一种基于电化学腐蚀的薄膜缺陷检测方法
By combining electrochemical etching and optical microscopy image analysis, the problems of high cost, high complexity, and low efficiency in thin film defect detection have been solved, achieving low-cost and high-efficiency thin film defect detection and providing a reliable assessment of thin film quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- JIANGNAN UNIV
- Filing Date
- 2025-09-23
- Publication Date
- 2026-07-17
AI Technical Summary
Existing methods for detecting defects in thin films suffer from high cost, high complexity, low efficiency, and low accuracy, making it difficult to meet the needs of industrial batch testing.
Electrochemical etching is used to treat thin films, expanding the original small-sized defects to a size observable by an optical microscope. Then, images are acquired and analyzed using an optical microscope to identify and statistically analyze the defect morphology, size, and distribution, and to deduce the original defect information of the thin film.
It achieves low-cost, high-efficiency thin film defect detection, accurately obtaining defect density, location, and type, avoiding the use of high-cost equipment, improving detection efficiency, and ensuring no risk of film detachment.
Smart Images
Figure CN121253531B_ABST