Temperature control system, temperature control method, and semiconductor apparatus

Abstract

The application discloses a temperature control system, a temperature control method and a semiconductor device, and belongs to the technical field of semiconductor devices. The first temperature control circulating loop in the temperature control system comprises a first temperature control unit and a first heat exchanger which are arranged in series. The second temperature control circulating loop comprises a second temperature control unit and a second heat exchanger which are arranged in series and are independently arranged from the first temperature control circulating loop. A gas driving source is used for driving gas to flow through the first heat exchanger for heat exchange. Wherein, part of the gas after heat exchange through the first heat exchanger enters a main gas bath cavity through a main gas pipe, and the other part of the gas enters the second heat exchanger for heat exchange again and is then introduced into a local gas bath cavity. A temperature adjusting module adjusts the temperature of heat exchange medium in the first temperature control circulating loop according to the first outlet temperature of the main gas bath cavity, and adjusts the temperature of heat exchange medium in the second temperature control circulating loop according to the second outlet temperature of the local gas bath cavity.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and in particular to a temperature control system, a temperature control method, and a semiconductor device. Background Technology

[0002] In semiconductor equipment where precision is required at the micro-nano or even sub-nano scale, minute temperature fluctuations can cause components such as substrates, workpiece stages, or lenses to deform due to thermal expansion, disrupting optical path stability and directly impacting the processing accuracy, yield, and reliability of the semiconductor equipment. Therefore, the ability to accurately and rapidly control internal temperature is particularly important for semiconductor equipment.

[0003] To ensure stable internal temperature, some technologies use a constant-temperature air conditioning system to supply temperature-regulated air into the semiconductor equipment, thereby maintaining a stable temperature within the entire cavity within a certain range. However, the temperature control accuracy of constant-temperature air conditioning systems is insufficient to meet the stringent requirements of high-precision processes and precision optical measurements for temperature fluctuations. Summary of the Invention

[0004] This application provides a temperature control system, a temperature control method, and a semiconductor device to solve the technical problem that the temperature control accuracy of constant temperature air conditioning systems is insufficient and cannot meet the stringent requirements of high-precision processes and precision optical measurements for temperature fluctuations.

[0005] To achieve the above objectives, according to a first aspect of this application, a temperature control system is provided, comprising:

[0006] The first temperature control circulation loop includes a first temperature control unit and a first heat exchanger connected in series.

[0007] The second temperature control circulation loop includes a second temperature control unit and a second heat exchanger connected in series, and is set independently from the first temperature control circulation loop.

[0008] The gas delivery system includes a gas drive source, a main gas pipe, and a branch gas pipe. The gas drive source is used to drive the gas to flow through the first heat exchanger for heat exchange. After the gas has been heated by the first heat exchanger, part of the gas enters the main gas bath chamber through the main gas pipe, and the other part enters the second heat exchanger through the branch gas pipe for heat exchange again before being introduced into the local gas bath chamber.

[0009] The temperature control module adjusts the temperature of the heat exchange medium in the first temperature control circulation loop according to the first outlet temperature of the main air bath, and adjusts the temperature of the heat exchange medium in the second temperature control circulation loop according to the second outlet temperature of the local air bath.

[0010] In some embodiments of this application, the temperature control system further includes:

[0011] The third temperature control loop includes a third temperature control unit and a third heat exchanger connected in series. The third temperature control unit is also connected in series on the second temperature control loop and is located upstream of the second temperature control unit.

[0012] The branch pipe connects the main pipe and the local air bath chamber. The second and third heat exchangers are both connected in series on the branch pipe, and the second heat exchanger is located downstream of the third heat exchanger.

[0013] In some embodiments of this application, the second temperature control unit includes a liquid cooling plate and a Peltier element, the Peltier element being disposed on at least one side of the liquid cooling plate, and a fluid channel within the liquid cooling plate being in fluid communication between the third temperature control unit and the second heat exchanger.

[0014] In some embodiments of this application, the second temperature control unit further includes:

[0015] The first heat-conducting component is disposed between the Peltier element and the liquid cooling plate, and is in contact with the Peltier element and the liquid cooling plate respectively, so as to conduct heat to connect the Peltier element and the liquid cooling plate.

[0016] In some embodiments of this application, the second temperature control unit further includes:

[0017] A heat dissipation device is installed on the side of the Peltier element facing away from the liquid cooling plate to dissipate heat from the Peltier element.

[0018] In some embodiments of this application, the second temperature control unit further includes:

[0019] The second heat-conducting component is disposed between the Peltier element and the heat sink, and is in contact with both the Peltier element and the heat sink respectively, so as to conduct heat to connect the Peltier element and the heat sink.

[0020] In some embodiments of this application, the second heat exchanger includes a shell and a heat exchange coil, the heat exchange coil is disposed inside the shell, and air inlet and air outlet are respectively provided on opposite sides of the shell.

[0021] The second temperature control unit is mounted on the housing via a fixed structure.

[0022] In some embodiments of this application, the first temperature control unit includes a first constant temperature water generator, and the third temperature control unit includes a third constant temperature water generator.

[0023] In some embodiments of this application, the temperature regulation module includes:

[0024] The first temperature acquisition unit is located at the outlet of the main air bath chamber and is used to acquire the first outlet temperature.

[0025] The first control unit is electrically connected to both the first temperature acquisition unit and the first temperature control unit. It adjusts the temperature of the heat exchange medium output by the first temperature control unit according to the first outlet temperature so that the first outlet temperature is within the first temperature threshold range.

[0026] In some embodiments of this application, the temperature regulation module includes:

[0027] The second temperature acquisition unit is located at the outlet of the local air bath chamber and is used to acquire the second outlet temperature.

[0028] The second control unit is electrically connected to both the second temperature acquisition unit and the second temperature control unit, and adjusts the temperature of the heat exchange medium output by the second temperature control unit according to the second outlet temperature so that the second outlet temperature is within the second temperature threshold range.

[0029] In some embodiments of this application, the second temperature control unit includes a liquid cooling plate and a Peltier element, the Peltier element being disposed on at least one side of the liquid cooling plate, and a fluid channel within the liquid cooling plate being in fluid communication between the third temperature control unit and the second heat exchanger.

[0030] The temperature control module includes:

[0031] The third temperature acquisition unit is located at the air inlet of the gas drive source and is electrically connected to the second control unit, for acquiring the air inlet temperature of the gas drive source; wherein, the second control unit is configured as follows:

[0032] The current parameters of the Peltier element are adjusted based on the difference between the first time T1 and the second time T2, as well as the temperature change value ΔT1. The first time T1 is the time required for air to flow from the air inlet of the gas drive source to the outlet of the local air bath chamber. The second time T2 is the time required for the Peltier element to start working until the temperature of the second outlet changes. The temperature change value ΔT1 is the change in the air inlet temperature relative to the target temperature.

[0033] In some embodiments of this application, the gas drive source includes a fan and a frequency converter connected to the fan drive; the temperature control system further includes:

[0034] The third control unit is electrically connected to the frequency converter. It calculates the temperature fluctuation value ΔT2 based on the second outlet temperature and the preset temperature, and controls the frequency converter to adjust the operating frequency of the fan based on the temperature fluctuation value ΔT2.

[0035] According to a second aspect of this application, a temperature control method is also provided, applied to the temperature control system described in any of the above technical solutions, the temperature control method comprising:

[0036] Obtain the first outlet temperature at the outlet of the main air bath chamber;

[0037] Obtain the second outlet temperature at the outlet of the local air bath chamber;

[0038] The temperature of the heat exchange medium in the first temperature control loop is adjusted according to the first outlet temperature, and the temperature of the heat exchange medium in the second temperature control loop is adjusted according to the second outlet temperature.

[0039] In some embodiments of this application, the temperature control system further includes a third temperature control loop, which includes a third temperature control unit and a third heat exchanger connected in series. The third temperature control unit is also connected in series on the second temperature control loop and is located upstream of the second temperature control unit. The branch gas pipe connects the main gas pipe and the local gas bath chamber. The second heat exchanger and the third heat exchanger are both connected in series on the branch gas pipe, and the second heat exchanger is located downstream of the third heat exchanger.

[0040] Temperature control methods also include:

[0041] The first time T1 required for air to flow from the inlet of the gas-driven source to the outlet of the local air bath chamber;

[0042] The second time T2 from when the second temperature control unit starts working until the second outlet temperature changes is obtained;

[0043] The inlet air temperature of the gas drive source is obtained, and the temperature change value ΔT1 is calculated based on the inlet air temperature. The temperature change value ΔT1 is the change value of the inlet air temperature relative to the target temperature.

[0044] The output temperature of the heat exchange medium in the second temperature control unit is controlled based on the difference between the first time T1 and the second time T2, as well as the temperature change value ΔT1.

[0045] In some embodiments of this application, the second temperature control unit includes a liquid cooling plate and a Peltier element, the Peltier element being disposed on at least one side of the liquid cooling plate, and a fluid channel within the liquid cooling plate being in fluid communication between the third temperature control unit and the second heat exchanger.

[0046] The steps for controlling the output temperature of the heat exchange medium in the second temperature control unit based on the difference between the first time T1 and the second time T2, and the temperature change value ΔT1, specifically include:

[0047] The current parameters of the Peltier element are adjusted based on the difference between the first time T1 and the second time T2, as well as the temperature change ΔT1.

[0048] In some embodiments of this application, the gas drive source includes a fan and a frequency converter connected to the fan drive; after the step of obtaining the second outlet temperature at the outlet of the local air bath chamber, the method further includes:

[0049] By comparing the second outlet temperature with the preset temperature, the temperature fluctuation value ΔT2 is calculated.

[0050] The frequency converter is used to adjust the operating frequency of the fan based on the temperature fluctuation value ΔT2.

[0051] According to a third aspect of this application, a semiconductor device is also provided, the semiconductor device comprising:

[0052] The temperature control system described in any of the above technical solutions, or the temperature control method described in any of the above technical solutions.

[0053] The temperature control system in this application embodiment has at least the following beneficial effects through the above technical solution:

[0054] In this technical solution, the temperature control system of this application includes two independent circulation loops: a first temperature control circulation loop is used to control the gas temperature of the main gas bath chamber, and a second temperature control circulation loop is specifically used to control the gas temperature of a local gas bath chamber. Specifically, the gas driving source (such as a fan) drives the gas to first flow through the first heat exchanger for heat exchange and regulation; subsequently, the heat-exchanged gas is divided into two paths: one path enters the main gas bath chamber through the main gas pipe, which covers the main working area of ​​the semiconductor device and is used to maintain the overall ambient temperature inside the device; the other path enters the second heat exchanger through the branch gas pipe for precise heat exchange again, and is then sent to a local gas bath chamber (such as the optical path area of ​​a laser interferometer) to implement further independent temperature control of this critical area. In other words, the critical area in the semiconductor device (such as the optical path area of ​​a laser interferometer) no longer depends on the uniform air supply temperature of the main gas pipe, but achieves fixed-point, precise, and independent temperature control of this local area through an independent second temperature control circulation loop and a second temperature control unit set on this loop.

[0055] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0056] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0057] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0058] Figure 1 This is a system framework diagram of the temperature control system provided in the embodiments of this disclosure;

[0059] Figure 2 This is an exploded view of the second temperature control unit and the second heat exchanger in the temperature control system provided in this embodiment of the present disclosure;

[0060] Figure 3 This is a perspective view of the second temperature control unit and the second heat exchanger in the temperature control system provided in the embodiments of this disclosure;

[0061] Figure 4 This is one of the flowcharts of the temperature control method provided in the embodiments of this disclosure;

[0062] Figure 5 This is the second flowchart of the temperature control method provided in the embodiments of this disclosure;

[0063] Figure 6 This is the third flowchart of the temperature control method provided in the embodiments of this disclosure.

[0064] Explanation of reference numerals in the attached figures:

[0065] 1-First temperature control unit; 2-First heat exchanger; 3-Second temperature control unit; 31-Liquid cooling plate; 311-First connector; 312-Second connector; 32-Peltier element; 33-Heat dissipation device; 331-Pipe connector; 34-First heat conduction element; 35-Second heat conduction element; 4-Second heat exchanger; 41-Shell; 411-Air outlet; 42-Heat exchange coil; 5-Gas drive source; 6-Main gas pipe; 7-Diverter gas pipe; 8-Main gas bath chamber; 9-Local gas bath chamber; 10-Third temperature control unit; 11-Third heat exchanger; 12-Fixed structure; 121-Fastener; 122-Fixed bracket; 13-First temperature acquisition unit; 14-First control unit; 15-Second temperature acquisition unit; 16-Second control unit; 17-Third temperature acquisition unit. Detailed Implementation

[0066] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0067] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship according to the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0068] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0069] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; or they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0070] This application provides a temperature control system, a temperature control method, and a semiconductor device, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, in the following embodiments, the descriptions of each embodiment have their own emphasis; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments.

[0071] Please refer to Figure 1 The temperature control system includes a first temperature control loop, a second temperature control loop, a gas delivery system, and a temperature regulation module. The first temperature control loop includes a first temperature control unit 1 and a first heat exchanger 2 connected in series. The second temperature control loop includes a second temperature control unit 3 and a second heat exchanger 4 connected in series, and is independently configured from the first temperature control loop. The gas delivery system includes a gas drive source 5, a main gas pipe 6, and a branch gas pipe 7. The gas drive source 5 drives the gas to flow through the first heat exchanger 2 for heat exchange. Part of the gas after heat exchange in the first heat exchanger 2 enters the main gas bath chamber 8 through the main gas pipe 6, and the other part enters the second heat exchanger 4 through the branch gas pipe 7 for further heat exchange before being introduced into the local gas bath chamber 9. The temperature regulation module regulates the temperature of the heat exchange medium in the first temperature control loop according to the first outlet temperature of the main gas bath chamber 8, and regulates the temperature of the heat exchange medium in the second temperature control loop according to the second outlet temperature of the local gas bath chamber 9.

[0072] In this technical solution, the temperature control system of this application includes two independent circulation loops: the first temperature control circulation loop is used to control the gas (outlet) temperature of the main gas bath chamber 8, and the second temperature control circulation loop is specifically used to control the gas (outlet) temperature of the local gas bath chamber 9. Specifically, the gas driving source 5 (such as a fan) drives the gas to first flow through the first heat exchanger 2 for heat exchange regulation; then, the gas after heat exchange is divided into two paths: one path of gas enters the main gas bath chamber 8 through the main gas pipe 6, and the main gas bath chamber 8 is used to cover the main working area of ​​semiconductor equipment (such as bonding equipment, lithography equipment, etc.) to maintain the overall ambient temperature inside the equipment; the other path of gas enters the second heat exchanger 4 through the branch gas pipe 7 for precise heat exchange again, and is then sent to the local gas bath chamber 9 (such as the optical path area of ​​a laser interferometer) to implement further independent temperature control of this critical area. In other words, critical areas in semiconductor equipment (such as the optical path area of ​​a laser interferometer) no longer rely on the uniform air supply temperature of the main air duct 6, but instead achieve precise and independent temperature control of the local area through an independent second temperature control circulation loop and a second temperature control unit 3 set on the loop.

[0073] Therefore, by adopting the above design, the overall stability of the internal temperature of semiconductor equipment can be achieved, while ensuring that the temperature of critical areas (such as the optical path area) fluctuates within a relatively small range, achieving ultra-high precision control. This, to a certain extent, solves the technical problem that traditional constant temperature air conditioning systems lack sufficient temperature control precision and cannot meet the stringent requirements of high-precision processes and precision optical measurements. Alternatively, it can be understood that the control precision of the second temperature control unit 3 is higher than that of the first temperature control unit 1, or that the control principle of the second temperature control unit 3 differs from that of the first temperature control unit 1.

[0074] Based on the above embodiments, the temperature control system further includes a third temperature control loop, which includes a third temperature control unit 10 and a third heat exchanger 11 connected in series. The third temperature control unit 10 is also connected in series on the second temperature control loop and is located upstream of the second temperature control unit 3. The branch pipe 7 connects the main gas pipe 6 and the local air bath chamber 9. The second heat exchanger 4 and the third heat exchanger 11 are both connected in series on the branch pipe 7, and the second heat exchanger 4 is located downstream of the third heat exchanger 11.

[0075] By adopting the above design, after the basic temperature regulation is completed in the main air duct, a two-stage local fine-tuning mechanism is further introduced for the local air bath cavity 9, thereby achieving higher precision and more stable temperature control. Specifically, the first stage is achieved by the third temperature control unit 10 controlling the third heat exchanger 11 to achieve rapid initial temperature fine-tuning; the second stage is achieved by the second temperature control unit 3 controlling the second heat exchanger 4 to perform more precise secondary fine-tuning, further eliminating residual fluctuations. Since the second heat exchanger 4 is located downstream of the branch pipe 7, that is, closer to the local air bath cavity 9 (such as the optical path area) than the third heat exchanger 11, the second-stage temperature control can eliminate residual temperature fluctuations, ensuring that the gas temperature entering the optical path area has high stability, stably controlled within a very small range (such as ±0.005℃), thereby effectively reducing measurement errors, optical path drift, and alignment deviations caused by temperature fluctuations.

[0076] Specifically, the diversion pipe 7 is a section of gas pipeline connecting the main gas pipe 6 and the local gas bath chamber 9. The diversion pipe 7 guides a portion of the gas from the main gas pipe 6 (gas that has already undergone preliminary heat exchange in the first heat exchanger 2) to the local gas bath chamber 9, instead of sending it all directly into the main gas bath chamber 8. In other words, the main gas pipe 6 is responsible for supplying the gas that has undergone basic temperature regulation to the main gas bath chamber 8, while the diversion pipe 7 is responsible for providing the local gas bath chamber 9 with gas for further precise temperature control.

[0077] The second heat exchanger 4 is located downstream of the third heat exchanger 11, with "downstream" referring to the direction of gas flow. Gas flows into the branch pipe 7 via the main gas pipe 6, and then sequentially passes through the third heat exchanger 11 and the second heat exchanger 4 on the branch pipe 7 before entering the local gas bath chamber 9. This gas flow direction is downstream. Therefore, from the perspective of gas flow sequence, the third heat exchanger 11 is upstream, and the second heat exchanger 4 is downstream. The gas first flows through the third heat exchanger 11 for initial temperature regulation, and then flows through the second heat exchanger 4 for more precise secondary fine-tuning, thereby achieving a graded, gradually approaching local temperature control strategy. For example, in some embodiments, the first heat exchanger 2, the second heat exchanger 4, and the third heat exchanger 11 are gas-liquid heat exchangers.

[0078] Please combine Figure 1 and Figure 2The second temperature control unit 3 includes a liquid cooling plate 31 and a Peltier element 32. The Peltier element 32 is disposed on at least one side (e.g., one or both sides) of the liquid cooling plate 31. The fluid channel within the liquid cooling plate 31 is fluidly connected between the third temperature control unit 10 and the second heat exchanger 4. The Peltier element 32, through thermoelectric effect, can directly and precisely heat or cool the liquid cooling plate 31 in contact with it. Its heating / cooling capacity can be precisely adjusted by controlling the magnitude and direction of its input current. In practical use, the heat or cold generated by the Peltier element 32 first acts on the surface of the liquid cooling plate 31. The liquid cooling plate 31, through the circulating fluid in its internal fluid channel, rapidly diffuses and transfers this heat or cold to the second heat exchanger 4, which is thermally coupled to it, thereby further precisely regulating the temperature of the gas flowing through the second heat exchanger 4.

[0079] Furthermore, the Peltier element 32 is an all-solid-state electronic cooling / heating device with no internal compressors, fans, valves, or other moving mechanical parts. It does not generate mechanical vibration or noise during operation, thus minimizing interference with optical paths, optical devices, or semiconductor processes. The Peltier element 32 can switch between cooling and heating modes by changing the direction of the current; the switching process is simple and convenient, enhancing the control flexibility of the second temperature control unit 3.

[0080] For example, Peltier elements 32 are provided on both sides of the liquid cooling plate 31. The working surface of each Peltier element 32 faces the liquid cooling plate 31, and the working surface of each Peltier element 32 can completely cover the surface (large surface) of the liquid cooling plate 31. Therefore, when the Peltier element 32 is attached to the surface of the liquid cooling plate 31, the liquid cooling plate 31 can evenly diffuse the heat or cold generated by the Peltier to its entire surface, avoiding local overcooling or overheating, thereby improving the uniformity and consistency of the temperature field within the local air bath cavity 9. The fluid channels within the liquid cooling plate 31 are connected between the third temperature control unit 10 and the second heat exchanger 4 via the first connector 311 and the second connector 312, respectively.

[0081] In this embodiment, the second temperature control unit 3 further includes a heat dissipation device 33. The heat dissipation device 33 is disposed on the side of the Peltier element 32 facing away from the liquid cooling plate 31 to dissipate heat from the Peltier element 32. That is, one side of the Peltier element 32 is attached to the liquid cooling plate 31 to cool or heat the liquid in the liquid cooling plate 31 (thermally coupled with the liquid cooling plate 31), while the other side (the side facing away from the liquid cooling plate 31) is equipped with the heat dissipation device 33 to conduct waste heat generated on the hot end side of the Peltier element 32, maintaining the temperature difference between the two sides of the Peltier element 32 and ensuring its stable operation. At the same time, the heat dissipation device 33 can effectively reduce the operating temperature of the Peltier element 32, preventing overheating damage and extending the service life of the Peltier element 32 to a certain extent. For example, the heat dissipation device 33 can be a heat sink, fan, heat pipe, liquid-cooled radiator, or liquid cooling plate 31, etc.

[0082] Specifically, the cooling capacity of the Peltier element 32 is limited by the temperature difference between its cold and hot ends. If the temperature of the hot end is too high, the temperature of the cold end will also rise, causing the cooling efficiency of the Peltier element 32 to decrease or even fail. The heat dissipation device 33 can effectively reduce the temperature of the hot end of the Peltier element 32, maintain a reasonable temperature difference between the two sides of the Peltier element 32, thereby ensuring its cooling / heating capacity, ensuring precise temperature control of the liquid cooling plate 31, and thus improving the heat exchange efficiency and temperature control stability of the Peltier element 32, ultimately achieving high-precision stability of the gas temperature in the local gas bath cavity 9. For example, the temperature fluctuation range at the outlet of the local gas bath cavity 9 can be controlled within ±0.005℃.

[0083] In some embodiments, the second temperature control unit 3 further includes a first heat-conducting element 34 and a second heat-conducting element 35. The first heat-conducting element 34 is disposed between the Peltier element 32 and the liquid cooling plate 31, and contacts both the Peltier element 32 and the liquid cooling plate 31 to thermally connect them. The second heat-conducting element 35 is disposed between the Peltier element 32 and the heat dissipation device 33, and contacts both the Peltier element 32 and the heat dissipation device 33 to thermally connect them. As an example of this application, the second temperature control unit 3 includes only the first heat-conducting element 34, which is disposed between the Peltier element 32 and the liquid cooling plate 31, and contacts both the Peltier element 32 and the liquid cooling plate 31 to thermally connect them. As another example of this application, the second temperature control unit 3 includes only a second heat-conducting element 35. The second heat-conducting element 35 is disposed between the Peltier element 32 and the heat dissipation device 33, and is in contact with both the Peltier element 32 and the heat dissipation device 33 respectively, to conduct heat to connect the Peltier element 32 and the heat dissipation device 33. Exemplarily, the heat-conducting element (first heat-conducting element 34 and / or second heat-conducting element 35) may be planarized, or a material with high thermal conductivity and uniform heat diffusion performance may be selected, such as a copper block, an aluminum block, thermal grease, indium sheet, or graphite sheet.

[0084] In other words, by providing a heat-conducting element (first heat-conducting element 34 and / or second heat-conducting element 35) on at least one side of the Peltier element 32, the thermal coupling interface between the Peltier element 32 and the contact element (liquid cooling plate 31 and / or heat dissipation device 33) in contact with it can be strengthened and optimized. This reduces the contact thermal resistance between the Peltier element 32 and the contact element, enhances the interface thermal diffusion capability, and makes the cold or heat generated by the Peltier element 32 more evenly distributed on the contact surface. This improves the temperature uniformity of the liquid cooling plate 31 surface and avoids local overheating or overcooling of the Peltier element 32. As a result, during cooling, the cold generated by the Peltier element 32 can be transferred to the liquid cooling plate 31 more efficiently, and the heat generated at its hot end can be carried away by the heat dissipation device 33 more efficiently (the same applies during heating). This is beneficial to improving the temperature control capability and dynamic response speed of the second temperature control unit 3, thereby improving the temperature control uniformity, consistency, and temperature control accuracy of the second temperature control unit 3.

[0085] Please refer to Figure 2 and Figure 3 In this embodiment, the second heat exchanger 4 includes a housing 41 and a heat exchange coil 42. The heat exchange coil 42 is disposed inside the housing 41, and air inlets and outlets 411 are respectively provided on opposite sides of the housing 41. The second temperature control unit 3 is mounted to the housing 41 via a fixing structure 12. That is, gas enters the housing 41 through the air inlet on one side of the housing 41 via a split gas pipe 7, flows through the heat exchange coil 42 inside the housing 41 to exchange heat with the heat exchange medium inside the heat exchange coil 42, and then flows out of the housing 41 through the outlet 411 on the other side of the housing 41, thereby achieving gas temperature regulation. Furthermore, the second temperature control unit 3 (including a liquid cooling plate 31, a Peltier element 32, a heat dissipation device 33, etc.) is not directly mounted inside the housing 41, but is mounted on the outside of the housing 41 via the fixing structure 12, physically separating the gas side from the temperature control side, allowing the second temperature control unit 3 to obtain greater heat dissipation space and ventilation conditions outside the housing 41. Furthermore, the second temperature control unit 3 and the second heat exchanger 4 adopt a modular design that allows for independent installation, disassembly, repair, or replacement, facilitating assembly and maintenance.

[0086] For example, the air inlet and outlet holes 411 on the shell 41 are arranged opposite each other on both sides of the shell 41 to guide the gas to flow unidirectionally and uniformly across the area where the heat exchange coil 42 is located, forming a stable airflow field, reducing turbulence and dead zones, and improving the overall heat exchange efficiency and temperature uniformity of the second heat exchanger 4. The heat exchange coil 42 is usually made of closely arranged metal pipes (such as copper or aluminum pipes) to increase the contact area between the gas and the pipe wall and improve the heat exchange efficiency.

[0087] The fixing structure 12 includes a fastener 121 and two opposing fixing brackets 122. The two fixing brackets 122 are respectively disposed on opposite sides of the second temperature control unit 3 to confine the second temperature control unit 3 within the gap between them. The first end of each fixing bracket 122 is connected to the housing 41, and the second end is provided with a fastener 121. The fastener 121 passes through the second end of the fixing bracket 122 to press and fix the second temperature control unit 3 onto the housing 41 or the fixing bracket 122. Specifically, the second temperature control unit 3 includes a bottom heat dissipation device 33, a bottom second heat conduction element 35, a bottom Peltier element 32, a bottom first heat conduction element 34, a liquid cooling plate 31, a top first heat conduction element 34, a top Peltier element 32, a top second heat conduction element 35, and a top heat dissipation device 33, stacked sequentially from the first end to the second end.

[0088] In other words, there are two first heat-conducting elements 34, which are respectively attached to the lower and upper surfaces of the liquid cooling plate 31, and both are used to conduct heat to connect the Peltier element 32 and the liquid cooling plate 31. There are also two second heat-conducting elements 35, which are located between the bottom heat dissipation device 33 and the bottom Peltier element, and between the top Peltier element and the top heat dissipation device 33, respectively. Both are used to conduct heat to connect the Peltier element 32 and the heat dissipation device 33. The whole structure forms a symmetrical, multi-layered heat-conducting and thermoelectric coupling stacked structure to achieve bidirectional and efficient cooling / heating of the liquid cooling plate 31, and to dissipate heat / cold energy in a timely manner through the heat dissipation device 33 to maintain stable system operation.

[0089] In some embodiments, the heat dissipation device 33 can be a liquid cooling plate 31, a heat sink, or an integrated structure of a heat sink and a fan. As an example, the heat dissipation device 33 provided in this application is a liquid cooling plate 31. The heat dissipation device 33 has a coolant flow channel and two pipe joints 331. One pipe joint 331 is connected to one end of the coolant flow channel, and the other pipe joint 331 is connected to the other end of the coolant flow channel. The coolant flow channel in the heat dissipation device 33 is connected to external cooling water through the two pipe joints 331 to form a water circulation to remove heat.

[0090] Please continue to refer to Figure 1In this embodiment, the first temperature control unit 1 includes a first constant-temperature water generator, and the third temperature control unit 10 includes a third constant-temperature water generator. The constant-temperature water generator is a temperature control device that heats and stably maintains water (or antifreeze, such as an ethylene glycol aqueous solution) at a set temperature through electric heating, temperature control (such as a PID controller), and water pump circulation. It is not easily affected by complex factors, has high long-term operational reliability, and is suitable for applications requiring relatively high temperature control accuracy. For example, the first constant-temperature water generator can control the air temperature entering the main air bath chamber 8 within 0.05 degrees Celsius. Of course, in some embodiments not shown in this application, at least one of the first temperature control unit 1 and the third temperature control unit 10 can be a Peltier temperature control unit or a compressor cooling / heating temperature control unit.

[0091] In some embodiments, the temperature regulation module includes a first temperature acquisition unit 13 and a first control unit 14. The first temperature acquisition unit 13 is disposed at the outlet of the main gas bath chamber 8 and is used to acquire the first outlet temperature. The first control unit 14 is electrically connected to both the first temperature acquisition unit 13 and the first temperature control unit 1. The first control unit 14 is configured to adjust the temperature of the heat exchange medium output by the first temperature control unit 1 according to the first outlet temperature, so that the first outlet temperature is within the first temperature threshold range. Thus, by monitoring the gas temperature in real time at the outlet of the main gas bath chamber 8, and dynamically adjusting the temperature of the heat exchange medium (such as water or antifreeze) output by the first temperature control unit 1 (such as a constant temperature water generator) to the main gas bath chamber 8 using the first control unit 14 (microcontroller, PID controller), precise control of the gas (outlet) temperature inside the main gas bath chamber 8 is achieved, ultimately ensuring that the temperature remains stable within the set target range (the first temperature threshold range).

[0092] Specifically, by monitoring the first outlet temperature of the main gas bath chamber 8 in real time, the temperature control system can accurately determine the actual temperature state inside the chamber. The first control unit 14 compares this actual temperature with a preset first temperature threshold range and dynamically adjusts the heat exchange medium temperature output by the first temperature control unit 1. This forms a closed-loop control circuit of detection, comparison, control, adjustment, and re-detection, ensuring that the gas temperature inside the main gas bath chamber 8 is always maintained within the desired range, thus guaranteeing accurate, stable, and reliable process environment temperature within the main gas bath chamber 8 (typically the main semiconductor process area).

[0093] In some embodiments, the temperature regulation module further includes a second temperature acquisition unit 15 and a second control unit 16. The second temperature acquisition unit 15 is disposed at the outlet of the local gas bath cavity 9 and is used to acquire the second outlet temperature. The second control unit 16 is electrically connected to both the second temperature acquisition unit 15 and the second temperature control unit 3, and adjusts the heat exchange medium temperature output by the second temperature control unit 3 according to the second outlet temperature to ensure that the second outlet temperature is within the second temperature threshold range. That is, by setting the second temperature acquisition unit 15 at the outlet of the local gas bath cavity 9, the actual temperature state (especially the gas temperature) of the local area can be accurately reflected. The second control unit 16 dynamically adjusts the second temperature control unit 3 according to the real-time temperature signal to accurately and quickly control its cooling or heating capacity, ultimately stabilizing the second outlet temperature (outlet temperature) within a very small target range (such as ±0.005℃ or higher accuracy), meeting the temperature requirements of ultra-high precision processes. Thus, precise temperature control of the area covered by the local gas bath cavity 9 can be achieved, which is beneficial to ensuring the stability of key processes such as precision optical measurement in semiconductor processes. It is understandable that, in addition to the optical path area involved in optical measurement, this local air bath cavity 9 can also be applied to various other scenarios that require local temperature control.

[0094] In some embodiments, for the second temperature control unit 3 including a liquid cooling plate 31 and a Peltier element 32, the temperature adjustment module includes a third temperature acquisition unit 17. The third temperature acquisition unit 17 is disposed at the air inlet of the gas drive source 5 and electrically connected to the second control unit 16, for acquiring the air inlet temperature of the gas drive source 5. The second control unit 16 is configured to adjust the current parameters (current magnitude or direction) of the Peltier element 32 according to the difference between a first time T1 and a second time T2 and the temperature change value ΔT1. The first time T1 is the time required for air to flow from the air inlet of the gas drive source 5 to the outlet of the local air bath chamber 9, the second time T2 is the time required for the Peltier element 32 to start working until the second outlet temperature changes, and the first time T1 > the second time T2. The temperature change value ΔT1 is the change in air inlet temperature relative to the target temperature.

[0095] Using the above method, based on the difference between the first time T1 and the second time T2, it is possible to determine whether the response of the Peltier element 32 matches the airflow arrival time, thereby achieving high-precision control with time synchronization and dynamic matching. This avoids controlling too early or too late, effectively solving the time delay problem caused by airflow conduction, and achieving closed-loop control with precise time window matching. Furthermore, the final temperature of the local air bath 9 is not only controlled by the Peltier element 32, but also affected by the inlet air temperature fluctuations of the gas drive source 5 (such as environmental changes, upstream heat exchanger disturbances, and inlet air temperature changes introduced by the gas drive source 5). By obtaining the temperature change value (ΔT1) at the inlet of the gas drive source 5, the second control unit 16 can predict in advance the potential impact of the inlet air temperature fluctuations of the gas drive source 5 on the second outlet temperature of the local air bath 9, and adjust the current of the Peltier element 32 before the disturbance is significantly reflected in the second outlet temperature, implementing feedforward compensation.

[0096] Specifically, the first time T1 represents the transmission time (or residence time) of the gas from the inlet of the gas drive source 5 (fan, air pump) to the outlet of the local air bath chamber 9, which is the time required for the gas to undergo heating / cooling and reach the detection point. The second control unit 16 can predict when the gas will reach the outlet of the local air bath chamber 9, thereby adjusting the Peltier element 32 in advance so that the cooling / heating effect reaches the preset temperature exactly when the gas reaches the outlet of the local air bath chamber 9, realizing precise control of time alignment, effectively solving the time lag problem caused by fluid conduction, improving the synchronization and response matching degree of control, and thus avoiding the problem of control signal lagging behind the actual gas state to a certain extent.

[0097] The second time T2 is the time from when the Peltier element 32 starts working until the second outlet temperature (outlet temperature) changes measurably. It reflects the dynamic response characteristics of the Peltier element 32 itself (such as current response, heat exchange efficiency, etc.). The time window from when the control signal is issued to when the temperature response appears is obtained by the second temperature control unit 3, so as to dynamically adjust the control strategy of the Peltier element 32 (such as early intervention, increasing current, adjusting PWM frequency, etc.).

[0098] The temperature change value ΔT1 represents the change in inlet air temperature relative to the target temperature. It reflects the degree to which the gas temperature entering the system deviates from the ideal target temperature. The second outlet temperature of the local air bath chamber 9 is affected to some extent by the inlet air temperature of the gas driving source 5. Based on the temperature change value ΔT1, the deviation of the inlet air temperature from the target can be known in advance. Before the gas flows through the entire local air bath chamber 9, the current of the Peltier element 32 is pre-adjusted according to the temperature change value ΔT1, thereby compensating for the temperature deviation in advance and improving the initiative and speed of the overall temperature control system. The temperature adjustment range that can be achieved through the second temperature control unit 3 is relatively large.

[0099] As an example, the gas drive source 5 includes a fan and a frequency converter connected to the fan drive; the temperature control system also includes a third control unit. The third control unit is electrically connected to the frequency converter, calculates the temperature fluctuation value ΔT2 based on the second outlet temperature and the preset temperature, and controls the frequency converter to adjust the fan's operating frequency based on the temperature fluctuation value ΔT2. Specifically, adjusting the fan's operating frequency based on the temperature fluctuation value ΔT2 between the second outlet temperature and the preset temperature allows for precise adjustment of the gas flow rate and velocity entering the local air bath chamber 9, thereby achieving independent temperature control of the local air bath chamber 9 and meeting the different temperature requirements of that area. Furthermore, the temperature control system can perform fine temperature adjustment for different air bath chambers separately, achieving refined temperature management for different areas and improving the temperature control accuracy of the entire temperature control system. The temperature adjustment range achievable through the third control unit is relatively small, but the response speed is extremely fast.

[0100] If the fan frequency changes too much, it will cause a sudden change in the outlet air temperature or air volume, which in turn will cause overshoot or oscillation in the temperature of the air bath chambers (main air bath chamber 8 and local air bath chamber 9). Therefore, the adjustment range of the fan operating frequency in this application does not exceed ±5Hz, ensuring a smooth transition and stable output of air speed and air volume, avoiding problems such as vibration, noise, and aerodynamic instability caused by sudden changes in air speed. This helps to achieve gentle temperature regulation and precise maintenance, improves the dynamic response quality and steady-state accuracy of the temperature control system, and can further reduce the risk of overshoot and oscillation, especially when combined with PID and other control algorithms.

[0101] It is understandable that the first control unit 14, the second control unit 16, and the third control unit can be implemented by different control modules within the same controller, or they can be controlled separately by independent controllers. When each control unit is controlled by an independent controller, each controller focuses on a single control loop and can be configured with the optimal control algorithm (such as high-precision PID), sampling frequency, control cycle, and adjustment parameters for that loop. This is particularly relevant for scenarios like the second temperature control loop (Peltier element 32 and local air bath 9), which is extremely sensitive to temperature fluctuations. The independent controller can specifically optimize its PID parameters, filtering algorithm, and control cycle to achieve higher control accuracy and lower steady-state error.

[0102] Please refer to Figure 4 In this embodiment, the present application also provides a temperature control method, which is applied to the temperature control system described in any of the above technical solutions. The temperature control method includes: obtaining a first outlet temperature at the outlet of the main air bath chamber 8; obtaining a second outlet temperature at the outlet of the local air bath chamber 9; adjusting the temperature of the heat exchange medium in the first temperature control circulation loop according to the first outlet temperature; and adjusting the temperature of the heat exchange medium in the second temperature control circulation loop according to the second outlet temperature.

[0103] In other words, critical areas in semiconductor equipment (such as the optical path area of ​​a laser interferometer) no longer rely on the uniform air supply temperature of the main air duct 6, but instead achieve precise, independent, and rapid temperature control of the local area through an independent second temperature control circulation loop and a second temperature control unit 3 set on the loop.

[0104] In some embodiments, such as Figure 5 As shown, the steps for adjusting the temperature of the heat exchange medium in the second temperature control loop according to the second outlet temperature specifically include: obtaining the first time T1 required for air to flow from the inlet of the gas drive source 5 to the outlet of the local air bath chamber 9; obtaining the second time T2 from the start of operation of the second temperature control unit 3 until the second outlet temperature changes; obtaining the inlet air temperature of the gas drive source 5, and calculating the temperature change value ΔT1 based on the inlet air temperature, where ΔT1 is the change in inlet air temperature relative to the target temperature; and controlling the output temperature of the heat exchange medium in the second temperature control unit 3 based on the difference between the first time T1 and the second time T2, and the temperature change value ΔT1. This temperature control method, by introducing the first time T1 (gas transmission time), the second time T2 (temperature control response time), and the temperature change value ΔT1 (inlet air temperature fluctuation), achieves more precise and intelligent dynamic adjustment of the second temperature control unit 3 (such as the heat exchange system of the local air bath chamber 9), thereby improving the stability and response speed of local temperature control.

[0105] The step of controlling the output temperature of the heat exchange medium in the second temperature control unit 3 based on the difference between the first time T1 and the second time T2, and the temperature change value ΔT1, specifically includes: adjusting the current parameter of the Peltier element 32 based on the difference between the first time T1 and the second time T2, and the temperature change value ΔT1. Thus, the time difference (the difference between the first time T1 and the second time T2) and the inlet air temperature change value ΔT1 are directly correlated with the adjustment of the current parameter of the Peltier element 32. Based on the difference between the first time T1 (the gas transmission time from the inlet to the outlet of the local air bath 9) and the second time T2 (the time from when the Peltier starts working to when the temperature response appears), the matching degree between the time window when the gas reaches the outlet and the Peltier response can be accurately determined. The temperature change value ΔT1 (the deviation between the inlet air temperature and the target temperature) can detect temperature disturbances on the inlet side in advance. The control strategy based on the comprehensive analysis of time difference and temperature disturbance can optimize the working timing of Peltier element 32 to match the airflow dynamics, and achieve faster and more accurate local temperature control by adjusting the current parameter of Peltier element 32 in real time.

[0106] Please refer to Figure 6 In this embodiment, when acquiring the local air bath 9 (see reference numerals) Figure 1Following the step of determining the second outlet temperature at the outlet of the fan, the process further includes: comparing the second outlet temperature with the preset temperature to calculate the temperature fluctuation value ΔT2; and controlling the frequency converter to adjust the fan's operating frequency based on the temperature fluctuation value ΔT2. Thus, by comparing the second outlet temperature with the preset temperature in real time, the deviation of the current second outlet temperature, i.e., the temperature fluctuation value ΔT2, can be accurately determined. The temperature fluctuation value ΔT2 serves as the direct basis for control decisions, dynamically adjusting the fan frequency. Through continuous, stepless speed regulation of the fan using the frequency converter, airflow changes can be precisely controlled, achieving gentle and accurate temperature control.

[0107] The operating frequency of the fan can be adjusted within ±5Hz.

[0108] In some embodiments of this application, a semiconductor device is also provided, which includes a temperature control system as described in any of the above technical solutions, or a temperature control method as described in any of the above technical solutions. Since the temperature control system or temperature control method in this semiconductor device has the same technical features as the aforementioned temperature control system or temperature control method, both can solve the same technical problem and achieve the same technical effect.

[0109] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0110] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims. Furthermore, specific examples have been used in the specification to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application, and the content of this specification should not be construed as a limitation of this application.

Claims

1. A temperature control method, characterized in that, This invention relates to a temperature control system, comprising a first temperature control loop, a second temperature control loop, and a gas delivery system. The first temperature control loop includes a first temperature control unit and a first heat exchanger connected in series. The second temperature control loop includes a second temperature control unit and a second heat exchanger connected in series, and is independently configured from the first temperature control loop. The gas delivery system includes a gas drive source, a main gas pipe, and a branch gas pipe. The gas drive source drives gas to flow through the first heat exchanger for heat exchange. Part of the gas after heat exchange in the first heat exchanger enters the main gas bath chamber through the main gas pipe, and the other part enters the second heat exchanger through the branch gas pipe for further heat exchange before being introduced into a local gas bath chamber. The temperature control method includes: Obtain the first outlet temperature at the outlet of the main air bath chamber; Obtain the second outlet temperature at the outlet of the local air bath chamber; Adjust the temperature of the heat exchange medium in the first temperature control loop according to the first outlet temperature. Adjusting the temperature of the heat exchange medium in the second temperature control circulation loop according to the second outlet temperature includes: acquiring a first time T1 required for air to flow from the inlet of the gas drive source to the outlet of the local air bath chamber; acquiring a second time T2 from the start of operation of the second temperature control unit until the second outlet temperature changes; acquiring the inlet temperature of the gas drive source, and calculating the temperature change value based on the inlet temperature. T1, the temperature change value T1 is the change in the inlet air temperature relative to the target temperature; based on the difference between the first time T1 and the second time T2, and the temperature change value... T1 controls the output temperature of the heat exchange medium in the second temperature control unit.

2. The temperature control method according to claim 1, characterized in that, The temperature control system further includes a third temperature control circulation loop, which includes a third temperature control unit and a third heat exchanger connected in series. The third temperature control unit is also connected in series on the second temperature control circulation loop and is located upstream of the second temperature control unit. The branch gas pipe connects the main gas pipe and the local gas bath chamber. The second heat exchanger and the third heat exchanger are both connected in series on the branch gas pipe, and the second heat exchanger is located downstream of the third heat exchanger. The second temperature control unit includes a liquid cooling plate and a Peltier element. The Peltier element is disposed on at least one side of the liquid cooling plate, and the fluid channel in the liquid cooling plate is fluidly connected between the third temperature control unit and the second heat exchanger. The difference between the first time T1 and the second time T2, and the temperature change value are used as the basis. The steps of controlling the output temperature of the heat exchange medium in the second temperature control unit by T1 specifically include: Based on the difference between the first time T1 and the second time T2, and the temperature change value T1 adjusts the current parameters of the Peltier element.

3. The temperature control method according to claim 1, characterized in that, The gas drive source includes a fan and a frequency converter connected to the fan drive; After the step of obtaining the second outlet temperature at the outlet of the local air bath chamber, the method further includes: The temperature fluctuation value is calculated by comparing the second outlet temperature with the preset temperature. T2; According to the temperature fluctuation value T2 controls the frequency converter to adjust the operating frequency of the fan.

4. A temperature control system, characterized in that, For performing the temperature control method as described in any one of claims 1 to 3, the temperature control system comprises: The temperature control module adjusts the temperature of the heat exchange medium in the first temperature control circulation loop according to the first outlet temperature of the main air bath chamber, and adjusts the temperature of the heat exchange medium in the second temperature control circulation loop according to the second outlet temperature of the local air bath chamber. The third temperature control loop includes a third temperature control unit and a third heat exchanger connected in series. The third temperature control unit is also connected in series on the second temperature control loop and is located upstream of the second temperature control unit. The branch gas pipe connects the main gas pipe and the local gas bath chamber. The second heat exchanger and the third heat exchanger are both connected in series on the branch gas pipe, and the second heat exchanger is located downstream of the third heat exchanger.

5. The temperature control system according to claim 4, characterized in that, The second temperature control unit includes a liquid cooling plate and a Peltier element, the Peltier element being disposed on at least one side of the liquid cooling plate, and the fluid channel within the liquid cooling plate being in fluid communication between the third temperature control unit and the second heat exchanger.

6. The temperature control system according to claim 5, characterized in that, The second temperature control unit also includes: A first heat-conducting element is disposed between the Peltier element and the liquid cooling plate, and is in contact with the Peltier element and the liquid cooling plate respectively, so as to conduct heat to connect the Peltier element and the liquid cooling plate.

7. The temperature control system according to claim 5, characterized in that, The second temperature control unit also includes: A heat dissipation device is disposed on the side of the Peltier element facing away from the liquid cooling plate to dissipate heat from the Peltier element.

8. The temperature control system according to claim 7, characterized in that, The second temperature control unit also includes: A second heat-conducting component is disposed between the Peltier element and the heat dissipation device, and is in contact with the Peltier element and the heat dissipation device respectively, so as to conduct heat to connect the Peltier element and the heat dissipation device.

9. The temperature control system according to claim 4, characterized in that, The second heat exchanger includes a shell and a heat exchange coil, the heat exchange coil is disposed inside the shell, and air inlet and air outlet are respectively provided on opposite sides of the shell; The second temperature control unit is mounted to the housing via a fixed structure.

10. The temperature control system according to claim 4, characterized in that, The first temperature control unit includes a first constant temperature water generator, and the third temperature control unit includes a third constant temperature water generator.

11. The temperature control system according to claim 4, characterized in that, The temperature regulation module includes: A first temperature acquisition unit is disposed at the outlet of the main air bath chamber and is used to acquire the first outlet temperature; The first control unit is electrically connected to both the first temperature acquisition unit and the first temperature control unit. It adjusts the temperature of the heat exchange medium output by the first temperature control unit according to the first outlet temperature so that the first outlet temperature is within the first temperature threshold range.

12. The temperature control system according to any one of claims 4 to 8, or 10 or 11, characterized in that, The temperature regulation module includes: The second temperature acquisition unit is disposed at the outlet of the local air bath chamber and is used to acquire the second outlet temperature; The second control unit is electrically connected to both the second temperature acquisition unit and the second temperature control unit, and adjusts the temperature of the heat exchange medium output by the second temperature control unit according to the second outlet temperature so that the second outlet temperature is within the second temperature threshold range.

13. The temperature control system according to claim 12, characterized in that, The second temperature control unit includes a liquid cooling plate and a Peltier element, the Peltier element being disposed on at least one side of the liquid cooling plate, and a fluid channel within the liquid cooling plate being in fluid communication between the third temperature control unit and the second heat exchanger; The temperature regulation module includes: A third temperature acquisition unit is disposed at the air inlet of the gas drive source and electrically connected to the second control unit, for acquiring the air inlet temperature of the gas drive source; wherein, the second control unit is configured as follows: Based on the difference between the first time T1 and the second time T2, and the temperature change value T1 adjusts the current parameter of the Peltier element; the first time T1 is the time required for air to flow from the inlet of the gas drive source to the outlet of the local air bath chamber; the second time T2 is the time required for the Peltier element to start working until the temperature at the second outlet changes; the temperature change value... T1 is the change in the inlet air temperature relative to the target temperature.

14. The temperature control system according to claim 4, characterized in that, The gas drive source includes a fan and a frequency converter connected to the fan drive; the temperature control system further includes: The third control unit is electrically connected to the frequency converter and calculates the temperature fluctuation value based on the second outlet temperature and the preset temperature. T2, and based on the temperature fluctuation value T2 controls the frequency converter to adjust the operating frequency of the fan.

15. A semiconductor device, characterized in that, The semiconductor device includes: The temperature control method as described in any one of claims 1 to 3, or the temperature control system as described in any one of claims 4 to 14.

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