Temperature control device based on triangular partition heat ridge active transport

Abstract

The temperature control device based on the triangle partition heat ridge active transport belongs to the vacuum environment temperature control equipment; The cylindrical vacuum inner tank is fixed in the cylindrical vacuum outer tank, the annular vacuum cavity is arranged between the inner wall of the cylindrical vacuum outer tank and the outer wall of the cylindrical vacuum inner tank, the annular circulating cooling water cavity is arranged on the inner wall of the cylindrical side plate of the cylindrical vacuum inner tank, the triangular electric heating radiation plate assembly is arranged in the cavity of the cylindrical vacuum inner tank, the temperature controller and the vacuum pump assembly are fixed outside the cylindrical vacuum outer tank, the temperature controller is communicated with the triangular electric heating radiation plate assembly, and the vacuum pump assembly is communicated with the vacuum cavity of the cylindrical vacuum outer tank and the annular circulating cooling water cavity of the cylindrical vacuum inner tank respectively; On the basis of the partition heat radiation, the device increases the heat ridge active transport structure, improves the temperature control efficiency, optimizes the uniformity of heat distribution, and realizes the accurate temperature control in the vacuum environment.

Description

Technical Field

[0001] This invention belongs to the technical field of vacuum environment temperature control equipment, and mainly relates to a temperature control device based on triangular partitioned heat monolithic active transport. Background Technology

[0002] As the development level of ultra-precision instruments and equipment continues to improve, the requirements for the working environment of precision instruments and equipment are becoming more stringent. Even slight environmental changes can have a significant impact on the accuracy of the instruments. Among them, thermal disturbance is one of the main sources of error. For example, in the interferometer lens group of a molecular measuring machine that works in a vacuum environment, the laser will generate thermal interference, causing changes in the air refractive index and thermal deformation of optical components, resulting in measurement errors. Therefore, it is necessary to control the working environment temperature of the instruments efficiently and accurately.

[0003] In the prior art, patent application CN201710290677.7 discloses a zoned temperature control system for a vacuum furnace used in heat treatment: the vacuum furnace chamber is divided into several independent zones, each equipped with a heater. Temperature is monitored by sensors, and a controller adjusts the heating power to regulate the temperature within the furnace chamber and ensure temperature uniformity. This device can achieve a uniform temperature distribution in the vacuum environment; however, each zone is independent, and the temperature of each zone can only be adjusted by regulating the power of the controller. It cannot respond quickly when adjusting for temperature uniformity, and when the power of a certain module is excessive or insufficient, adjustment can only be made by regulating the heating power of the controller. Patent application CN202210086786.8 discloses a multi-zone independent temperature control method for thermal vacuum testing, which uses a heat-conducting medium to adjust the cooling or heating amount and controls the temperature of the temperature-controlled zones through radiative heat exchange. However, it also suffers from the problem of relatively independent temperature-controlled zones. Patent application CN202411532728.9 discloses a temperature control device and method for a three-axis rotary table in a vacuum environment: the heating circuit consists of several electrically connected heating elements, different heating circuits are set on the surface of the three-axis rotary table, and the heating power is regulated by a control module. A heat dissipation surface is also provided to adjust the temperature distribution of the three-axis rotary table in a vacuum environment. However, the use of radiation heat dissipation is inefficient and cannot achieve rapid temperature regulation. Furthermore, each heating module heats the three-axis rotary table through heat conduction, resulting in a relatively fast but independent heating speed, poor heat transfer, and low temperature control accuracy.

[0004] In summary, considering the thermal stability requirements of precision instruments in a vacuum environment, independent zone temperature control cannot achieve localized heat transfer and power regulation, and the temperature control accuracy for a single zone is low and the control speed is slow. The aforementioned technologies cannot meet the operating environment control requirements of precision instruments for high thermal stability and fast temperature control response. Summary of the Invention

[0005] The purpose of this invention is:

[0006] To address the shortcomings of the existing technology, this invention provides a temperature control device based on triangular partitioned active heat transport. It utilizes triangular electric heating radiation plates for partitioned temperature control, semiconductor cooling chips for inter-partition active heat transport, and a controller to regulate the power of the heaters in each partition and the input voltage of the semiconductor cooling chips, thereby achieving the goal of meeting the working environment control requirements of high thermal stability and fast temperature control response of precision instruments.

[0007] The objective of this invention is achieved as follows:

[0008] This application provides a temperature control device based on triangular partitioned heat transfer, comprising a temperature controller, a cylindrical vacuum inner tank fixedly mounted inside a cylindrical vacuum outer tank, an annular vacuum cavity between the inner wall of the cylindrical vacuum outer tank and the outer wall of the cylindrical vacuum inner tank, an annular circulating cooling water cavity on the inner wall of the cylindrical side plate of the cylindrical vacuum inner tank, a triangular electrothermal radiation plate assembly disposed and installed inside the cavity of the cylindrical vacuum inner tank, and a temperature controller and a vacuum pump assembly fixedly mounted outside the cylindrical vacuum outer tank. The triangular electrothermal radiation plate assembly is composed of equilateral triangular electrothermal radiation plates, semiconductor cooling chips, and temperature sensors. Adjacent equilateral triangular electrothermal radiation plates are joined together by sharing a common side to form a densely arranged cylindrical honeycomb structure. A semiconductor cooling chip is embedded in each common side, the plane of which completely coincides with the common side, and its length is consistent with the side length of the equilateral triangular electrothermal radiation plate. The cold end of the semiconductor cooling chip absorbs heat from the adjacent equilateral triangular electrothermal radiation plate. The hot end of the thermoelectric cooler is bonded to the heat dissipation surface of the adjacent equilateral triangular electrothermal radiation plate. Heat is actively transported from the high-temperature unit to the low-temperature unit via a heat-trough pattern through current direction control. The heat actively converges in the strip-shaped heat-troughs of the heat radiation structure, with the heat transport directions of any two adjacent heat-troughs opposite. A temperature sensor is attached to the surface of the equilateral triangular electrothermal radiation plate and connected to a temperature controller via a signal line. The temperature controller calculates the local temperature gradient caused by thermal disturbances within the triangular electrothermal radiation plate assembly based on real-time data from the temperature sensor. The temperature controller dynamically adjusts the heating power of the corresponding equilateral triangular electrothermal radiation plate and the input voltage from adjacent radiation plates to the thermoelectric cooler based on the calculated temperature gradient. This causes heat to converge in the heat-troughs and be transported along a preset unidirectional path. By reducing the heating power of the equilateral triangular electrothermal radiation plate where heat is concentrated, the temperature uniformity of the triangular electrothermal radiation plate assembly is ensured. The annular circulating cooling water cavity on the surface of the cylindrical vacuum inner tank provides a cold source background, which, together with the triangular electrothermal radiation plate assembly, controls the temperature of the controlled target within the set temperature range.

[0009] The beneficial effects of this invention are:

[0010] This invention provides a temperature control device based on triangular partitioned heat distribution with active heat transport. During operation, the device precisely controls the heat flow path from the heat source area to other heat radiation zones by pre-setting the current direction of the semiconductor cooling chips. When a band-like thermal interference occurs, the heating power of the heat radiation plates is reduced to maintain overall temperature consistency, and the locally concentrated heat is rapidly and directionally conducted to other heat radiation zones in the heat transfer path for even distribution, improving the response speed to local temperature changes. Simultaneously, the series connection of the heat radiation plates expands the control range of heat radiation power, and the water-cooled heat sink provides a cold source background for maintaining the set temperature of the heat radiation zones. When a sudden band-like thermal interference is detected by an equilateral triangular electric heating radiation plate in a certain area, the heat can be quickly and actively gathered into the strip-shaped heat trench of the heat radiation structure through the connected semiconductor cooling chips, and transported along a pre-set unidirectional path to the equilateral triangular electric heating radiation plates on the path, reducing the temperature difference between the plates. Simultaneously, the heating power of the electric heating radiation plates on this path is reduced, forming a thermal isolation zone. The remaining equilateral triangular heat radiation plates can maintain their original temperature settings, preventing the spread of thermal interference.

[0011] The triangular partitioned radiative temperature control structure is densely arranged with shared sides to form a continuous thermal radiation surface. Each partition is thermally coupled with three adjacent partitions. During the heat transport process, more thermal radiation partitions participate in heat transfer, which improves the heat dissipation speed and ensures that the overall temperature control device can quickly achieve temperature consistency and improve temperature control accuracy. At the same time, the triangular partition has high plane filling efficiency, good spatial universality, and more stable mechanical structure, which can effectively prevent structural problems such as thermal deformation.

[0012] By adjusting the installation method of the thermoelectric cooler to control the direction of heat transport, on-demand, grid-like heat transport is achieved. This means that when dealing with concentrated heat in interphase strips, the heat is dispersed perpendicular to the heat bands, transported in a manner similar to water flow in furrows. By adjusting the power of the heat radiation plates at the heat concentration points and using grid-like transport to evenly distribute heat, multiple interphase strip-like thermal contaminations formed on the controlled target are eliminated, optimizing the heat distribution. This eliminates the need for mechanically moving parts, improving temperature control efficiency and temperature stability.

[0013] By actively transporting heat, independent radiant heat panels are connected in series, and the accumulated heat from adjacent strips is dispersed and transported to the cold zones on both sides. During the transport process, the concentrated heat caused by interference sources is evenly dispersed, reducing the temperature difference of the radiant heat panels and increasing the radiant heat area. Compared with zonal radiant heat panels with small area temperature differences, this method can improve the speed at which the radiant heat panels and cold sources reach the set temperature, thereby increasing temperature control efficiency. The power adjustment range of a single radiant heat panel is limited, so the zonal structure with independent temperature control may not be able to complete the temperature regulation task of eliminating severe thermal interference. The structure of multiple radiant heat panels connected in series can increase the power adjustment range many times over to cope with severe thermal pollution and improve the applicability of the device. At the same time, heat can be quickly and actively transported to the low-thermal-sensitive area to prevent the heat from accumulating for a long time and causing adverse effects on the temperature-sensitive area. This invention solves the problem in existing technologies where uneven heat distribution necessitates independent adjustment of the power of each radiant heat plate by the controller for temperature control. By actively transporting heat and increasing the heat transfer path, the temperature control range of radiant temperature control is improved. Simultaneously, heat is actively transported and distributed across multiple radiant heat plates. The triangular partitioning allows more radiant heat plates to participate in heat transfer along the transport path, and the larger connected radiant heat area enables faster temperature control response. It can significantly reduce temperature gradients in a short time, eliminate abrupt changes in heat distribution across the controlled target, and ensure that the overall temperature control device can quickly achieve temperature uniformity. It also solves the problems of divergent heat transport direction and uncontrolled transport power, significantly improving temperature control efficiency and accuracy. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of a temperature control device based on triangular partitioned heat monolithic active transport;

[0015] Figure 2 This is a schematic diagram of the triangular electric heating radiation plate assembly structure;

[0016] Figure 3 This is a schematic diagram of the heat transport direction of the triangular electric heating radiant panel assembly;

[0017] Figure 4 This is a schematic diagram of the vacuum pump assembly structure.

[0018] Part numbers in the diagram: 1. Cylindrical vacuum outer tank; 2. Cylindrical vacuum inner tank; 3. Triangular electric heating radiation plate assembly; 3-1. Equilateral triangular electric heating radiation plate; 3-2. Semiconductor cooling chip; 3-2-1. Cold end of cooling chip; 3-2-2. Hot end of cooling chip; 3-3. Temperature sensor; 4. Temperature controller; 5. Vacuum pump assembly; 5-1. Vacuum gauge; 5-2. Foreboard pump; 5-3. Main pump; 5-4. Chiller; 5-5. Water pipe A; 5-6. Water pipe B; 5-7. Water pipe C; 5-8. Gas pipe A; 5-9. Gas pipe B; 5-10. Gas pipe C; 5-11. Gas pipe D; 6. Annular circulating cooling water chamber. Detailed Implementation

[0019] The embodiments of the present invention will now be clearly and completely described with reference to the accompanying drawings.

[0020] This invention provides a temperature control device based on triangular partitioned heat monolithic active transport, see [link to related document]. Figures 1-4 The system includes a temperature controller 4, a cylindrical vacuum inner tank 2 fixed inside a cylindrical outer vacuum tank 1, an annular vacuum cavity between the inner wall of the cylindrical outer vacuum tank 1 and the outer wall of the cylindrical inner vacuum tank 2, an annular circulating cooling water cavity 6 on the inner wall of the cylindrical side plate of the cylindrical inner vacuum tank 2, a triangular electric heating radiation plate assembly 3 installed inside the cavity of the cylindrical inner vacuum tank 2, and a temperature controller 4 and a vacuum pump assembly 5 fixed outside the cylindrical outer vacuum tank 1.

[0021] The triangular electrothermal radiation plate assembly 3 is composed of an equilateral triangular electrothermal radiation plate 3-1, a semiconductor cooling chip 3-2, and a temperature sensor 3-3. Adjacent equilateral triangular electrothermal radiation plates 3-1 are spliced ​​together through a common side to form a cylindrical honeycomb-like dense arrangement structure. A semiconductor cooling chip 3-2 is embedded in each common side, with its plane completely overlapping the common side and its length matching the side length of the equilateral triangular electrothermal radiation plate 3-1. The cold end 3-2-1 of the semiconductor cooling chip 3-2 is in contact with the heat-absorbing surface of the adjacent equilateral triangular electrothermal radiation plate 3-1, and the hot end 3-2-2 of the semiconductor cooling chip 3-2 is in contact with the heat-dissipating surface of the adjacent equilateral triangular electrothermal radiation plate 3-1. The active heat transport from the high-temperature unit to the low-temperature unit is achieved through current direction control. Heat is concentrated in the strip-shaped heat trenches of the thermal radiation structure, with the heat transport directions of every two adjacent heat trenches being opposite. Temperature sensors 3-3 are attached to the surface of the equilateral triangular electrothermal radiation plate 3-1, and are connected to the temperature controller 4 via signal lines. The temperature controller 4 calculates the local temperature gradient caused by thermal disturbances within the triangular electrothermal radiation plate assembly 3 based on real-time data from the temperature sensors 3-3. The temperature controller 4 dynamically adjusts the heating power of the corresponding equilateral triangular electrothermal radiation plate 3-1 and the input voltage from adjacent radiation plates to the semiconductor cooling chip 3-2 based on the calculated temperature gradient, causing heat to concentrate in each heat trench and transported along a preset unidirectional path. By reducing the heating power of the equilateral triangular electrothermal radiation plates where heat is concentrated, the temperature consistency of the triangular electrothermal radiation plate assembly is ensured. The annular circulating cooling water cavity on the surface of the cylindrical vacuum inner tank provides a cold source background, working together with the triangular electrothermal radiation plate assembly to control the target temperature within the set temperature range.

[0022] The vacuum pump assembly 5 includes a vacuum gauge 5-1, a backing pump 5-2, a main pump 5-3, and a circulating chiller 5-4. The vacuum gauge 5-1, the backing pump 5-2, and the main pump 5-3 are connected to the vacuum inner cavity of the cylindrical vacuum outer tank 1 through gas pipes A 5-8, B 5-9, and C 5-10, respectively. The backing pump 5-2 and the main pump 5-3 are connected to each other through gas pipe D 5-11. The circulating chiller 5-4 is connected to the annular circulating cooling water cavity 6 on the cylindrical vacuum inner tank 2 and the main pump 5-3 through water pipes A 5-5 and B 5-6, respectively. Water pipe C 5-7 connects the main pump 5-3 to the backing pump 5-2.

[0023] During operation, circulating cooling water continuously flows within the annular circulating cooling water chamber 6, the circulating chiller 5-4, the pre-pump 5-2, and the main pump 5-3, providing a cooling source. The side surfaces of the equilateral triangular electric heating radiant plates 3-1 are thermally connected by semiconductor cooling chips 3-2, establishing an active heat transport channel. Heat is transported according to a pre-set direction: the cold end 3-2-1 of the semiconductor cooling chip 3-2 is attached to the equilateral triangular electric heating radiant plate 3-1 receiving heat, and the hot end 3-2-2 of the semiconductor cooling chip 3-2 is attached to the equilateral triangular electric heating radiant plate 3-1 transporting heat. Simultaneously, the temperature sensor 3-3 monitors the temperature in real time. The temperature controller 4 automatically controls the input power of each equilateral triangular electric heating radiant plate 3-1 based on the signal measured by the temperature sensor 3-3 and the pre-set temperature control range. When the measured temperature exceeds the set temperature, the temperature controller 4 reduces the heating power and changes the input voltage of the semiconductor cooling chip 3-2, increasing the semiconductor cooling output. The temperature difference between the cold end 3-2-1 and the hot end 3-2-2 of the cooling plate 3-2 increases the heat transport power. The inner surface of the triangular electric heating radiation plate assembly 3 exchanges heat with the heat source that generates thermal disturbance inside. When a temperature gradient is generated on the surface of the triangular electric heating radiation plate assembly 3, the temperature controller 4 will reduce the heating power of the heat-concentrated heat radiation plate to maintain a consistent heat distribution on the surface of the controlled target. The triangular electric heating radiation plate assembly 3 and the annular circulating cooling water cavity 6 set on the inner wall of the cylindrical vacuum inner tank 2 work together to stabilize the temperature at the set value. Heat is actively transported in a grid pattern between the equilateral triangular electric heating radiation plates 3-1, avoiding the problem of heat accumulation in a certain strip area causing the internal environment of the device to be unable to dissipate heat quickly, improving the temperature control efficiency, and ensuring the uniformity of the internal temperature of the device and the thermal stability of the temperature control device. During the operation of the device, the fore-pump 5-2 starts running first, and the vacuum gauge 5-1 monitors the air pressure inside the cylindrical vacuum outer tank 1. When the air pressure drops to a certain value, the main pump 5-3 starts running until the vacuum degree reaches the working requirements of the device. During this process, the circulating chiller 5-4 is always in operation.

Claims

1. A temperature control device based on triangular partitioned heat monolithic active transport, comprising a temperature controller (4), characterized in that: A cylindrical vacuum inner tank (2) is fixedly installed inside a cylindrical vacuum outer tank (1). An annular vacuum cavity is provided between the inner wall of the cylindrical vacuum outer tank (1) and the outer wall of the cylindrical vacuum inner tank (2). An annular circulating cooling water cavity (6) is provided on the inner wall of the cylindrical side plate of the cylindrical vacuum inner tank (2). A triangular electrothermal radiation plate assembly (3) is installed inside the cavity of the cylindrical vacuum inner tank (2). The temperature controller (4) and vacuum pump assembly (5) are fixedly installed outside the cylindrical vacuum outer tank (1). The triangular electrothermal radiation plate assembly (3) consists of an equilateral triangular electrothermal radiation plate (3-1), a semiconductor cooling chip (3-2), and a temperature controller (4). The sensor (3-3) is assembled such that adjacent equilateral triangular electrothermal radiation plates (3-1) are spliced ​​together through a common side to form a cylindrical honeycomb-like densely arranged structure. A semiconductor cooling chip (3-2) is embedded in each common side. The plane of the semiconductor cooling chip (3-2) completely coincides with the common side, and its length is the same as the side length of the equilateral triangular electrothermal radiation plate (3-1). The cold end (3-2-1) of the semiconductor cooling chip (3-2) is in contact with the heat-absorbing surface of the adjacent equilateral triangular electrothermal radiation plate (3-1), and the hot end (3-2-2) of the semiconductor cooling chip (3-2) is in contact with the heat-absorbing surface of the adjacent equilateral triangular electrothermal radiation plate (3-1) on the other side. -1) The heat dissipation surface is attached, and the heat is actively transported from the high-temperature unit to the low-temperature unit by controlling the installation method and current direction of the semiconductor cooling chip (3-2). The heat actively gathers in the strip-shaped heat grooves of the heat radiation structure, and the heat transport direction of each two adjacent heat grooves is opposite. The temperature sensor (3-3) is attached to the surface of the equilateral triangular electrothermal radiation plate (3-1). The temperature sensor (3-3) is connected to the temperature controller (4) through a signal line. The temperature controller (4) calculates the local temperature gradient caused by the thermal disturbance inside the triangular electrothermal radiation plate assembly (3) based on the real-time data of the temperature sensor (3-3). The temperature controller (4) dynamically adjusts the heating power of the corresponding equilateral triangular electric radiant plate (3-1) and the input voltage of the adjacent radiant plates to the semiconductor cooling chip (3-2) according to the calculated temperature gradient, so that the heat is concentrated in each heat trench and transported along the preset unidirectional path. By reducing the heating power of the equilateral triangular electric radiant plate (3-1) where the heat is concentrated, the temperature consistency of the triangular electric radiant plate assembly (3) is ensured. The annular circulating cooling water cavity (6) on the surface of the cylindrical vacuum inner tank (2) provides a cold source background, which works together with the triangular electric radiant plate assembly (3) to control the temperature of the controlled target within the set temperature range.

2. The temperature control device based on triangular partitioned heat monolithic active transport according to claim 1, characterized in that: The vacuum pump assembly (5) includes a vacuum gauge (5-1), a backing pump (5-2), a main pump (5-3), and a circulating chiller (5-4). The vacuum gauge (5-1), the backing pump (5-2), and the main pump (5-3) are connected to the vacuum inner cavity of the cylindrical vacuum outer tank (1) through air pipes A (5-8), B (5-9), and C (5-10), respectively. The backing pump (5-2) and the main pump (5-3) are connected to each other through air pipe D (5-11). The circulating chiller (5-4) is connected to the annular circulating cooling water cavity (6) on the cylindrical vacuum inner tank (2) and the main pump (5-3) through water pipes A (5-5) and B (5-6), respectively. Water pipe C (5-7) connects the main pump (5-3) to the backing pump (5-2).

Images