一种厚铜板的外层蚀刻装置
By using anti-clogging components and a Bernoulli effect slit structure in the etching device for the outer layer of thick copper plates, deposits are automatically intercepted and cleaned, solving the problem of nozzle clogging in the etching solution circulation, improving etching quality and efficiency, and reducing production costs and environmental risks.
Patent Information
- Application Number
- CN202511550833.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-28
- Publication Date
- 2026-07-17
- Estimated Expiration
- 2045-10-28
AI Technical Summary
During the etching solution circulation process, the accumulation of precipitates causes nozzle blockage, affecting etching quality and efficiency. Furthermore, the uneven consumption of etching solution components increases environmental pressure.
A thick copper plate outer layer etching device is designed. The device uses an elastic sheet in the anti-clogging component to form a slit using the Bernoulli effect to intercept deposits and automatically clean the deposits when clogging occurs. Combined with an electric valve and a purification system, it ensures stable spraying and recycling of the etching solution.
It improves etching precision and efficiency, avoids nozzle clogging, reduces production costs and environmental pressure, and ensures balanced utilization of etching solution components.
Smart Images
Figure CN121262746B_ABST
Abstract
Citation Information
Patent Citations
PCB etching equipment
CN118946021A
Filtering device for plate glass thinning etching waste acid
CN209696385U