A gravity loop heat pipe and radiator based on leaf vein type flow channel

Abstract

The application discloses a gravity loop heat pipe and radiator based on a leaf vein type flow channel, which comprises an evaporation assembly, a mounting bracket, a condensation assembly, a medium injection inlet communicated with the evaporation assembly, an input copper pipe and a return copper pipe; medium is input into the evaporation assembly through the medium injection inlet, and the medium forms steam after absorbing heat, flows into the condensation assembly through the input copper pipe, and returns to the evaporation assembly through the return copper pipe after completing heat exchange in the condensation assembly. The application significantly improves the condensation efficiency through the leaf vein heat plate, reduces the volume of the condensation assembly, prolongs the working medium return path, and realizes more sufficient heat exchange. The external water cooling structure improves the heat dissipation efficiency, is not limited by the internal case, and is flexible to install. In addition, different structural designs of the gas and liquid pipelines effectively avoid the problems of early return and dry-out of the working medium in the evaporation tank body, and improve the operation efficiency and reliability of the heat pipe as a whole.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and in particular to a gravity loop heat pipe and radiator based on a leaf vein-type flow channel. Background Technology

[0002] In the development of modern electronic devices, these devices exhibit a significant trend towards high performance, high integration, and miniaturization. This trend has led to a sharp increase in the heat flux density per unit area of ​​electronic devices, making the effective management and reduction of the high heat generated during operation a critical issue that urgently needs to be addressed. Liquid-gas phase change, as a highly efficient heat transfer method, has been widely used in the thermal management of high-power electronic components. However, traditional gravity-loop heat pipes generally use fans as the condenser's cooling equipment, and their air-cooling method relies on a combination of metal fins and fans. This cooling method has significant limitations and defects:

[0003] First, air cooling has limited heat dissipation capacity. Its cooling capacity is directly limited by the size of the heatsink and the ambient temperature. In high-temperature or confined spaces, its efficiency drops significantly, making it difficult to meet the cooling needs of high-heat electronic devices. Second, it occupies a large space. To improve cooling performance, air coolers often require larger fins and higher-speed fans. This not only increases the size and weight of the heatsink but also occupies more internal space in the computer case, hindering the miniaturization and integration of electronic devices. Third, there is the noise issue. High-speed fans generate considerable noise during operation, affecting the user experience, especially in environments requiring quiet operation. Fourth, it has low energy efficiency. As cooling demands increase, air coolers consume more electricity to drive the fans, leading to a lower energy efficiency ratio and increasing the overall energy consumption of electronic devices. Summary of the Invention

[0004] This invention provides a gravity loop heat pipe and radiator based on a leaf vein flow channel to solve the technical problem in the prior art of how to increase the condensation rate of the working fluid in the condenser while reducing the volume of the loop radiator.

[0005] In view of the above technical problems, embodiments of the present invention provide a gravity loop heat pipe based on a leaf vein flow channel, including an evaporation assembly, a mounting bracket, a condensation assembly mounted on the mounting bracket, a medium injection port communicating with the evaporation assembly, an input copper pipe and a return copper pipe;

[0006] The medium is introduced into the evaporation assembly through the medium injection port. After absorbing heat, the medium forms steam, which flows into the condensation assembly through the input copper pipe. After heat exchange is completed in the condensation assembly, the steam flows back to the evaporation assembly through the return copper pipe.

[0007] Optionally, the condensation assembly includes a blade vein heat spreader, a circulating water cooling plate, and a water cooling cover plate that are stacked in sequence; the condensation assembly also includes a steam pipe and a liquid storage pipe, with the inlet end of the blade vein heat spreader connected to the steam pipe and the outlet end of the blade vein heat spreader connected to the liquid storage pipe.

[0008] Optionally, the leaf vein heat spreader includes a plurality of leaf vein inlets spaced apart and connected to the inlet end of the leaf vein heat spreader, a plurality of leaf vein outlets spaced apart and connected to the outlet end of the leaf vein heat spreader, a plurality of main vein channels connected to the leaf vein inlets, and a plurality of branch vein channels connected between the main vein channels and the leaf vein outlets, wherein the main vein channels and the branch vein channels constitute a leaf vein network radiating outward from the center.

[0009] Optionally, the condensation assembly further includes a rubber sealing ring between the circulating water cooling plate and the water cooling cover plate.

[0010] Optionally, the first end of the input copper pipe is connected to the evaporation assembly, and the second end of the input copper pipe is connected to the steam pipe; the first end of the return copper pipe is connected to the evaporation assembly, and the second end of the return copper pipe is connected to the liquid storage pipe.

[0011] Optionally, the gravity loop heat pipe based on the leaf vein flow channel further includes a first pagoda hose connector and a second pagoda hose connector installed on the water-cooled cover plate; the first pagoda hose connector is connected to the inlet end of the circulating water-cooled plate, and the second pagoda hose connector is connected to the output end of the circulating water-cooled plate.

[0012] Optionally, the circulating water cooling plate is provided with multiple flow channels.

[0013] Optionally, the evaporation assembly includes an orthogonally coupled liquid-absorbing core disposed on the mounting bracket and an evaporation chamber covering the outside of the orthogonally coupled liquid-absorbing core.

[0014] The present invention also provides a heat sink, including the above-described gravity loop heat pipe based on a veil-like flow channel.

[0015] In the heat sink of the above embodiments of the present invention, the gravity loop heat pipe based on the leaf vein flow channel has several beneficial effects:

[0016] First, this loop heat pipe uses a leaf-vein vapor chamber as the main component of the condensation assembly. This not only reduces the volume of the condensation assembly but also extends the recirculation path of the working fluid, allowing the liquid working fluid to be cooled more thoroughly, thus significantly improving the circulation efficiency. The leaf-vein vapor chamber, by mimicking the radial distribution of leaf veins, increases the contact area between the working fluid and the condensation plate, improving heat exchange efficiency and accelerating the condensation process.

[0017] Secondly, this loop heat pipe includes an external water-cooling structure, which consists of a circulating water-cooling plate, a water-cooling cover plate, a first pagoda-shaped hose connector, and a second pagoda-shaped hose connector. Through efficient heat conduction via external water circulation, it can quickly transfer heat generated by core components to the external radiator. This cooling method is not limited by the internal space and airflow of the chassis. Furthermore, because the heat exchange process is independent of the chassis interior, it reduces the impact of heat buildup inside the chassis on other components. In addition, this external water-cooling structure offers greater installation flexibility; the radiator can be placed in a well-ventilated location by extending the piping, further enhancing its heat dissipation potential.

[0018] Finally, in the design of this loop heat pipe, the gas pipe and the liquid pipe adopt two different structures. The gas pipe does not have a wick to ensure that the gaseous working fluid can fully reach the steam pipe and avoid premature backflow. The liquid pipe is equipped with a wick to improve the liquid backflow speed, prevent the working fluid inside the evaporator from burning dry, and optimize the operating efficiency of the entire loop heat pipe. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the overall structure of a gravity loop heat pipe based on a leaf vein flow channel in one embodiment of the present invention.

[0021] Figure 2 This is an exploded view of a condensation assembly according to an embodiment of the present invention;

[0022] Figure 3 This is a schematic diagram of the structure of the leaf vein heat spreader in one embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of the structure of a circulating water cooling plate in one embodiment of the present invention;

[0024] Figure 5 This is a schematic diagram of the evaporation assembly in one embodiment of the present invention.

[0025] The reference numerals in the accompanying drawings are as follows:

[0026] 1-Evaporation assembly, 11-Orthogonal coupling liquid suction core, 12-Evaporation chamber, 2-Condensation assembly, 21-Vein heat spreader, 211-Vein inlet, 212-Vein outlet, 213-Main vein channel, 214-Branch vein channel, 22-Circulating water cooling plate, 221-Flow channel, 23-Water cooling cover plate, 24-Steam pipe, 25-Liquid storage pipe, 26-Rubber sealing ring, 3-Mounting bracket, 4-Media injection port, 5-Input copper pipe, 6-Return copper pipe, 7-First pagoda hose connector, 8-Second pagoda hose connector. Detailed Implementation

[0027] To make the technical problems solved, the technical solutions, and the beneficial effects of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0028] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0029] like Figures 1 to 5 As shown, one embodiment of the present invention provides a gravity loop heat pipe based on a leaf vein flow channel, including an evaporation assembly 1, a mounting bracket 3, a condensation assembly 2 mounted on the mounting bracket 3, a medium inlet 4 communicating with the evaporation assembly 1, an inlet copper pipe 5, and a return copper pipe 6. The medium is input into the evaporation assembly 1 through the medium inlet 4, absorbs heat to form vapor, flows into the condensation assembly 2 through the inlet copper pipe 5, completes heat exchange in the condensation assembly 2, and then flows back to the evaporation assembly 1 through the return copper pipe 6. Understandably, the mounting bracket provides the necessary support for the condensation assembly, ensuring its correct alignment with the evaporation assembly to optimize heat transfer efficiency.

[0030] In one embodiment, such as Figures 1 to 2As shown, the condensing assembly 2 includes a vein-type heat spreader 21, a circulating water-cooled plate 22, and a water-cooled cover plate 23 connected in sequence. The condensing assembly 2 also includes a steam pipe 24 and a liquid storage pipe 25. The inlet end of the vein-type heat spreader 21 is connected to the steam pipe 24, and the outlet end of the vein-type heat spreader 21 is connected to the liquid storage pipe 25. Understandably, by sequentially stacking the vein-type heat spreader, the circulating water-cooled plate, and the water-cooled cover plate, a compact and efficient heat exchange system is achieved. This stacked structure not only optimizes space utilization and reduces the volume of the gravity loop heat pipe, but also, with the inlet end of the vein-type heat spreader connected to the steam pipe and the outlet end connected to the liquid storage pipe, forms an effective condensation and reflux path.

[0031] In one embodiment, such as Figure 3 As shown, the leaf vein heat spreader 21 includes a plurality of leaf vein inlets 211 spaced apart and connected to the inlet end of the leaf vein heat spreader 21, a plurality of leaf vein outlets 212 spaced apart and connected to the outlet end of the leaf vein heat spreader 21, a plurality of main vein channels 213 connected to the leaf vein inlets 211, and a plurality of branch vein channels 214 connected between the main vein channels 213 and the leaf vein outlets 212. The main vein channels 213 and the branch vein channels 214 form a leaf vein network radiating outward from the center. Understandably, the numerous, spaced-out vein inlets 211 and outlets 212 contribute to the uniform distribution of steam and condensate, ensuring stable fluid flow within the vein heat exchanger 21. The main vein channel 213, serving as the primary fluid channel, connects to multiple branch vein channels 214, which radiate outwards from the center, forming a highly efficient vein network. This increases the contact area between the working fluid and the surface of the vein heat exchanger 21, prolonging the steam residence time and ensuring sufficient release of latent heat, thereby improving heat exchange efficiency. After steam enters the vein heat exchanger 21, the vein structure facilitates uniform steam distribution and rapid condensation. The increased contact area with the plate surface as steam flows through the vein network makes the condensation process faster and more thorough. The structural design of the vein network allows for more complete contact between the steam and the plate surface during condensation, improving condensation efficiency and also promoting the collection and reflux of the condensed liquid working fluid. In addition, the structure of the leaf vein heat spreader 21 also helps to reduce the volume of the loop heat pipe because it can accommodate more flow channels 221 in a smaller space, thereby achieving more efficient heat exchange in a limited space.

[0032] In one embodiment, such as Figures 1 to 2 As shown, the condensation assembly 2 also includes a rubber sealing ring 26 between the circulating water cooling plate 22 and the water cooling cover plate 23. Understandably, a groove is provided on the circulating water cooling plate, and the rubber sealing ring 26 is embedded within it, ensuring tight contact between the water cooling cover plate 23 and the circulating water cooling plate 22, thereby effectively preventing coolant leakage and ensuring the sealing performance of the circulating water cooling system.

[0033] In one embodiment, such as Figures 1 to 2 As shown, the first end of the input copper pipe 5 is connected to the evaporation assembly 1, and the second end of the input copper pipe 5 is connected to the steam pipe 24; the first end of the return copper pipe 6 is connected to the evaporation assembly 1, and the second end of the return copper pipe 6 is connected to the liquid storage pipe 25. Understandably, the design of the input copper pipe 5 and the return copper pipe 6 achieves an effective connection between the evaporation assembly 1 and the condensation assembly 2; the first end of the input copper pipe 5 is connected to the evaporation assembly 1, and the second end is connected to the steam pipe 24, allowing the working fluid (such as R134a) in the evaporation assembly 1 to be smoothly transferred to the steam pipe 24 in the condensation assembly 2 after absorbing heat generated by the processor and converting into steam through the input copper pipe 5. Similarly, the first end of the return copper pipe 6 is connected to the evaporation assembly 1, and the second end is connected to the liquid storage pipe 25, ensuring that the condensed liquid working fluid can flow back from the liquid storage pipe 25 to the evaporation assembly 1 to complete the vapor-liquid cycle.

[0034] In one embodiment, such as Figures 1 to 2 As shown, the gravity loop heat pipe based on the leaf vein flow channel also includes a first pagoda hose connector 7 and a second pagoda hose connector 8 installed on the water-cooling cover plate 23; the first pagoda hose connector 7 connects to the inlet end of the circulating water-cooling plate 22, and the second pagoda hose connector 8 connects to the outlet end of the circulating water-cooling plate 22. Understandably, the arrangement of the first pagoda hose connector 7 and the second pagoda hose connector 8 not only ensures smooth flow of coolant in the circulating water-cooling plate 22, but also effectively transfers the heat generated by the core components to the external radiator through the external circulating water cooling system. This highly efficient heat conduction method greatly improves heat dissipation efficiency and is not limited by the internal space and airflow conditions of the chassis, thus ensuring that electronic equipment can maintain a suitable temperature in various operating environments. Furthermore, since the external water circulation system is independent of the chassis, it reduces the potential impact of heat accumulation inside the chassis on other sensitive components, improving the stability and reliability of the entire system. The flexibility of the installation layout is also a significant advantage, allowing users to install the radiator in the optimal ventilation location by extending the pipes according to specific heat dissipation needs and space conditions, further enhancing the system's heat dissipation capacity.

[0035] In one embodiment, such as Figure 1 and Figure 4 As shown, the circulating water-cooled plate 22 is provided with multiple flow channels 221. Understandably, the multiple flow channels 221 provided on the circulating water-cooled plate 22 greatly enhance the heat dissipation capacity of the loop heat pipe. These flow channels 221 provide channels for the coolant, allowing it to flow evenly across the entire surface of the circulating water-cooled plate 22, thereby achieving sufficient heat exchange with the heat source.

[0036] In one embodiment, such as Figure 1 and Figure 5 As shown, the evaporation assembly 1 includes an orthogonally coupled wicking core 11 mounted on the mounting bracket 3 and an evaporation chamber 12 covering the orthogonally coupled wicking core 11. Understandably, the orthogonally coupled wicking core 11 enhances the liquid absorption capacity of the working fluid, ensuring that the working fluid can be rapidly heated and converted into vapor during evaporation, while the condensed liquid working fluid can be effectively returned to the evaporation zone. This wicking core design typically features a large specific surface area and optimized pore structure to improve liquid absorption efficiency and thermal conductivity. The evaporation chamber 12 provides physical protection for the wicking core and forms the outer boundary of the evaporator. It helps maintain the integrity of the evaporation assembly 1, while providing a sealed environment to ensure no leakage of the working fluid and the formation of stable vapor during evaporation.

[0037] In the above embodiments of the present invention, the evaporation assembly 1 and the condensation assembly 2 are arranged in parallel. During operation, the working fluid of the gravity loop heat pipe based on the leaf vein flow channel is input into the evaporation assembly 1 through the medium inlet 4. The heat generated by the processor during operation is transferred to the working fluid (such as medium R134a) in the evaporation chamber through the mounting bracket 3 via heat conduction. After absorbing heat, the working fluid heats up to its boiling point and undergoes a boiling phase change to form steam. Due to the low density of steam, the steam moves upward through the input copper pipe 5 into the steam pipe 24, and transfers heat to the steam pipe 24 in the process. Then, the steam enters the leaf vein heat spreader 21 from the steam pipe 24. The structure of the leaf vein heat spreader 21 is similar to the structure of leaf veins in nature, with multiple main vein channels 213 and branch vein channels 214 radiating outward from the center. The steam gradually enters the main vein channels 213 and branch vein channels 214 through the inlet end of the leaf vein heat spreader 21 to form a leaf vein network radiating outward from the center. At this time, the external circulating water cooling system starts, and water flows in through the first pagoda hose connector 7, flows through the flow channel 221 in the circulating water cooling plate 22, and then flows out from the second pagoda hose connector 8. This water circulation process can remove the heat from the blade heat exchanger 21. That is, the steam exchanges heat with the circulating water cooling plate 22 and releases heat. When the heat released by the steam reaches the liquefaction condition, it condenses into a liquid working fluid. The blade network can increase the contact area between the working fluid and the surface of the blade heat exchanger 21, improving the heat exchange efficiency between them. Finally, the condensed liquid working fluid flows into the liquid storage pipe 25 through the outlet end of the blade heat exchanger 21, and then flows back to the return copper pipe 6 through the return copper pipe 6, thus completing the entire vapor-liquid cycle.

[0038] The present invention also provides a radiator including the above-described gravity loop heat pipe based on a vein-like flow channel. In the radiator of the above embodiments of the present invention, the gravity loop heat pipe based on a vein-like flow channel includes an evaporation assembly 1, a mounting bracket 3, a condensation assembly 2 mounted on the mounting bracket 3, a medium inlet 4 communicating with the evaporation assembly 1, an input copper pipe 5, and a return copper pipe 6; the medium is input into the evaporation assembly 1 through the medium inlet 4, absorbs heat to form steam, flows into the condensation assembly 2 through the input copper pipe 5, completes heat exchange in the condensation assembly 2, and then flows back to the evaporation assembly 1 through the return copper pipe 6.

[0039] In the heat sink of the above embodiments of the present invention, the gravity loop heat pipe based on the leaf vein flow channel has several advantages. First, the loop heat pipe uses the leaf vein heat spreader 21 as the main component of the condenser assembly 2. This not only reduces the volume of the condenser assembly 2, but also extends the path of the working fluid return, allowing the liquid working fluid to be cooled more fully, thereby significantly improving the circulation efficiency. The leaf vein heat spreader 21, by mimicking the radial distribution of leaf veins, increases the contact area between the working fluid and the condenser plate, improves the heat exchange efficiency, and accelerates the condensation process.

[0040] Secondly, the loop heat pipe includes an external water-cooling structure, which consists of a circulating water-cooling plate 22, a water-cooling cover plate 23, a first pagoda-shaped hose connector 7, and a second pagoda-shaped hose connector 8. Through efficient heat conduction via external water circulation, it can quickly transfer heat generated by core components to the external radiator. This heat dissipation method is not limited by the internal space and airflow of the chassis. Furthermore, because the heat exchange process is independent of the chassis interior, it reduces the impact of heat buildup inside the chassis on other components. In addition, this external water-cooling structure provides greater installation layout flexibility; the radiator can be placed in a well-ventilated location by extending the piping, further enhancing its heat dissipation potential.

[0041] Finally, in the design of this loop heat pipe, the gas pipe and the liquid pipe adopt two different structures. The gas pipe does not have a wick to ensure that the gaseous working fluid can fully reach the steam pipe 24 and avoid premature backflow. The liquid pipe is equipped with a wick to improve the liquid backflow speed, prevent the working fluid inside the evaporator 12 from burning dry, and optimize the operating efficiency of the entire loop heat pipe.

[0042] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A gravity loop heat pipe based on a leaf vein-type flow channel, characterized in that, It includes an evaporation assembly (1), a mounting bracket (3), a condensation assembly (2) mounted on the mounting bracket (3), a medium injection port (4) connected to the evaporation assembly (1), an inlet copper pipe (5), and a return copper pipe (6). The medium is input into the evaporation assembly (1) through the medium injection port (4). After absorbing heat, the medium forms steam, which flows into the condensation assembly (2) through the input copper pipe (5). After heat exchange is completed in the condensation assembly (2), the steam flows back to the evaporation assembly (1) through the return copper pipe (6). The condensing assembly (2) includes a vein heat spreader (21), a circulating water cooling plate (22), and a water cooling cover plate (23) connected in sequence; the condensing assembly (2) also includes a steam pipe (24) and a liquid storage pipe (25), the inlet end of the vein heat spreader (21) is connected to the steam pipe (24), and the outlet end of the vein heat spreader (21) is connected to the liquid storage pipe (25). The leaf vein heat spreader (21) includes a plurality of leaf vein inlets (211) spaced apart and connected to the inlet end of the leaf vein heat spreader (21), a plurality of leaf vein outlets (212) spaced apart and connected to the outlet end of the leaf vein heat spreader (21), a plurality of main vein channels (213) connected to the leaf vein inlets (211), and a plurality of branch vein channels (214) connected between the main vein channels (213) and the leaf vein outlets (212). The main vein channels (213) and the branch vein channels (214) constitute a leaf vein network radiating outward from the center. The first end of the input copper pipe (5) is connected to the evaporation assembly (1), and the second end of the input copper pipe (5) is connected to the steam pipe (24); the first end of the return copper pipe (6) is connected to the evaporation assembly (1), and the second end of the return copper pipe (6) is connected to the liquid storage pipe (25).

2. The gravity loop heat pipe based on a leaf vein flow channel according to claim 1, characterized in that, The condensation assembly (2) also includes a rubber sealing ring (26) between the circulating water cooling plate (22) and the water cooling cover plate (23), and the rubber sealing ring (26) is embedded in a groove provided on the circulating water cooling plate (22).

3. The gravity loop heat pipe based on a leaf vein flow channel according to claim 2, characterized in that, It also includes a first pagoda hose connector (7) and a second pagoda hose connector (8) installed on the water-cooled cover plate (23); the first pagoda hose connector (7) is connected to the inlet end of the circulating water-cooled plate (22), and the second pagoda hose connector (8) is connected to the output end of the circulating water-cooled plate (22).

4. The gravity loop heat pipe based on a leaf vein flow channel according to claim 3, characterized in that, Multiple flow channels (221) are provided on the circulating water cooling plate (22).

5. The gravity loop heat pipe based on a leaf vein flow channel according to claim 4, characterized in that, The evaporation assembly (1) includes an orthogonally coupled liquid suction core (11) disposed on the mounting bracket (3) and an evaporation chamber (12) covering the outside of the orthogonally coupled liquid suction core (11).

6. A radiator, characterized in that, Including the gravity loop heat pipe based on the leaf vein flow channel as described in any one of claims 1-5.

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