一种大长厚比导轨翻转机构
By designing a guide rail flipping mechanism consisting of a support assembly, a placement platform, and a rotating device, the problem of uneven force distribution during the flipping process of guide rails with a large length-to-thickness ratio was solved, achieving stable flipping and uniform force distribution of the guide rails, and avoiding deformation and collisions.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HUBEI JIANGSHAN HEAVY IND
- Filing Date
- 2025-10-28
- Publication Date
- 2026-07-17
AI Technical Summary
In existing technologies, guide rails with a large length-to-thickness ratio suffer from uneven stress during the flipping process, making them prone to deformation and collision with the platform.
A guide rail flipping mechanism is designed, which includes a support assembly, a placement platform, and a rotating device. The rotating device drives the adsorption assembly and the guide rail to flip between the placement platforms on both sides of the support assembly. The segmented gear shaft and electromagnetic adsorption assembly are used to achieve uniform force distribution and avoid deformation and collision.
This achieves uniform force distribution on the high length-to-thickness guide rail during the flipping process, avoiding deformation and platform collision, and improving the stability and safety of the flipping.
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Figure CN121247398B_ABST
Abstract
Citation Information
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