1 and the lower curing plate 2. The temperature of the upper shape plate and the lower shape plate in each single curing module is precisely controlled by controlling the operation of the electric heating tubes and the flow of cold water in the water-cooled copper tubes.

[0020] Furthermore, the upper and lower shaped pressure plates can be selected as either flattened adhesive-cured pressure plates or naturally bonded adhesive-cured pressure plates, depending on the requirements of the composite material pod rod manufacturing process. Specifically, the flattened adhesive-cured pressure plates and naturally bonded adhesive-cured pressure plates are respectively as follows: Figure 1 Natural state shape pressure plate 3, flattened state shape pressure plate 4.

[0021] Furthermore, the pneumatic pressure cylinder 5 drives the upper curing plate 1 and the upper shaped pressure plate to move up and down, so that after the upper and lower shaped pressure plates press the composite material pod rod tightly, the pressure on the composite material pod rod is adjusted by adjusting the pneumatic pressure.

[0022] Furthermore, after the adjacent single curing modules are positioned and locked by the lower curing plate connecting pin 6, the flatness of the upper surface of the lower curing plate 2 of the adjacent single curing modules is less than 0.1mm.

[0023] More preferably, in specific embodiments of the present invention, different numbers of single-curing modules can be combined according to the traction speed of the composite material pod stalk bonding and curing, and the temperature and pressure changes required for film curing. Each single-curing module is configured with a curing temperature and pressure, which can meet the requirements of temperature and pressure rise, hold, and fall as the composite material pod stalk moves forward between modules. The modular continuous bonding and curing device for composite material pod stalks of the present invention can be adaptively optimized and modified according to the constraints of the actual production of composite material pod stalks, such as their form, structure, size requirements, and process requirements.

[0024] This invention provides a method for continuous bonding and curing of modular composite bean pod stalks, implemented using the continuous bonding and curing device for modular composite bean pod stalks provided in this invention, comprising: Step S1: Based on the dimensions of the composite pod stem and the bonding process requirements, determine whether the composite pod stem should be flattened or bonded in a natural state, and select the appropriate upper and lower shaped pressure plates. Step S2: Based on the width of the composite material pod rod, set the side limiting pin of the composite material pod rod on the lower shaped pressure plate, and set the corresponding clearance groove on the upper shaped pressure plate; Step S3: Determine the required number of single-curing modules based on preparation parameters such as the bonding speed of the composite pod stalk, the length of a single composite pod stalk module, and the curing time required for the adhesive film; Step S4: Position the individual curing modules together using the lower curing plate connecting pin 6 and fix them with the side quick-release buckles. After connection, the flatness of the upper surface of the lower curing plate 2 of all individual curing modules is less than 0.1mm; forming a complete modular composite material pod stem continuous adhesive bonding and curing device. Step S5: Set the temperature and pressure of each single curing module according to the curing regime of the adhesive film to ensure that the temperature and pressure can rise, maintain, and fall during the forward movement of the composite material pod rod; Step S6: The composite pod stem is intermittently and continuously bonded and cured into a complete composite pod stem in the complete modular composite pod stem continuous bonding and curing device.

[0025] More specifically, the implementation principle of this invention is as follows: continuous bonding of composite pod stems is achieved through combinations of different numbers of single-curing modules, while simultaneously satisfying different bonding speeds, thus achieving efficient bonding of ultra-long composite pod stems; by changing the shape of the pressure plate, bonding of composite pod stems in different states—flattened and natural—and bonding of composite pod stems with different cross-sectional dimensions in the natural state can be achieved; by setting different combinations of single-curing modules, temperatures, and pressures, different curing regimes for the adhesive film can be adapted; furthermore, by adjusting the bonding parameters, the adhesive film of the bonded composite pod stems can achieve high degree of curing, stable and reliable bonding quality, uniform adhesive film thickness, and controllable bonding area size; the relative positional accuracy of the upper and lower lobes of the composite pod stems is high, and the dimensional accuracy is high.

[0026] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0027] Specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. Unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

Claims

1. A modular composite material bean pod stalk continuous bonding and curing device, characterized in that, It is composed of multiple single-solidification modules connected together; The composite pod stalks that need to be bonded and cured are processed into individual modules. Each composite pod stalk module corresponds to a single curing module position. Multiple composite pod stalk modules are intermittently forward and continuously bonded and cured together in the modular composite pod stalk continuous bonding and curing device to form a complete composite pod stalk. Each of the single curing modules includes: a pneumatic pressure cylinder (5), an upper curing plate (1), an upper shape pressure plate, a lower shape pressure plate, and a lower curing plate (2) arranged sequentially from top to bottom; The pneumatic pressure cylinder (5) is fixedly installed above the upper curing plate (1); Each composite material pod stalk module is wrapped and glued together by upper and lower shaped pressure plates on both sides. The adjacent single curing modules are connected by a lower curing plate connecting pin (6) set on the lower curing plate (2); Between adjacent single-curing modules, quick positioning and locking are achieved through the lower curing plate connecting pin (6) and quick-release buckle; The lower shaped pressure plate is provided with a side limiting pin for the composite material pod rod to constrain the intermittent movement of the single module of the composite material pod rod; The distance between two adjacent side limit pins of the composite material pod rods on the lower shaped pressure plate is no more than 50mm; the upper shaped pressure plate is correspondingly provided with clearance grooves for the limit pins; The upper curing plate (1) and the lower curing plate (2) are arranged with electric heating tubes and water-cooled copper tubes in an alternating manner on the same horizontal plane.

2. The modular composite material pod stalk continuous bonding and curing device according to claim 1, characterized in that, The upper and lower shaped pressure plates are either flattened adhesive-cured pressure plates or naturally adhesive-cured pressure plates.

3. The modular composite material pod stalk continuous bonding and curing device according to claim 1, characterized in that, The pneumatic pressure cylinder (5) drives the upper curing plate (1) and the upper shape pressure plate to move up and down, so that after the upper shape pressure plate and the lower shape pressure plate press the composite material pod rod, the pressure on the composite material pod rod is adjusted by adjusting the pneumatic pressure.

4. The modular composite material pod stalk continuous bonding and curing device according to claim 1, characterized in that, After the adjacent single curing modules are positioned by the lower curing plate connecting pin (6) and fixed and locked by the side quick-release buckle, the flatness of the upper surface of the lower curing plate (2) of the adjacent single curing modules is less than 0.1mm.

5. A method for continuous adhesive bonding and curing of modular composite material bean pod stems, characterized in that, This is achieved using the modular composite material pod stem continuous bonding and curing device according to any one of claims 1 to 4, comprising: Step S1: Based on the dimensions of the composite pod stem and the bonding process requirements, determine whether the composite pod stem should be flattened or bonded in a natural state, and select the appropriate upper and lower shaped pressure plates. Step S2: Based on the width of the composite material pod rod, set the side limiting pin of the composite material pod rod on the lower shaped pressure plate, and set the corresponding clearance groove on the upper shaped pressure plate; Step S3: Determine the required number of single-curing modules based on the composite material pod stem preparation parameters; Step S4: Position the single curing modules together using the lower curing plate connecting pin (6) and fix them with the side quick-release buckle. After connection, the flatness of the upper surface of the lower curing plate (2) of all single curing modules is less than 0.1mm; forming a complete modular composite material pod rod continuous adhesive bonding and curing device. Step S5: Set the temperature and pressure of each single curing module according to the film curing regime to ensure that the temperature and pressure can rise, maintain, and fall during the forward movement of the composite material pod rod; Step S6: The composite pod stem is intermittently and continuously bonded and cured into a complete composite pod stem in the complete modular composite pod stem continuous bonding and curing device.

Citation Information

Patent Citations

  • Continuous cementing method for super-long composite material strain energy rod

    CN113526222A

  • Heating and pressurizing device for cementing, forming and pre-curing of composite stringer and skin

    CN115816848A