A fully automatic visual guidance soldering machine

Abstract

The application discloses a kind of full-automatic visual guidance soldering machine, belongs to soldering machine technical processing field.A kind of full-automatic visual guidance soldering machine, slag removal mechanism includes: slag removal frame, one end is communicated with the tin pipe, the other end is towards the tin end of tin feeding mechanism;Spiral scraper is connected in slag removal frame;Wherein, the through-hole for tin wire through is equipped in the middle of spiral scraper, the spiral inclination direction of spiral scraper is same with the tin wire advancing direction, the present application is by means of spiral scraper multidimensional design by slag removal mechanism, middle adaptation tin wire through-hole, the spiral inclination direction of same with tin wire advancing direction and included angle 120-150 °, at least two groups of number of turns, realize the high-precision non-damage pretreatment of tin wire surface, by pressing, push off double effect cleaning burr produced after breaking tin, and the characteristics that tin wire cross section only unilateral contact with scraper, reduce the fracture risk of tin wire due to multidirectional stress, simultaneously significantly improve tin wire surface smoothness, reduce the frictional resistance of tin wire and tin pipe.

Description

Technical Field

[0001] This invention relates to the field of soldering machine technology, and in particular to a fully automatic vision-guided soldering machine. Background Technology

[0002] As a key piece of equipment in the electronics manufacturing industry, the CCD automatic vision soldering machine, with the real-time image capture capability of the high-resolution CCD camera and the synergy of the precision motion control system, can achieve micron-level solder joint positioning accuracy. It has been widely used in precision welding scenarios such as consumer electronics, automotive electronics, and medical instruments. Among them, the solder feeding system is the core execution unit of the soldering machine, and its solder feeding stability directly determines the solder joint forming quality, welding consistency and production efficiency. The design of the solder breaking mechanism is particularly critical.

[0003] In the prior art, in order to solve the problem of solder splattering caused by the thermal expansion of the internal flux during high-temperature soldering, a solder-breaking wheel is generally used to pre-cut the solder wire. Through the mechanical contact between the cutting teeth of the solder-breaking wheel and the solder wire, regular notches are formed on the surface of the solder wire, so that the flux can be released in an orderly manner along the notches, avoiding the splashing of molten solder caused by pressure concentration. However, most existing solder breaking wheels use sharp straight teeth or triangular teeth. When in contact with solder wire, the pressure and cutting of the solder wire surface by the teeth will cause plastic deformation of the surface metal of the solder wire, and some metal will be directly peeled off, forming metal debris. After these debris enters the solder feeding tube with the solder wire, they will mix with SnO and SnO2 powder produced by the oxidation of the solder wire at high temperature, and will also adsorb organic acids and carbides produced by the decomposition of unsoldering flux to form sticky solder dross, which is very easy to adhere to the inner wall of the solder feeding tube, causing the solder feeding channel to narrow or even block. The rigid contact between the desoldering wheel and the solder wire can cause irregular deformation on the surface of the solder wire. In addition to the pre-set notches, it can also form defects such as burrs and scratches. These defects rub against the inner wall of the solder feeding tube during the solder feeding process, which further aggravates the generation of debris. At the same time, it causes fluctuations in the solder wire feeding resistance, causing the solder joint coordinates located by the CCD vision system to deviate from the actual solder feeding position, thus reducing the soldering yield. Summary of the Invention

[0004] The purpose of this invention is to solve the problems mentioned in the background art and to provide a fully automatic vision-guided soldering machine.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A fully automatic vision-guided soldering machine includes a solder feeding mechanism and a soldering mechanism, wherein the solder feeding mechanism and the soldering mechanism are connected by a solder feeding tube, and further includes a slag removal mechanism disposed between the solder feeding mechanism and the solder feeding tube; the slag removal mechanism includes: The slag removal frame is connected to the solder feeding tube at one end and faces the solder feeding end of the solder feeding mechanism at the other end. A spiral scraper is connected inside the slag removal frame; The spiral scraper has a through hole in the middle for the solder wire to pass through, and the spiral tilt direction of the spiral scraper is the same as the forward direction of the solder wire; The suction pipe is installed on the slag removal frame and located at the lower end of the spiral scraper; The suction pipe is used to extract tin dross from the dross removal frame.

[0006] To prevent cutting the solder wire, preferably, the angle between the spiral tilt direction of the spiral scraper and the forward direction of the solder wire is 120-150°.

[0007] To improve the scraping effect on burrs and residual tin dross, preferably, the spiral scraper has at least two sets of rotations.

[0008] To improve the burr removal effect, preferably, the spiral scraper is rotatably connected to the slag removal frame, the slag removal frame is fixedly connected to a micro motor, the output end of the micro motor is fixedly connected to a drive gear, and the drive gear meshes with the upper end of the spiral scraper.

[0009] To prevent solder dross from entering the solder feeding pipe, preferably, a filter plate is fixedly connected inside the dross cleaning frame, the suction pipe faces the filter plate, and the filter plate is located at the lower end of the spiral scraper.

[0010] Preferably, the slag removal frame is provided with an upper air supply system and a lower air supply system, and the filter plate is located between the upper air supply system and the lower air supply system; wherein, the upper air supply system includes an upper air inlet ring pipe, and the upper air inlet ring pipe is provided with multiple sets of upper air inlets, the upper air inlets facing the spiral scraper; The down-draft system includes a down-inlet ring pipe with multiple sets of down-inlet ports. The down-inlet ports are located at the end of the slag removal frame away from the suction pipe and face the suction pipe.

[0011] Preferably, it also includes a mounting frame disposed within the slag removal frame, the mounting frame being located between the filter plate and the spiral scraper, the mounting frame being used to install a micro camera, the micro camera being used to monitor the amount of tin slag remaining in the spiral scraper in order to control the air supply volume of the lower air inlet and the upper air inlet and the rotational speed of the drive gear.

[0012] Preferably, it further includes a control mechanism, a control panel, and a placement rack. The control panel and placement rack are located on the soldering machine frame. The control mechanism includes an X-axis adjusting screw mounted on the soldering machine frame. An X-axis screw seat is threaded onto the X-axis adjusting screw. A Z-axis adjusting screw is mounted on the X-axis screw seat. A Z-axis screw seat is threaded onto the Z-axis adjusting screw. A Y-axis adjusting screw is mounted on the Z-axis screw seat. A Y-axis screw seat is threaded onto the Y-axis adjusting screw. The soldering mechanism is mounted on the Y-axis lead screw seat, and the solder feeding mechanism is mounted on the Y-axis lead screw seat.

[0013] Preferably, the solder feeding mechanism includes a solder feeding roller and a solder feeding frame mounted on the Z-axis lead screw seat. The solder feeding frame is provided with a solder breaking wheel driven by a motor. A guide wheel and a guide wheel are rotatably connected to the solder feeding frame. The guide wheel and the solder breaking wheel are meshed with each other through gears. The slag removal frame is located at the lower end of the tangent between the guide wheel and the tin-breaking wheel.

[0014] Preferably, the soldering mechanism includes a soldering heating head mounted on a Y-axis lead screw seat, and a solder feeding head is connected to the soldering heating head; wherein, the end of the solder feeding tube away from the slag removal frame is connected to the solder feeding head.

[0015] Compared with the prior art, the present invention provides a fully automatic vision-guided soldering machine, which has the following advantages: This invention utilizes a multi-dimensional design of a spiral scraper to achieve high-precision, non-damaging pretreatment of the solder wire surface through a slag removal mechanism. This mechanism features a central through-hole adapted to the solder wire, a spiral tilt direction with an angle of 120-150° to the direction of solder wire movement, and at least two sets of turns. The dual action of pressing and pushing removes burrs generated after solder breakage. Furthermore, the characteristic that only one side of the solder wire cross-section contacts the scraper reduces the risk of breakage due to multi-directional stress. Simultaneously, it significantly improves the smoothness of the solder wire surface, reduces frictional resistance between the solder wire and the solder feeding tube, solves the problems of solder wire jamming and breakage after breakage, and greatly improves solder feeding stability. The slag removal mechanism of this invention constructs a dynamic monitoring and intelligent control slag removal system through the collaborative design of micro-camera, micro-motor and dual air supply system. The micro-camera monitors the amount of residual solder dross on the spiral scraper area and filter plate in real time, and synchronously feeds back the signal to the control system to dynamically adjust the air supply volume of the dual air supply system and the rotation speed of the spiral scraper driven by the micro-motor. This can effectively avoid the blockage of the slag removal channel caused by the accumulation of solder dross, eliminate the need for machine shutdown for cleaning, extend the continuous operation time of the equipment, and significantly reduce the cost of manual intervention and downtime losses. The slag removal mechanism of this invention uses a layered synergy of filter plates, suction pipes, and a dual air supply system. The filter plates can effectively intercept the pushed-down solder dross, preventing it from entering the solder delivery pipe with the airflow or solder wire movement. The lower air inlet blows the solder dross on the filter plates toward the suction pipe, and with the negative pressure suction of the suction pipe, the solder dross is efficiently discharged, reducing defects such as cold solder joints and short circuits caused by solder dross entering the welding area. At the same time, the low-pressure nitrogen delivered by the upper air inlet can guide the suspended tiny solder dross downwards to the filter plates, and also prevent the solder dross from floating upwards and contaminating the CCD camera lens or welding heating head, ensuring the cleanliness and service life of the core components of the equipment. Attached Figure Description

[0016] Figure 1This is a front view of a fully automatic vision-guided soldering machine proposed in this invention; Figure 2 This is a side view of a fully automatic vision-guided soldering machine proposed in this invention; Figure 3 This is a schematic diagram of the structure of a fully automatic vision-guided soldering machine proposed in this invention; Figure 4 This is a schematic diagram of the Z-axis lead screw seat of a fully automatic vision-guided soldering machine proposed in this invention; Figure 5 This invention proposes a fully automatic vision-guided soldering machine. Figure 4 A schematic diagram of the structure of part A; Figure 6 This is a schematic diagram of the slag removal frame of a fully automatic vision-guided soldering machine proposed in this invention; Figure 7 This is a top view of the spiral scraper of a fully automatic vision-guided soldering machine proposed in this invention; Figure 8 This is a schematic diagram of the spiral scraper of a fully automatic vision-guided soldering machine proposed in this invention; Figure 9 This is a schematic diagram of the solder feeding tube structure of a fully automatic vision-guided soldering machine proposed in this invention.

[0017] In the diagram: 1. Soldering machine frame; 101. Control panel; 102. Placement rack; 2. X-axis adjusting screw; 201. X-axis screw seat; 202. Z-axis adjusting screw; 203. Z-axis screw seat; 204. Y-axis adjusting screw; 205. Y-axis screw seat; 3. Soldering heating head; 301. Solder feeding head; 302. Solder feeding tube; 4. Solder feeding frame; 401. Solder breaking wheel; 402. Guide wheel; 403. Guide wheel; 404. Solder feeding roller; 5. Slag removal frame; 501. Micro motor; 502. Drive gear; 503. Filter plate; 504. Suction tube; 6. Spiral scraper; 7. Lower air inlet; 701. Lower air inlet ring pipe; 8. Upper air inlet; 801. Upper air inlet ring pipe. Detailed Implementation

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0019] Example 1: Reference Figures 1-9A fully automatic vision-guided soldering machine includes a solder feeding mechanism and a soldering mechanism, a control panel 101, and a placement rack 102. The control panel 101 and the placement rack 102 are located on a soldering machine frame 1. The placement rack 102 is used to place components to be soldered. The control mechanism includes an X-axis adjusting screw 2 mounted on the soldering machine frame 1. An X-axis screw seat 201 is threadedly connected to the X-axis adjusting screw 2. A Z-axis adjusting screw 202 is mounted on the X-axis screw seat 201. A Z-axis screw seat 203 is threadedly connected to the Z-axis adjusting screw 202. The Z-axis lead screw seat 203 is equipped with a Y-axis adjusting lead screw 204, and the Y-axis adjusting lead screw 204 is threadedly connected to the Y-axis lead screw seat 205. The soldering mechanism is installed on the Y-axis lead screw seat 205, and the solder feeding mechanism is installed on the Y-axis lead screw seat 205. By setting the X-axis adjusting lead screw 2, Z-axis adjusting lead screw 202, and Y-axis adjusting lead screw 204, the position of the soldering mechanism during soldering can be adjusted. Combined with the real-time image capture capability of the CCD camera and the precision motion control system, the stability during soldering is ensured. The solder feeding mechanism includes a solder feeding roller 404 and a solder feeding frame 4 mounted on the Z-axis lead screw seat 203. The solder feeding frame 4 is equipped with a solder breaking wheel 401 driven by a motor. A guide wheel 402 and a guide wheel 403 are rotatably connected to the solder feeding frame 4. The guide wheel 402 and the solder breaking wheel 401 are meshed with each other through gears. The slag removal frame 5 is located at the lower end of the tangent between the guide wheel 402 and the solder breaking wheel 401. Through the set solder feeding mechanism, the solder wire can be stably fed to the solder feeding head 301. The soldering mechanism includes a soldering heating head 3 mounted on the Y-axis lead screw seat 205, and a solder feeding head 301 connected to the soldering heating head 3. The soldering heating head 3 is used to heat and melt the solder wire fed out by the solder feeding head 301 at the place to be soldered. The solder feeding mechanism and the soldering mechanism are connected by a solder feeding tube 302. The system also includes a slag removal mechanism, which is positioned between the solder feeding mechanism and the solder feeding tube 302. The end of the solder feeding tube 302 furthest from the slag removal frame 5 is connected to the solder feeding head 301. The slag removal mechanism includes: The slag removal frame 5 is connected to the solder feeding tube 302 at one end and faces the solder feeding end of the solder feeding mechanism at the other end. The spiral scraper 6 is connected inside the slag removal frame 5. The spiral scraper 6 has a through hole in the middle for the solder wire to pass through. The spiral inclination direction of the spiral scraper 6 is the same as the forward direction of the solder wire. The spiral scraper 6 can press the outer surface of the solder wire and push back or push off the burrs squeezed out by the solder breaking wheel 401, so that the surface of the solder wire is smooth, thereby reducing the friction with the solder feeding tube 302 during solder feeding and ensuring the stability of solder feeding. It is important to note that the spiral scraper 6 can also guide the pushed-down solder dross to prevent it from accumulating. Furthermore, due to the spiral structure of the spiral scraper 6, only one side of the solder wire is in contact with the spiral scraper 6, which can effectively prevent the solder wire from being scraped and ensure the stability of solder feeding. The spiral scraper 6 has at least two sets of turns, which can scrape the same position of the solder wire at least twice in a spiral motion to ensure the cleaning effect of the solder wire. Specifically, refer to Figure 6 The angle α between the spiral tilt direction of the spiral scraper 6 and the forward direction of the solder wire is 120-150°, which ensures the removal of burrs while preventing the solder wire from breaking. The suction pipe 504 is installed on the slag removal frame 5 and located at the lower end of the spiral scraper 6. The suction pipe 504 is used to extract the tin slag in the slag removal frame 5.

[0020] The spiral scraper 6 is rotatably connected to the slag removal frame 5. A micro motor 501 is fixedly connected to the slag removal frame 5. The output end of the micro motor 501 is fixedly connected to the drive gear 502. The drive gear 502 meshes with the upper end of the spiral scraper 6. It should be noted that the rotation direction of the spiral scraper 6 is opposite to the spiral direction of the spiral scraper 6. At this time, the tilt angle of the spiral scraper 6 can further ensure the stability of the solder wire when returning to the solder during the solder feeding process and prevent the solder wire from breaking.

[0021] A filter plate 503 is fixedly connected inside the slag removal frame 5. The suction pipe 504 faces the filter plate 503. The filter plate 503 is located at the lower end of the spiral scraper 6. The slag scraped and scraped off by the spiral scraper 6 will stay on the lower filter plate 503, thereby ensuring the stability of the suction pipe 504 in sucking up the slag, ensuring the discharge of slag, and preventing slag from entering the slag feeding pipe 302.

[0022] The cleaning frame 5 is equipped with an upper air supply system and a lower air supply system, and the filter plate 503 is located between the upper air supply system and the lower air supply system; the upper air supply system includes an upper air inlet ring pipe 801, and the upper air inlet ring pipe 801 is equipped with multiple sets of upper air inlets 8, which face the spiral scraper 6. The down-flow system includes a down-inlet ring pipe 701, which is provided with multiple sets of down-inlet ports 7. The down-inlet ports 7 are located at the end of the slag removal frame 5 away from the suction pipe 504, and the down-inlet ports 7 face the suction pipe 504. Among them, the upper air intake ring pipe 801 and the lower air intake ring pipe 701 are connected to separate air supply pipes, and the gas supplied by the air supply pipes is a protective gas such as nitrogen. The lower air inlet 7 is used to blow the solder dross on the filter plate 503 toward the suction pipe 504 to assist in the removal of the solder dross, while the upper air inlet ring pipe 801 at the upper end can blow the solder dross at the upper end downward to prevent the solder dross from clogging.

[0023] It also includes a mounting bracket set inside the slag removal frame 5. The mounting bracket is located between the filter plate 503 and the spiral scraper 6. The mounting bracket is used to install a micro camera. The micro camera is used to monitor the amount of tin slag remaining in the spiral scraper 6 in order to control the air supply volume of the lower air inlet 7 and the upper air inlet 8 and the rotation speed of the drive gear 502.

[0024] Example 2: Reference Figures 1-9 A fully automatic vision-guided soldering machine is described. Upon powering on the soldering machine, the control panel 101 triggers a system self-check. The X-axis adjusting lead screw 2, Z-axis adjusting lead screw 202, and Y-axis adjusting lead screw 204 drive their corresponding lead screw seats to reset to their preset initial positions, ensuring the soldering mechanism and solder feeding mechanism are in standby mode. The micro-motor 501 is powered on and in standby mode, the drive gear 502 remains stationary, and the spiral scraper 6 is in its initial position, with its through-hole coaxially aligned with the solder feeding end of the solder feeding mechanism and the solder feeding tube 302. The suction tube 504 is connected to the negative pressure system and is in standby mode. The upper air inlet ring pipe 801 and lower air inlet ring pipe 701 are connected to nitrogen protective gas through external air supply pipes, maintaining low-pressure standby. The soldering heating head 3 of the soldering mechanism is preheated to the preset soldering temperature. The CCD camera is activated and completes image calibration. The precision motion control system establishes a signal connection with the CCD camera to ensure visual positioning accuracy. The operator fixes the component to be soldered in the preset position of the placement rack 102, and inputs the soldering parameters such as soldering point, solder feeding speed and heating temperature through the control panel 101; the CCD camera captures real-time images of the component to be soldered on the placement rack 102 and transmits the image data to the precision motion control system. The control system analyzes and processes the image, locates the three-dimensional coordinates of the point to be welded, and generates X / Y / Z axis adjustment commands based on preset welding parameters. This drives the X-axis adjustment screw 2, Z-axis adjustment screw 202, and Y-axis adjustment screw 204 to work together, moving the welding heating head 3 and the solder feeding head 301 to a preset distance directly above the point to be welded, thus completing the welding positioning. The motor on the solder feeding frame 4 drives the solder breaking wheel 401 to rotate. The guide wheel 402 rotates synchronously with the solder breaking wheel 401 through gear meshing. The solder wire is conveyed to the space between the solder breaking wheel 401 and the guide wheel 402 by the solder feeding roller 404. After being squeezed and broken, it continues to be conveyed forward. The micro motor 501 drives the drive gear 502 to rotate. The drive gear 502 drives the spiral scraper 6 to rotate. Its rotation direction is opposite to the spiral direction of the spiral scraper 6. The micro camera in the slag cleaning frame 5 is activated to monitor the amount of residual solder slag in the area of ​​the spiral scraper 6 in real time. The upper air inlet ring pipe 801 delivers low-pressure nitrogen to the area of ​​the spiral scraper 6 through the upper air inlet 8 to form an airflow barrier and prevent the solder slag from drifting upward. After the solder is broken, the solder wire is guided by the guide wheel 403 and enters the central through hole of the spiral scraper 6 inside the slag cleaning frame 5. The spiral scraper 6 rotates and performs spiral pressing on the outer surface of the solder wire, pressing back or pushing off the burrs generated by breaking the solder. The cross-section of the solder wire only contacts the scraper on one side to avoid scratching the solder wire. At the same time, the spiral scraper 6 cleans the same position of the solder wire multiple times through at least two sets of turns to ensure a smooth surface. The pushed-down solder dross falls downwards under the guidance of the spiral scraper 6 and is intercepted and collected by the filter plate 503. Based on the feedback signal of the amount of solder dross residue, the micro camera adjusts the air supply volume of the lower air inlet ring pipe 701, and the lower air inlet 7 blows nitrogen into the filter plate 503, blowing the solder dross towards the suction pipe 504. The suction pipe 504 starts negative pressure suction to pull the solder dross on the filter plate 503 out of the dross cleaning frame 5, preventing the solder dross from accumulating or entering the solder delivery pipe 302. If the micro camera detects that there is too much solder dross residue, the speed of the micro motor 501 can be increased simultaneously to enhance the cleaning effect of the spiral scraper 6. The cleaned smooth solder wire is stably conveyed to the solder feeding head 301 through the solder feeding tube 302. Because there are no burrs on the surface of the solder wire, the frictional resistance with the solder feeding tube 302 is reduced, ensuring a uniform solder feeding speed.

[0025] The CCD camera captures images of the points to be soldered in real time, dynamically corrects soldering position deviations, and drives the X-axis adjusting screw 2, Z-axis adjusting screw 202, and Y-axis adjusting screw 204 for fine adjustments through a precision motion control system to ensure that the solder feeding head 301 is precisely aligned with the points to be soldered. The solder feeding head 301 delivers the cleaned solder wire to the heating area of ​​the soldering heating head 3, where the solder wire is heated and melted, dripping onto the soldering point. During the soldering process, the CCD camera continuously monitors the soldering status and, in conjunction with the multi-axis adjustment mechanism, adjusts the soldering position and solder feeding amount in real time to ensure soldering stability and quality. After a single soldering point is completed, the solder feeding head 301 stops feeding solder, the soldering heating head 3 moves away from the solder point, and the CCD camera checks the solder point quality. If it passes the quality check, the process moves to the next soldering point. After all soldering points are completed, the solder feeding mechanism stops feeding solder, and the solder breaking wheel 401 and guide wheel 402 stop rotating. The slag removal mechanism continues to run for 3-5 seconds to ensure that the residual solder slag is completely sucked up. Then, the micro motor 501, the air supply and suction pipe 504 stop working. The X-axis adjusting lead screw 2, Z-axis adjusting lead screw 202, and Y-axis adjusting lead screw 204 drive the soldering mechanism and solder feeding mechanism to reset to their initial positions. The soldering heating head 3 stops heating, the CCD camera is turned off, and the operator removes the soldered component from the placement rack 102. The equipment completes one full soldering process.

[0026] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A fully automatic vision-guided soldering machine, comprising a solder feeding mechanism and a soldering mechanism, wherein the solder feeding mechanism and the soldering mechanism are connected by a solder feeding tube (302), characterized in that, It also includes a slag removal mechanism, which is disposed between the solder feeding mechanism and the solder feeding tube (302); the slag removal mechanism includes: The slag removal frame (5) is connected at one end to the solder feeding tube (302) and at the other end to the solder feeding end of the solder feeding mechanism; Spiral scraper (6) is connected inside the slag removal frame (5); The spiral scraper (6) has a through hole in the middle for the solder wire to pass through, and the spiral tilt direction of the spiral scraper (6) is the same as the forward direction of the solder wire. The suction pipe (504) is installed on the slag removal frame (5) and located at the lower end of the spiral scraper (6); The suction pipe (504) is used to extract the tin dross in the dross removal frame (5); The angle between the spiral tilt direction of the spiral scraper (6) and the forward direction of the tin wire is 120-150°; The spiral scraper (6) is rotatably connected to the slag removal frame (5), and a micro motor (501) is fixedly connected to the slag removal frame (5). The output end of the micro motor (501) is fixedly connected to the drive gear (502), and the drive gear (502) meshes with the upper end of the spiral scraper (6). The rotation direction of the spiral scraper (6) is opposite to the spiral direction of the spiral scraper (6).

2. The fully automatic vision-guided soldering machine according to claim 1, characterized in that, The spiral scraper (6) has at least two sets of rotations.

3. The fully automatic vision-guided soldering machine according to claim 1, characterized in that, The cleaning frame (5) is fixedly connected to a filter plate (503), the suction pipe (504) faces the filter plate (503), and the filter plate (503) is located at the lower end of the spiral scraper (6).

4. The fully automatic vision-guided soldering machine according to claim 3, characterized in that, The slag removal frame (5) is equipped with an upper air supply system and a lower air supply system, and the filter plate (503) is located between the upper air supply system and the lower air supply system; in, The upper air supply system includes an upper air inlet ring pipe (801), and the upper air inlet ring pipe (801) is provided with multiple sets of upper air inlets (8), and the upper air inlets (8) face the spiral scraper (6). The down-flow system includes a down-inlet ring pipe (701), which is provided with multiple sets of down-inlet ports (7). The down-inlet ports (7) are located at the end of the slag removal frame (5) away from the suction pipe (504) and face the suction pipe (504).

5. A fully automatic vision-guided soldering machine according to claim 4, characterized in that, It also includes a mounting bracket set inside the slag removal frame (5), the mounting bracket being located between the filter plate (503) and the spiral scraper (6), the mounting bracket being used to install a micro camera, the micro camera being used to monitor the amount of tin slag remaining in the spiral scraper (6) to control the air supply volume of the lower air inlet (7) and the upper air inlet (8) and the rotation speed of the drive gear (502).

6. The fully automatic vision-guided soldering machine according to claim 1, characterized in that, It also includes a control mechanism, a control panel (101), and a placement rack (102). The control panel (101) and the placement rack (102) are located on the soldering machine frame (1). The control mechanism includes an X-axis adjusting screw (2) installed on the soldering machine frame (1). An X-axis screw seat (201) is threadedly connected to the X-axis adjusting screw (2). A Z-axis adjusting screw (202) is installed on the X-axis screw seat (201). A Z-axis screw seat (203) is threadedly connected to the Z-axis adjusting screw (202). A Y-axis adjusting screw (204) is provided on the Z-axis screw seat (203). A Y-axis screw seat (205) is threadedly connected to the Y-axis adjusting screw (204). The soldering mechanism is mounted on the Y-axis lead screw seat (205), and the solder feeding mechanism is mounted on the Y-axis lead screw seat (205).

7. A fully automatic vision-guided soldering machine according to claim 6, characterized in that, The solder feeding mechanism includes a solder feeding roller (404) and a solder feeding frame (4) mounted on a Z-axis lead screw seat (203). The solder feeding frame (4) is equipped with a solder breaking wheel (401) driven by a motor. The solder feeding frame (4) is rotatably connected with a guide wheel (402) and a guide wheel (403). The guide wheel (402) and the solder breaking wheel (401) are meshed by gears. The slag removal frame (5) is located at the lower end of the tangent between the guide wheel (402) and the tin-breaking wheel (401).

8. A fully automatic vision-guided soldering machine according to claim 6, characterized in that, The soldering mechanism includes a soldering heating head (3) mounted on a Y-axis lead screw seat (205), and a solder feeding head (301) is connected to the soldering heating head (3). The end of the solder feeding tube (302) away from the slag removal frame (5) is connected to the solder feeding head (301).

Images