A heat-resistant high-toughness PCB and a preparation method thereof

By modifying epoxy-terminated polybutadiene with polysiloxane and epoxy resin with aminosilsesquioxane curing agent, the problem of insufficient toughness and heat resistance of epoxy resin in PCB production was solved, achieving high strength, toughness and heat resistance of copper-clad substrates and PCBs, while maintaining good adhesion performance.

CN121268376BActive Publication Date: 2026-07-03荣丰(清远)线路板有限公司
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Patent Information

Application Number
CN202511421925.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-09-30
Publication Date
2026-07-03
Estimated Expiration
2045-09-30

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Abstract

This invention belongs to the field of printed circuit board materials technology, and discloses a heat-resistant, high-strength, and tough PCB board and its preparation method. The preparation method involves: performing a hydrosilylation polymerization reaction between epoxy-terminated polybutadiene and polymethylhydrosiloxane under the conditions of a catalyst and organic solvent to obtain a polysiloxane-modified epoxy-terminated polybutadiene solution; then mixing this solution with epoxy resin, an aminosilsesquioxane curing agent, and inorganic fillers to obtain a modified epoxy resin adhesive; impregnating a non-conductive substrate with the obtained modified epoxy resin adhesive; then, applying copper foil to one or both sides, followed by hot-pressing and curing to obtain a copper-clad substrate; finally, through cutting, drilling, copper plating, etching, and surface treatment, a heat-resistant, high-strength, and tough PCB board is obtained. This invention uses polysiloxane-modified epoxy-terminated polybutadiene to modify the epoxy resin, which can significantly improve the heat resistance and toughness of the obtained copper-clad substrate and PCB board, while maintaining high adhesion performance.
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Citation Information

Patent Citations

  • Resin compositions, prepregs, laminates, foil-coated laminates, and printed circuit boards

    CN111757911B

  • High temperature resistant epoxy adhesive modified by silsesquioxane for flexible copper clad laminate

    CN101591518A

  • Polysiloxane-allyl compound modified polybutadiene resin composition, and prepreg, laminated board and printed circuit board thereof

    CN108250605A