Single-glass unit film layer removal process based on forward and reverse bidirectional and zoning

Abstract

The application discloses a single-glass-component adhesive film layer removing process based on forward and reverse bidirectional and partition, which comprises the following steps: S1, forward removing; S2, reverse removing. In one aspect, the adhesive film layer is divided into a first region and a second region by pressing, and the first region and the second region are removed in sequence by forward and reverse movement based on the pressing limit, so that the formed scraping region fully covers the adhesive film layer, and the removal rate of the adhesive film layer is effectively improved; in another aspect, a scraping mode of left and right partition and front and back staggering is adopted, so that the scraping force borne by the component can be dispersed, the deformation probability of the component can be effectively reduced, the removal quality of the adhesive film layer is improved, and the formed adhesive film scrap particles have a small diameter, so that the collection and treatment are facilitated.

Description

Technical Field

[0001] This invention belongs to the field of photovoltaic technology, specifically relating to a process for removing the encapsulant layer of a single-glass module based on bidirectional and partitioned methods. Background Technology

[0002] A photovoltaic module is a power generation device that generates direct current when exposed to sunlight. It consists of thin solid photovoltaic cells made almost entirely of semiconductor materials (such as silicon). More than 90% of the materials can be recycled and reused, which has considerable recycling value and high economic profit. Therefore, recycling retired photovoltaic modules can not only alleviate the shortage of raw materials for photovoltaic equipment to a certain extent, but also effectively reduce environmental pollution.

[0003] Currently, photovoltaic modules are mainly classified into single-glass modules and double-glass modules according to their structure. Single-glass modules consist of a backsheet layer, a cell layer, an encapsulant layer, and a glass layer stacked in sequence. The recycling of photovoltaic modules mainly involves the dismantling and recycling of each layer of materials. When the surface glass layer of a single-glass module is peeled off, the existing technology mainly uses pressure rollers and cutters that are spaced apart above the module along the module's transport direction. As the module is transported horizontally, the pressure rollers press on the module surface, and the cutters simultaneously remove the encapsulant layer.

[0004] However, in the actual recycling process, due to the insufficient rigidity of the backsheet layer at the bottom of the single-glass module, and the inevitable gap between the rolling pressure position formed by the pressure roller and the scraping position formed by the cutter, after a certain area of ​​the encapsulant layer is removed, the end of the module to be removed will inevitably gradually detach from the pressure of the pressure roller and lose its restraint. As the module is further transported, the end of the module that has lost the rolling pressure restraint is prone to deformation (such as upturning or bending downward) under the action of the cutting force of the cutter and the horizontal transport force. This makes the contact between the cutter and the encapsulant layer unstable, which can easily lead to the cutter scraping depth being too deep, causing damage to the cell layer or even the backsheet layer, or the cutter scraping depth being too shallow, resulting in the remaining area of ​​the encapsulant layer not being completely removed. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide an improved process for removing the encapsulant layer of a single-glass module based on bidirectional and partitioned methods.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: A bidirectional and partitioned encapsulant removal process for single-glass modules includes the following steps: S1, Forward Removal The single-glass module is transferred to the forward removal station and driven to keep moving forward horizontally along the length direction. At the same time, the single-glass module is pressed down and the encapsulant layer is divided into a first region and a second region in the front-back direction according to the pressing position. Based on the area to be removed in the first region and / or the second region, the first region is divided into left and right partitions and gradually removed in a front-back staggered manner to completely remove the first region. S2, Reverse Cutting The single-glass module with the first area removed is transferred to the reverse removal station and driven to be carried horizontally along the length direction. At the same time, the single-glass module is pressed down according to the layout of the first and second areas in step S1. Based on the area to be removed in the second area and / or the first area, the second area is divided into left and right sections and gradually removed in a staggered manner to completely remove the second area. At this point, the encapsulant layer is completely removed.

[0007] Preferably, when performing zoned cutting, the width and / or length of each cutting zone are equal. This achieves uniform cutting, and the process is simple, easy to operate and implement.

[0008] Preferably, while progressively scraping the first and / or second regions, the pressed monoglass module is kept positioned between each pair of adjacent scraping steps. This ensures the monoglass module remains pressed down during each scraping step, further reducing the probability of deformation.

[0009] Preferably, in step S2, the single-glass module that has completed the removal of the first region is continuously conveyed forward into the reverse removal station. First, the single-glass module is conveyed forward, and the first and second regions of the encapsulant layer are sequentially brushed until the single-glass module reaches its starting position before reverse removal. Then, the single-glass module is conveyed backward to remove the second region of the encapsulant layer. This avoids encapsulant fragments generated during forward removal interfering with the movement of the single-glass module at the reverse removal station, ensuring a high removal rate of the second region of the encapsulant layer.

[0010] According to a specific embodiment and preferred aspect of the present invention, the reverse cutting station and the forward cutting station are connected one after the other through the transmission line of the single glass module, and each of the reverse cutting station and the forward cutting station includes multiple cutting tools arranged above the transmission line and distributed sequentially, and a pressing module based on the corresponding distribution of the cutting tools, wherein the cutting heads of the multiple cutting tools are staggered front and back and form multiple scraping areas covering the adhesive film layer in the left and right directions.

[0011] Preferably, a scraping channel is formed between each cutter and the transmission line. Each pressing module includes a pressing group and a brushing group. During scraping, the single-glass module is pressed down through each scraping channel based on the pressing group, and the brushing group presses down on the module simultaneously to remove the formed film debris. Here, it is ensured that the film debris is swept away from the module surface in a timely manner to avoid residue.

[0012] Preferably, the pressure assembly can generate matching transmission power synchronously with the transmission line, or the pressure assembly elastically abuts against the surface of the component as the component is transmitted.

[0013] Preferably, the transmission line includes multiple transmission rollers arranged side by side at intervals along the length of the component, and the pressing points formed on the component by the pressing group and the brushing group are vertically aligned with the support points formed on the component by the corresponding transmission rollers.

[0014] According to another specific embodiment and preferred aspect of the invention, a cleaning component is further provided between the reverse removal station and the forward removal station. The cleaning component includes a U-shaped cleaning module located above the corresponding transfer roller with its opening facing downwards, and a lifting power component that drives the cleaning module to move up and down. As the cleaning module descends, it squeezes out the film debris remaining on the transfer roller from the space between adjacent transfer rollers. This avoids large areas of film debris remaining on the transfer roller, which could affect the transport of subsequent components.

[0015] According to another specific embodiment and preferred aspect of the present invention, in the forward cutting station, the pressing group includes at least one or more first pressing rollers correspondingly arranged on one side of the feed end of each cutting channel; the brushing group includes at least one or more first brushing rollers arranged on one side of the discharge end of the last cutting channel.

[0016] Preferably, in the orthographic projection on the horizontal plane, the center distance between each cutter and the adjacent first lower pressure roller is equal. Here, it is ensured that the lengths of the misaligned cutting zones are equal.

[0017] According to another specific embodiment and preferred aspect of the invention, in the reverse cutting station, the pressing group includes at least one or more second pressing rollers correspondingly arranged on one side of the feed end and discharge end of each cutting channel; the brushing group includes at least multiple second brushing rollers arranged on one side of the first and last cutting channels. Here, it is ensured that the components achieve surface film debris removal during both forward and reverse movements in the reverse cutting station, avoiding residue that could affect the cutting action of the tool.

[0018] In addition, the cutting tools include a cutting roller and multiple planing blades distributed around the cutting roller. During the scraping process, the cutting depth of each planing blade is equal to the thickness of the adhesive film layer; and / or, after each cutting tool completes the scraping of the corresponding area on the adhesive film layer, the cutting tool is de-energized and forms a follower pressure roller that is pressed onto the single glass module.

[0019] Due to the implementation of the above technical solutions, the present invention has the following advantages compared with the prior art: In existing technologies, the bottom layer of a single-glass module is a backsheet, which lacks rigidity. Furthermore, there is an inevitable gap between the pressing position formed by the pressure roller and the scraping position formed by the cutter. Therefore, after a certain area of ​​the encapsulant layer is removed, the end of the module to be scraped will gradually detach from the pressure of the pressure roller and lose its restraint. As the module is further transported, the end of the module that has lost the pressure restraint is prone to deformation (e.g., upturning or bending downward) under the action of the cutting force of the cutter and the horizontal transport force. This makes the contact between the cutter and the encapsulant layer unstable, which can easily lead to excessive scraping depth of the cutter, causing damage to the cell layer or even the backsheet layer, or insufficient scraping depth of the cutter, resulting in the remaining area of ​​the encapsulant layer not being completely removed. This application presents a comprehensive design for a bidirectional, partitioned encapsulant layer removal process for single-glass modules, cleverly addressing the shortcomings and defects of existing technologies. By adopting this bidirectional, partitioned encapsulant layer removal process, the encapsulant layer is removed first in the forward direction. The single-glass module is transported to the forward removal station and driven to move horizontally forward along its length. Simultaneously, the single-glass module is pressed down, and the encapsulant layer is divided into a first region and a second region in the front-to-back direction based on the pressing position. The process involves maintaining the area to be removed within the first region and / or the area to be removed within the pressed region. Alternatively, for the second region, the first region is divided into left and right sections and gradually scraped out in a staggered manner to completely remove the first region; then, reverse scraping is performed, and the single-glass module with the first region scraped is transferred to the reverse scraping station and driven to keep it horizontally along the length direction. At the same time, the single-glass module is pressed down according to the layout of the first and second regions in the forward scraping, and based on keeping the area to be scraped in the second region and / or the first region pressed down, the second region is divided into left and right sections and gradually scraped out in a staggered manner to completely remove the second region. At this point, the encapsulant layer is completely removed. Therefore, compared with the prior art, the present invention divides the adhesive film layer into first and second regions by pressing down, and removes the first and second regions one after the other by forward and reverse motion while maintaining the pressure limit, ensuring that the formed scraping area fully covers the adhesive film layer and effectively improving the removal rate of the adhesive film layer; on the other hand, the scraping mode with left and right partitions and front and back staggered can disperse the scraping force on the component, effectively reduce the probability of component deformation, improve the removal quality of the adhesive film layer, and at the same time, the resulting adhesive film fragments have small particle diameters, which are easy to collect and process. Attached Figure Description

[0020] Figure 1 This is a half-sectional schematic diagram of the removal device of the present invention; Figure 2 for Figure 1 Enlarged schematic diagram of the structure of the forward cutting station; Figure 3 for Figure 1 Enlarged structural diagram of the reverse cutting station; Figure 4 This is a top view of a single-glass module; Wherein: X, transmission line; X0, transmission roller; W1, forward cutting station; W2, reverse cutting station; 1, cutting tool; 10, cutting roller; q0, scraping area; t, scraping channel; 2, pressing module; 20, pressing group; 201, first pressing roller; 202, second pressing roller; 21, brushing group; 211, first brushing roller; 212, second brushing roller; 3, cleaning component; 30, cleaning module; 31, lifting power component; J, component; q1, first area; q2, second area. Detailed Implementation

[0021] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0022] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0024] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0025] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0026] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0027] like Figures 1 to 4 As shown, the encapsulant layer removal process for single-glass modules based on bidirectional and partitioned methods involved in this embodiment uses removal equipment including a forward removal station W1 and a reverse removal station W2.

[0028] Specifically, the reverse cutting station W2 and the forward cutting station W1 are connected one after the other via the transmission line X of the single-glass module. Each of the reverse cutting station W2 and the forward cutting station W1 includes multiple cutting tools 1 arranged sequentially above the transmission line X, and pressing modules 2 distributed accordingly based on the cutting tools 1. The cutting heads of the multiple cutting tools 1 are staggered front to back and form multiple scraping areas q0 covering the adhesive film layer in the left and right directions. When performing partitioned scraping, the width and length of each scraping area q0 are equal. This achieves uniform scraping, and the process is simple, easy to operate and implement.

[0029] In this example, the transmission line X includes multiple transmission rollers X0 arranged side by side at intervals along the length of the single glass module J, wherein the single glass module J is horizontally transmitted along the multiple transmission rollers X0 with the encapsulated film layer facing upward.

[0030] In this example, there are two cutting tools 1 in each of the forward cutting station W1 and the reverse cutting station W2. Each cutting tool 1 includes a cutting roller 10 and multiple planing blades distributed circumferentially around the cutting roller 10 (not shown in the figure, but easy to imagine). During the cutting process, the cutting depth of each planing blade is equal to the thickness of the adhesive film layer. The planing blades are commercially available products. That is to say, in the forward cutting station W1 and the reverse cutting station W2, the multiple planing blades on the two cutting rollers 10 are staggered in the length direction of the assembly.

[0031] In some specific embodiments, after each cutter 1 completes the scraping of the corresponding area on the adhesive film layer, the cutter 1 is de-energized and forms a follower pressure roller that is pressed onto the single glass component J.

[0032] In this example, the so-called pressing module 2 is distributed according to the corresponding distribution of the cutting tool 1. That is, the single glass module entering the forward cutting station W1 or the reverse cutting station W2 is divided into a first region q1 and a second region q2 in the length direction (or front-back direction) of the module based on the position of the pressing module 2. In the process of removing the encapsulant film from the single glass module, the first region q1 and the second region q2 are removed by the forward cutting station W1 and the reverse cutting station W2 in sequence and in opposite directions.

[0033] In some specific embodiments, each cutting tool 1 forms a scraping channel t with the transmission line X. Each pressing module 2 includes a pressing group 20 and a brushing group 21. During scraping, the single-glass module is pressed down through each scraping channel t based on the pressing group 20, and the brushing group 21 simultaneously presses down on the single-glass module and is used to remove the formed film debris. Here, it is ensured that the film debris is swept away from the module surface in a timely manner to avoid residue.

[0034] For ease of implementation, the pressing group 20 can synchronously generate matching transmission power with the transmission line X, or the pressing group 20 can elastically abut against the surface of the component as the component is transmitted; the pressing points formed on the component by the pressing group 20 and the brushing group 21 are vertically aligned with the support points formed on the component by the corresponding transmission roller X0. This ensures uniform force on the upper and lower surfaces of the component, reducing deformation problems.

[0035] In some specific embodiments, in the forward cutting station W1, the pressing group 20 includes at least one or more first pressing rollers 201 correspondingly arranged on one side of the feed end of each cutting channel t. The two first pressing rollers 201 located on one side of the feed end of the first cutting channel t are power rollers, capable of rotating synchronously with the transfer roller X0 and clamping the component in the direction of the cutting channel t to meet the power requirements for the component to pass through the cutting channel t. The first pressing roller 201 located between the two cutting channels t is a follower roller, which rotates synchronously with the component's transmission when rolling on the component surface. The brushing group 21 includes at least one or more first brushing rollers 211 arranged on one side of the discharge end of the last cutting channel t. In the orthographic projection on the horizontal plane, the center distance between each cutter 1 and the adjacent first pressing roller 201 is equal, ensuring that the lengths of the misaligned cutting zones are equal.

[0036] In the reverse cutting station W2, the pressing group 20 includes at least one or more second pressing rollers 202 correspondingly arranged on one side of the feed end and discharge end of each cutting channel t. During reverse cutting, the two second pressing rollers 202 located on the feed end side of the last cutting channel t are power rollers, which can rotate synchronously with the transmission roller X0 and clamp the component in the direction of the cutting channel t to meet the transmission power requirements of the component passing through the cutting channel t. The second pressing roller 202 located between the two cutting channels t is a follower roller, which rotates synchronously with the transmission of the component when rolling on the surface of the component. The brushing group 21 includes at least multiple second brushing rollers 212 arranged on one side of the first and last cutting channels t. Here, it is ensured that the surface film fragments of the component are cleaned during both forward and reverse movements in the reverse cutting station to avoid residues that may affect the cutting of the tool.

[0037] In this example, a cleaning component 3 is also provided between the forward de-cutting station W1 and the reverse de-cutting station W2. The cleaning component 3 includes a U-shaped cleaning module 30 located above the corresponding transfer roller X0 with its opening facing downwards, and a lifting power component 31 that drives the cleaning module 30 to move up and down. As the cleaning module 30 moves downwards, it squeezes out the film debris stuck on the transfer roller X0 from the space between adjacent transfer rollers. This avoids large areas of film debris remaining on the transfer rollers and affecting the transmission of subsequent components.

[0038] Therefore, the encapsulant layer removal process for single-glass modules based on bidirectional and partitioned methods in this embodiment includes the following steps: S1, Forward Removal The single-glass module is transferred to the forward removal station and driven to keep moving forward horizontally along the length direction. At the same time, the single-glass module is pressed down and the encapsulant layer is divided into a first region and a second region in the front-back direction according to the pressing position. Based on the area to be removed in the first region and / or the second region, the first region is divided into left and right partitions and gradually removed in a front-back staggered manner to completely remove the first region. S2, Reverse Cutting The single-glass module with the first area removed is transferred to the reverse removal station and driven to be carried horizontally along the length direction. At the same time, the single-glass module is pressed down according to the layout of the first and second areas in step S1. Based on the area to be removed in the second area and / or the first area, the second area is divided into left and right sections and gradually removed in a staggered manner to completely remove the second area. At this point, the encapsulant layer is completely removed. Specifically, the single-glass module that has completed the first area removal is continuously conveyed forward to the reverse removal station. First, the single-glass module is conveyed forward, and the first and second areas of the encapsulant layer are brushed sequentially until the single-glass module reaches its starting position before reverse removal. Then, the single-glass module is conveyed backward to remove the second area of ​​the encapsulant layer. This process avoids encapsulant fragments generated during forward removal interfering with the movement of the single-glass module at the reverse removal station, ensuring a high removal rate of the second area of ​​the encapsulant layer.

[0039] In summary, after adopting this bidirectional and partitioned encapsulant layer removal process for single-glass modules, the encapsulant layer removal process begins with forward removal. The single-glass module is transported to the forward removal station and driven to move horizontally forward along its length. Simultaneously, the single-glass module is pressed down, and the encapsulant layer is divided into a first region and a second region in the front-to-back direction based on the pressing position. Based on the area to be removed in the first region and / or the second region, the first region is gradually removed by left-right partitioning and front-to-back staggering to completely remove the first region. Then, reverse removal is performed. The single-glass module with the first region removed is transported to the reverse removal station and driven to move horizontally backward along its length. Simultaneously, the single-glass module is pressed down according to the layout of the first and second regions in the forward removal. Based on the area to be removed in the second region and / or the first region, the second region is gradually removed by left-right partitioning and front-to-back staggering to completely remove the second region. Thus, the encapsulant layer is completely removed. Therefore, compared with the prior art, the present invention, on the one hand, divides the encapsulant layer into first and second regions by pressing down, and removes the first and second regions sequentially by forward and reverse motion while maintaining the downward pressure constraint, ensuring that the formed scraping area fully covers the encapsulant layer and effectively improving the removal rate of the encapsulant layer; on the other hand, it adopts a scraping mode with left and right partitions and front and back staggered positions, which can disperse the scraping force on the module, effectively reduce the probability of module deformation, improve the removal quality of the encapsulant layer, and at the same time, the resulting encapsulant fragments have small particle diameters, making them easy to collect and process; thirdly, it achieves uniform scraping, and the process is simple, easy to operate and implement; fourthly, it avoids the encapsulant fragments generated by forward scraping from interfering with the displacement of the single-glass module at the reverse scraping station, ensuring the removal rate of the second region of the encapsulant layer; and fifthly, it can avoid large areas of encapsulant fragments remaining on the transfer rollers, which would affect the subsequent transfer of the module.

[0040] The present invention has been described in detail above, with the aim of enabling those skilled in the art to understand and implement the invention. However, this description should not be construed as limiting the scope of protection of the invention. All equivalent changes or modifications made in accordance with the spirit and essence of the invention should be included within the scope of protection of the invention.

Claims

1. A bidirectional and partitioned encapsulant layer removal process for single-glass modules, characterized in that, It includes the following steps: S1, Forward Removal The single-glass module is transferred to the forward removal station and driven to keep moving forward horizontally along the length direction. At the same time, the single-glass module is pressed down and the encapsulant layer is divided into a first region and a second region in the front-back direction according to the pressing position. Based on the area to be removed in the first region and / or the second region, the first region is divided into left and right partitions and gradually removed in a front-back staggered manner to completely remove the first region. S2, Reverse Cutting The single-glass module with the first area removed is transferred to the reverse removal station and driven to move horizontally backward along the length direction. At the same time, the single-glass module is pressed down according to the layout of the first and second areas in step S1. Based on the area to be removed in the second area and / or the first area, the second area is divided into left and right sections and gradually removed in a staggered manner to completely remove the second area. At this point, the encapsulant layer is completely removed.

2. The encapsulant layer removal process for single-glass modules based on bidirectional and partitioned methods according to claim 1, characterized in that, When performing zoned shaving, the width and / or length of each shaving zone are equal.

3. The encapsulant layer removal process for single-glass modules based on bidirectional and partitioned methods according to claim 1, characterized in that, While progressively scraping the first and / or second regions, the pressed monoglass module is kept in the section between each two adjacent scraping steps.

4. The encapsulant layer removal process for single-glass modules based on bidirectional and partitioned methods according to claim 1, characterized in that, In step S2, the single-glass module that has completed the first area removal is kept forward and transported to the reverse removal station. First, the single-glass module is transported forward and the first and second areas of the encapsulant layer are brushed in sequence until the single-glass module reaches the starting position before reverse removal. Then, the single-glass module is transported backward to remove the second area of ​​the encapsulant layer.

5. The encapsulant layer removal process for single-glass modules based on bidirectional and partitioned methods according to any one of claims 1-4, characterized in that, The reverse cutting station and the forward cutting station are connected one after the other through the transmission line of the single glass module. Each of the reverse cutting station and the forward cutting station includes multiple cutting tools arranged above the transmission line and distributed in sequence, and a pressing module based on the corresponding distribution of the cutting tools. The cutting heads of the multiple cutting tools are staggered and form multiple scraping areas covering the adhesive film layer in the left and right directions.

6. The encapsulant layer removal process for single-glass modules based on bidirectional and partitioned methods according to claim 5, characterized in that, Each of the cutting tools and the transmission line form a scraping channel. Each of the pressing modules includes a pressing group and a brushing group. During scraping, the single glass component is pressed down through each of the scraping channels based on the pressing group, and the brushing group presses down on the single glass component simultaneously and is used to remove the formed film debris.

7. The encapsulant layer removal process for single-glass modules based on bidirectional and partitioned methods according to claim 6, characterized in that, The pressure assembly can generate matching transmission power synchronously with the transmission line, or it can elastically abut against the surface of the single-glass module as the single-glass module is transmitted.

8. The encapsulant layer removal process for single-glass modules based on bidirectional and partitioned methods according to claim 6, characterized in that, The transmission line includes multiple transmission rollers arranged side by side at intervals along the length of the single glass module. The pressing points formed by the pressing group and the brushing group on the single glass module are vertically aligned with the support points formed by the corresponding transmission rollers on the single glass module.

9. The encapsulant layer removal process for single-glass modules based on bidirectional and partitioned methods according to claim 8, characterized in that, A cleaning component is also provided between the reverse removal station and the forward removal station. The cleaning component includes a U-shaped cleaning module located above the corresponding transfer roller with its opening facing downwards, and a lifting power component that drives the cleaning module to move up and down. As the cleaning module moves downwards, it squeezes out the film debris stuck on the transfer roller from the space between adjacent transfer rollers.

10. The encapsulant layer removal process for single-glass modules based on bidirectional and partitioned methods according to claim 6, characterized in that, In the forward cutting station, the pressing group includes at least one or more first pressing rollers arranged on one side of the feed end of each cutting channel; the brushing group includes at least one or more first brushing rollers arranged on one side of the discharge end of the last cutting channel.

11. The encapsulant layer removal process for a single-glass module based on bidirectional and partitioned methods according to claim 10, characterized in that, In the orthographic projection on the horizontal plane, the center distance between each of the cutters and the adjacent first lower pressure roller is equal.

12. The encapsulant layer removal process for single-glass modules based on bidirectional and partitioned methods according to claim 6, characterized in that, In the reverse cutting station, the pressing group includes at least one or more second pressing rollers arranged on one side of the feed end and discharge end of each cutting channel; the brushing group includes at least multiple second brushing rollers arranged on one side of the first and last cutting channels.

13. The encapsulant layer removal process for single-glass modules based on bidirectional and partitioned methods according to claim 5, characterized in that, The cutting tool includes a cutting roller and a plurality of planing blades distributed circumferentially around the cutting roller. During the scraping process, the cutting depth of each planing blade is equal to the thickness of the adhesive film layer; and / or, after each blade completes the scraping of the corresponding area on the adhesive film layer, the blade is de-energized and forms a follower pressure roller that is pressed onto the single glass module.

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