基于方形分区热量单向主动输运的温控装置
By combining a square electric heating radiation plate and a semiconductor cooling chip, unidirectional active heat transport and rapid temperature response are achieved in a vacuum environment, solving the problems of insufficient thermal stability and control speed in existing technologies, and improving the efficiency and accuracy of the temperature control device.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HARBIN INST OF TECH
- Filing Date
- 2025-10-23
- Publication Date
- 2026-07-17
AI Technical Summary
Existing technologies cannot achieve rapid local heat transfer and high-precision temperature control in a vacuum environment. Independent zone temperature control results in insufficient thermal stability and control speed, which cannot meet the requirements of high thermal stability and temperature control response speed for precision instruments.
A temperature control device with unidirectional active heat transfer in a square partition is adopted. Through the combination of a square electric heating radiation plate and a semiconductor cooling chip, the heating power and the voltage of the semiconductor cooling chip are adjusted by a temperature controller to realize unidirectional active heat transfer from the high-temperature unit to the low-temperature unit. Combined with an annular circulating cooling water chamber to provide a cold source background, temperature consistency and rapid response are ensured.
It achieves rapid directional heat conduction and high-precision temperature control, improving temperature control efficiency and stability. It can quickly respond to local thermal interference, ensuring temperature uniformity and temperature control within the set range.
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Figure CN121274636B_ABST
Abstract
Citation Information
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