Electronic device

Abstract

The application provides an electronic device. The electronic device comprises a shell and a first loudspeaker located in a receiving space. The shell has a first sound outlet hole and the receiving space. The first sound outlet hole is in communication with the receiving space and the outside of the shell. The first loudspeaker comprises a first acoustic cavity space, a first inner core and a first heat conduction structure. The first inner core is located in the first acoustic cavity space and separates the first acoustic cavity space into a first front cavity and a first rear cavity. The first front cavity is in communication with the first sound outlet hole. The first rear cavity is in communication with the first inner core. The first heat conduction structure is located between the first inner core and / or the first front cavity and the first rear cavity. The first heat conduction structure can conduct heat in the first rear cavity to the first front cavity to be dissipated to the outside of the electronic device through the first sound outlet hole. The first heat conduction structure can also prevent sound conduction between the first rear cavity and the first front cavity. The technical scheme of the application can prevent the area where the loudspeaker is located in the device from generating a hot spot due to the accumulation of heat, thereby improving the heat dissipation performance of the electronic device.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to an electronic device. Background Technology

[0002] In electronic devices such as mobile phones, tablets, and laptops, speakers are used to convert audio electrical signals such as music and voice into sound and have the function of supporting audio playback. However, in scenarios where audio is played out externally, the area where the speaker is located can generate hotspots due to heat accumulation, resulting in poor heat dissipation performance of the electronic device. Summary of the Invention

[0003] Embodiments of this application provide an electronic device that can prevent the area where the speaker is located from becoming a hot spot due to heat accumulation, thereby improving the heat dissipation performance of the electronic device.

[0004] An embodiment of this application provides an electronic device, the electronic device comprising:

[0005] A housing having a first sound outlet and a receiving space, the first sound outlet communicating with the receiving space and the exterior of the housing; and

[0006] A first loudspeaker located within the containment space includes a first acoustic cavity space, a first core, and a first heat-conducting structure. The first core is located within the first acoustic cavity space and divides the first acoustic cavity space into a first front cavity and a first rear cavity. The first front cavity is connected to the first sound outlet, and the first rear cavity is connected to the first core. The first heat-conducting structure is located between the first core and / or the first front cavity and the first rear cavity. The first heat-conducting structure can conduct heat from the first rear cavity to the first front cavity, so as to dissipate it to the outside of the electronic device through the first sound outlet. The first heat-conducting structure can also prevent acoustic conduction between the first rear cavity and the first front cavity.

[0007] Understandably, the first core separates the first front cavity and the first rear cavity of the first speaker, and the part of the first core that can be energized and move (i.e., the first voice coil mentioned below) is located close to the first rear cavity. Furthermore, because the first core performs electroacoustic conversion, a smaller portion of the electrical signal energy is effectively converted into sound, while a larger portion is converted into heat. This causes heat to easily accumulate in the first rear cavity, making it hotter than the first front cavity. Based on the principle of thermal expansion and contraction, the air in the first rear cavity will be hotter and expand, making the area where the first rear cavity is located prone to forming hotspots due to higher temperatures and creating an air pressure imbalance between the first front cavity and the first rear cavity.

[0008] Therefore, in the technical solution of this application, by setting a first heat-conducting structure on the first core, heat can be conducted between the first core and the first front cavity through the first heat-conducting structure, while preventing acoustic communication between the first core and the first front cavity. Furthermore, since the first core is connected to the first rear cavity, due to the thermally conductive but non-sound-conducting structural characteristic of the first heat-conducting structure, heat can be conducted between the first rear cavity and the first front cavity while maintaining acoustic isolation. This allows heat in the first rear cavity to be conducted to the first front cavity via the first rear cavity, the first core, and the first heat-conducting structure, while the air carrying heat in the first front cavity can be dissipated to the outside of the electronic device through the first sound outlet of the housing.

[0009] In this configuration, when the first core performs electroacoustic conversion, it pushes the hot air in the first rear cavity. The heat from the hot air in the first rear cavity can enter the first front cavity through the first core and the first heat-conducting structure, causing the cold air in the first front cavity to carry the heat and become hot air. Furthermore, based on the interaction of forces, the air in the first rear cavity also drives the vibrating part in the first core (i.e., the first diaphragm hereinafter) to vibrate, thereby promoting heat exchange between the hot air in the first front cavity carrying heat and the outside of the electronic device, enhancing the convection between the air in the first rear cavity and the outside air of the electronic device, and improving the heat dissipation efficiency of the first rear cavity of the first speaker. By utilizing the first speaker inside the electronic device and the gas circulation outside the electronic device, heat exchange and cooling can be achieved in the area where the first speaker is located and even in the entire device. This can diversify the performance of the first speaker, enabling it to perform both sound generation and heat dissipation functions, which is beneficial to improving the heat dissipation performance of the entire device. Furthermore, when the temperature of the first rear cavity is high, the first heat conduction channel formed by the first rear cavity, the first core, the first heat conduction structure, the first front cavity, and the first sound outlet hole of the shell can be used to depressurize the first rear cavity, maintain the air pressure balance between the first front cavity and the first rear cavity, and improve reliability.

[0010] In one possible implementation, the first core includes a first diaphragm that separates the first front cavity and the first rear cavity. The first diaphragm includes a first dome and a first diaphragm body that surrounds and connects to the outer periphery of the first dome.

[0011] The first heat-conducting structure includes a first breathable membrane and a plurality of first perforations. The plurality of first perforations are spaced apart on the first dome. Each first perforation penetrates the first dome along the thickness direction of the first dome and connects the first core and the first front cavity. The first breathable membrane is connected to the surface of the first dome facing the first front cavity and covers the plurality of first perforations. The first breathable membrane allows air conduction between the first front cavity and the first core and prevents acoustic conduction between the first front cavity and the first core.

[0012] It is understandable that the first dome of the first diaphragm is the part of the first diaphragm with greater strength and stiffness. By setting multiple first perforations on the first dome of the first diaphragm, the first diaphragm can have both vibration and gas flow functions without compromising its vibration stability.

[0013] The first breathable membrane can cover the opening of each first perforation located on the first outer surface of the first diaphragm, thereby completely blocking the opening of each first perforation on the first outer surface of the first diaphragm. In this configuration, the high-temperature airflow flowing out through the first core can reach the first breathable membrane after passing through the first perforation and pass through it. However, water and sound waves flowing out through the first core are blocked by the first breathable membrane and cannot pass through.

[0014] In one possible implementation, the first core includes a first diaphragm that separates the first front cavity and the first rear cavity. The first diaphragm includes a first dome and a first diaphragm body. The first diaphragm body is connected to the outer periphery of the first dome. The first dome forms the first thermally conductive structure. The material of the first dome is a thermally conductive material.

[0015] In this configuration, the heat accumulated on one side of the first inner surface of the first diaphragm can be conducted to one side of the first outer surface of the first diaphragm through the vibration of the first diaphragm, realizing the conduction of heat from the first rear cavity to the first front cavity. Subsequently, through the vibration of the first diaphragm, the hot air carrying heat in the first front cavity can be driven to flow, thereby accelerating the convection circulation with the cold air outside the electronic device and realizing heat exchange and cooling of the electronic device.

[0016] In one possible implementation, the electronic device further includes a first enclosure structure, wherein the first enclosure structure and the first core are both fixed within the housing, and the first enclosure structure and the first core enclose to form the first front cavity;

[0017] The first heat-conducting structure includes a first breathable membrane and a plurality of first perforations. The plurality of first perforations are spaced apart on the first enclosure structure. Each first perforation penetrates the first enclosure structure along the thickness direction and connects the first front cavity and the first rear cavity. The first breathable membrane is connected to the surface of the first enclosure structure facing or away from the first front cavity and covers the plurality of first perforations. The first breathable membrane allows air to pass through the first front cavity and the first rear cavity, and prevents acoustic communication between the first front cavity and the first rear cavity.

[0018] It is understandable that the first enclosure structure is located between the first front cavity and the first rear cavity. By setting multiple first perforations on the first enclosure structure, the first enclosure structure can have the dual functions of isolating the first front cavity and the first rear cavity and allowing gas to flow.

[0019] The first breathable membrane can cover the opening of each first perforation at one end of the first enclosure structure, thereby completely blocking the opening of each first perforation at one end of the first enclosure structure. In this configuration, the high-temperature airflow flowing out through the first rear cavity can reach the first breathable membrane after passing through the first perforation and pass through it. However, water and sound waves flowing out through the first rear cavity are blocked by the first breathable membrane and cannot pass through.

[0020] In one possible implementation, the housing further has a second sound outlet, the second sound outlet communicating with the receiving space and the outside of the housing, and the electronic device further includes a second speaker located within the receiving space, the second speaker being disposed opposite to the first speaker in the longitudinal direction of the electronic device;

[0021] The second loudspeaker includes a second acoustic cavity space, a second core, and a second heat-conducting structure. The second core is located within the second acoustic cavity space and divides the second acoustic cavity space into a second front cavity and a second rear cavity. The second front cavity is connected to the second sound outlet, and the second rear cavity is connected to the second core.

[0022] The second heat-conducting structure is located between the second core and / or between the second front cavity and the second rear cavity. The second heat-conducting structure can conduct heat from the second rear cavity to the second front cavity, so as to dissipate it to the outside of the electronic device through the second sound outlet. The second heat-conducting structure can also prevent acoustic conduction between the second rear cavity and the second front cavity.

[0023] Understandably, the second core separates the second front cavity and the second rear cavity of the second speaker, and the part of the second core that can be energized and move (i.e., the second voice coil mentioned below) is located close to the second rear cavity. Furthermore, because the second core performs electroacoustic conversion, a smaller portion of the electrical signal energy is effectively converted into sound, while a larger portion is converted into heat. This causes heat to easily accumulate in the second rear cavity, making it hotter than the second front cavity. Based on the principle of thermal expansion and contraction, the air in the second rear cavity will be hotter and expand, making the area where the second rear cavity is located prone to forming hotspots due to higher temperatures and creating an air pressure imbalance between the second front cavity and the second rear cavity.

[0024] Therefore, in this embodiment, by setting a second heat-conducting structure on the second core, heat can be conducted between the second core and the second front cavity through the second heat-conducting structure, while preventing acoustic communication between the second core and the second front cavity. Since the second core is connected to the second rear cavity, due to the thermally conductive but non-sound-conducting structural characteristic of the second heat-conducting structure, the second rear cavity and the second front cavity can conduct heat while maintaining acoustic isolation. This allows heat in the second rear cavity to be conducted to the second front cavity via the second rear cavity, the second core, and the second heat-conducting structure, while the air carrying heat in the second front cavity can be dissipated to the outside of the electronic device through the second sound outlet of the housing.

[0025] In this configuration, when the second core performs electroacoustic conversion, it pushes the hot air in the second rear cavity. The heat from the hot air in the second rear cavity can enter the second front cavity through the second core and the second heat-conducting structure, causing the cold air in the second front cavity to carry the heat and become hot air. Furthermore, based on the interaction of forces, the air in the second rear cavity also drives the vibrating part of the second core (i.e., the second diaphragm mentioned below) to vibrate, thereby promoting heat exchange between the hot air in the second front cavity carrying heat and the outside of the electronic device. This enhances the convection between the air in the second rear cavity and the external air of the electronic device, improving the heat dissipation efficiency of the second rear cavity of the second speaker. By utilizing the second speaker inside the electronic device and the gas circulation outside the electronic device, heat exchange and cooling can be achieved in the area where the second speaker is located and even in the entire device. This can diversify the performance of the second speaker, enabling it to perform both sound generation and heat dissipation functions, which is beneficial to improving the overall heat dissipation performance. Furthermore, when the temperature of the second rear cavity is high, the second heat conduction channel formed by the second rear cavity, the second core, the second heat conduction structure, the second front cavity, and the second sound outlet of the shell can be used to depressurize the second rear cavity, maintaining the air pressure balance between the second front cavity and the second rear cavity, resulting in better reliability.

[0026] In one possible implementation, the second core includes a second diaphragm that separates the second front cavity and the second rear cavity. The second diaphragm includes a second dome and a second diaphragm body that surrounds and is connected to the outer periphery of the second dome.

[0027] The second heat-conducting structure includes a second breathable membrane and a plurality of second perforations. The plurality of second perforations are spaced apart on the second dome. Each second perforation penetrates the second dome along the thickness direction of the second dome and connects the second core and the second front cavity. The second breathable membrane is connected to the surface of the second dome facing the second front cavity and covers the plurality of second perforations. The second breathable membrane allows air to pass between the second front cavity and the second core, and prevents acoustic communication between the second front cavity and the second core.

[0028] It is understandable that the second dome of the second diaphragm is the part of the second diaphragm with greater strength and stiffness. By setting multiple second perforations on the second dome of the second diaphragm, the second diaphragm can have both vibration and gas flow functions without compromising its vibration stability.

[0029] The second breathable membrane can cover the opening of each second perforation located on the second outer surface of the second diaphragm, thereby completely blocking the opening of each second perforation on the second outer surface of the second diaphragm. In this configuration, the high-temperature airflow flowing out through the second core can reach the second breathable membrane after passing through the second perforations and pass through it. However, water and sound waves flowing out through the second core are blocked by the second breathable membrane and cannot pass through.

[0030] In one possible implementation, the second core includes a second diaphragm that separates the second front cavity and the second rear cavity. The second diaphragm includes a second dome and a second diaphragm body. The second diaphragm body is connected to the outer periphery of the second dome. The second dome forms the second heat-conducting structure. The material of the second dome is a heat-conducting material.

[0031] In this configuration, the heat accumulated on one side of the second inner surface of the second diaphragm can be conducted to one side of the second outer surface of the second diaphragm through the vibration of the second diaphragm, realizing the conduction of heat from the second rear cavity to the second front cavity. Subsequently, the vibration of the second diaphragm can drive the flow of hot air carrying heat in the second front cavity, thereby accelerating the convection circulation with the cold air outside the electronic device and realizing heat exchange and cooling of the electronic device.

[0032] In one possible implementation, the electronic device further includes a second enclosure structure, which and the second core are both fixed within the housing, and the second enclosure structure and the second core enclose to form the second front cavity;

[0033] The second heat-conducting structure includes a second breathable membrane and a plurality of second perforations. The plurality of second perforations are spaced apart on the second enclosure structure. Each second perforation penetrates the second enclosure structure along the thickness direction and connects the second front cavity and the second rear cavity. The second breathable membrane is connected to the surface of the second enclosure structure facing or away from the second front cavity and covers the plurality of second perforations. The second breathable membrane allows air to pass through the second front cavity and the second rear cavity, and prevents acoustic communication between the second front cavity and the second rear cavity.

[0034] It is understandable that the second enclosure structure is located between the second front cavity and the second rear cavity. By setting multiple second perforations on the second enclosure structure, the second enclosure structure can have the dual functions of isolating the second front cavity and the second rear cavity as well as allowing gas to flow.

[0035] The second breathable membrane can cover the opening of each second perforation at one end of the second enclosure structure, thereby completely blocking the opening of each second perforation at one end of the second enclosure structure. In this configuration, the high-temperature airflow flowing out through the second rear cavity can reach the second breathable membrane after passing through the second perforation and pass through it. However, water and sound waves flowing out through the second rear cavity are blocked by the second breathable membrane and cannot pass through.

[0036] In one possible implementation, the first core includes a first diaphragm that separates the first front cavity and the first rear cavity, the second core includes a second diaphragm that separates the second front cavity and the second rear cavity, the first rear cavity and the second rear cavity communicate to form a rear acoustic cavity, and the first diaphragm and / or the second diaphragm vibrate to cause airflow to flow in the rear acoustic cavity.

[0037] In other words, the vibration of the first diaphragm of the first core and / or the second diaphragm of the second core can cause the airflow to circulate within the entire machine.

[0038] It is understandable that the vibration of the first diaphragm will cause airflow in the first front cavity and the first rear cavity, and the vibration of the second diaphragm will cause airflow in the second front cavity and the second rear cavity. Furthermore, since the first rear cavity of the first speaker and the second rear cavity of the second speaker are both open rear cavities, and the first rear cavity of the first speaker and the second rear cavity of the second speaker are connected to form a rear acoustic cavity.

[0039] Therefore, when the first diaphragm and / or the second diaphragm vibrates, gas exchange can occur between the first rear cavity of the first speaker and the second rear cavity of the second speaker. The airflow circulates within the rear acoustic cavity formed by the vibration of the first and / or second diaphragms, ensuring a uniform heat distribution throughout the device and reducing the overall body temperature, thus achieving good temperature uniformity in the electronic device. Furthermore, the air circulation driven by the first and second rear cavities of the first and second speakers can transfer heat from the rear acoustic cavity to the first front cavity via the first heat-conducting structure and to the second front cavity via the second heat-conducting structure. The heat is then dissipated to the outside of the electronic device through the first sound outlet of the housing connected to the first front cavity and the second sound outlet of the housing connected to the second front cavity. Corresponding air pressure changes also allow cool air from outside to enter the first and second front cavities, achieving convection circulation between the internal and external air of the electronic device. This continuous circulation achieves overall heat dissipation.

[0040] In this configuration, the first and second speakers can act as fans, continuously removing hot air from the entire unit and introducing cool air from the outside of the unit. This continuous heat removal achieves heat exchange and cooling of the entire unit, which is beneficial for optimizing the performance of the first and second speakers and improving the heat dissipation performance of electronic devices.

[0041] In one possible implementation, the electronic device further includes a motherboard electrically connected to the first core and the second core, the motherboard being used to send a first audio signal to the first core and a second audio signal to the second core, so that the first diaphragm and the second diaphragm vibrate in the same or opposite directions.

[0042] When the phases of the first audio signal and the second audio signal are the same, the first diaphragm of the first core and the second diaphragm of the second core can vibrate in the same direction. For example, the first diaphragm of the first core and the second diaphragm of the second core can vibrate upwards simultaneously to expand the volume of the rear acoustic cavity, or vibrate downwards simultaneously to compress the volume of the rear acoustic cavity, so that the heat in the rear acoustic cavity is spread out and made uniform through continuous expansion and compression.

[0043] When the phases of the first audio signal and the second audio signal are opposite, the first diaphragm of the first core and the second diaphragm of the second core can vibrate in opposite directions. For example, when the first diaphragm of the first core vibrates upward, the second diaphragm of the second core can vibrate downward, and vice versa. This vibration of the two diaphragms creates a push-pull structure that pushes and pulls the airflow in the rear acoustic cavity, accelerating airflow within the entire unit and improving its heat dissipation efficiency.

[0044] In one possible implementation, the first audio signal and the second audio signal are out of phase;

[0045] When the first core receives the first audio signal and the second core receives the second audio signal, the first diaphragm vibrates towards the rear acoustic cavity, and the second diaphragm vibrates away from the rear acoustic cavity, so that the first diaphragm pushes airflow into the rear acoustic cavity, and the second diaphragm pulls airflow out of the rear acoustic cavity; or...

[0046] When the first core receives the first audio signal and the second core receives the second audio signal, the first diaphragm vibrates away from the rear acoustic cavity, and the second diaphragm vibrates toward the rear acoustic cavity, so that the first diaphragm pulls the airflow out of the rear acoustic cavity and the second diaphragm pushes the airflow into the rear acoustic cavity.

[0047] This setting can accelerate airflow within the machine and improve the overall heat dissipation efficiency.

[0048] In one possible implementation, the first speaker includes a first state and a second state;

[0049] When the first speaker is in the first state, the first speaker can support audio playback and heat dissipation for the electronic device, and the first diaphragm vibrates to make the air exchange volume in and out of the first sound outlet the first air exchange volume.

[0050] When the first speaker is in the second state, the first speaker can dissipate heat for the electronic device. The first diaphragm vibrates so that the air exchange volume entering and exiting the first sound outlet is the second air exchange volume, which is greater than the first air exchange volume.

[0051] The first state of the first speaker is its normal playback mode. The second state of the first speaker is its heat dissipation mode.

[0052] Understandably, when the first speaker is in its first state, it can perform the dual functions of audio playback and heat dissipation for the electronic device. However, because the air exchange volume through the first sound outlet of the housing is greater when the first speaker is in its second state than when it is in its first state, the heat dissipation airflow is greater in the second state than in the first state, resulting in higher heat dissipation efficiency. In this case, the first speaker can function solely as a heat dissipation device without needing to perform audio playback.

[0053] In one possible implementation, the second speaker includes a third state and a fourth state;

[0054] When the second speaker is in the third state, the second speaker can support audio playback and heat dissipation for the electronic device, and the second diaphragm vibrates to make the air exchange volume in and out of the second sound outlet the third air exchange volume;

[0055] When the second speaker is in the fourth state, the second speaker can dissipate heat for the electronic device. The first diaphragm vibrates so that the air exchange volume entering and exiting the second sound outlet is the fourth air exchange volume, which is greater than the third air exchange volume.

[0056] Understandably, when the second speaker is in its third state, it can perform the dual functions of audio playback and heat dissipation for the electronic device. Since the air exchange rate through the second sound outlet in the housing is greater when the second speaker is in its fourth state than when it is in its third state, the heat dissipation airflow in the fourth state is greater than in the third state, resulting in higher heat dissipation efficiency. In this case, the second speaker can function solely as a heat dissipation device without needing to perform audio playback. Attached Figure Description

[0057] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0058] Figure 2 yes Figure 1 A simplified schematic diagram illustrating one usage scenario of the electronic device shown.

[0059] Figure 3 yes Figure 1 An exploded schematic diagram of the casing of the electronic device shown.

[0060] Figure 4 It is along Figure 1 A schematic cross-sectional view of the first and second loudspeakers of the first embodiment obtained by cutting along section line AA;

[0061] Figure 5 yes Figure 1 A simplified schematic diagram of the structure of the first speaker of the electronic device shown.

[0062] Figure 6 It is along Figure 1 A simplified cross-sectional view of the first embodiment, showing the assembly of the first core and the first heat-conducting structure, obtained by cutting along section line AA.

[0063] Figure 7 yes Figure 6 A top view of the first core and the first heat-conducting structure assembled;

[0064] Figure 8 yes Figure 1 A simplified schematic diagram of a second speaker structure for the electronic device shown.

[0065] Figure 9 It is along Figure 1 A simplified cross-sectional diagram of the assembly of the second core and the second heat-conducting structure in the first embodiment, obtained by cutting along section line AA as shown;

[0066] Figure 10 yes Figure 9 A top view of the assembly of the second core and the second heat-conducting structure;

[0067] Figure 11 yes Figure 4 A simplified schematic diagram of airflow circulation between the first rear cavity of the first loudspeaker and the second rear cavity of the second loudspeaker;

[0068] Figure 12 It is along Figure 1 A schematic cross-sectional view of the first and second loudspeakers of the second embodiment obtained by cutting along section line AA;

[0069] Figure 13 It is along Figure 1 The diagram shows a partial cross-sectional view of the first and second loudspeakers of the third embodiment obtained by cutting along section line AA. Detailed Implementation

[0070] For ease of understanding, the terminology used in the embodiments of this application will be explained first.

[0071] And / or: This is simply a way of describing the relationship between related objects. It indicates that there can be three kinds of relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0072] Multiple: refers to two or more.

[0073] Connection: should be interpreted broadly. For example, the connection between A and B can be a direct connection between A and B, or an indirect connection between A and B through an intermediary.

[0074] The specific embodiments of this application will now be clearly described in conjunction with the accompanying drawings.

[0075] An embodiment of this application provides an electronic device.

[0076] Among these, electronic devices can be products with sound playback capabilities, such as mobile phones, tablets, laptops, wearable devices, and portable music players. Wearable devices can be smart bracelets, smartwatches, smart headsets, and smart glasses.

[0077] The following explanation will use a mobile phone as an example, but it should be understood that it is not limited to this.

[0078] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of the electronic device 100 provided in the embodiments of this application.

[0079] In the embodiments of this application, for ease of illustration, the length direction of the electronic device 100 is taken as the X direction, the width direction of the electronic device 100 is taken as the Y direction, and the thickness direction of the electronic device 100 is taken as the Z direction. The X, Y, and Z directions are perpendicular to each other.

[0080] The electronic device 100 may include a housing 10, a motherboard 20, a battery 30, a first speaker 40, and a second speaker 50. The housing 10 has a receiving space W, within which the motherboard 20, battery 30, first speaker 40, and second speaker 50 are all located. The first speaker 40 and second speaker 50 are located on opposite sides of the battery 30 and are arranged opposite each other along the X-direction. The motherboard 20 is electrically connected to the first speaker 40 and second speaker 50. Audio signals sent by the motherboard 20 are transmitted to the first speaker 40 and second speaker 50, and converted into sound waves (i.e., sound) by the first speaker 40 and second speaker 50 for external output.

[0081] The motherboard 20 is used to set up the electronic components of the electronic device 100 and to realize the electrical connections between the various electronic components. For example, the electronic components can be a system-on-chip (SOC), a graphics processing unit (GPU), or universal flash storage (UFS). The battery 30 provides power to the motherboard 20, the first speaker 40, the second speaker 50, etc. The first speaker 40 and the second speaker 50 (also referred to as "loudspeakers") are electroacoustic transducers that can convert audio signals such as music and speech into sound waves and support audio playback. The working principle of the first speaker 40 and the second speaker 50 is to use an energized element to drive the diaphragm to generate mechanical vibration, which pushes the surrounding air, causing the air to fluctuate, thereby realizing the conversion between "electricity-force-sound". The first speaker 40 and the second speaker 50 have dual functions of audio playback and heat dissipation. They are used not only to support audio playback, enabling the electronic device 100 to play audio externally, but also to dissipate heat from the electronic device 100, so that the whole device can maintain good heat dissipation performance.

[0082] For example, the motherboard 20 can be a rigid circuit board, a flexible printed circuit (FPC), or a rigid-flex circuit board. The battery 30 can be a nickel-cadmium battery, a nickel-metal hydride battery, a lithium battery, etc. The first speaker 40 and the second speaker 50 can be dynamic speakers, balanced armature speakers, hybrid speakers, electromagnetic speakers, inductive speakers, electrostatic speakers, planar speakers, and ribbon speakers, etc.

[0083] One possible implementation, such as Figure 1 As shown, the first speaker 40 and the second speaker 50 are located on opposite sides of the battery 30 and are arranged opposite each other in the opposite direction of the X-axis. Specifically, the first speaker 40 can be located at the top of the electronic device 100, the battery 30 can be located in the middle of the electronic device 100, and the second speaker 50 can be located at the bottom of the electronic device 100. The top of the electronic device 100 is positioned near the ear when the user holds the electronic device 100, and the bottom of the electronic device 100 is positioned near the mouth when the user holds the electronic device 100.

[0084] The mainboard 20 may include a first circuit board 21 and a second circuit board 22, which are located on opposite sides of the battery 30 along the X direction. The first circuit board 21 and the first speaker 40 may be located on the same side of the battery 30 and arranged adjacent to each other, with the first circuit board 21 electrically connected to the first speaker 40. The second circuit board 22 and the second speaker 50 may be located on the same side of the battery 30 and arranged adjacent to each other, with the second circuit board 22 electrically connected to the second speaker 50. The second circuit board 22 is also electrically connected to the first circuit board 21.

[0085] For example, the first circuit board 21 can be a main circuit board, and the second circuit board 22 can be a secondary circuit board. The first circuit board 21 can send audio signals to a first speaker 40 electrically connected to it, and transmit them via the second circuit board 22 to a second speaker 50 electrically connected to it. The first speaker 40 and the second speaker 50 convert the signals into sound waves and output them to produce sound. The first circuit board 21 and the second circuit board 22 can be connected to each other by means of a flexible circuit board, coaxial cable, etc., to achieve electrical connection between them.

[0086] It should be noted that, Figure 1 The connection relationships of the housing 10, motherboard 20, battery 30, first speaker 40, and second speaker 50 are only schematically described, and the structures illustrated in the embodiments of this application do not constitute a specific limitation on the electronic device 100. In other embodiments of this application, the electronic device 100 may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements.

[0087] Please see Figure 2 , Figure 2 yes Figure 1 This is a simplified schematic diagram illustrating one usage scenario of the electronic device 100. Figure 2 In the image, the dashed box on the left represents the area where the first speaker 40 is located, and the dashed box on the right represents the area where the second speaker 50 is located.

[0088] Understandably, on the one hand, the first speaker 40 and the second speaker 50, as electroacoustic conversion elements, enable the electronic device 100 to perform audio playback and allow the user to hear sound. Furthermore, by setting the first speaker 40 and the second speaker 50, and positioning them on the upper and lower sides of the electronic device 100 respectively, the electronic device 100, with its dual-speaker structure, can better achieve audio effects such as stereo sound, thereby improving the user experience.

[0089] On the other hand, as electroacoustic conversion elements, the first speaker 40 and the second speaker 50, besides effectively converting a portion of the electrical signal energy into sound, convert the remaining electrical signal energy into heat, causing heat to focus in the areas where the first speaker 40 and the second speaker 50 are located. In the case of audio external playback in the electronic device 100, for example... Figure 2 In the landscape grip scenario shown, if the area where the first speaker 40 and the area where the second speaker 50 are located are not cooled in time, hot spots may easily form in the area where the first speaker 40 and the second speaker 50 are located due to increased temperature, affecting the user's hand feel and user experience.

[0090] It should be understood that hot spots will form in the areas where the first speaker 40 and the second speaker 50 are located due to heat accumulation. Furthermore, the electronic device 100 has a high configuration density, high heat flux density, short internal heat conduction paths, and needs to adapt to the trend of thinner and lighter overall design. Therefore, there is insufficient structural space in the electronic device 100 to accommodate a cooling system to dissipate heat from the areas where the first speaker 40, the second speaker 50, and other areas of the device, resulting in uneven heat dissipation within the electronic device 100 and making localized areas prone to overheating. The gas circulation at the first speaker 40 and the second speaker 50 serves as a place in the whole machine where heat can be continuously exchanged. By utilizing the structural characteristics of the first speaker 40 and the second speaker 50, heat transfer paths are designed for the first speaker 40 and / or the second speaker 50. The heat generated in the area where the first speaker 40 is located, the heat generated in the area where the second speaker 50 is located, and even the heat generated by other components in the whole machine (such as the motherboard 20, battery 30, motor, etc.) are conducted to the outside of the electronic device 100 for dissipation through the heat transfer paths of the first speaker 40 and / or the second speaker 50. This effectively avoids heat accumulation inside the whole machine, can reduce the temperature of the whole machine to a certain extent, achieve heat exchange and cooling of the whole machine, and improve the working reliability of the electronic device 100.

[0091] Therefore, in the embodiments of this application, the first speaker 40 and the second speaker 50 can both function as electroacoustic conversion elements to output sound. The first speaker 40 and the second speaker 50 can also function as heat dissipation devices to cool their respective areas and even the entire device, thereby achieving good temperature uniformity. In other words, the first speaker 40 and the second speaker 50 can simultaneously achieve both audio playback and heat dissipation performance.

[0092] The following will use three embodiments, taking the first speaker 40 and the second speaker 50 as heat dissipation devices to heat the whole machine, to describe in detail the heat transfer path of the first speaker 40 and the second speaker 50. However, it should be understood that this is not a limitation.

[0093] First embodiment:

[0094] Please refer to the following: Figure 1 and Figure 3 , Figure 3 yes Figure 1 An exploded schematic diagram of the housing 10 of the electronic device 100 shown.

[0095] In this embodiment, the housing 10 may include a frame 11, a display module 12, and a back cover 13. The display module 12 and the back cover 13 are respectively connected to the two sides of the frame 11 and are arranged opposite to each other in the Z direction. The display module 12, the frame 11, and the back cover 13 can enclose a receiving space W forming the housing 10. When the electronic device 100 is a mobile phone, the frame 11 is the middle frame of the mobile phone. The display module 12 is the cover facing the user's face when the user holds the mobile phone, and it can be equipped with a display screen to display visual information such as images, colors, and text. The back cover 13 is the cover facing away from the user's face when the user holds the mobile phone, and it can be equipped with a camera module to act as a rear camera to capture still images or dynamic videos behind the mobile phone. Exemplarily, the material of the back cover 13 includes glass, plastic, or ceramic.

[0096] The housing 10 may have a first sound outlet 101 and a second sound outlet 102. The first sound outlet 101 of the housing 10 connects the receiving space W of the housing 10 and the outside of the housing 10. The first sound outlet 101 of the housing 10 not only allows the sound waves converted by the first speaker 40 to pass through, so as to conduct the sound waves converted by the first speaker 40 to the outside of the electronic device 100, realizing the audio playback function of the first speaker 40, but also allows the heat inside the electronic device 100 to pass through, so that the heat inside the electronic device 100 can pass through and dissipate to the outside of the electronic device 100, so as to dissipate heat for the whole device and realize the heat dissipation function of the first speaker 40.

[0097] The first sound outlet 101 can be located on the frame 11 and extend through the frame 11 along the thickness direction of the wall panel. Alternatively, the first sound outlet 101 can be located on the display module 12, such as in a non-display area of ​​the display module 12. Alternatively, the first sound outlet 101 can be formed by an assembly gap between a portion of the outer peripheral surface of the display module 12 and a portion of the inner peripheral surface of the frame 11. Alternatively, the first sound outlet 101 can be formed by a groove on a portion of the outer peripheral surface of the display module 12 and the inner peripheral surface of the frame 11.

[0098] For example, such as Figure 3 As shown, the first sound outlet 101 can be disposed on the frame 11 and located at the top of the frame 11 (i.e., the top of the electronic device 100), and extends through the top of the frame 11 in the X direction. The number of first sound outlets 101 can be one or more. When there are multiple first sound outlets 101, the multiple first sound outlets 101 can be arranged at intervals on the top of the frame 11.

[0099] It should be noted that the number, position, and shape of the first sound outlet 101 are not limited to the description above. They only need to be set on the housing 10 and be able to connect the inside of the electronic device 100 and the outside of the electronic device 100. There are no strict restrictions on this.

[0100] The second sound outlet 102 of the housing 10 is spaced apart from the first sound outlet 101 of the housing 10. The second sound outlet 102 of the housing 10 not only allows the sound waves converted by the second speaker 50 to pass through, so as to conduct the sound waves converted by the second speaker 50 to the outside of the electronic device 100, realizing the audio playback function of the second speaker 50, but also allows the heat inside the electronic device 100 to pass through, so that the heat inside the electronic device 100 can pass through and be dissipated to the outside of the electronic device 100, so as to dissipate heat for the whole device and realize the heat dissipation function of the second speaker 50.

[0101] The second sound outlet 102 can be located on the frame 11 and extend through the frame 11 along the thickness direction of the wall panel. Alternatively, the second sound outlet 102 can be located on the display module 12, such as in a non-display area of ​​the display module 12. Alternatively, the second sound outlet 102 can be formed by an assembly gap between a portion of the outer peripheral surface of the display module 12 and a portion of the inner peripheral surface of the frame 11. Alternatively, the second sound outlet 102 can be formed by a groove fitting between a portion of the outer peripheral surface of the display module 12 and the inner peripheral surface of the frame 11.

[0102] For example, such as Figure 1As shown, the second sound outlet 102 can be disposed on the frame 11 and located at the bottom of the frame 11 (i.e., the bottom of the electronic device 100), and extends through the bottom of the frame 11 in the X direction. The number of second sound outlets 102 can be one or more. When there are multiple second sound outlets 102, the multiple second sound outlets 102 can be arranged at intervals at the bottom of the frame 11.

[0103] It should be noted that the number, position, and shape of the second sound outlet 102 are not limited to those described above. They only need to be provided on the housing 10 and be able to connect the inside of the electronic device 100 and the outside of the electronic device 100. There are no strict restrictions on this.

[0104] Please see Figure 4 , Figure 4 It is along Figure 1 The diagram shows a partial cross-sectional schematic of the first speaker 40 and the second speaker 50 of the first embodiment, obtained by cutting along section line AA. Figure 4 In the diagram, each arrow represents the flow path of the airflow.

[0105] The first loudspeaker 40 is fixed to the housing 10 and located within the housing space W of the housing 10. The first loudspeaker 40 may include a first shell structure 41, a first core 42, and a first heat-conducting structure 43. The first shell structure 41 has a first acoustic cavity space Q. The first core 42 is located within the first acoustic cavity space Q of the first shell structure 41 and is electrically connected to the motherboard 20. The first core 42 is a transducer in the first loudspeaker 40 that can convert electrical signals into sound signals. Audio electrical energy can cause the diaphragm in the first core 42 to vibrate and resonate with the surrounding air through electromagnetic, piezoelectric, or electrostatic reactions, thereby producing sound. The first heat-conducting structure 43 is located within the first acoustic cavity space Q of the first shell structure 41. The first heat-conducting structure 43 can conduct heat from the first rear cavity Q2 to the first front cavity Q1, so that the heat from the first rear cavity Q2 can be dissipated to the outside of the electronic device 100 through the first sound outlet 101 of the housing 10. The first heat-conducting structure 43 can also prevent the first front cavity Q1 and the first rear cavity Q2 of the first loudspeaker 40 from conducting sound.

[0106] Please refer to the following: Figure 4 and Figure 5 , Figure 5 yes Figure 1 A simplified schematic diagram of the structure of the first speaker 40 of the electronic device 100 shown. Figure 5 In this illustration, the shape of the first speaker 40 is for convenience only and does not represent the actual shape of the first speaker 40.

[0107] In this embodiment, the first speaker 40 can be a single speaker unit. Alternatively, the first speaker 40 can also be a speaker module.

[0108] When the first loudspeaker 40 is a single loudspeaker unit, such as Figure 4 As shown, the first housing structure 41 of the first speaker 40 can be formed by the housing 10 of the electronic device 100 and other components of the electronic device 100 (such as the first enclosure structure 60 described below). In other words, at least a portion of the first housing structure 41 of the first speaker 40 is formed by the housing 10 of the electronic device 100.

[0109] When the first speaker 40 is a speaker module, such as Figure 5 As shown, the first shell structure 41 of the first speaker 40 can be an independent shell structure disposed in the receiving space W of the housing 10. This independent shell structure can accommodate the first core 42 and the first heat-conducting structure 43, so that the first speaker 40 can be assembled with other structures in the electronic device 100 in the form of a module. At this time, the first shell structure 41 can have a first connecting hole 411, which communicates with the first sound outlet 101 of the housing 10, so that the sound generated by the first speaker 40 can be propagated to the outside of the electronic device 100.

[0110] For example, the first connecting hole 411 of the first shell structure 41 is connected to the first sound outlet hole 101 of the shell 10. This can be achieved by forming a first sound guiding channel on the shell 10, with one end of the first sound guiding channel connected to the first connecting hole 411 of the first shell structure 41 and the other end connected to the first sound outlet hole 101 of the shell 10. This facilitates the transmission of sound from the first connecting hole 411 of the first shell structure 41 to the first sound outlet hole 101 of the shell 10 via the first sound guiding channel, and then from the first sound outlet hole 101 of the shell 10 to the outside of the electronic device 100.

[0111] The following explanation will take the first loudspeaker 40 as an example of a loudspeaker unit, but it should be understood that it is not limited to this.

[0112] Please see Figure 4 The first core 42 can divide the first acoustic cavity space Q of the first shell structure 41 into the first front cavity Q1 and the first rear cavity Q2 of the first speaker 40. The first front cavity Q1 and the first rear cavity Q2 of the first speaker 40 are independent of each other and acoustically isolated, that is, the first front cavity Q1 and the first rear cavity Q2 of the first speaker 40 will not be acoustically short-circuited.

[0113] The first front cavity Q1 of the first speaker 40 is located on the front side of the first core 42, and the front side of the first core 42 is the sound transmission side of the first core 42. The first front cavity Q1 of the first speaker 40 can communicate with the first sound outlet 101 of the housing 10. When the first core 42 is working, it can drive the air in the first front cavity Q1 to vibrate and produce sound, and the sound can be conducted to the outside of the electronic device 100 through the first sound outlet 101.

[0114] One possible implementation, such as Figure 4 As shown, the electronic device 100 may further include a first enclosure structure 60. The first enclosure structure 60 and the first core 42 are both fixed inside the housing 10, and the first enclosure structure 60 and the first core 42 together form a first front cavity Q1.

[0115] The first enclosure structure 60 can be a part of the structure of the housing 10, thereby enclosing the first core 42 with the housing 10 to form the first front cavity Q1. For example, the first core 42 can form the first front cavity Q1 with the display module 12. Alternatively, the first core 42 can form the first front cavity Q1 with the bezel 11. Alternatively, the first core 42 can form the first front cavity Q1 with the back cover 13.

[0116] The first enclosure structure 60 can also be an independent structural component, so that the first enclosure structure 60, the first core 42, and the housing 10 of the electronic device 100 together form the first front cavity Q1. Exemplarily, the first enclosure structure 60 can be foam, adhesive backing, etc. Of course, in other embodiments, when the first speaker 40 is a speaker module, the first front cavity Q1 can be the front cavity integrated into the speaker module; this is not strictly limited.

[0117] In this embodiment, the first rear cavity Q2 of the first loudspeaker 40 is located behind the first core 42, which is the side opposite to the sound transmission side of the first core 42. The first rear cavity Q2 of the first loudspeaker 40 can be used to balance the rearward vibration of the first core 42, avoiding noise generated by compressed air when the first core 42 vibrates rearward, which is beneficial to optimizing the audio effect of the first loudspeaker 40, preventing short circuits in the mid-low frequency range, and improving the smoothness of the sound. In addition, a first ventilation channel (not shown in the figure, but represented by two upward and two downward arrows on the rear side of the first core 42) is provided between the first rear cavity Q2 and the first core 42 to facilitate ventilation between the first core 42 and the first rear cavity Q2.

[0118] The first rear cavity Q2 of the first speaker 40 is an open rear cavity to increase the total volume of the first rear cavity Q2, improve the audio experience of the electronic device 100, and reduce the power consumption of the electronic device 100. Here, "open rear cavity Q2" means that the first rear cavity Q2 of the first speaker 40 is not a closed structure, but is connected to the receiving space W of the housing 10. This means that the total volume of the first rear cavity Q2 of the first speaker 40 is the sum of the original volume of the first rear cavity Q2 and the volume of the additionally enlarged receiving space W of the housing 10.

[0119] It is understandable that, according to the cavity design principle of the first speaker 40, the volume of the first rear cavity Q2 has a significant impact on low frequencies, acting as a high-pass filter. When the volume of the first rear cavity Q2 increases, the low-frequency resonant frequency decreases, and the low-frequency performance is significantly improved. Therefore, the volume of the first rear cavity Q2 should be increased as much as possible to maximize the low-frequency performance of the first speaker 40. Based on this, in the embodiments of this application, by setting the first rear cavity Q2 of the first speaker 40 as an open rear cavity, it can well adapt to the trend of thinner and lighter electronic devices 100 and the high sound quality requirements of the first speaker 40. For example, the total volume of the first rear cavity Q2 can be increased from 0.5cc (cubic centimeters) to 6cc-22cc (including the endpoint values ​​of 6cc and 22cc).

[0120] Of course, in other embodiments, the first rear cavity Q2 of the first loudspeaker 40 may also be a closed rear cavity, and there is no strict limitation on this.

[0121] In this embodiment, the first heat-conducting structure 43 can be located in the first core 42. The first heat-conducting structure 43 can conduct the heat from the first rear cavity Q2 entering the first core 42 via the first ventilation channel to the first front cavity Q1, so that the heat in the first rear cavity Q2 can be dissipated to the outside of the electronic device 100 through the first sound outlet 101 of the housing 10. The heat in the first rear cavity Q2 may include the heat focused by the first rear cavity Q2 itself and the heat generated by other components in the whole device. The first rear cavity Q2, the first core 42, the first heat-conducting structure 43, the first front cavity Q1, and the first sound outlet 101 of the housing 10 can cooperate to form a first heat-conducting channel. The first heat-conducting channel is used to conduct the hot air carrying heat in the first rear cavity Q2 to the outside of the electronic device 100, so as to dissipate heat from the electronic device 100.

[0122] Understandably, the first core 42 separates the first front cavity Q1 and the first rear cavity Q2 of the first speaker 40, and the part of the first core 42 that can be energized to generate movement (i.e., the first voice coil 425 mentioned below) is located close to the first rear cavity Q2. Furthermore, when the first core 42 performs electroacoustic conversion, a smaller portion of the electrical signal energy is effectively converted into sound, while a larger portion is converted into heat. This causes heat to easily accumulate in the first rear cavity Q2, resulting in the first rear cavity Q2 being hotter than the first front cavity Q1. Based on the principle of thermal expansion and contraction, the air in the first rear cavity Q2 will be hotter and expand, making the area where the first rear cavity Q2 is located prone to forming hot spots due to higher temperatures and causing an imbalance in air pressure between the first front cavity Q1 and the first rear cavity Q2.

[0123] Therefore, in this embodiment, by providing a first heat-conducting structure 43 on the first core 42, heat can be conducted between the first core 42 and the first front cavity Q1 through the first heat-conducting structure 43, while preventing acoustic communication between the first core 42 and the first front cavity Q1. Furthermore, since the first core 42 is connected to the first rear cavity Q2, the heat-conducting but not acoustically conductive structural characteristic of the first heat-conducting structure 43 allows the first rear cavity Q2 and the first front cavity Q1 to conduct heat while maintaining acoustic isolation. This allows heat in the first rear cavity Q2 to be conducted to the first front cavity Q1 via the first rear cavity Q2, the first core 42, and the first heat-conducting structure 43, while the air carrying heat in the first front cavity Q1 can be dissipated to the outside of the electronic device 100 through the first sound outlet 101 of the housing 10.

[0124] In this configuration, when the first core 42 performs electroacoustic conversion, it pushes the hot air in the first rear cavity Q2. The heat from the hot air in the first rear cavity Q2 can enter the first front cavity Q1 through the first core 42 and the first heat-conducting structure 43, causing the cold air in the first front cavity Q1 to carry heat and become hot air. Furthermore, based on the interaction of forces, the air in the first rear cavity Q2 also pushes the vibrating part of the first core 42 (i.e., the first diaphragm 424 hereinafter) to vibrate, thereby driving the hot air in the first front cavity Q1 carrying heat to exchange heat with the outside of the electronic device 100, enhancing the convection between the air in the first rear cavity Q2 and the outside air of the electronic device 100, and improving the heat dissipation efficiency of the first rear cavity Q2 of the first speaker 40. By utilizing the air circulation between the first speaker 40 inside the electronic device 100 and the outside of the electronic device 100, heat exchange and cooling can be achieved in the area where the first speaker 40 is located and even in the entire device. This can diversify the performance of the first speaker 40, enabling it to have both sound generation and heat dissipation functions, which is beneficial to improving the heat dissipation performance of the entire device. Furthermore, when the temperature of the first rear cavity Q2 is high, the first heat conduction channel can be used to depressurize the first rear cavity Q2, maintaining the air pressure balance between the first front cavity Q1 and the first rear cavity Q2, resulting in better reliability.

[0125] Please refer to the following: Figure 6 and Figure 7 , Figure 6 It is along Figure 1 The diagram shown is a simplified cross-sectional view of the first embodiment, obtained by cutting along section line AA, showing the assembly of the first core 42 and the first heat-conducting structure 43. Figure 7 yes Figure 6 The diagram shows a top view of the first core 42 and the first heat-conducting structure 43 assembled together.

[0126] The first core 42 may include a first support 421, a first vibration structure 422, and a first magnetic circuit structure 423. The first magnetic circuit structure 423 is used to generate a magnetic field. The first vibration structure 422 can vibrate under the action of this magnetic field, and drive the air in the first front cavity Q1 to vibrate, thereby outputting sound. The first support 421 serves as the basic support structure of the first core 42, used to support the first vibration structure 422 and fix the first magnetic circuit structure 423, so that the first vibration structure 422 vibrates stably and the first magnetic circuit structure 423 can generate a stable magnetic field.

[0127] Specifically, the first support 421 may be in the shape of an annular frame. One end of the first support 421 has a first opening (not shown) and a first cavity 4211, the first opening communicating with the first cavity 4211. The first cavity 4211 is used to accommodate the first magnetic circuit structure 423 and at least a portion of the first vibration structure 422. Exemplarily, the first support 421 may be made of metal, plastic, or a combination of metal and plastic.

[0128] The first magnetic circuit structure 423 is fixed to the first support 421 and located within the first cavity 4211 of the first support 421. The first magnetic circuit structure 423 may include a first central magnet 4231 and a first side magnet 4232. The first side magnet 4232 may be disposed around the periphery of the first central magnet 4231 and arranged circumferentially around the periphery of the first central magnet 4231. The first central magnet 4231 and the first side magnet 4232 may form a first magnetic gap 4233, which may be an annular gap. Exemplarily, the number of first side magnets 4232 may be one, with one first side magnet 4232 arranged around the periphery of the first central magnet 4231. Alternatively, the number of first side magnets 4232 may be multiple, with multiple first side magnets 4232 arranged circumferentially along the first central magnet 4231. Of course, in other embodiments, the first magnetic circuit structure 423 may also have only a first central magnet 4231, and this is not strictly limited.

[0129] The first vibrating structure 422 may include a first diaphragm 424 and a first voice coil 425. The first diaphragm 424 is fixed to one end of the first support 421 having a first opening and closes the first opening of the first support 421. The first diaphragm 424 may include a first inner surface 4241 and a first outer surface 4242. The first outer surface 4242 refers to the surface of the first diaphragm 424 that faces away from the interior of the first core 42, that is, the side of the first diaphragm 424 that vibrates and produces sound. The first inner surface 4241 refers to the surface that is disposed opposite to the first outer surface 4242 in the thickness direction of the first diaphragm 424, that is, the surface of the first diaphragm 424 that faces the first core 42.

[0130] The first diaphragm 424 separates the first front cavity Q1 and the first rear cavity Q2, and is capable of vibrating upward or downward along the thickness direction of the first diaphragm 424. In other words, the first core 42 can separate the first front cavity Q1 and the first rear cavity Q2 of the first speaker 40 by means of the first diaphragm 424, such that the first front cavity Q1 and the first rear cavity Q2 are respectively located on both sides of the first diaphragm 424, wherein the first outer surface 4242 of the first diaphragm 424 faces the first front cavity Q1, and the first inner surface 4241 of the first diaphragm 424 faces the first magnetic circuit structure 423. Exemplarily, the first diaphragm 424 and the first bracket 421 can be connected by means such as adhesive, snap-fit, welding or screw connection.

[0131] The first diaphragm 424 and the first support 421 together form the outer surface of the first core 42. The first diaphragm 424 may include a first dome 4243 and a first diaphragm body 4244. The strength of the first dome 4243 is greater than the strength of the first diaphragm body 4244. The strength of the first dome 4243 refers to its ability to resist damage by external forces, and the strength of the first diaphragm body 4244 refers to its ability to resist damage by external forces. For example, as... Figure 7 As shown, the area within the dashed box is the first dome 4243, and the area outside the dashed box is the first diaphragm body 4244.

[0132] The first diaphragm body 4244 can be a ring-shaped flexible structural member. The outer edge of the first diaphragm 424 is connected to the end face of the first support 421 having a first opening. The first dome 4243 can be a rigid structural member and is located in the area encircled by the first diaphragm body 4244. The outer edge of the first dome 4243 is connected to the inner edge of the first diaphragm body 4244, so that the first diaphragm body 4244 is connected to the outer periphery of the first dome 4243. The first diaphragm body 4244 can deform when subjected to external force, thereby causing the first dome 4243 to vibrate upward or downward along the thickness direction of the first diaphragm 424.

[0133] For example, the material of the first dome 4243 can be mica sheet, steel sheet, aluminum foil, aluminum-magnesium alloy, etc. The first diaphragm body 4244 and the first dome 4243 can be connected by assembly methods such as adhesive bonding or welding to form an integral structure. Alternatively, the first diaphragm body 4244 and the first dome 4243 can also be connected by a method such as integral molding to form an integral structure.

[0134] The first voice coil 425 is located within the first cavity 4211 of the first bracket 421 and is electrically connected to the main board 20. One end of the first voice coil 425 is connected to the first inner surface 4241 of the first diaphragm 424, and the other end of the first voice coil 425 can extend into the first magnetic gap 4233. Exemplarily, the first voice coil 425 can be connected to the first diaphragm body 4244 and / or the first dome 4243 of the first diaphragm 424, and the first voice coil 425 and the first diaphragm 424 can be connected by means such as adhesive, snap-fit, welding or screw connection.

[0135] Understandably, by extending one end of the first voice coil 425 into the first magnetic gap 4233, the first voice coil 425 can be placed in a stable magnetic field generated by the first magnetic circuit structure 423. When the first voice coil 425 is energized, it generates an induced magnetic field. The first magnetic circuit structure 423 responds to this induced magnetic field and applies a driving force to the first voice coil 425, causing the first voice coil 425 to displace under the magnetic drive of the first magnetic circuit structure 423. Since the other end of the first voice coil 425 is connected to the first diaphragm 424, the displacement of the first voice coil 425 can cause the first diaphragm 424 to vibrate. The vibration of the first diaphragm 424 can drive the air in the first front cavity Q1 to vibrate and generate sound waves. The sound waves generated by the vibrating air in the first front cavity Q1 can be exported to the outside of the electronic device 100 through the first sound outlet 101 to emit sounds that can be heard or cannot be heard by the human ear.

[0136] It should be noted that, as described above, a first ventilation channel is provided between the first core 42 and the first rear cavity Q2, connecting the two. This first ventilation channel can connect the first rear cavity Q2 and the first cavity 4211 of the first support 421. The first ventilation channel can be a hole formed on the first support 421, a hole formed on the first magnetic circuit structure 423, or formed by the assembly gap between the first magnetic circuit system and the first support 421, etc. It is only necessary that the first ventilation channel can connect the first core 42 and the first rear cavity Q2; the specific location and form of the first ventilation channel are not strictly limited.

[0137] In this embodiment, the first heat-conducting structure 43 can be formed within the first core 42. Alternatively, as... Figure 6 and Figure 7As shown, the first heat-conducting structure 43 can be a separate structure.

[0138] When the first heat-conducting structure 43 is formed within the first core 42, it can be formed from the first dome 4243 of the first diaphragm 424. The material of the first dome 4243 of the first diaphragm 424 can be a heat-conducting material with high thermal conductivity, such as mica or aluminum foil. In this configuration, heat accumulated on one side of the first inner surface 4241 of the first diaphragm 424 can be conducted to the one side of the first outer surface 4242 of the first diaphragm 424 via vibration, thus transferring heat from the first rear cavity Q2 to the first front cavity Q1. Subsequently, the vibration of the first diaphragm 424 can drive the flow of hot air carrying heat in the first front cavity Q1, thereby accelerating the convection circulation with the cold air outside the electronic device 100 and achieving heat exchange and cooling of the electronic device 100.

[0139] When the first heat-conducting structure 43 is a separate structure, it allows air conduction between the first front cavity Q1 and the first rear cavity Q2, while preventing acoustic conduction between them. The following detailed explanation will use the example of the first heat-conducting structure 43 being a separate structure, but it should be understood that this is not a limitation.

[0140] Please refer to the following: Figure 6 and Figure 7 The first thermally conductive structure 43 may include a first breathable membrane 432 and a plurality of first perforations 431.

[0141] Multiple first perforations 431 are spaced apart on the first dome 4243 of the first diaphragm 424. Each first perforation 431 penetrates the first dome 4243 along its thickness direction and connects the first core 42 and the first front cavity Q1. Each first perforation 431 can be used to allow gas flowing from the first rear cavity Q2 into the first core 42 to pass through.

[0142] It is understandable that the first dome 4243 of the first diaphragm 424 is the part of the first diaphragm 424 with greater strength and stiffness. By setting multiple first perforations 431 on the first dome 4243 of the first diaphragm 424, the first diaphragm 424 can have both vibration and gas supply functions without compromising the vibration stability of the first diaphragm 424.

[0143] Exemplarily, a plurality of first perforations 431 may be located in the central region of the first dome 4243. The ratio of the total area of ​​the plurality of first perforations 431 to the area of ​​the first dome 4243 may be in the range of 10%-80% (inclusive of the endpoint values ​​of 10% and 80%). The plurality of first perforations 431 may be arranged in an array, and each first perforation 431 may be a micropore, thereby forming an array of micropores. By setting a plurality of first perforations 431 and making the first perforations 431 a micropore structure, excessive weakening of the structure of the first diaphragm 424 can be avoided, thereby improving the strength and structural stiffness of the first diaphragm 424 while achieving air conduction between the first core 42 and the first front cavity Q1, and facilitating airflow. Of course, in other embodiments, the number of first perforations 431 may also be one. The shape of the first perforation 431 may also be other shapes such as circles or polygons. This embodiment does not impose strict requirements on the shape, number, position, and size of the first perforations 431.

[0144] A first breathable membrane 432 is connected to the surface of the first dome 4243 facing the first front cavity Q1 and covers a plurality of first perforations 431. The first breathable membrane 432 allows airflow between the first front cavity Q1 and the first core 42, while preventing acoustic flow between them, thereby preventing acoustic flow between the first front cavity Q1 and the first rear cavity Q2. The first breathable membrane 432 is a high-polymer waterproof material that allows air to pass through while blocking water and sound. In other words, the first breathable membrane 432 allows for smooth and gentle airflow (including cold and hot air) between the first core 42 and the first front cavity Q1, and prevents acoustic short-circuiting between the first front cavity Q1 and the first rear cavity Q2.

[0145] For example, the first breathable membrane 432 can be a TPU (Thermoplastic polyurethanes) expanded film, a PE (polyethylene) film, a PET (Polyethylene terephthalate) film, a PTFE (Polytetrafluoroethylene) expanded film, etc. Of course, the first breathable membrane 432 in this embodiment is not limited to the materials listed above; any solid membrane layer formed from materials with waterproof, breathable, and sound-insulating functions is within the scope of protection claimed in this embodiment. The first breathable membrane 432 and the first dome 4243 can be fixed by adhesive bonding.

[0146] Understandably, the first breathable membrane 432 can cover the opening of each first perforation 431 located on the first outer surface 4242 side of the first diaphragm 424, thereby completely blocking the opening of each first perforation 431 located on the first outer surface 4242 side of the first diaphragm 424. In this configuration, the high-temperature airflow flowing out through the first core 42 can reach the first breathable membrane 432 after passing through the first perforation 431 and pass through it. However, water and sound waves flowing out through the first core 42 are blocked by the first breathable membrane 432 and cannot pass through.

[0147] Of course, in other embodiments, the first breathable membrane 432 may also be connected to the surface of the first dome 4243 facing the first rear cavity Q2 and cover the plurality of first perforations 431. Specifically, the first breathable membrane 432 may cover the opening of each first perforation 431 located on one side of the first inner surface 4241 of the first diaphragm 424. Alternatively, the first heat-conducting structure 43 may not be a structure in which the first breathable membrane 432 and the plurality of first perforations 431 are combined, but rather a breathable material such as a breathable membrane, breathable mesh, or sound-absorbing cotton is attached, as long as it can enable air conduction between the first front cavity Q1 and the first core 42 and prevent sound conduction between the two, there is no strict limitation on this.

[0148] Please see Figure 4 The second speaker 50 is fixed to the housing 10 and located within the housing 10's receiving space W. The second speaker 50 is positioned opposite the first speaker 40 in the X direction. The second speaker 50 may include a second housing structure 51, a second core 52, and a second heat-conducting structure 53. The second housing structure 51 has a second acoustic cavity space K. The second core 52 is located within the second acoustic cavity space K of the second housing structure 51 and is electrically connected to the motherboard 20. The second core 52 is a transducer in the second speaker 50 that converts electrical signals into sound signals. Audio electrical energy can cause the diaphragm in the second core 52 to vibrate and resonate with the surrounding air through electromagnetic, piezoelectric, or electrostatic reactions, thereby producing sound. The second heat-conducting structure 53 is located within the second acoustic cavity space K of the second housing structure 51. The second heat-conducting structure 53 can conduct heat from the second rear cavity K2 to the second front cavity K1, so that the heat from the second rear cavity K2 can be dissipated to the outside of the electronic device 100 through the second sound outlet 102 of the housing 10. The second heat-conducting structure 53 can also prevent the second front cavity K1 and the second rear cavity K2 of the second speaker 50 from conducting acoustically.

[0149] Please refer to the following: Figure 4 and Figure 8 , Figure 8 yes Figure 1 A simplified schematic diagram of the structure of the second speaker 50 of the electronic device 100 shown. Figure 8In this illustration, the shape of the second speaker 50 is for convenience only and does not represent the actual shape of the second speaker 50.

[0150] In this embodiment, the second speaker 50 can be a single speaker unit. Alternatively, the second speaker 50 can also be a speaker module.

[0151] When the second speaker 50 is a single speaker unit, such as Figure 4 As shown, the second shell structure 51 of the second speaker 50 can be formed by the housing 10 of the electronic device 100 and other components of the electronic device 100 (such as the second enclosure structure 70 described below). In other words, at least a portion of the second shell structure 51 of the second speaker 50 is formed by the housing 10 of the electronic device 100.

[0152] When the second speaker 50 is a speaker module, such as Figure 8 As shown, the second shell structure 51 of the second speaker 50 can be an independent shell structure disposed in the receiving space W of the housing 10. This independent shell structure can accommodate the second core 52 and the second heat-conducting structure 53, so that the second speaker 50 can be assembled with other structures in the electronic device 100 in the form of a module. At this time, the second shell structure 51 can have a second connecting hole 511, which communicates with the second sound outlet hole 102 of the housing 10, so that the sound generated by the second speaker 50 can be propagated to the outside of the electronic device 100.

[0153] For example, the second connecting hole 511 of the second shell structure 51 is connected to the second sound outlet hole 102 of the shell 10. This can be achieved by forming a second sound guiding channel on the shell 10, with one end of the second sound guiding channel connected to the second connecting hole 511 of the second shell structure 51 and the other end connected to the second sound outlet hole 102 of the shell 10. This facilitates the transmission of sound from the second connecting hole 511 of the second shell structure 51 to the second sound outlet hole 102 of the shell 10 via the second sound guiding channel, and then from the second sound outlet hole 102 of the shell 10 to the outside of the electronic device 100.

[0154] The following explanation will use the second speaker 50 as an example of a speaker unit, but it should be understood that it is not limited to this.

[0155] Please see Figure 4 The second core 52 can divide the second acoustic cavity space K of the second shell structure 51 into the second front cavity K1 of the second speaker 50 and the second rear cavity K2 of the second speaker 50. The second front cavity K1 of the second speaker 50 and the second rear cavity K2 of the second speaker 50 are independent of each other and acoustically isolated, that is, the second front cavity K1 of the second speaker 50 and the second rear cavity K2 of the second speaker 50 will not be acoustically short-circuited.

[0156] The second front cavity K1 of the second speaker 50 is located on the front side of the second core 52, and the front side of the second core 52 is the sound transmission side of the second core 52. The second front cavity K1 of the second speaker 50 can communicate with the second sound outlet 102 of the housing 10. When the second core 52 is working, it can drive the air in the second front cavity K1 to vibrate and produce sound, which can be conducted to the outside of the electronic device 100 through the second sound outlet 102.

[0157] One possible implementation, such as Figure 4 As shown, the electronic device 100 may further include a second enclosure structure 70. The second enclosure structure 70 and the second core 52 are both fixed inside the housing 10, and the second enclosure structure 70 and the second core 52 together form a second front cavity K1.

[0158] The second enclosure structure 70 can be a part of the structure of the housing 10, thereby enclosing the second core 52 with the housing 10 to form the second front cavity K1. For example, the second core 52 can form the second front cavity K1 with the display module 12. Alternatively, the second core 52 can form the second front cavity K1 with the frame 11. Alternatively, the second core 52 can form the second front cavity K1 with the back cover 13.

[0159] The second enclosure structure 70 can also be an independent structural component, so that the second enclosure structure 70, the second core 52, and the housing 10 of the electronic device 100 together form the second front cavity K1. Exemplarily, the second enclosure structure 70 can be foam, adhesive backing, etc. Of course, in other embodiments, when the second speaker 50 is a speaker module, the second front cavity K1 can be the front cavity integrated into the speaker module; this is not strictly limited.

[0160] In this embodiment, the second rear cavity K2 of the second speaker 50 is located behind the second core 52, which is the side opposite to the sound transmission side of the second core 52. The second rear cavity K2 of the second speaker 50 can be used to balance the rearward vibration of the second core 52, avoiding noise generated by compressed air when the second core 52 vibrates rearward. This helps to optimize the audio effect of the second speaker 50, prevent short circuits in the mid-low frequencies, and improve the smoothness of the sound. In addition, a second ventilation channel (not shown in the figure, but represented by two upward and two downward arrows on the rear side of the second core 52) is provided between the second rear cavity K2 and the second core 52 to facilitate ventilation between the second core 52 and the second rear cavity K2.

[0161] The second rear cavity K2 of the second speaker 50 is an open rear cavity to increase the total volume of the second rear cavity K2, improve the audio experience of the electronic device 100, and reduce the power consumption of the electronic device 100. Here, "open rear cavity K2" means that the second rear cavity K2 of the second speaker 50 is not a closed structure, but is connected to the receiving space W of the housing 10. This means that the total volume of the second rear cavity K2 of the second speaker 50 is the sum of the original volume of the second rear cavity K2 and the volume of the additionally enlarged receiving space W of the housing 10.

[0162] It is understandable that, based on the cavity design principle of the second speaker 50, the volume of the second rear cavity K2 has a significant impact on low frequencies, acting as a high-pass filter. When the volume of the second rear cavity K2 increases, the low-frequency resonant frequency decreases, and the low-frequency performance is significantly improved. Therefore, the volume of the second rear cavity K2 should be increased as much as possible to maximize the low-frequency performance of the second speaker 50. Based on this, in the embodiments of this application, by setting the second rear cavity K2 of the second speaker 50 as an open rear cavity, it can well adapt to the trend of thinner and lighter electronic devices 100 and the high sound quality requirements of the second speaker 50. For example, the total volume of the second rear cavity K2 can be increased from 0.5cc (cubic centimeters) to 6cc-22cc (including the endpoint values ​​of 6cc and 22cc).

[0163] Of course, in other embodiments, the second rear cavity K2 of the second speaker 50 may also be a closed rear cavity, and there is no strict limitation on this.

[0164] In this embodiment, the second heat-conducting structure 53 can be located in the second core 52. The second heat-conducting structure 53 can conduct the heat from the second rear cavity K2 entering the second core 52 via the second ventilation channel to the second front cavity K1, so that the heat in the second rear cavity K2 can be dissipated to the outside of the electronic device 100 through the second sound outlet 102 of the housing 10. The heat in the second rear cavity K2 may include the heat focused by the second rear cavity K2 itself and the heat generated by other components in the whole device. The second rear cavity K2, the second core 52, the second heat-conducting structure 53, the second front cavity K1, and the second sound outlet 102 of the housing 10 can cooperate to form a second heat-conducting channel. The second heat-conducting channel is used to conduct the hot air carrying heat in the second rear cavity K2 to the outside of the electronic device 100, so as to dissipate heat from the electronic device 100.

[0165] Understandably, the second core 52 separates the second front cavity K1 and the second rear cavity K2 of the second speaker 50, and the part of the second core 52 that can be energized and move (i.e., the second voice coil 525 mentioned below) is located close to the second rear cavity K2. Furthermore, because the second core 52 converts electrical signal energy into sound during electroacoustic conversion, a smaller portion of the electrical signal energy is effectively converted into sound, while a larger portion is converted into heat. This causes heat to easily accumulate in the second rear cavity K2, resulting in the second rear cavity K2 being hotter than the second front cavity K1. Based on the principle of thermal expansion and contraction, the air in the second rear cavity K2 will be hotter and expand, making the area where the second rear cavity K2 is located prone to forming hot spots due to higher temperatures and causing an imbalance in air pressure between the second front cavity K1 and the second rear cavity K2.

[0166] Therefore, in this embodiment, by providing a second heat-conducting structure 53 on the second core 52, heat can be conducted between the second core 52 and the second front cavity K1 through the second heat-conducting structure 53, while preventing acoustic communication between the second core 52 and the second front cavity K1. Furthermore, since the second core 52 is connected to the second rear cavity K2, the heat-conducting but not sound-conducting structural characteristic of the second heat-conducting structure 53 allows the second rear cavity K2 and the second front cavity K1 to conduct heat while maintaining acoustic isolation. This allows heat in the second rear cavity K2 to be conducted to the second front cavity K1 via the second rear cavity K2, the second core 52, and the second heat-conducting structure 53, while the air carrying heat in the second front cavity K1 can be dissipated to the outside of the electronic device 100 through the second sound outlet 102 of the housing 10.

[0167] In this configuration, when the second core 52 performs electroacoustic conversion, it pushes the hot air in the second rear cavity K2. The heat from the hot air in the second rear cavity K2 can enter the second front cavity K1 through the second core 52 and the second heat-conducting structure 53, causing the cold air in the second front cavity K1 to carry the heat and become hot air. Furthermore, based on the interaction of forces, the air in the second rear cavity K2 also pushes the vibrating part of the second core 52 (i.e., the second diaphragm 524 hereinafter) to vibrate, thereby driving the hot air in the second front cavity K1 carrying heat to exchange heat with the outside of the electronic device 100, enhancing the convection between the air in the second rear cavity K2 and the outside air of the electronic device 100, and improving the heat dissipation efficiency of the second rear cavity K2 of the second speaker 50. By utilizing the second speaker 50 inside the electronic device 100 and the gas circulation outside the electronic device 100, heat exchange and cooling can be achieved in the area where the second speaker 50 is located and even in the whole device. This can diversify the performance of the second speaker 50, enabling it to have the dual functions of sound generation and heat dissipation, which is beneficial to improving the heat dissipation performance of the whole device. Furthermore, when the temperature of the second rear cavity K2 is high, the pressure of the second rear cavity K2 can be relieved through the second heat conduction channel, maintaining the air pressure balance between the second front cavity K1 and the second rear cavity K2, resulting in better reliability.

[0168] Please refer to the following: Figure 9 and Figure 10 , Figure 9 It is along Figure 1 The diagram shows a simplified cross-sectional view of the assembly of the second core 52 and the second heat-conducting structure 53 in the first embodiment, obtained by cutting along section line AA. Figure 10 yes Figure 9 The diagram shows a top view of the assembly of the second core 52 and the second heat-conducting structure 53.

[0169] The second core 52 may include a second support 521, a second vibration structure 522, and a second magnetic circuit structure 523. The second magnetic circuit structure 523 is used to generate a magnetic field. The second vibration structure 522 can vibrate under the action of this magnetic field, and drive the air in the second front cavity K1 to vibrate, thereby outputting sound. The second support 521 serves as the basic support structure of the second core 52, used to support the second vibration structure 522 and fix the second magnetic circuit structure 523, so that the second vibration structure 522 vibrates stably and the second magnetic circuit structure 523 can generate a stable magnetic field.

[0170] Specifically, the second support 521 may be in the shape of an annular frame. One end of the second support 521 has a second opening (not shown) and a second cavity 5211, the second opening communicating with the second cavity 5211, the second cavity 5211 being used to accommodate the second magnetic circuit structure 523 and at least a portion of the second vibration structure 522. Exemplarily, the second support 521 may be made of metal, plastic, or a combination of metal and plastic.

[0171] The second magnetic circuit structure 523 is fixed to the second support 521 and located within the second cavity 5211 of the second support 521. The second magnetic circuit structure 523 may include a second central magnet 5231 and second side magnets 5232. The second side magnets 5232 may be disposed around the periphery of the second central magnet 5231 and arranged circumferentially around its periphery. The second central magnet 5231 and the second side magnets 5232 may form a second magnetic gap 5233, which may be an annular gap. Exemplarily, the number of second side magnets 5232 may be one, with one second side magnet 5232 surrounding the periphery of the second central magnet 5231. Alternatively, the number of second side magnets 5232 may be multiple, with multiple second side magnets 5232 arranged circumferentially along the second central magnet 5231. Of course, in other embodiments, the second magnetic circuit structure 523 may only have a second central magnet 5231; this is not strictly limited.

[0172] The second vibrating structure 522 may include a second diaphragm 524 and a second voice coil 525. The second diaphragm 524 is fixed to one end of the second support 521 having a second opening and closes the second opening of the second support 521. The second diaphragm 524 may include a second inner surface 5241 and a second outer surface 5242. The second outer surface 5242 refers to the surface of the second diaphragm 524 that faces away from the interior of the second core 52, that is, the side surface of the second diaphragm 524 that vibrates and produces sound. The second inner surface 5241 refers to the surface that is disposed opposite to the second outer surface 5242 in the thickness direction of the second diaphragm 524, that is, the surface of the second diaphragm 524 that faces the second core 52.

[0173] The second diaphragm 524 separates the second front cavity K1 and the second rear cavity K2, and is capable of vibrating upwards or downwards along the thickness direction of the second diaphragm 524. In other words, the second core 52 can separate the second front cavity K1 and the second rear cavity K2 of the second speaker 50 by means of the second diaphragm 524, such that the second front cavity K1 and the second rear cavity K2 are respectively located on both sides of the second diaphragm 524, wherein the second outer surface 5242 of the second diaphragm 524 faces the second front cavity K1, and the second inner surface 5241 of the second diaphragm 524 faces the second magnetic circuit structure 523. Exemplarily, the second diaphragm 524 and the second bracket 521 can be connected by means such as adhesive, snap-fit, welding or screw connection.

[0174] The second diaphragm 524 and the second support 521 together form the outer surface of the second core 52. The second diaphragm 524 may include a second dome 5243 and a second diaphragm body 5244. The strength of the second dome 5243 is greater than the strength of the second diaphragm body 5244. The strength of the second dome 5243 refers to its ability to resist damage from external forces, and the strength of the second diaphragm body 5244 refers to its ability to resist damage from external forces. For example, as... Figure 7 As shown, the area within the dashed box is the second dome 5243, and the area outside the dashed box is the second diaphragm body 5244.

[0175] The second diaphragm body 5244 can be a ring-shaped flexible structural member. The outer edge of the second diaphragm 524 is connected to the end face of the second support 521 having a second opening. The second dome 5243 can be a rigid structural member and is located within the area encircled by the second diaphragm body 5244. The outer edge of the second dome 5243 is connected to the inner edge of the second diaphragm body 5244, so that the second diaphragm body 5244 is connected to the outer periphery of the second dome 5243. The second diaphragm body 5244 can deform when subjected to external force, thereby causing the second dome 5243 to vibrate upward or downward along the thickness direction of the second diaphragm 524.

[0176] For example, the material of the second dome 5243 can be mica sheet, steel sheet, aluminum foil, aluminum-magnesium alloy, etc. The second diaphragm body 5244 and the second dome 5243 can be connected by assembly methods such as adhesive bonding or welding to form an integral structure. Alternatively, the second diaphragm body 5244 and the second dome 5243 can also be connected by a method such as integral molding to form an integral structure.

[0177] The second voice coil 525 is located within the second cavity 5211 of the second bracket 521 and is electrically connected to the main board 20. One end of the second voice coil 525 is connected to the second inner surface 5241 of the second diaphragm 524, and the other end of the second voice coil 525 can extend into the second magnetic gap 5233. Exemplarily, the second voice coil 525 can be connected to the second diaphragm body 5244 and / or the second dome 5243 of the second diaphragm 524, and the second voice coil 525 and the second diaphragm 524 can be connected by means such as adhesive, snap-fit, welding or screw connection.

[0178] Understandably, by extending one end of the second voice coil 525 into the second magnetic gap 5233, the second voice coil 525 can be placed in a stable magnetic field generated by the second magnetic circuit structure 523. When the second voice coil 525 is energized, it generates an induced magnetic field. The second magnetic circuit structure 523 responds to this induced magnetic field and applies a driving force to the second voice coil 525, causing it to displace under the magnetic drive of the second magnetic circuit structure 523. Since the other end of the second voice coil 525 is connected to the second diaphragm 524, the displacement of the second voice coil 525 can cause the second diaphragm 524 to vibrate. The vibration of the second diaphragm 524 can drive the air in the second front cavity K1 to vibrate and generate sound waves. The sound waves generated by the vibrating air in the second front cavity K1 can be exported to the outside of the electronic device 100 through the second sound outlet 102 to emit sounds that can be heard or cannot be heard by the human ear.

[0179] It should be noted that, as described above, a second ventilation channel is provided between the second core 52 and the second rear cavity K2, connecting the two. This second ventilation channel can connect the second rear cavity K2 and the second cavity 5211 of the second support 521. The second ventilation channel can be a hole in the second support 521, a hole in the second magnetic circuit structure 523, or formed by the assembly gap between the second magnetic circuit system and the second support 521, etc. It is only necessary that the second ventilation channel can connect the second core 52 and the second rear cavity K2; the specific location and form of the second ventilation channel are not strictly limited.

[0180] In this embodiment, the second heat-conducting structure 53 can be formed within the second core 52. Alternatively, as... Figure 9 and Figure 10As shown, the second heat-conducting structure 53 can be a separate structure.

[0181] When the second heat-conducting structure 53 is formed within the second core 52, the second heat-conducting structure 53 can be formed by the second dome 5243 of the second diaphragm 524. The material of the second dome 5243 of the second diaphragm 524 can be a heat-conducting material with high thermal conductivity, such as mica or aluminum foil. In this configuration, heat accumulated on one side of the second inner surface 5241 of the second diaphragm 524 can be conducted to one side of the second outer surface 5242 of the second diaphragm 524 via the vibration of the second diaphragm 524, realizing the conduction of heat from the second rear cavity K2 to the second front cavity K1. Subsequently, the vibration of the second diaphragm 524 can drive the flow of hot air carrying heat in the second front cavity K1, thereby accelerating the convection circulation with the cold air outside the electronic device 100, achieving heat exchange and cooling of the electronic device 100.

[0182] When the second heat-conducting structure 53 is a separate structure, it allows air communication between the second front cavity K1 and the second rear cavity K2, while preventing acoustic communication between them. The following detailed explanation will use the example of the second heat-conducting structure 53 being a separate structure, but it should be understood that this is not a limitation.

[0183] Please refer to the following: Figure 9 and Figure 10 The second thermally conductive structure 53 may include a second breathable membrane 532 and a plurality of second perforations 531.

[0184] Multiple second perforations 531 are spaced apart on the second dome 5243 of the second diaphragm 524. Each second perforation 531 penetrates the second dome 5243 along its thickness direction and connects to the second core 52 and the second front cavity K1. Each second perforation 531 can be used to allow gas flowing from the second rear cavity K2 into the second core 52 to pass through.

[0185] It is understandable that the second dome 5243 of the second diaphragm 524 is the part of the second diaphragm 524 with greater strength and stiffness. By setting multiple second perforations 531 on the second dome 5243 of the second diaphragm 524, the second diaphragm 524 can have both vibration and gas supply functions without compromising the vibration stability of the second diaphragm 524.

[0186] Exemplarily, a plurality of second perforations 531 may be located in the central region of the second dome 5243. The ratio of the total area of ​​the plurality of second perforations 531 to the area of ​​the second dome 5243 may be in the range of 10%-80% (inclusive of the endpoint values ​​of 10% and 80%). The plurality of second perforations 531 may be arranged in an array, and each second perforation 531 may be a micropore, thereby forming an array of micropores. By setting a plurality of second perforations 531 and making the second perforations 531 a micropore structure, excessive weakening of the structure of the second diaphragm 524 can be avoided, thereby improving the strength and structural stiffness of the second diaphragm 524 while achieving air conduction between the second core 52 and the second front cavity K1, and facilitating airflow. Of course, in other embodiments, the number of second perforations 531 may also be one. The shape of the second perforation 531 may also be other shapes such as circles or polygons. This embodiment does not impose strict requirements on the shape, number, position, and size of the second perforations 531.

[0187] The second breathable membrane 532 is connected to the surface of the second dome 5243 facing the second front cavity K1 and covers a plurality of second perforations 531. The second breathable membrane 532 allows air to pass through the second front cavity K1 and the second core 52, and prevents acoustic communication between the second front cavity K1 and the second core 52, thereby preventing acoustic communication between the second front cavity K1 and the second rear cavity K2. The second breathable membrane 532 is a high-polymer waterproof material that allows air to pass through while preventing water and sound from passing through. In other words, the second breathable membrane 532 can be used to allow air (including cold and hot air) to flow smoothly and gently between the second core 52 and the second front cavity K1, and to prevent acoustic short-circuiting between the second front cavity K1 and the second rear cavity K2.

[0188] For example, the second breathable membrane 532 can be a TPU (Thermoplastic polyurethanes) expanded film, a PE (polyethylene) film, a PET (Polyethylene terephthalate) film, a PTFE (Polytetrafluoroethylene) expanded film, etc. Of course, the second breathable membrane 532 in this embodiment is not limited to the materials listed above; any solid membrane layer formed from materials with waterproof, breathable, and sound-insulating functions is within the scope of protection claimed in this embodiment. The second breathable membrane 532 and the second dome 5243 can be fixed by adhesive bonding.

[0189] Understandably, the second breathable membrane 532 can cover the opening of each second perforation 531 located on the second outer surface 5242 side of the second diaphragm 524, thereby completely blocking the opening of each second perforation 531 located on the second outer surface 5242 side of the second diaphragm 524. In this configuration, the high-temperature airflow flowing out through the second core 52 can reach the second breathable membrane 532 after passing through the second perforation 531 and pass through it. However, water and sound waves flowing out through the second core 52 are blocked by the second breathable membrane 532 and cannot pass through.

[0190] Of course, in other embodiments, the second breathable membrane 532 may also be connected to the surface of the second dome 5243 facing the second rear cavity K2 and cover the plurality of second perforations 531. Specifically, the second breathable membrane 532 may cover the opening of each second perforation 531 located on one side of the second outer surface 5242 of the second diaphragm 524. Alternatively, the second heat-conducting structure 53 may not be a structure in which the second breathable membrane 532 and the plurality of second perforations 531 are combined, but rather a breathable material such as a breathable membrane, breathable mesh, or sound-absorbing cotton is attached, as long as it can enable air conduction between the second front cavity K1 and the second core 52 and prevent sound conduction between the two, there is no strict limitation on this.

[0191] Please refer to the following: Figure 4 and Figure 11 , Figure 11 yes Figure 4 A simplified schematic diagram of the airflow circulation between the first rear cavity Q2 of the first loudspeaker 40 and the second rear cavity K2 of the second loudspeaker 50. Figure 11 In the diagram, the dashed lines represent airflow, and the arrows indicate the direction of airflow.

[0192] In this embodiment, the first rear cavity Q2 of the first speaker 40 and the second rear cavity K2 of the second speaker 50 are connected to form a rear acoustic cavity T. The rear acoustic cavity T can be a shared rear cavity for the first speaker 40 and the second speaker 50. The first diaphragm 424 of the first core 42 and / or the second diaphragm 524 of the second core 52 vibrate to cause airflow within the rear acoustic cavity T. In other words, the vibration of the first diaphragm 424 of the first core 42 and / or the second diaphragm 524 of the second core 52 can cause airflow to circulate within the entire device.

[0193] For example, the first rear cavity Q2 of the first speaker 40 and the second rear cavity K2 of the second speaker 50 can be interconnected through one or more of the following: the gap between the motherboard 20 and the rear cover 13; the gap between the display module 12 and the frame 11; the gap between the frame 11 and the rear cover 13; the gap between the battery 30 and the frame 11; the gap between the battery 30 and the battery 30 baffle; and the gap between the battery 30 and the rear cover 13. Of course, this embodiment is not limited to the structures listed above. Any implementation that satisfies the requirement of communication between the first rear cavity Q2 of the first speaker 40 and the second rear cavity K2 of the second speaker 50 is within the scope of protection claimed in this embodiment, and no strict limitation is imposed.

[0194] It is understandable that the vibration of the first diaphragm 424 will cause airflow in the first front cavity Q1 and the first rear cavity Q2, and the vibration of the second diaphragm 524 will cause airflow in the second front cavity K1 and the second rear cavity K2. Furthermore, since the first rear cavity Q2 of the first speaker 40 and the second rear cavity K2 of the second speaker 50 are both open rear cavities, and the first rear cavity Q2 of the first speaker 40 and the second rear cavity K2 of the second speaker 50 are connected to form the rear acoustic cavity T.

[0195] Therefore, when the first diaphragm 424 and / or the second diaphragm 524 vibrate, gas exchange can be achieved between the first rear cavity Q2 of the first speaker 40 and the second rear cavity K2 of the second speaker 50. The airflow circulates within the rear acoustic cavity T formed by the vibration of the first diaphragm 424 and / or the second diaphragm 524, allowing for uniform heat distribution within the device and thus reducing the overall body temperature, achieving good temperature uniformity for the electronic device 100. Furthermore, the air circulation driven by the first rear cavity Q2 of the first speaker 40 and the second rear cavity K2 of the second speaker 50 can send heat from the rear acoustic cavity T into the first front cavity Q1 via the first heat-conducting structure 43 and into the second front cavity K1 via the second heat-conducting structure 53. Subsequently, the heat is dissipated to the outside of the electronic device 100 through the first sound outlet 101 of the housing 10 connected to the first front cavity Q1 and the second sound outlet 102 of the housing 10 connected to the second front cavity K1. The corresponding air pressure change will also cause cold air from the outside to enter the first front cavity Q1 and the second front cavity K1, realizing the convection circulation of air inside and outside the electronic device 100, and thus achieving heat dissipation of the whole machine through repeated circulation.

[0196] In this configuration, the first speaker 40 and the second speaker 50 can act as fans, continuously removing hot air from the whole unit and introducing cool air from the outside of the whole unit. This continuous removal of heat from the whole unit achieves heat exchange and cooling, which helps to optimize the performance of the first speaker 40 and the second speaker 50, as well as improve the heat dissipation performance of the electronic device 100.

[0197] Please continue reading. Figure 4 and Figure 11 The motherboard 20 can send audio signals to the first core 42 and the second core 52. The phase of the audio signal received by the first core 42 can be the same as, have a phase difference from, or be opposite to the phase of the audio signal received by the second core 52.

[0198] For example, when the phase of the audio signal received by the first core 42 is the same as the phase of the audio signal received by the second core 52, the vibration direction of the first diaphragm 424 of the first core 42 and the vibration direction of the second diaphragm 524 of the second core 52 can be the same. For example, the first diaphragm 424 of the first core 42 and the second diaphragm 524 of the second core 52 can simultaneously vibrate upwards to expand the volume of the rear acoustic cavity T, or simultaneously vibrate downwards to compress the volume of the rear acoustic cavity T, so that the heat in the rear acoustic cavity T is spread out and made uniform through continuous expansion and compression. When the phase of the audio signal received by the first core 42 is opposite to the phase of the audio signal received by the second core 52, the vibration direction of the first diaphragm 424 of the first core 42 and the vibration direction of the second diaphragm 524 of the second core 52 can be opposite. For example, when the first diaphragm 424 of the first core 42 vibrates upwards, the second diaphragm 524 of the second core 52 can vibrate downwards, and when the first diaphragm 424 of the first core 42 vibrates downwards, the second diaphragm 524 of the second core 52 can vibrate upwards. This achieves a push-pull structure by vibrating the two diaphragms to push and pull the airflow in the rear acoustic cavity T, thereby accelerating airflow within the entire unit and improving its heat dissipation efficiency. When there is a phase difference between the audio signal received by the first core 42 and the audio signal received by the second core 52, this phase difference can be 30 degrees, 60 degrees, 90 degrees, etc., and is not strictly limited.

[0199] In one possible implementation, the motherboard 20 can be used to send a first audio signal to the first core 42 and a second audio signal to the second core 52. When the phases of the first and second audio signals are the same, the first diaphragm 424 of the first core 42 and the second diaphragm 524 of the second core 52 can vibrate in the same direction. When the phases of the first and second audio signals are opposite, the first diaphragm 424 of the first core 42 and the second diaphragm 524 of the second core 52 can vibrate in opposite directions.

[0200] like Figure 4 As shown, when the first audio signal and the second audio signal are out of phase, and the first core 42 receives the first audio signal and the second core 52 receives the second audio signal, the first diaphragm 424 of the first core 42 can vibrate toward the rear acoustic cavity T. Figure 4The second diaphragm 524 of the second core 52 can vibrate away from the rear acoustic cavity T (which manifests as downward vibration). Figure 4 The first diaphragm 424 of the first core 42 pushes the airflow into the rear acoustic cavity T, and the second diaphragm 524 of the second core 52 pulls the airflow out of the rear acoustic cavity T, thereby accelerating the airflow within the whole machine and improving the heat dissipation efficiency of the whole machine.

[0201] Alternatively, when the first audio signal and the second audio signal are out of phase, and the first core 42 receives the first audio signal and the second core 52 receives the second audio signal, the first diaphragm 424 of the first core 42 can vibrate away from the rear acoustic cavity T. Figure 4 The second diaphragm 524 of the second core 52 can vibrate towards the rear acoustic cavity T (which manifests as upward vibration). Figure 4 The vibration is manifested as downward vibration, which causes the first diaphragm 424 of the first core 42 to pull the airflow outward from the rear acoustic cavity T, and the second diaphragm 524 of the second core 52 to push the airflow inward from the rear acoustic cavity T, thereby accelerating the airflow in the whole machine and improving the heat dissipation efficiency of the whole machine.

[0202] In this embodiment, the first speaker 40 may include a first state and a second state. The first state of the first speaker 40 is the normal playback mode of the first speaker 40. The second state of the first speaker 40 is the heat dissipation mode of the first speaker 40.

[0203] Specifically, when the first speaker 40 is in the first state, the first diaphragm 424 vibrates to cause airflow within the rear acoustic cavity T, and pushes the air within the first front cavity Q1 to vibrate, forming a first sound wave. The first sound wave is transmitted to the outside of the electronic device 100 through the first sound outlet 101 of the housing 10. The frequency range of the first sound wave can be the audio range audible to the human ear. For example, the audio range audible to the human ear can be in the range of 20Hz-20000Hz (including the endpoints 20Hz and 20000Hz).

[0204] Furthermore, when the first speaker 40 is in the first state, the first speaker 40 can support audio playback and heat dissipation for the electronic device 100, and the first diaphragm 424 vibrates to make the air exchange volume of the first sound outlet 101 entering and exiting the housing 10 the first air exchange volume.

[0205] Understandably, when the first speaker 40 is in the first state, the first diaphragm 424 can not only drive the air in the first front cavity Q1 to vibrate and generate the first sound wave that can be heard by the human ear, thus enabling the electronic device 100 to perform audio playback, but also drive the air in the first rear cavity Q2 to vibrate, forming an airflow that circulates within the rear acoustic cavity, thereby achieving the function of heat dissipation for the electronic device 100. In summary, when the first speaker 40 is in the first state, it can achieve the dual functions of audio playback and heat dissipation for the electronic device 100.

[0206] When the first speaker 40 is in the second state, the first diaphragm 424 vibrates to cause airflow within the rear acoustic cavity T, which in turn drives the air within the first front cavity Q1 to vibrate and form a second sound wave. This second sound wave is transmitted to the outside of the electronic device 100 via the first sound outlet 101. The frequency range of the second sound wave can be either the audible range or the inaudible range. For example, the inaudible frequency range can be sounds below 20Hz, such as infrasound. Alternatively, the inaudible frequency range can be sounds above 20000Hz, such as infrasound. The audible audio range can be in the range of 20Hz-20000Hz (including the endpoints 20Hz and 20000Hz), such as low-frequency sound waves.

[0207] Furthermore, when the first speaker 40 is in the second state, the first speaker 40 can dissipate heat for the electronic device 100, and the first diaphragm 424 vibrates so that the air exchange volume of the first sound outlet 101 entering and exiting the housing 10 is the second air exchange volume, which is greater than the first air exchange volume.

[0208] It is understandable that, since the air exchange volume of the first speaker 40 in the second state through the first sound outlet 101 of the housing 10 is greater than that in the first state, the heat dissipation airflow of the first speaker 40 in the second state is greater than that in the first state, and the heat dissipation efficiency of the first speaker 40 is higher. In this case, the first speaker 40 can function simply as a heat dissipation device without needing to perform audio playback.

[0209] The second speaker 50 may include a third state and a fourth state. The third state of the second speaker 50 is the normal playback mode of the second speaker 50. The fourth state of the second speaker 50 is the heat dissipation mode of the second speaker 50.

[0210] Specifically, when the second speaker 50 is in the third state, the second diaphragm 524 vibrates to cause airflow within the rear acoustic cavity T, and pushes the air within the second front cavity K1 to vibrate, forming a third sound wave. This third sound wave is transmitted to the outside of the electronic device 100 via the second sound outlet 102 of the housing 10. The frequency range of the third sound wave can be the audio range audible to the human ear. For example, the audio range audible to the human ear can be in the range of 20Hz-20000Hz (including the endpoints 20Hz and 20000Hz).

[0211] Furthermore, when the second speaker 50 is in the third state, the second speaker 50 can support audio playback and heat dissipation for the electronic device 100, and the second diaphragm 524 vibrates to make the air exchange rate of the second sound outlet 102 entering and exiting the housing 10 the third air exchange rate.

[0212] Understandably, when the second speaker 50 is in the third state, the second diaphragm 524 can not only drive the air in the second front cavity K1 to vibrate and generate a third sound wave that can be heard by the human ear, thus enabling the electronic device 100 to perform audio playback, but also drive the air in the second rear cavity K2 to vibrate, forming an airflow that circulates within the rear acoustic cavity, thereby achieving the function of heat dissipation for the electronic device 100. In summary, when the second speaker 50 is in the third state, it can achieve the dual functions of audio playback and heat dissipation for the electronic device 100.

[0213] When the second speaker 50 is in the fourth state, the second diaphragm 524 vibrates to cause airflow within the rear acoustic cavity T, which in turn drives the air within the second front cavity K1 to vibrate and form a fourth sound wave. This fourth sound wave is transmitted to the outside of the electronic device 100 via the second sound outlet 102. The frequency range of the fourth sound wave can be either the audible range or the inaudible range. For example, the inaudible frequency range can be sounds below 20Hz, such as infrasound. Alternatively, the inaudible frequency range can be sounds above 20000Hz, such as infrasound. The audible audio range can be in the range of 20Hz-20000Hz (including the endpoints 20Hz and 20000Hz), such as low-frequency sound waves.

[0214] Furthermore, when the second speaker 50 is in the fourth state, the second speaker 50 can dissipate heat for the electronic device 100, and the second diaphragm 524 vibrates so that the air exchange volume of the second sound outlet 102 entering and exiting the housing 10 is the fourth air exchange volume, which is greater than the third air exchange volume.

[0215] Understandably, since the air exchange volume of the second speaker 50 in the fourth state through the second sound outlet 102 of the housing 10 is greater than that in the third state, the heat dissipation airflow of the second speaker 50 in the fourth state is greater than that in the third state, resulting in higher heat dissipation efficiency. In this case, the second speaker 50 can function solely as a heat dissipation device without needing to perform audio playback.

[0216] Second embodiment:

[0217] Please see Figure 12 , Figure 12 It is along Figure 1 The diagram shows a partial cross-sectional schematic of the first speaker 40 and the second speaker 50 of the second embodiment, obtained by cutting along section line AA. In this embodiment, the contents identical to those in the first embodiment will not be repeated. The difference from the first embodiment is that the first heat-conducting structure 43 is no longer located on the first core 42, but is located between the first front cavity Q1 and the first rear cavity Q2. The second heat-conducting structure 53 is no longer located on the second core 52, but is located between the second front cavity K1 and the second rear cavity K2.

[0218] Specifically, the first heat-conducting structure 43 prevents acoustic communication between the first front cavity Q1 and the first rear cavity Q2 of the first speaker 40, while allowing direct air communication between them. Since the first rear cavity Q2 and the first front cavity Q1 are air-connected through the first heat-conducting structure 43, and the first front cavity Q1 is air-connected to the first sound outlet 101 of the housing 10, the first rear cavity Q2 can be directly air-connected to the first front cavity Q1. The first rear cavity Q2, the first heat-conducting structure 43, the first front cavity Q1, and the first sound outlet 101 of the housing 10 are sequentially connected to form a first heat-conducting channel. This first heat-conducting channel is used to exhaust the hot air carrying heat in the first rear cavity Q2 to the outside of the electronic device 100, thereby dissipating heat from the electronic device 100.

[0219] Understandably, the first core 42 separates the first front cavity Q1 and the first rear cavity Q2 of the first speaker 40, and the part of the first core 42 that can be energized and move (i.e., the first voice coil 425 mentioned above) is located close to the first rear cavity Q2. Furthermore, when the first core 42 performs electroacoustic conversion, a smaller portion of the electrical signal energy is effectively converted into sound, while a larger portion is converted into heat. This causes heat to easily accumulate in the first rear cavity Q2, resulting in the first rear cavity Q2 being hotter than the first front cavity Q1. Based on the principle of thermal expansion and contraction, the air in the first rear cavity Q2 will be hotter and expand, making the area where the first rear cavity Q2 is located prone to forming hot spots due to higher temperatures and causing an imbalance in air pressure between the first front cavity Q1 and the first rear cavity Q2.

[0220] Therefore, in this embodiment, by providing a first heat-conducting structure 43 between the first front cavity Q1 and the first rear cavity Q2, the first front cavity Q1 and the first rear cavity Q2 can be connected by air through the first heat-conducting structure 43, while preventing acoustic communication between the first front cavity Q1 and the first rear cavity Q2. Furthermore, since the first front cavity Q1 is connected to the first sound outlet 101 of the housing 10, due to the air-conducting but sound-conducting structural characteristic of the first heat-conducting structure 43, the first rear cavity Q2 and the first front cavity Q1 can be permeable while maintaining acoustic isolation. This allows the air carrying heat in the first rear cavity Q2 to be dissipated to the outside of the electronic device 100 through the first heat-conducting channel formed by the sequential connection of the first rear cavity Q2, the first heat-conducting structure 43, the first front cavity Q1, and the first sound outlet 101 of the housing 10.

[0221] In this configuration, when the first core 42 performs electroacoustic conversion, it pushes the hot air in the first rear cavity Q2. The hot air in the first rear cavity Q2 can enter the first front cavity Q1 through the first heat-conducting structure 43. Furthermore, based on the interaction of forces, the air in the first rear cavity Q2 also pushes the vibrating part of the first core 42 (i.e., the first diaphragm 424 mentioned above) to vibrate, thereby pushing the hot air entering the first front cavity Q1 to exchange heat with the outside of the electronic device 100, enhancing the convection between the air in the first rear cavity Q2 and the outside air of the electronic device 100, and improving the heat dissipation efficiency of the first rear cavity Q2 of the first speaker 40. By utilizing the air circulation between the first speaker 40 inside the electronic device 100 and the outside of the electronic device 100, heat exchange and cooling can be achieved in the area where the first speaker 40 is located and even in the entire device. This can diversify the performance of the first speaker 40, enabling it to have both sound generation and heat dissipation functions, which is beneficial to improving the heat dissipation performance of the entire device. In addition, the first rear cavity Q2 can be depressurized through the first heat conduction channel when the temperature is high, maintaining the air pressure balance between the first front cavity Q1 and the first rear cavity Q2, resulting in better reliability.

[0222] Please continue reading. Figure 12 The first thermally conductive structure 43 may include a first breathable membrane 432 and a plurality of first perforations 431.

[0223] Multiple first perforations 431 are spaced apart on the first enclosure structure 60. Each first perforation 431 penetrates the first enclosure structure 60 along its thickness direction and connects the first front cavity Q1 and the first rear cavity Q2. Each first perforation 431 can be used to allow gas in the first rear cavity Q2 to pass through.

[0224] It is understandable that the first enclosure structure 60 is located between the first front cavity Q1 and the first rear cavity Q2. By setting multiple first perforations 431 on the first enclosure structure 60, the first enclosure structure 60 can have the dual functions of isolating the first front cavity Q1 and the first rear cavity Q2 and allowing gas to flow.

[0225] Exemplarily, a plurality of first perforations 431 may be located in the middle region of the first enclosure structure 60. The ratio of the total area of ​​the plurality of first perforations 431 to the area of ​​the first enclosure structure 60 may be in the range of 10%-80% (inclusive of the endpoint values ​​of 10% and 80%). The plurality of first perforations 431 may be arranged in an array, and each first perforation 431 may be a micropore, thereby forming an array of micropores. By setting a plurality of first perforations 431 and making the first perforations 431 a micropore structure, excessive weakening of the structure of the first enclosure structure 60 can be avoided, thereby improving the strength and structural rigidity of the first enclosure structure 60 while achieving air conduction between the first rear cavity Q2 and the first front cavity Q1, and facilitating airflow. Of course, in other embodiments, the number of first perforations 431 may also be one. The shape of the first perforation 431 may also be other shapes such as circles, polygons, etc. This embodiment does not impose strict requirements on the shape, number, position, and size of the first perforations 431.

[0226] A first breathable membrane 432 is connected to the surface of the first enclosure structure 60 facing the first front cavity Q1 or the first rear cavity Q2, and covers a plurality of first perforations 431. The first breathable membrane 432 is a high-polymer waterproof material that allows air to pass through while blocking water and sound. In other words, the first breathable membrane 432 allows for smooth and gentle airflow (including cold and hot air) between the first rear cavity Q2 and the first front cavity Q1, while preventing acoustic short-circuiting between the first front cavity Q1 and the first rear cavity Q2. In other words, the first breathable membrane 432 allows airflow between the first rear cavity Q2 and the first front cavity Q1, while blocking acoustic flow between the first front cavity Q1 and the first rear cavity Q2.

[0227] For example, the first breathable membrane 432 can be a TPU (Thermoplastic polyurethanes) expanded film, a PE (polyethylene) film, a PET (Polyethylene terephthalate) film, a PTFE (Polytetrafluoroethylene) expanded film, etc. Of course, the first breathable membrane 432 in this embodiment is not limited to the materials listed above; any solid membrane layer formed from materials with waterproof, breathable, and sound-insulating functions is within the scope of protection claimed in this embodiment. The first breathable membrane 432 and the first enclosure structure 60 can be fixed by adhesive bonding.

[0228] Understandably, the first breathable membrane 432 can cover the opening of each first perforation 431 at one end of the first enclosure structure 60, thereby completely blocking the opening of each first perforation 431 at one end of the first enclosure structure 60. With this configuration, the high-temperature airflow flowing out through the first rear cavity Q2 can reach the first breathable membrane 432 after passing through the first perforation 431 and pass through it. However, water and sound waves flowing out through the first rear cavity Q2 are blocked by the first breathable membrane 432 and cannot pass through.

[0229] Of course, in other embodiments, the first heat-conducting structure 43 may not be a structure in which the first breathable membrane 432 and multiple first perforations 431 are combined. Instead, it may be made of breathable materials such as breathable membrane, breathable mesh, or sound-absorbing cotton. It is only necessary to satisfy the requirement that the air can be conducted between the first front cavity Q1 and the first rear cavity Q2 and that the sound can be prevented from being conducted between them. There are no strict restrictions on this.

[0230] Please continue reading. Figure 12 The second heat-conducting structure 53 prevents acoustic communication between the second front cavity K1 and the second rear cavity K2 of the second speaker 50, while allowing direct air communication between them. Since the second rear cavity K2 and the second front cavity K1 are air-connected through the second heat-conducting structure 53, and the second front cavity K1 is air-connected to the second sound outlet 102 of the housing 10, the second rear cavity K2 can be directly air-connected to the second front cavity K1. The second rear cavity K2, the second heat-conducting structure 53, the second front cavity K1, and the second sound outlet 102 of the housing 10 are sequentially connected to form a second heat-conducting channel. This second heat-conducting channel is used to exhaust the hot air carrying heat in the second rear cavity K2 to the outside of the electronic device 100 for heat dissipation.

[0231] Understandably, the second core 52 separates the second front cavity K1 and the second rear cavity K2 of the second speaker 50, and the part of the second core 52 that can be energized and move (i.e., the second voice coil 525 mentioned above) is located close to the second rear cavity K2. Furthermore, because the second core 52 converts electrical signal energy into sound during electroacoustic conversion, a smaller portion of the electrical signal energy is effectively converted into sound, while a larger portion is converted into heat. This causes heat to easily accumulate in the second rear cavity K2, resulting in the second rear cavity K2 being hotter than the second front cavity K1. Based on the principle of thermal expansion and contraction, the air in the second rear cavity K2 will be hotter and expand, making the area where the second rear cavity K2 is located prone to forming hot spots due to higher temperatures and creating an air pressure imbalance between the second front cavity K1 and the second rear cavity K2.

[0232] Therefore, in this embodiment, by providing a second heat-conducting structure 53 between the second front cavity K1 and the second rear cavity K2, the second front cavity K1 and the second rear cavity K2 can be connected by air through the second heat-conducting structure 53, while preventing acoustic communication between the second front cavity K1 and the second rear cavity K2. Furthermore, since the second front cavity K1 is connected to the second sound outlet 102 of the housing 10, due to the air-conducting but sound-conducting structural characteristic of the second heat-conducting structure 53, the second rear cavity K2 and the second front cavity K1 can be permeable while maintaining acoustic isolation. This allows the air carrying heat in the second rear cavity K2 to be dissipated to the outside of the electronic device 100 through the second heat-conducting channel formed by the sequential connection of the second rear cavity K2, the second heat-conducting structure 53, the second front cavity K1, and the second sound outlet 102 of the housing 10.

[0233] In this configuration, when the second core 52 performs electroacoustic conversion, it pushes the hot air in the second rear cavity K2, which can then enter the second front cavity K1 via the second heat-conducting structure 53. Furthermore, based on the interaction of forces, the air in the second rear cavity K2 also drives the vibrating part of the second core 52 (i.e., the second diaphragm 524 mentioned above) to vibrate, thereby promoting heat exchange between the hot air entering the second front cavity K1 and the outside of the electronic device 100. This enhances the convection between the air in the second rear cavity K2 and the external air of the electronic device 100, improving the heat dissipation efficiency of the second rear cavity K2 of the second speaker 50. By utilizing the second speaker 50 inside the electronic device 100 and the gas circulation outside the electronic device 100, heat exchange and cooling can be achieved in the area where the second speaker 50 is located and even in the whole device. This can diversify the performance of the second speaker 50, enabling it to have the dual functions of sound generation and heat dissipation, which is beneficial to improving the heat dissipation performance of the whole device. In addition, when the temperature of the second rear cavity K2 is high, the pressure of the second rear cavity K2 can be relieved through the second heat conduction channel, maintaining the air pressure balance between the second front cavity K1 and the second rear cavity K2, resulting in better reliability.

[0234] Please continue reading. Figure 12The second thermally conductive structure 53 may include a second breathable membrane 532 and a plurality of second perforations 531.

[0235] Multiple second perforations 531 are spaced apart on the second enclosure structure 70. Each second perforation 531 penetrates the second enclosure structure 70 along its thickness direction and connects the second front cavity K1 and the second rear cavity K2. Each second perforation 531 can be used to allow gas in the second rear cavity K2 to pass through.

[0236] It is understood that the second enclosure structure 70 is located between the second front cavity K1 and the second rear cavity K2. By setting multiple second perforations 531 on the second enclosure structure 70, the second enclosure structure 70 can have the dual functions of isolating the second front cavity K1 and the second rear cavity K2 and allowing gas to flow.

[0237] For example, a plurality of second perforations 531 may be located in the middle region of the second enclosure structure 70. The ratio of the total area of ​​the plurality of second perforations 531 to the area of ​​the second enclosure structure 70 may be in the range of 50%-60% (including the endpoint values ​​of 50% and 60%). The plurality of second perforations 531 may be arranged in an array, and each second perforation 531 may be a micropore, thereby forming an array of micropores. By setting a plurality of second perforations 531 and making the second perforations 531 a micropore structure, excessive weakening of the structure of the second enclosure structure 70 can be avoided, thereby improving the strength and structural rigidity of the second enclosure structure 70 while achieving air conduction between the second rear cavity K2 and the second front cavity K1, and facilitating air flow. Of course, in other embodiments, the number of second perforations 531 may also be one. The shape of the second perforation 531 may also be other shapes such as circles, polygons, etc. This embodiment does not impose strict requirements on the shape, number, position, and size of the second perforations 531.

[0238] The second breathable membrane 532 is connected to the surface of the second enclosure structure 70 facing the second front cavity K1 or the second rear cavity K2, and covers a plurality of second perforations 531. The second breathable membrane 532 is a polymer waterproof material that allows air to pass through while blocking water and sound. In other words, the second breathable membrane 532 allows for smooth and gentle airflow (including cold and hot air) between the second rear cavity K2 and the second front cavity K1, while preventing acoustic short-circuiting between the second front cavity K1 and the second rear cavity K2. In other words, the second breathable membrane 532 allows airflow between the second rear cavity L2 and the second front cavity K1, while blocking acoustic flow between them.

[0239] For example, the second breathable membrane 532 can be a TPU (Thermoplastic polyurethanes) expanded film, a PE (polyethylene) film, a PET (Polyethylene terephthalate) film, a PTFE (Polytetrafluoroethylene) expanded film, etc. Of course, the second breathable membrane 532 in this embodiment is not limited to the materials listed above; any solid membrane layer formed from materials with waterproof, breathable, and sound-insulating functions is within the scope of protection claimed in this embodiment. The second breathable membrane 532 and the second enclosure structure 70 can be fixed by adhesive bonding.

[0240] Understandably, the second breathable membrane 532 can cover the opening of each second perforation 531 at one end of the second enclosure structure 70, thereby completely blocking the opening of each second perforation 531 at one end of the second enclosure structure 70. With this configuration, the high-temperature airflow flowing out through the second rear cavity K2 can reach the second breathable membrane 532 after passing through the second perforation 531 and pass through it. However, water and sound waves flowing out through the second rear cavity K2 are blocked by the second breathable membrane 532 and cannot pass through.

[0241] Of course, in other embodiments, the second heat-conducting structure 53 may not be a structure in which the second breathable membrane 532 and multiple second perforations 531 are combined. Instead, it may be made of breathable materials such as breathable membrane, breathable mesh, or sound-absorbing cotton. It is only necessary to satisfy the requirement that the air can be connected between the second front cavity K1 and the second rear cavity K2 and that the sound can be prevented between the two. There are no strict restrictions on this.

[0242] In this embodiment, the descriptions of the connection between the first rear cavity Q2 and the second rear cavity K2 to form the rear acoustic cavity T, the descriptions of the first and second states of the first loudspeaker 40, and the descriptions of the third and fourth states of the second loudspeaker 50 can be found in the first embodiment and will not be repeated here.

[0243] Third embodiment:

[0244] Please see Figure 13 , Figure 13 It is along Figure 1The diagram shows a partial cross-sectional schematic of the first speaker 40 and the second speaker 50 of the third embodiment, obtained by cutting along section line AA. In this embodiment, the contents identical to those in the first embodiment will not be repeated. The difference from the first embodiment is that the first heat-conducting structure 43 is located not only on the first core 42, but also between the first front cavity Q1 and the first rear cavity Q2. The second heat-conducting structure 53 is located not only on the second core 52, but also between the second front cavity K1 and the second rear cavity K2.

[0245] In this embodiment, the description of the first heat-conducting structure 43 located in the first core 42 can be found in the first embodiment; the description of the structure between the first front cavity Q1 and the first rear cavity Q2 can be found in the second embodiment; the description of the second heat-conducting structure 53 located in the second core 52 can be found in the first embodiment; and the description of the second heat-conducting structure 53 located between the second front cavity K1 and the second rear cavity K2 can be found in the second embodiment. Descriptions regarding the connection between the first rear cavity Q2 and the second rear cavity K2 to form the rear acoustic cavity T, the first and second states of the first loudspeaker 40, and the third and fourth states of the second loudspeaker 50 can be found in the first embodiment and will not be repeated here.

[0246] Referring to the descriptions of the three embodiments above, it should be understood that in the embodiments of this application, the electronic device 100 may also include a greater number of speakers, such as three, four, etc. When the electronic device 100 includes a greater number of speakers, the structural configuration of the remaining speakers can be set with reference to the first speaker 40 and the second speaker 50, as long as the rear cavities of each speaker are connected, so that by adjusting the vibration of each speaker, the air in the front and rear cavities of each speaker is driven to vibrate, thereby forming an air circulation flow in the whole machine, so that the heat generated by each speaker and other components in the whole machine can be dissipated to the outside through the sound outlets of the housing 10. There is no strict limitation on this.

[0247] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. An electronic device, characterized in that, The electronic device includes: A housing having a first sound outlet, a second sound outlet, and a receiving space, wherein both the first sound outlet and the second sound outlet communicate with the receiving space and the outside of the housing; and A first loudspeaker located within the containment space includes a first acoustic cavity space, a first core, and a first heat-conducting structure. The first core is located within the first acoustic cavity space and includes a first diaphragm. The first diaphragm divides the first acoustic cavity space into a first front cavity and a first rear cavity. The first front cavity communicates with the first sound outlet, and the first rear cavity communicates with the first core. The first heat-conducting structure is located between the first core and / or the first front cavity and the first rear cavity. The first heat-conducting structure can conduct heat from the first rear cavity to the first front cavity, so that it can be dissipated to the outside of the electronic device through the first sound outlet. The first heat-conducting structure can also prevent acoustic conduction between the first rear cavity and the first front cavity. A second loudspeaker is located within the receiving space, and is disposed opposite to the first loudspeaker along the length of the electronic device. The second loudspeaker includes a second acoustic cavity space, a second core, and a second heat-conducting structure. The second core is located within the second acoustic cavity space and includes a second diaphragm. The second diaphragm divides the second acoustic cavity space into a second front cavity and a second rear cavity. The second front cavity communicates with the second sound outlet, and the second rear cavity communicates with the second core. The second rear cavity communicates with the first rear cavity to form a rear acoustic cavity. The first diaphragm and / or the second diaphragm vibrates to cause airflow within the rear acoustic cavity. The second heat-conducting structure is located between the second core and / or between the second front cavity and the second rear cavity. The second heat-conducting structure can conduct heat from the second rear cavity to the second front cavity, so that it can be dissipated to the outside of the electronic device through the second sound outlet. The second heat-conducting structure can also prevent acoustic conduction between the second rear cavity and the second front cavity. A motherboard, electrically connected to the first core and the second core, the motherboard being used to send a first audio signal to the first core and a second audio signal to the second core, the first audio signal and the second audio signal being out of phase; When the first core receives the first audio signal and the second core receives the second audio signal, the first diaphragm vibrates towards the rear acoustic cavity, and the second diaphragm vibrates away from the rear acoustic cavity, so that the first diaphragm pushes airflow into the rear acoustic cavity, and the second diaphragm pulls airflow out of the rear acoustic cavity; or... When the first core receives the first audio signal and the second core receives the second audio signal, the first diaphragm vibrates away from the rear acoustic cavity, and the second diaphragm vibrates toward the rear acoustic cavity, so that the first diaphragm pulls the airflow out of the rear acoustic cavity and the second diaphragm pushes the airflow into the rear acoustic cavity.

2. The electronic device as claimed in claim 1, characterized in that, The first diaphragm includes a first dome and a first diaphragm body, the first diaphragm body being connected to the outer periphery of the first dome; The first heat-conducting structure includes a first breathable membrane and a plurality of first perforations. The plurality of first perforations are spaced apart on the first dome. Each first perforation penetrates the first dome along the thickness direction of the first dome and connects the first core and the first front cavity. The first breathable membrane is connected to the surface of the first dome facing the first front cavity and covers the plurality of first perforations. The first breathable membrane allows air conduction between the first front cavity and the first core and prevents acoustic conduction between the first front cavity and the first core.

3. The electronic device as claimed in claim 1, characterized in that, The first diaphragm includes a first dome and a first diaphragm body. The first diaphragm body is connected to the outer periphery of the first dome. The first dome forms the first heat-conducting structure. The material of the first dome is a heat-conducting material.

4. The electronic device as claimed in claim 1, characterized in that, The electronic device further includes a first enclosure structure, which and the first core are both fixed inside the housing, and the first enclosure structure and the first core enclose to form the first front cavity; The first heat-conducting structure includes a first breathable membrane and a plurality of first perforations. The plurality of first perforations are spaced apart on the first enclosure structure. Each first perforation penetrates the first enclosure structure along the thickness direction and connects the first front cavity and the first rear cavity. The first breathable membrane is connected to the surface of the first enclosure structure facing or away from the first front cavity and covers the plurality of first perforations. The first breathable membrane allows air to pass through the first front cavity and the first rear cavity, and prevents acoustic communication between the first front cavity and the first rear cavity.

5. The electronic device as claimed in claim 1, characterized in that, The second diaphragm includes a second dome and a second diaphragm body, the second diaphragm body being connected to the outer periphery of the second dome; The second heat-conducting structure includes a second breathable membrane and a plurality of second perforations. The plurality of second perforations are spaced apart on the second dome. Each second perforation penetrates the second dome along the thickness direction of the second dome and connects the second core and the second front cavity. The second breathable membrane is connected to the surface of the second dome facing the second front cavity and covers the plurality of second perforations. The second breathable membrane allows air to pass between the second front cavity and the second core, and prevents acoustic communication between the second front cavity and the second core.

6. The electronic device as claimed in claim 1, characterized in that, The second diaphragm includes a second dome and a second diaphragm body. The second diaphragm body is connected to the outer periphery of the second dome. The second dome forms the second heat-conducting structure. The material of the second dome is a heat-conducting material.

7. The electronic device as claimed in claim 1, characterized in that, The electronic device further includes a second enclosure structure, which and the second core are both fixed inside the housing, and the second enclosure structure and the second core together form the second front cavity; The second heat-conducting structure includes a second breathable membrane and a plurality of second perforations. The plurality of second perforations are spaced apart on the second enclosure structure. Each second perforation penetrates the second enclosure structure along the thickness direction and connects the second front cavity and the second rear cavity. The second breathable membrane is connected to the surface of the second enclosure structure facing or away from the second front cavity and covers the plurality of second perforations. The second breathable membrane allows air to pass through the second front cavity and the second rear cavity, and prevents acoustic communication between the second front cavity and the second rear cavity.

8. The electronic device as claimed in claim 1, characterized in that, The first speaker includes a first state and a second state; When the first speaker is in the first state, the first speaker can support audio playback and heat dissipation for the electronic device, and the first diaphragm vibrates to make the air exchange volume in and out of the first sound outlet the first air exchange volume. When the first speaker is in the second state, the first speaker can dissipate heat for the electronic device. The first diaphragm vibrates so that the air exchange volume entering and exiting the first sound outlet is the second air exchange volume, which is greater than the first air exchange volume.

9. The electronic device as claimed in claim 1, characterized in that, The second speaker includes a third state and a fourth state; When the second speaker is in the third state, the second speaker can support audio playback and heat dissipation for the electronic device, and the second diaphragm vibrates to make the air exchange volume in and out of the second sound outlet the third air exchange volume; When the second speaker is in the fourth state, the second speaker can dissipate heat for the electronic device. The first diaphragm vibrates so that the air exchange rate in and out of the second sound outlet is the fourth air exchange rate, which is greater than the third air exchange rate.

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