High speed silicon photonic engine method and apparatus for silicon photonic modules

Abstract

This invention relates to the field of silicon photonics chip technology, specifically including a method and apparatus for a high-speed silicon photonic engine for silicon photonic modules. The method includes: acquiring basic technical parameters of an optical fiber connection product equipped with a silicon photonic module; configuring the refractive index distribution and waveguide cross-sectional dimensions of the silicon photonic waveguide to construct a multimode waveguide array; integrating an electro-optic modulator array in the multimode waveguide array and adjusting the coupling efficiency between the waveguide and the optical fiber in real time through dynamic impedance matching; simultaneously, driving the electro-optic modulator array with a high-speed electric drive circuit and optimizing the signal rise / fall characteristics, while adjusting the power consumption of the high-speed electric drive circuit. This invention solves the technical problem that silicon photonic waveguide designs often use fixed parameters, which easily lead to mode crosstalk in high-speed transmission scenarios, resulting in a degraded optical signal quality. It achieves the technical effect of dynamically configuring the waveguide refractive index and constructing a multimode waveguide array, effectively reducing mode crosstalk, decreasing transmission loss, and improving the quality of optical signal transmission.

Description

Technical Field

[0001] This invention relates to the field of silicon photonics chip technology, and specifically to a high-speed silicon photonic engine method and apparatus for silicon photonic modules. Background Technology

[0002] As the core component of silicon photonics modules, the performance of silicon photonics engines directly determines the modulation and transmission efficiency of optical signals and the stability of the system. However, in current silicon photonics engine technology, silicon photonics waveguide designs mostly use fixed parameters, which are difficult to adapt to the optical transmission requirements of different scenarios. This results in problems such as large mode crosstalk and high transmission loss. At high-speed transmission speeds above 400Gbps, optical signal distortion is severe, leading to a significant increase in the bit error rate. In addition, high-frequency signal attenuation and impedance mismatch in high-speed electric drive circuits result in excessive chip power consumption and poor operating stability, which seriously restricts the reliability of silicon photonics modules in high-speed scenarios. Summary of the Invention

[0003] This application provides a high-speed silicon photonics engine method and apparatus for silicon photonics modules, aiming to solve the technical problem that existing silicon photonics waveguide designs often use fixed parameters, which easily lead to mode crosstalk in high-speed transmission scenarios, resulting in a degraded optical signal quality.

[0004] In view of the above problems, the technical solution to achieve the present application is as follows:

[0005] In a first aspect, this application provides a high-speed silicon photonic engine method for silicon photonic modules, wherein the method includes: obtaining basic technical parameters of an optical fiber connection product equipped with a silicon photonic module; configuring the refractive index distribution and waveguide cross-sectional dimensions of the silicon photonic waveguide based on the basic technical parameters to construct a multimode waveguide array; integrating an electro-optic modulator array in the multimode waveguide array, and adjusting the coupling efficiency between the waveguide and the optical fiber in real time through dynamic impedance matching; simultaneously, driving the electro-optic modulator array with a high-speed electric drive circuit and optimizing the signal rise / fall characteristics, and constructing a thermo-electric-optic coupling model to adjust the power consumption of the high-speed electric drive circuit.

[0006] Preferably, a common-mode choke is integrated at the output of the high-speed electric drive circuit to compensate for high-frequency signal attenuation through dynamic pre-emphasis.

[0007] Preferably, a MEMS tunable grating is integrated at the waveguide output end to monitor the reflected light power spectrum in real time; based on the reflected light power spectrum, the piezoelectric ceramic micro-displacement is triggered by demodulating the reflected phase noise.

[0008] Preferably, the phase noise integral value is obtained, and when the phase noise integral value exceeds a preset integral threshold, a piezoelectric ceramic displacement adjustment command is triggered; the piezoelectric ceramic displacement adjustment command is used to control the waveguide end face curvature radius adjustment accuracy within the tolerance standard.

[0009] Preferably, a graphene-based micro heat pipe array is integrated below the electro-optic modulator, and an infrared thermal imaging sensor is deployed to provide real-time feedback on the chip junction temperature for dynamic power consumption adjustment; when the chip junction temperature exceeds the preset upper temperature limit, a gradient frequency reduction strategy is triggered and redundant heat is directionally discharged through the heat pipe.

[0010] Preferably, the heat pipe operating mode is dynamically adjusted according to the chip junction temperature. When the chip junction temperature is in the temperature range starting from 80% of the preset upper temperature limit, the heat pipe capillary action is activated to enhance heat dissipation.

[0011] Preferably, a waveguide-fiber-drive circuit joint calibration module is constructed, and a 4D parameter compensation matrix is ​​generated using a wavelength-sensitive matrix tester; based on the 4D parameter compensation matrix, the modulator bias voltage and fiber input angle are dynamically optimized through federated learning.

[0012] Preferably, local data is uploaded to the cloud platform for global aggregation and update; after global aggregation and update, the modulator bias voltage and fiber input angle are output.

[0013] Preferably, a lightweight federated learning agent is deployed based on an edge computing node; on the lightweight federated learning agent, random noise is injected into the local data to formulate an adversarial network.

[0014] A second aspect of this application provides a high-speed silicon photonic engine device for silicon photonic modules, wherein the device comprises: a parameter acquisition module for acquiring basic technical parameters of an optical fiber connection product equipped with a silicon photonic module; a multimode waveguide array construction module for configuring the refractive index distribution and waveguide cross-sectional dimensions of the silicon photonic waveguide based on the basic technical parameters, and constructing a multimode waveguide array; an impedance matching module for integrating an electro-optic modulator array in the multimode waveguide array, and adjusting the coupling efficiency between the waveguide and the optical fiber in real time through dynamic impedance matching; and a power consumption adjustment module for simultaneously driving the electro-optic modulator array with a high-speed electric drive circuit and optimizing the signal rise / fall characteristics, and constructing a thermo-electric-optic coupling model to adjust the power consumption of the high-speed electric drive circuit.

[0015] In summary, one or more technical solutions provided in this application achieve the technical effects of dynamically configuring waveguide refractive index, constructing multimode waveguide arrays, effectively reducing mode crosstalk, reducing transmission loss, and improving the quality of optical signal transmission.

[0016] The above description is merely an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, specific embodiments of this application are given below. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a flowchart illustrating a high-speed silicon photonics engine method for a silicon photonics module in one embodiment.

[0019] Figure 2 This is an architectural diagram of a high-speed silicon photonics engine device for a silicon photonics module in one embodiment.

[0020] Figure labeling: Parameter acquisition module 11, multimode waveguide array construction module 12, impedance matching module 13, power consumption adjustment module 14. Detailed Implementation

[0021] This application provides a high-speed silicon photonics engine method and apparatus for silicon photonics modules, which solves the technical problem that existing silicon photonics waveguide designs often use fixed parameters, and are prone to mode crosstalk in high-speed transmission scenarios, leading to a degraded optical signal quality.

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0023] It should be noted that the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, such as a process, method, apparatus, product, or server that includes a series of steps or units, not necessarily limited to those steps or units that are explicitly listed, but may include other steps or modules that are not explicitly listed or that are inherent to such processes, methods, products, or apparatus.

[0024] Example 1: The present application will be described in detail below with reference to the accompanying drawings, as follows... Figure 1 As shown, this application provides a high-speed silicon photonics engine method for silicon photonics modules, the method comprising:

[0025] Obtain the basic technical parameters of the fiber optic connection product equipped with silicon photonics module; based on the basic technical parameters, configure the refractive index distribution and waveguide cross-sectional size of the silicon photonics waveguide, and construct a multimode waveguide array.

[0026] Specifically, the basic technical parameters of optical fiber connection products include the fiber core diameter, cladding diameter, numerical aperture, cutoff wavelength, and transmission loss. Among these, the refractive index distribution of silicon optical waveguides refers to the variation of the refractive index of the silicon material in the waveguide with position. The refractive index of silicon is approximately 3.48, while the refractive index of the silicon dioxide cladding is approximately 1.44. This significant difference in refractive index allows silicon optical waveguides to effectively confine the light field, but it also increases the complexity of the design. Waveguide cross-sectional dimensions refer to the geometric parameters such as the width and thickness of the waveguide, which have a significant impact on the number and characteristics of the modes supported by the waveguide. For example, the waveguide width is generally between several hundred nanometers and several micrometers. Narrower waveguides typically support single-mode operation, while wider waveguides can support multimode operation. Multimode waveguide arrays refer to arrays composed of multiple waveguides with different mode characteristics. By rationally designing the parameters of each waveguide, multiple modes of light can be transmitted in the array, thereby increasing the capacity and flexibility of information transmission.

[0027] In one embodiment, the basic technical parameters of the fiber optic connection product are obtained. Based on the basic technical parameters of the fiber optic connection product with silicon optical modules, the refractive index distribution and waveguide cross-sectional dimensions of the silicon optical waveguide are configured to construct a multimode waveguide array. By precisely controlling the geometry and refractive index distribution of the waveguide, mode crosstalk can be effectively reduced and the transmission quality of optical signals can be improved. For example, when the waveguide width is 1.2 micrometers, the silicon optical waveguide can support multiple mode transmissions. These modes are completely overlapping in space but have orthogonality. Therefore, when transmitted in a straight waveguide, they can maintain their independence and avoid mutual coupling and crosstalk.

[0028] An electro-optic modulator array is integrated into the multimode waveguide array. Through dynamic impedance matching, the coupling efficiency between the waveguide and the optical fiber is adjusted in real time. At the same time, a high-speed electric drive circuit drives the electro-optic modulator array and optimizes the signal rise / fall characteristics. A thermo-electric-optic coupling model is constructed to regulate the power consumption of the high-speed electric drive circuit.

[0029] Specifically, an electro-optic modulator array refers to an array composed of multiple modulators capable of converting electrical signals into optical signals. Each modulator can independently control the amplitude, phase, or frequency characteristics of the optical signal. Dynamic impedance matching aims to reduce signal reflection, improve transmission efficiency, and ensure good coupling between the waveguide and the optical fiber. Coupling efficiency refers to the efficiency with which the optical signal is coupled from the waveguide into the optical fiber. A high-speed electric drive circuit is a circuit that can quickly provide electrical signals to drive the electro-optic modulator array. Its performance directly affects the modulation speed and quality of the optical signal. The signal rise / fall characteristics refer to the time required for the signal to rise from a low level to a high level or fall from a high level to a low level. These rise / fall characteristics have a significant impact on the bandwidth and rate of optical signal transmission. The thermo-electric-optic coupling model is a model that comprehensively considers the interaction of three physical fields: heat, electricity, and light. It is used to analyze and adjust the power consumption of high-speed electric drive circuits to achieve a dynamic balance between power consumption and temperature.

[0030] In one embodiment, an electro-optic modulator array is integrated into a multimode waveguide array, enabling each waveguide to independently modulate the optical signal, thereby achieving parallel processing of the optical signal and improving the transmission efficiency and capacity. By using dynamic impedance matching technology to adjust the coupling efficiency between the waveguide and the optical fiber in real time, it is ensured that optical signals of different wavelengths and modes can be efficiently coupled from the waveguide to the optical fiber, effectively improving the performance of the optical link. For example, at a transmission rate of 100Gbps, dynamic impedance matching technology can improve the coupling efficiency by approximately 20% and reduce the optical signal loss by approximately 1.5dB.

[0031] Simultaneously, the high-speed electric drive circuit drives the electro-optic modulator array and optimizes the signal rise and fall characteristics. Specifically, it can shorten the signal rise time and fall time, thereby improving the modulation rate and bandwidth of the optical signal to meet the needs of high-speed optical communication. A thermo-electric-optic coupling model is constructed to adjust the power consumption of the high-speed electric drive circuit. It can dynamically adjust the circuit's operating state according to the power consumption and heat generated by the electric drive circuit, achieving a balance between power consumption and temperature. For example, when the power of the electric drive circuit is increased, the chip temperature is kept within a certain range through the adjustment of the thermo-electric-optic coupling model, thereby improving the stability and reliability of the circuit and further improving the performance and efficiency of the entire silicon photonic engine.

[0032] Furthermore, the method also includes:

[0033] A common-mode choke is integrated at the output of the high-speed electric drive circuit to compensate for high-frequency signal attenuation through dynamic pre-emphasis.

[0034] Specifically, common-mode chokes are electronic components used to suppress common-mode noise in high-frequency signals. Their working principle involves using the inductance of a coil to generate a large inductive reactance to the high-frequency signal, thereby suppressing the transmission of common-mode noise while having minimal impact on differential-mode signals. A common-mode choke typically consists of two coils wound on a single magnetic core. When a common-mode current flows through, the magnetic fields generated by the two coils superimpose, forming a large inductive reactance that suppresses the common-mode current. When a differential-mode current flows through, the magnetic fields generated by the two coils cancel each other out, having minimal impact on the differential-mode signal. Dynamic pre-emphasis employs signal compensation, appropriately amplifying or adjusting the high-frequency signal at the signal transmitting end to compensate for the amplitude reduction caused by high-frequency attenuation during transmission, thereby improving signal quality and transmission distance. High-frequency signal attenuation refers to the phenomenon where the amplitude of the high-frequency components of a signal gradually decreases during high-speed transmission due to factors such as transmission line loss and reflection, affecting signal integrity and transmission efficiency.

[0035] In one embodiment, a common-mode choke is integrated at the output of the high-speed electric drive circuit to effectively suppress common-mode noise of high-frequency signals, improve the anti-interference capability of the signal, and ensure that the drive signal received by the electro-optic modulator array has high quality and stability. Through dynamic pre-emphasis technology, the amplitude and phase of the signal are adjusted in real time according to the frequency characteristics and transmission characteristics of the signal to compensate for the attenuation of the high-frequency signal during transmission, so that the signal maintains good rising and falling edge characteristics when it reaches the electro-optic modulator.

[0036] Optionally, in high-speed optical communication systems, when the signal rate is as high as 400Gbps, the amplitude of the signal without dynamic pre-emphasis technology may drop by more than 30% at the end of the transmission line. However, with the adoption of dynamic pre-emphasis technology, the drop in signal amplitude can be controlled within 10%, thereby significantly improving the signal quality and transmission efficiency and ensuring high-speed and stable transmission of optical signals.

[0037] Furthermore, this application provides a method for real-time adjustment of the coupling efficiency between the waveguide and the optical fiber through dynamic impedance matching, the method comprising:

[0038] A MEMS tunable grating is integrated at the waveguide output end to monitor the reflected light power spectrum in real time; based on the reflected light power spectrum, the piezoelectric ceramic micro-displacement is triggered by demodulating the reflected phase noise.

[0039] Specifically, MEMS tunable gratings are adjustable optical elements manufactured using microelectromechanical systems (MEMS) technology. They can diffract and modulate incident light by changing their period, fill factor, or tilt angle to control the propagation direction and intensity of light. For example, by controlling the tilt angle of the grating, the diffraction angle of the light can be changed, achieving precise control of the optical signal. The reflected optical power spectrum refers to the power distribution of the optical signal reflected from the waveguide output at different wavelengths. By monitoring the reflected optical power spectrum, important information such as the transmission characteristics of the optical signal in the waveguide, loss conditions, and coupling state between the optical fiber and the waveguide can be obtained. Reflected phase noise refers to the random fluctuations in the phase of the reflected optical signal, usually caused by changes in the physical environment of the optical fiber or waveguide, interference during transmission, etc. Phase noise affects the quality and coherence of the optical signal. By demodulating the reflected phase noise, the transmission status of the optical signal can be monitored in real time, and corresponding adjustment mechanisms can be triggered to optimize the signal quality.

[0040] In one embodiment, a MEMS tunable grating is integrated at the waveguide output end, which can monitor the reflected light power spectrum in real time. The monitoring frequency can reach thousands of times per second, covering a wavelength range typically between 1260nm and 1650nm, thereby comprehensively understanding the transmission characteristics of optical signals in the waveguide. Based on the reflected light power spectrum, by demodulating the reflected phase noise, the piezoelectric ceramic micro-displacement adjustment can be precisely triggered, thereby improving the coupling efficiency between the waveguide and the optical fiber, reducing coupling loss, and effectively enhancing the transmission quality and stability of the optical signal.

[0041] Furthermore, this application provides a method for demodulating the reflected phase noise based on the reflected light power spectrum, the method comprising:

[0042] The phase noise integral value is obtained. When the phase noise integral value exceeds the preset integral threshold, a piezoelectric ceramic displacement adjustment command is triggered. The piezoelectric ceramic displacement adjustment command is used to control the waveguide end face curvature radius adjustment accuracy within the tolerance standard.

[0043] Specifically, the phase noise integral value refers to the value obtained by integrating the reflected phase noise over a certain time interval. It is used to quantify the cumulative effect of phase noise and reflects the phase stability of the optical signal during transmission. The preset integration threshold is a pre-set standard value used to determine whether the phase noise exceeds the allowable range. When the phase noise integral value exceeds this threshold, it indicates that the phase stability of the optical signal has been significantly affected and adjustment is required. The piezoelectric ceramic displacement adjustment command is a control signal used to drive the piezoelectric ceramic element to perform micro-displacement adjustment. Piezoelectric ceramics are materials with piezoelectric effect, which can produce small deformations under the action of an electric field. This deformation can be used to precisely adjust the curvature radius of the waveguide end face. The waveguide end face curvature radius adjustment accuracy refers to the precision of adjusting the waveguide end face curvature radius, which is directly related to the coupling efficiency between the waveguide and the optical fiber and the optical signal transmission quality, ensuring coupling efficiency and signal quality. The tolerance standard refers to the allowable error range, which is a specific requirement for adjustment accuracy. It is usually required that the adjustment accuracy of the waveguide end face curvature radius be within ±0.5 micrometers to ensure efficient coupling and transmission of the optical signal.

[0044] In one embodiment, the phase noise integral value is obtained and compared with a preset integration threshold to achieve dynamic adjustment of the waveguide-fiber coupling efficiency. Specifically, when the phase noise integral value exceeds the preset integration threshold, it indicates that the phase stability of the optical signal is disturbed. At this time, a piezoelectric ceramic displacement adjustment command is triggered. Through the micro-displacement adjustment of the piezoelectric ceramic, the adjustment accuracy of the waveguide end face curvature radius is controlled within the tolerance standard, thereby maintaining the coupling efficiency between the waveguide and the optical fiber.

[0045] Optionally, in an optical communication system, when the optical fiber is affected by external temperature changes or mechanical vibrations, causing phase noise accumulation, the above-mentioned adjustment mechanism can increase the coupling efficiency between the waveguide and the optical fiber from the initial 60% to over 85%, significantly improving the transmission quality of the optical signal. At the same time, precise curvature radius adjustment can also reduce the reflection loss of the optical signal, thereby further enhancing the overall performance and stability of the system and ensuring the efficient and reliable operation of the optical communication system.

[0046] Furthermore, this application provides a method for adjusting the power consumption of the high-speed electric drive circuit by constructing a thermal-electric-optical coupling model, the method comprising:

[0047] A graphene-based micro heat pipe array is integrated below the electro-optic modulator, and an infrared thermal imaging sensor is deployed to provide real-time feedback on the chip junction temperature for dynamic power consumption adjustment. When the chip junction temperature exceeds the preset upper limit, a gradient frequency reduction strategy is triggered and redundant heat is directionally discharged through the heat pipe.

[0048] Specifically, graphene-based micro heat pipe arrays are heat dissipation elements. Graphene has an extremely high thermal conductivity, typically exceeding 5000 W / (m·K), far surpassing traditional metal materials, enabling micro heat pipes to efficiently conduct and dissipate heat. A micro heat pipe array consists of multiple tiny heat pipes, each containing a working fluid. When one end is heated, the liquid evaporates, carrying away heat; when the other end is cooled, the liquid condenses, releasing heat, thus achieving rapid heat transfer. Infrared thermal imaging sensors detect infrared radiation from an object's surface and convert it into temperature information, allowing real-time monitoring of the chip's junction temperature without physical contact. Dynamic power consumption adjustment refers to adjusting the power consumption of the electric drive circuit based on real-time conditions such as chip temperature and load, ensuring efficient circuit operation while avoiding overheating. Gradient frequency reduction strategy refers to gradually reducing the operating frequency of the electric drive circuit when the chip temperature is too high, reducing power consumption and heat generation to protect the chip from damage.

[0049] In one embodiment, a graphene-based micro heat pipe array is integrated beneath the electro-optic modulator, and an infrared thermal imaging sensor is deployed to monitor the chip junction temperature in real time. This enables precise temperature control of the chip. For example, when the chip load reaches over 80% and the ambient temperature exceeds 35°C, the temperature of the electro-optic modulator rapidly rises to over 90°C. At this point, the infrared thermal imaging sensor feeds back the temperature information to the dynamic power consumption adjustment system in real time, triggering a gradient frequency reduction strategy. This allows the chip temperature to rapidly drop below 75°C within a short time. Simultaneously, redundant heat is directed away through the heat pipes, effectively preventing optical signal distortion and increased bit error rate due to overheating. This not only improves the stability and reliability of the chip, ensuring the efficient operation of the entire silicon photonics engine in high-speed optical communication scenarios, but also, by optimizing the heat pipe's operating mode, when the chip junction temperature is within 80% of the preset upper temperature limit, the capillary action of the heat pipe is activated to enhance heat dissipation, further improving heat dissipation efficiency and enabling the chip to operate stably over a wider temperature range.

[0050] Furthermore, the method includes:

[0051] The heat pipe operating mode is dynamically adjusted according to the chip junction temperature. When the chip junction temperature is in the temperature range starting from 80% of the preset upper temperature limit, the heat pipe capillary action is activated to enhance heat dissipation.

[0052] Specifically, the junction temperature of a chip refers to the junction temperature of the transistors inside the chip. It reflects the heat accumulation during chip operation and is an important indicator for measuring the chip's thermal state. The junction temperature directly affects the chip's performance, power consumption, and lifespan. The preset temperature upper limit is a temperature threshold set according to the chip's design specifications and safe operation requirements. When the chip junction temperature exceeds this preset temperature upper limit, it may lead to a decrease in chip performance, an increase in power consumption, or even damage. For example, the preset temperature upper limit of common silicon photonic chips is usually between 85°C and 100°C. Heat pipe capillary action enhances heat dissipation by utilizing the capillary structure inside the heat pipe to enhance the circulation of the working fluid and improve the heat dissipation capacity of the heat pipe. Capillary action is the phenomenon of liquid automatically rising or diffusing in a thin tube or porous material due to surface tension. In a heat pipe, capillary action allows the liquid to quickly flow back from the condenser end to the evaporator end, maintaining the heat pipe's efficient heat dissipation.

[0053] In one embodiment, the heat pipe operating mode is dynamically adjusted according to the chip junction temperature to precisely control the chip temperature and ensure its stable operation. For example, when the chip junction temperature is in the temperature range starting from 80% of the preset upper temperature limit, that is, if the preset upper temperature limit is 85°C, when the chip junction temperature reaches 68°C, the heat pipe capillary action is activated to enhance heat dissipation, effectively suppressing temperature overshoot, reducing chip temperature fluctuations, reducing the risk of chip damage caused by drastic temperature changes, and at the same time reducing optical signal distortion and bit error rate to ensure long-term stable operation of the system.

[0054] Furthermore, the method also includes:

[0055] A waveguide-fiber-drive circuit joint calibration module is constructed, and a 4D parameter compensation matrix is ​​generated using a wavelength-sensitive matrix tester. Based on the 4D parameter compensation matrix, the modulator bias voltage and fiber input angle are dynamically optimized through federated learning.

[0056] Specifically, the waveguide-fiber-driver circuit joint calibration module aims to ensure the coordinated operation and performance optimization among silicon optical waveguides, optical fibers, and electro-optic modulator driver circuits. Joint calibration can improve the transmission efficiency and signal quality of the entire optical communication system. The wavelength-sensitive matrix tester is an instrument that can measure the transmission characteristics of optical signals at different wavelengths and generate matrix data. By detecting parameters such as wavelength, intensity, and phase of the optical signal, it generates a 4D parameter compensation matrix to compensate for and optimize the transmission characteristics of the optical signal. The 4D parameter compensation matrix is ​​a four-dimensional data matrix containing compensation parameters for optical signals at different wavelengths, modes, polarization states, and transmission paths. It can accurately guide the adjustment of modulator bias voltage and fiber input angle to achieve the best optical signal transmission effect. Federated learning is a distributed machine learning technology that trains models collaboratively on multiple devices or nodes while ensuring data privacy and security, thereby dynamically optimizing modulator bias voltage and fiber input angle, improving the system's adaptability and performance.

[0057] In one embodiment, a waveguide-fiber-drive circuit joint calibration module is constructed, and a 4D parameter compensation matrix is ​​generated using a wavelength-sensitive matrix tester, which can realize fine calibration and optimization of the optical communication system. Based on the 4D parameter compensation matrix, the modulator bias voltage and fiber input angle are dynamically optimized through federated learning, enabling the system to maintain high-performance operation under different working conditions and environments.

[0058] Optionally, in a 100Gbps optical communication system, the coupling efficiency between the optical fiber and the waveguide can be improved by using a joint calibration module and a 4D parameter compensation matrix, and the extinction ratio of the modulator can be optimized to above 25dB, reducing the bit error rate of the optical signal by about three orders of magnitude. In an environment with a temperature range of -5℃ to 75℃, the modulator bias voltage can be dynamically adjusted by federated learning to ensure that the transmission quality of the optical signal is not affected by temperature, keeping the bit error rate of the system below 1e-12, while increasing the transmission bandwidth of the optical signal, significantly improving the performance and reliability of the entire optical communication system.

[0059] Furthermore, this application provides a method for dynamically optimizing the modulator bias voltage and fiber input angle through federated learning, the method further comprising:

[0060] The local data is uploaded to the cloud platform for global aggregation and update; after the global aggregation and update, the modulator bias voltage and the fiber input angle are output.

[0061] Specifically, local data refers to parameter data about optical communication performance collected and processed on various distributed silicon photonics module devices; uploading to the cloud platform means that this data is transmitted to a centralized remote server system via the Internet for storage and further analysis; the cloud platform has powerful computing and data storage capabilities and can process data from multiple different locations.

[0062] In a federated learning environment, global aggregation update refers to summarizing the model updates or training data uploaded by various local devices, updating the global model through methods such as average weighting, and then redistributing this optimized model to various local devices for the next round of training. This can utilize a large amount of distributed data to improve the model's generalization ability while protecting data privacy. Modulator bias voltage refers to the bias voltage applied to the electrodes of the electro-optic modulator, used to control the modulator's operating state and modulation efficiency. Fiber input angle refers to the coupling angle between the optical fiber and the silicon optical waveguide, which is crucial for efficient coupling of optical signals. After the global model update, the optimal modulator bias voltage and fiber input angle are obtained for subsequent optical signal modulation and transmission.

[0063] In one embodiment, a large number of silicon photonic modules exist in a distributed optical fiber communication network. Each module collects data on the quality of optical signal transmission, such as signal strength, bit error rate, and transmission loss, under different operating environments. Uploading the local data to a cloud platform can establish a large-scale database with optical communication performance characteristics. The cloud platform adopts a federated learning architecture, in which thousands of nodes are deployed, and each node is responsible for processing and updating some model parameters.

[0064] Optionally, during the aggregation update process, the cloud platform analyzes and summarizes the data uploaded by each silicon photonics module, and uses machine learning algorithms to optimize the calculation models for modulator bias voltage and fiber input angle. For example, the cloud platform can perform statistical analysis on massive amounts of data points. If it finds that adjusting the modulator bias voltage from 2.5V to 2.8V can reduce the bit error rate by 15%, and optimizing the fiber input angle from 8° to 8.2° can improve the coupling efficiency by 10%, after the global aggregation update, the cloud platform will output the optimized modulator bias voltage and fiber input angle parameters and feed them back to each silicon photonics module device, thereby improving the transmission efficiency and stability of the entire system.

[0065] Furthermore, this application provides a method for outputting the modulator bias voltage and fiber input angle after a global aggregation update, the method further comprising:

[0066] A lightweight federated learning agent is deployed based on edge computing nodes; random noise is injected into local data on the lightweight federated learning agent to formulate an adversarial network.

[0067] Specifically, edge computing nodes refer to computing devices located at the network edge (close to the data source or user end) for preliminary processing and analysis of local data. They are small servers, smart gateways, or dedicated hardware devices deployed in fiber optic communication networks. Their characteristics include the ability to process data quickly locally, reducing dependence on central servers and lowering data transmission latency. Lightweight federated learning agents refer to simplified federated learning clients deployed on edge computing nodes. In comparison, lightweight federated learning agents have smaller memory footprints, lower computing resource requirements, and faster response times. They can run efficiently on resource-constrained edge devices while maintaining the basic functions of federated learning, such as model updates, data encryption, and communication optimization.

[0068] Random noise injection is used for data privacy protection. Random noise is added to local data to make it difficult to steal or recover the original information during transmission and processing. Specifically, it involves adding random perturbations of a certain magnitude to the feature dimensions of the data. For example, adding random noise in the range [-0.5, 0.5] to light signal intensity data ensures data privacy during federated learning. Adversarial networks (ANNs) are network structures built during federated learning to improve the robustness and generalization ability of the model. Through adversarial training, random noise and data perturbations are simultaneously countered during the learning process, enhancing the model's adaptability to different data distributions. Specifically, an ANN includes a generator and a discriminator. The generator attempts to generate noisy data that can confuse the discriminator, while the discriminator attempts to distinguish between real and generated data. This adversarial training improves the stability and performance of federated learning.

[0069] In one embodiment, each fiber optic connection node of the high-speed communication network of the silicon photonics module is equipped with an edge computing device, on which a lightweight federated learning agent is deployed. The agent first preprocesses the locally collected optical communication data (such as modulator bias voltage, fiber input angle, optical signal quality, etc.), including data cleaning and feature extraction. Before the data is uploaded to the cloud, a random noise injection module perturbs the data according to preset noise intensity parameters (such as noise amplitude accounting for 5% of the original data) to ensure data privacy and security.

[0070] The lightweight federated learning agent uses local computing resources for initial model training and uploads the updated model information (not the original data) to the cloud platform. On the cloud platform, the global model is optimized by aggregating the updates from each edge node. At the same time, the adversarial network module starts working, simulating various possible noise interferences and data anomalies to perform adversarial training on the global model. After multiple iterations, the robustness of the global model is significantly improved. The optimized global model is distributed back to each edge computing node, and the lightweight federated learning agent adjusts the local modulator bias voltage and fiber input angle according to the new model parameters, thereby improving the transmission efficiency and stability of the entire silicon photonics communication network.

[0071] In summary, the embodiments of this application have at least the following technical effects:

[0072] This application provides a high-speed silicon photonics engine method and apparatus for silicon photonics modules. It achieves the technical effects of dynamically configuring the waveguide refractive index and constructing a multimode waveguide array by acquiring the basic technical parameters of fiber optic connection products with silicon photonics modules; configuring the refractive index distribution and waveguide cross-sectional dimensions of the silicon photonics waveguide; constructing a multimode waveguide array; integrating an electro-optic modulator array within the multimode waveguide array; and dynamically adjusting the coupling efficiency between the waveguide and the fiber through impedance matching. Simultaneously, a high-speed electric drive circuit drives the electro-optic modulator array and optimizes the signal rise / fall times characteristics, constructing a thermo-electric-optic coupling model to regulate the power consumption of the high-speed electric drive circuit.

[0073] Example 2, based on the same inventive concept as the high-speed silicon photonics engine method for silicon photonics modules in the foregoing examples, such as... Figure 2 As shown, this application provides a high-speed silicon photonics engine device for silicon photonics modules, the device comprising:

[0074] The parameter acquisition module 11 is used to acquire the basic technical parameters of fiber optic connection products equipped with silicon photonics modules.

[0075] The multimode waveguide array construction module 12 is used to configure the refractive index distribution and waveguide cross-sectional dimensions of the silicon optical waveguide based on the basic technical parameters, and to construct a multimode waveguide array.

[0076] Impedance matching module 13 is used to integrate an electro-optic modulator array in the multimode waveguide array and adjust the coupling efficiency between the waveguide and the optical fiber in real time through dynamic impedance matching.

[0077] The power consumption adjustment module 14 is used to simultaneously drive the electro-optic modulator array with the high-speed electric drive circuit and optimize the signal rising edge / falling edge characteristics, and construct a thermal-electric-optic coupling model to adjust the power consumption of the high-speed electric drive circuit.

[0078] Furthermore, the high-speed silicon photonic engine device for the silicon photonic module is also used to perform the following method:

[0079] A common-mode choke is integrated at the output of the high-speed electric drive circuit to compensate for high-frequency signal attenuation through dynamic pre-emphasis.

[0080] Furthermore, the impedance matching module 13 is also used to perform the following method:

[0081] A MEMS tunable grating is integrated at the waveguide output end to monitor the reflected light power spectrum in real time; based on the reflected light power spectrum, the piezoelectric ceramic micro-displacement is triggered by demodulating the reflected phase noise.

[0082] Furthermore, the impedance matching module 13 is also used to perform the following method:

[0083] The phase noise integral value is obtained. When the phase noise integral value exceeds the preset integral threshold, a piezoelectric ceramic displacement adjustment command is triggered. The piezoelectric ceramic displacement adjustment command is used to control the waveguide end face curvature radius adjustment accuracy within the tolerance standard.

[0084] Furthermore, the power consumption adjustment module 14 is also used to perform the following method:

[0085] A graphene-based micro heat pipe array is integrated below the electro-optic modulator, and an infrared thermal imaging sensor is deployed to provide real-time feedback on the chip junction temperature for dynamic power consumption adjustment. When the chip junction temperature exceeds the preset upper limit, a gradient frequency reduction strategy is triggered and redundant heat is directionally discharged through the heat pipe.

[0086] Furthermore, the power consumption adjustment module 14 is also used to perform the following method:

[0087] The heat pipe operating mode is dynamically adjusted according to the chip junction temperature. When the chip junction temperature is in the temperature range starting from 80% of the preset upper temperature limit, the heat pipe capillary action is activated to enhance heat dissipation.

[0088] Furthermore, the power consumption adjustment module 14 is also used to perform the following method:

[0089] A waveguide-fiber-drive circuit joint calibration module is constructed, and a 4D parameter compensation matrix is ​​generated using a wavelength-sensitive matrix tester. Based on the 4D parameter compensation matrix, the modulator bias voltage and fiber input angle are dynamically optimized through federated learning.

[0090] Furthermore, the power consumption adjustment module 14 is also used to perform the following method:

[0091] The local data is uploaded to the cloud platform for global aggregation and update; after the global aggregation and update, the modulator bias voltage and the fiber input angle are output.

[0092] Furthermore, the power consumption adjustment module 14 is also used to perform the following method:

[0093] A lightweight federated learning agent is deployed based on edge computing nodes; random noise is injected into local data on the lightweight federated learning agent to formulate an adversarial network.

[0094] It should be noted that the order of the embodiments described above is merely for descriptive purposes and does not represent the superiority or inferiority of the embodiments. Furthermore, the above description focuses on specific embodiments of this specification. The processes depicted in the accompanying drawings do not necessarily require a specific or sequential order to achieve the desired results. In some implementations, multitasking and parallel processing are possible or may be advantageous.

[0095] The above description is only a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0096] This specification and accompanying drawings are merely illustrative examples of this application and are intended to cover any and all modifications, variations, combinations, or equivalents within the scope of this application. Clearly, those skilled in the art can make various alterations and modifications to this application without departing from its scope. Therefore, if such modifications and modifications fall within the scope of this application and its equivalents, this application intends to include such modifications and modifications.

Claims

1. A high-speed silicon photonic engine method for silicon photonic modules, characterized in that, The method includes: Obtain the basic technical parameters of fiber optic connection products equipped with silicon photonics modules; Based on the aforementioned basic technical parameters, the refractive index distribution and waveguide cross-sectional dimensions of the silicon optical waveguide are configured to construct a multimode waveguide array; An electro-optic modulator array is integrated into the multimode waveguide array, and the coupling efficiency between the waveguide and the optical fiber is adjusted in real time through dynamic impedance matching. Simultaneously, a high-speed electric drive circuit is used to drive the electro-optic modulator array and optimize the signal rising edge / falling edge characteristics. A thermal-electric-optic coupling model is constructed to regulate the power consumption of the high-speed electric drive circuit. The method includes: A common-mode choke is integrated at the output of the high-speed electric drive circuit to compensate for high-frequency signal attenuation through dynamic pre-emphasis. The method for adjusting the coupling efficiency between the waveguide and the optical fiber in real time through dynamic impedance matching includes: A MEMS tunable grating is integrated at the waveguide output end to monitor the power spectrum of reflected light in real time. Based on the reflected light power spectrum, the micro-displacement of the piezoelectric ceramic is triggered by demodulating the reflected phase noise; Based on the reflected light power spectrum, the method includes demodulating the reflected phase noise, comprising: The phase noise integral value is obtained, and when the phase noise integral value exceeds a preset integral threshold, a piezoelectric ceramic displacement adjustment command is triggered. Using the piezoelectric ceramic displacement adjustment command, the waveguide end face curvature radius adjustment accuracy is controlled within the tolerance standard; The method for adjusting the power consumption of the high-speed electric drive circuit by constructing a thermal-electric-optical coupling model includes: A graphene-based micro heat pipe array is integrated below the electro-optic modulator, and an infrared thermal imaging sensor is deployed to provide real-time feedback on the chip junction temperature for dynamic power consumption adjustment. When the chip junction temperature exceeds the preset upper limit, a gradient frequency reduction strategy is triggered and redundant heat is directed out through the heat pipe. The method further includes: A waveguide-fiber-drive circuit joint calibration module was constructed, and a 4D parameter compensation matrix was generated using a wavelength sensitivity matrix tester. Based on the 4D parameter compensation matrix, the modulator bias voltage and fiber input angle are dynamically optimized through federated learning. The 4D parameter compensation matrix is ​​a four-dimensional data matrix that contains compensation parameters for optical signals under different wavelengths, modes, polarization states, and transmission paths.

2. The method as described in claim 1, characterized in that, The method includes: The heat pipe operating mode is dynamically adjusted according to the chip junction temperature. When the chip junction temperature is in the temperature range starting from 80% of the preset upper temperature limit, the heat pipe capillary action is activated to enhance heat dissipation.

3. The method as described in claim 1, characterized in that, The method further includes dynamically optimizing the modulator bias voltage and fiber input angle through federated learning. Upload local data to the cloud platform for global aggregation and updating; After global aggregation update, the modulator bias voltage and fiber input angle are output.

4. The method as described in claim 3, characterized in that, After the global aggregation update, the modulator bias voltage and fiber input angle are output. The method further includes: Deploy a lightweight federated learning agent based on edge computing nodes; At the lightweight federated learning agent, random noise is injected into the local data to formulate an adversarial network.

5. A high-speed silicon photonic engine device for silicon photonic modules, characterized in that, For implementing the high-speed silicon photonics engine method for a silicon photonics module according to any one of claims 1-4, the apparatus comprises: The parameter acquisition module is used to acquire the basic technical parameters of fiber optic connection products equipped with silicon photonics modules; A multimode waveguide array construction module is used to configure the refractive index distribution and waveguide cross-sectional dimensions of silicon optical waveguides based on the aforementioned basic technical parameters, and to construct a multimode waveguide array. An impedance matching module is used to integrate an electro-optic modulator array in the multimode waveguide array, and to adjust the coupling efficiency between the waveguide and the optical fiber in real time through dynamic impedance matching. The power consumption adjustment module is used to simultaneously drive the electro-optic modulator array with a high-speed electric drive circuit and optimize the signal rising / falling edge characteristics, and construct a thermal-electric-optic coupling model to adjust the power consumption of the high-speed electric drive circuit.

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