一种本征型低介电聚酰亚胺薄及其制备方法和应用
By introducing branched organic fillers into polyimide films and controlling the proportion of raw materials, polyimide films with low dielectric constants can be prepared, solving the problems of transmission loss and waveform distortion in high-frequency environments, achieving a reduction in dielectric constant and an improvement in performance, and making them suitable for flexible circuit boards for 5G base stations.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HARBIN UNIV OF SCI & TECH
- Filing Date
- 2025-10-24
- Publication Date
- 2026-07-17
AI Technical Summary
Existing polyimide films have a high dielectric constant, which makes it difficult to meet the requirements of 5G communication for low dielectric materials, especially in high-frequency environments where transmission loss and waveform distortion are severe.
By introducing branched organic fillers and controlling the proportion of raw materials, intrinsic low-dielectric polyimide films are prepared, reducing molecular polarizability and the number of polarized molecules, increasing the molecular chain spacing, and inhibiting the formation of charge-transfer complexes.
It achieves a dielectric constant reduction to 2.4-2.5 while maintaining good thermal stability and mechanical properties, making it suitable for flexible circuit boards for 5G base stations.
Smart Images
Figure CN121226802B_ABST