Wafer thinning apparatus and process

Abstract

The application relates to the technical field of semiconductor manufacturing, and discloses a wafer thinning device and process, which comprises a plurality of grinding discs, functional assemblies and scraping assemblies. The grinding surface of a single grinding disc is provided with two functional assemblies, and two grinding areas are formed between the two functional assemblies. The functional assemblies are used for cleaning the grinding areas and spraying grinding fluid. The scraping assemblies pass through the grinding areas of the plurality of grinding discs, and are used for uniformly dispersing the grinding fluid. The functional assemblies are arranged on the corresponding grinding discs, the grinding fluid in the grinding areas of the grinding discs can be cleaned, and the grinding fluid can be sprayed again, so that wafer grinding particles can be removed, the purity of the grinding fluid can be ensured, the grinding fluid can be uniformly dispersed before the grinding fluid contacts the wafer, local aggregation of the grinding fluid can be avoided, stress concentration problems can be prevented, the wafer will not be scratched, and the grinding precision can be ensured.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a wafer thinning equipment and process. Background Technology

[0002] Wafers are a crucial raw material for manufacturing semiconductor integrated circuits. Their primary material is silicon, and the manufacturing process involves multiple steps such as grinding, polishing, and slicing. As requirements for product performance and size continue to increase, wafer back-side grinding technology is also constantly improving. Wafer back-side grinding, also known as wafer thinning, aims to adjust the thickness of the wafer to make it suitable for various electronic devices, especially small electronic devices.

[0003] An existing invention patent application with publication number CN111261505A discloses a method for grinding a wafer. The grinding process includes: using a first chemical substance to conduct a chemical reaction to change the properties of a first portion of a material layer on the wafer; performing a first rinse to remove the first chemical substance and delay the chemical reaction; and then performing a mechanical grinding process to remove the first portion of the material layer.

[0004] In the aforementioned technical solution, the wafer is placed on a carrier, and a polishing slurry is applied using a slurry dispensing device. The polishing pad is then rotated by a dressing arm to polish the wafer. Some other polishing devices have a suction cup at the end of the rotating shaft to hold the wafer in place. The wafer is then pressed onto the polishing pad, and polishing is performed after adjusting the pressure. In the wafer grinding and polishing process, the grinding accuracy is greatly affected by the abrasive particle size distribution and uniformity of the grinding fluid. Uneven particle size distribution or uneven distribution of the grinding fluid during grinding can easily cause scratches on the wafer. Therefore, the performance requirements of the grinding fluid and the spraying method are crucial. Currently, grinding fluids are mostly applied to the grinding pad via dripping, and then directly dispersed by the wafer during subsequent grinding. This can easily lead to localized agglomeration of the grinding fluid, making it difficult to remove abrasive particles. This results in localized stress concentration, one of the main causes of wafer scratches. Therefore, better dispersing of the grinding fluid and avoiding agglomeration to generate localized stress is one of the keys to ensuring wafer processing quality. Summary of the Invention

[0005] In view of this, the present invention proposes a wafer thinning equipment and process that can ensure uniform application of grinding fluid, thereby improving the wafer thinning quality, in order to solve the problem of wafer scratches caused by uneven distribution of grinding fluid in the existing wafer grinding process.

[0006] The technical solution of this invention is implemented as follows: On one hand, the present invention provides a wafer thinning apparatus, including a grinding disk, functional components, and a leveling component, wherein, Multiple grinding discs are provided; The grinding surface of a single grinding disc is provided with two functional components, and two grinding zones are formed between the two functional components; Functional components are used to clean the grinding zone and spray grinding fluid; The leveling component passes through the grinding zone of multiple grinding discs and is used to disperse the grinding fluid.

[0007] Based on the above technical solutions, preferably, the functional components include a ring frame, a carrier frame, a first grinding fluid nozzle, a water supply nozzle, and a second grinding fluid nozzle, wherein... The ring frame and the grinding disc are set concentrically; The carrier is set inside the ring frame and corresponds to the grinding disc; The first grinding fluid nozzle, the water supply nozzle, and the second grinding fluid nozzle are sequentially arranged on the carrier, and the first grinding fluid nozzle and the second grinding fluid nozzle are adjacent to the grinding area.

[0008] Based on the above technical solutions, preferably, the functional components also include a baffle, a lever, and bolts, wherein, A baffle is installed between the first grinding fluid nozzle and the water supply nozzle. One end of the baffle is connected to the carrier frame, and the other end is connected to the ring frame by bolts. The baffle plate is positioned between the water supply nozzle and the second grinding fluid nozzle. One end of the baffle plate is rotatably connected to the carrier frame, and the other end is connected to the ring frame by bolts. The ring frame has a groove corresponding to the bolts.

[0009] Based on the above technical solutions, preferably, the lever includes a plate, a rotating shaft, and an air tube, wherein... The plate has a hollow structure, and the side of the plate corresponding to the grinding disc has an open structure; The pivot is mounted on the plate and is rotatably connected to the carrier frame; The trachea is located on the plate and is connected to the plate.

[0010] Based on the above technical solutions, preferably, the leveling assembly includes a scraper ring, a bracket, a motor, a drive wheel, and a driven wheel, wherein... One side of the scraper ring abuts against the grinding disc, and multiple grinding discs are arranged in a circular array with the center point of the scraper ring as a reference, and the scraper ring passes through the ring frame; The support and the grinding disc are fixed relative to each other; The motor is mounted on a bracket; The drive wheel is mounted on the main shaft of the motor and abuts against the side of the bracket; The driven wheel is rotatably mounted on the bracket and is positioned opposite the drive wheel.

[0011] Based on the above technical solutions, preferably, the ring frame has a groove corresponding to the grinding area, and the groove is located on the outside of the scraping ring.

[0012] Based on the above technical solutions, preferably, four grinding discs are provided, and there is a gap between two adjacent grinding discs; The support has a cross-shaped structure, and the end of the support is located between two adjacent grinding discs; The motor, drive wheel, and driven wheel are located at the ends of the bracket.

[0013] Based on the above technical solutions, preferably, it also includes a water tank, which comprises a base plate, a U-shaped plate, side plates, and a rectangular frame, wherein... The base plate has a grid-like structure to form U-shaped zones in four directions, and the motor is located in the U-shaped zone; The U-shaped plate is set to correspond to the U-shaped area and fits the edge of the base plate; The side panels are positioned between two adjacent U-shaped panels and fit against the outer edge of the base plate; The rectangular frame is positioned in the middle of the base plate, and the rectangular frame has a through groove that extends through the base plate; The support frame is attached to the U-shaped plate and the rectangular frame.

[0014] Based on the above technical solutions, preferably, it also includes a conduit, which is set on the base plate and corresponds to the gap between the four grinding discs, and the inner hole of the conduit penetrates the base plate.

[0015] On the other hand, the present invention proposes a wafer thinning process, which uses the above-mentioned wafer thinning equipment and includes the following steps: S1. Mount the wafer onto the rotary grinding shaft and move it toward the grinding disk; S2. Grinding fluid is sprayed through the first grinding fluid nozzle and / or the second grinding fluid nozzle, wherein the first grinding fluid nozzle adopts conventional spraying and the second grinding fluid nozzle adopts atomized spraying; S3. The driving component drives the grinding disc to rotate, and at the same time the motor drives the scraper ring to rotate through the drive wheel and driven wheel to disperse the grinding fluid on the grinding disc. S4. Then, the rotating grinding shaft drives the wafer to move and fit against the grinding pad. The grinding pad is evenly coated with grinding fluid to grind the wafer. S5. As the grinding disc rotates, it passes between the baffle and the baffle plate, where water is sprayed from the water nozzle to clean the grinding fluid. S6. The part of the grinding disc that has been cleaned by spraying water passes under the baffle to scrape off some of the accumulated water. S7. Connect the air supply or suction device through the air pipe to further remove residual water from the grinding disc by air jet cleaning or suction treatment. S8. The grinding disc continues to rotate and sprays grinding fluid again through the first grinding fluid nozzle and / or the second grinding fluid nozzle to carry out continuous grinding work.

[0016] The wafer thinning equipment and process of the present invention have the following advantages over the prior art: (1) By setting functional components for the corresponding grinding disk, the grinding fluid in the grinding area of ​​the grinding disk can be cleaned and the grinding fluid can be sprayed again. This can remove the grinding particles on the wafer and ensure the purity of the grinding fluid. At the same time, by setting the leveling component, the grinding fluid can be evenly dispersed before it comes into contact with the wafer, thereby avoiding local accumulation of the grinding fluid and preventing stress concentration problems. This ensures that the wafer will not be scratched and guarantees the grinding accuracy. (2) Multiple grinding discs are equipped with functional components for cleaning and spraying grinding fluid. At the same time, multiple grinding discs are dispersed through the same scraping component, so that multiple grinding discs can process at the same time, ensuring the compactness and efficiency of the equipment. (3) Each functional component has a water supply nozzle and a first grinding fluid nozzle and a second grinding fluid nozzle located on both sides of the water supply nozzle. In this way, the grinding area between the two functional components can be sprayed with grinding fluid in both directions, which ensures the supply of grinding fluid and avoids the problems of heat generation and particle aggregation during the grinding process. At the same time, the two grinding fluid nozzles can selectively spray grinding fluid by dripping, direct spraying or atomizing to meet different grinding needs. (4) In the functional components, baffles and deflectors are also provided. The baffles and deflectors are located on both sides of the water supply nozzle. This can prevent the grinding fluid from being diluted during the water supply nozzle flushing process and play a blocking role. At the same time, the deflector is rotatably connected to the carrier and fixed by bolts. After the bolts are loosened, the deflector can be slid through the groove of the ring frame to adjust the space between the baffle and the deflector, thereby meeting different flushing requirements. (5) The baffle in the functional components consists of a plate, a rotating shaft and an air pipe. The side of the plate corresponding to the grinding disc is set as an open structure. In this way, the air supply equipment or the air suction equipment can be connected through the air pipe to clean the residual water on the grinding disc after rinsing by air jet cleaning or suction treatment, so as to avoid diluting the subsequent sprayed grinding fluid. (6) By setting up a water tank, when the scraper ring of the scraper assembly carries out the grinding fluid through the ring frame, the water tank can collect the grinding fluid to ensure a good processing environment and avoid waste; at the same time, the water tank supports the bracket through the U-shaped plate and side plate to ensure the accurate position of multiple motors, drive wheels and driven wheels, so as to ensure the rotation accuracy of the scraper ring and thus ensure the dispersion effect of the grinding fluid. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a perspective view of the wafer thinning apparatus of the present invention; Figure 2 For the present invention Figure 1 Enlarged view of the structure at point A in the middle; Figure 3 This is a front view of the wafer thinning apparatus of the present invention; Figure 4 This is a top view of the wafer thinning apparatus of the present invention; Figure 5 This is a bottom view of the wafer thinning apparatus of the present invention; Figure 6 A schematic diagram of the slotted structure of the ring frame in the wafer thinning equipment of the present invention; Figure 7 This is a three-dimensional view showing the functional components of the wafer thinning equipment of the present invention. Figure 8 This is a perspective view of the dial plate of the wafer thinning apparatus of the present invention; Figure 9 This is a perspective view of the bottom structure of the wafer thinning device of the present invention; Figure 10 This is a perspective view of the water tank in the wafer thinning apparatus of the present invention; Figure 11 This is a top view of the water tank in the wafer thinning apparatus of the present invention; Figure 12 This is a structural diagram of the water tank and leveling assembly of the wafer thinning equipment of the present invention. Figure 13 For the present invention Figure 12 Enlarged view of the structure at point B; In the diagram: 1. Grinding disc; 101. Grinding area; 2. Functional component; 21. Ring frame; 22. Carrier frame; 23. First grinding fluid nozzle; 24. Water supply nozzle; 25. Second grinding fluid nozzle; 26. Baffle; 27. Paddle plate; 271. Plate; 272. Rotating shaft; 273. Air pipe; 28. Bolt; 201. Slide groove; 202. Groove opening; 3. Scraping assembly; 31. Scraper ring; 32. Support; 33. Motor; 34. Drive wheel; 35. Driven wheel; 4. Water tank; 41. Base plate; 42. U-shaped plate; 43. Side plate; 44. Rectangular frame; 401. U-shaped area; 402. Through groove; 5. Conduit. Detailed Implementation

[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0020] like Figures 1-13 As shown, the wafer thinning apparatus of the present invention includes a grinding disc 1, a functional component 2, a leveling component 3, a water tank 4, and a conduit 5.

[0021] like Figures 1-4 As shown, multiple grinding discs 1 are provided; each grinding surface of a single grinding disc 1 is provided with two functional components 2, and two grinding zones 101 are formed between the two functional components 2; the functional components 2 are used to clean the grinding zones 101 and spray grinding fluid. As described above, the grinding disk 1 is used to grind the back side of the wafer. In order to ensure the grinding effect, a functional component is provided corresponding to the grinding disk 1, which can clean the grinding fluid and grinding particles on the grinding disk 1 and spray new grinding fluid to ensure the purity of the grinding fluid, avoid the problem of grinding fluid and grinding particles accumulating, prevent local stress concentration, and thus ensure the grinding effect. Specifically, the grinding disc 1 is driven by a motor to achieve rotation.

[0022] Specifically, the grinding disc 1 is provided with spoke stripes or mesh stripes to guide the flow of grinding fluid and further improve the grinding accuracy.

[0023] like Figure 1 As shown, the leveling component 3 passes through the grinding area 101 of multiple grinding discs 1, and the leveling component 3 is used to disperse the grinding fluid; As described above, by setting the scraping component 3, the grinding fluid can be evenly dispersed before it comes into contact with the wafer, thereby avoiding local accumulation of the grinding fluid, preventing stress concentration problems, and ensuring that the wafer will not have scratches, thus guaranteeing grinding accuracy. In this equipment structure, multiple grinding discs 1 are equipped with functional components 2 for cleaning and spraying grinding fluid. At the same time, multiple grinding discs 1 are dispersed by the same scraping component 3. This allows multiple grinding discs 1 to process simultaneously, while ensuring the compactness and efficiency of the equipment.

[0024] like Figure 4 and Figure 7As shown, functional component 2 includes a ring frame 21, a carrier frame 22, a first grinding fluid nozzle 23, a water supply nozzle 24, and a second grinding fluid nozzle 25. The ring frame 21 is concentrically arranged with the grinding disk 1. The carrier frame 22 is located inside the ring frame 21 and corresponds to the grinding disk 1. The first grinding fluid nozzle 23, the water supply nozzle 24, and the second grinding fluid nozzle 25 are sequentially arranged on the carrier frame 22, and the first grinding fluid nozzle 23 and the second grinding fluid nozzle 25 are adjacent to the grinding area 101. As described above, the ring frame 21 serves as a support and can be installed on the grinding machine body together with the grinding disc 1. The carrier frame 22 is set on the ring frame 21, and the first grinding fluid nozzle 23, the water supply nozzle 24, and the second grinding fluid nozzle 25 are installed on the carrier frame 22. In this way, during grinding, the first grinding fluid nozzle 23 and the second grinding fluid nozzle 25 are on both sides of the grinding area 101, which can spray the grinding fluid in both directions to ensure the supply of grinding fluid, thereby avoiding the problems of heat generation and particle aggregation during the grinding process, and ensuring the grinding accuracy. Meanwhile, the two grinding fluid nozzles can selectively spray grinding fluid in the form of dripping, direct spraying or atomized spraying to meet different grinding needs and improve the applicability. During operation, as the grinding disc 1 rotates, the grinding fluid is displaced to below the water supply nozzle 24. At this time, the water supply nozzle 24 outputs a flushing water flow to remove the used grinding fluid and grinding particles, thereby avoiding subsequent accumulation that could cause stress concentration.

[0025] like Figure 4 and Figure 7 As shown, functional component 2 also includes a baffle 26, a lever 27, and a bolt 28. The baffle 26 is disposed between the first grinding fluid nozzle 23 and the water supply nozzle 24. One end of the baffle 26 is connected to the carrier 22, and the other end is connected to the ring frame 21 by the bolt 28. The lever 27 is disposed between the water supply nozzle 24 and the second grinding fluid nozzle 25. One end of the lever 27 is rotatably connected to the carrier 22, and the other end is connected to the ring frame 21 by the bolt 28. The ring frame 21 has a groove 201 corresponding to the bolt 28. As described above, the baffle 26 and the deflector 27 are located on both sides of the water supply nozzle, which can block the water flow from the water supply nozzle 24 and prevent the grinding fluid from being diluted during the rinsing process. At the same time, the deflector 27 is rotatably connected to the carrier 22 and fixed by bolts 28. After loosening the bolts 28, the deflector 27 can be slid through the groove 201 of the ring frame 21 to adjust the space between the baffle 26 and the deflector 27, thereby meeting different rinsing requirements. Specifically, when a larger flushing water flow is required, the space between the baffle 26 and the deflector 27 is increased to minimize the overflow of water pressure through the gap between the bottom surfaces of the baffle 26 and the deflector 27.

[0026] In some embodiments, the bottom surfaces of the baffle 26 and the deflector 27 are provided with a flexible material, such as cloth, to directly contact the grinding disc 1, thereby improving the barrier effect and cleaning up excess water flow.

[0027] like Figures 7-9 As shown, the dial 27 includes a plate 271, a rotating shaft 272, and an air pipe 273. The plate 271 has a hollow structure, and the side of the plate 271 corresponding to the grinding disc 1 has an open structure. The rotating shaft 272 is mounted on the plate 271 and is rotatably connected to the carrier 22. The air pipe 273 is mounted on the plate 271 and is connected to the plate 271. As described above, the baffle 27 in functional component 2 is composed of a plate 271, a rotating shaft 272, and an air pipe 273. The side of plate 271 corresponding to the grinding disc 1 is set as an open structure, so that an air supply device or an air suction device can be connected through the air pipe 273 to clean the residual water on the grinding disc 1 after rinsing by jet cleaning or suction treatment through the open opening on the bottom surface of plate 271, so as to avoid the residual water diluting the subsequent sprayed grinding fluid.

[0028] In some embodiments, the grinding disc 1 has an annular structure. When the bottom surface of the lever 27 contacts the grinding disc through a flexible material, in order to improve the water flow outward effect, the bolt 28 can be loosened and the lever 27 can be moved to adjust the tilt angle of the lever 27, so as to selectively guide the water flow out through the outer edge of the grinding disc 1 or through the central hole of the grinding disc 1.

[0029] like Figure 2 and Figure 12 As shown, the leveling assembly 3 includes a scraper ring 31, a bracket 32, a motor 33, a drive wheel 34, and a driven wheel 35. One side of the scraper ring 31 abuts against the grinding disc 1. Multiple grinding discs 1 are arranged in a circular array with the center point of the scraper ring 31 as a reference, and the scraper ring 31 passes through the ring frame 21. As described above, the scraping component 3 disperses the grinding fluid on the grinding disk 1 through the scraping ring 31. Since the scraping ring 31 passes through multiple grinding disks 1 at the same time, the rotation of the scraping ring 31, in conjunction with the rotation of the grinding disk 1, can achieve uniform dispersion of the grinding fluid on multiple grinding disks 1, thereby avoiding the accumulation of grinding fluid and stress concentration. The bracket 32 ​​is fixed relative to the grinding disc 1; the motor 33 is mounted on the bracket 32; the drive wheel 34 is mounted on the main shaft of the motor 33 and abuts against the side of the bracket 32; the driven wheel 35 is rotatably mounted on the bracket 32 ​​and is positioned opposite to the drive wheel 34. As described above, the bracket 32 ​​is used to install the motor 33, drive wheel 34 and driven wheel 35. The bracket 32 ​​can be connected to the grinding machine body. The motor 33 drives the drive wheel 34, and the drive wheel 34 cooperates with the driven wheel 35 to clamp the scraper ring 31, thereby driving the scraper ring 31 to rotate, so as to achieve the dispersion of grinding fluid on multiple grinding discs 1.

[0030] In some embodiments, the bottom surface of the scraper ring 31 is provided with flexible bristles that contact the grinding disc 1 to avoid wear of the grinding disc 1 when dispersing the grinding fluid.

[0031] like Figure 6 As shown, the ring frame 21 has a groove 202 corresponding to the grinding area 101, and the groove 202 is located on the outside of the scraper ring 31; As described above, the scraper ring 31 passes through the two grinding areas 101 of a single grinding disk 1. Due to the ring structure of the scraper ring 31, one grinding area 101 has a larger grinding area, and the scraper ring 31 is closer to the grinding fluid nozzle. The other grinding area 101 is divided by the scraper ring 31, with two areas of different sizes on the inner and outer sides of the scraper ring 31. In this way, when applied, three types of wafers can be ground at the same time to make full use of the grinding area 101. Meanwhile, the slot 202 allows the two grinding areas 101 located outside the scraper ring 31 to be fed into the wafer by translation, thus requiring less adjustment space up and down and improving the convenience of wafer feeding.

[0032] Considering the issues of grinding fluid distribution and grinding precision requirements, during fine grinding, the grinding fluid can be sprayed only by the second grinding fluid nozzle 25, and the grinding disc 1 rotates from the second grinding fluid nozzle 25 toward the scraper ring 31 and performs grinding work in the grinding area 101 on the other side of the scraper ring 31. In this way, the grinding fluid can be dispersed through the scraper ring 31. During coarse grinding, grinding fluid can be sprayed from the first grinding fluid nozzle 23. At this time, the grinding disc 1 can be rotated in the opposite direction. Of course, the first grinding fluid nozzle 23 and the second grinding fluid nozzle 25 can also spray grinding fluid at the same time.

[0033] In some embodiments, the scraper ring 31 is configured to be adjustable up and down, and the ring frame 21 has an open vertical groove on the top surface to accommodate the scraper ring 31. At this time, a cylinder is installed on the grinding machine body, and the piston rod of the cylinder is connected to the bracket 32. This can drive the scraping assembly 3 to rise and fall as a whole. The scraper ring 31 will move up and down in the vertical groove of the ring frame 21 to selectively press the bottom surface against or away from the grinding disc 1, thereby meeting different working conditions.

[0034] like Figure 4 , Figures 10-12As shown, there are four grinding discs 1, and there is a gap between two adjacent grinding discs 1; the support 32 has a cross structure, and the end of the support 32 is located between two adjacent grinding discs 1; the motor 33, the drive wheel 34 and the driven wheel 35 are located at the end of the support 32. As described above, by setting four grinding discs 1, the scraper ring 31 can be fully utilized and the size of the grinding area 101 can be ensured to be appropriate. When setting the drive structure of the scraper assembly 3, the bracket 32 ​​is set as a cross structure, so that the motor 33, drive wheel 34 and driven wheel 35 can be set at the end of the bracket 32 ​​and correspond to the gap between adjacent grinding discs 1. This makes full use of space, ensures the compactness of the equipment, and the stability of the scraper ring 31 operation.

[0035] like Figure 5 , Figures 10-13 As shown, the water tank 4 includes a bottom plate 41, U-shaped plates 42, side plates 43, and a rectangular frame 44. The bottom plate 41 has a grid-like structure to form U-shaped areas 401 in four directions, and the motor 33 is installed in the U-shaped areas 401. The U-shaped plates 42 are positioned corresponding to the U-shaped areas 401 and fit against the edge of the bottom plate 41. The side plates 43 are positioned between two adjacent U-shaped plates 42 and fit against the outer edge of the bottom plate 41. The rectangular frame 44 is positioned in the middle of the bottom plate 41 and has a through groove 402 that penetrates the bottom plate 41. The support 32 overlaps the U-shaped plates 42 and the rectangular frame 44. As described above, the base plate 41, together with the U-shaped plate 42, the side plate 43, and the rectangular frame 44, forms a grid-shaped flow channel. When the scraper ring 31 rotates, if the grinding fluid splashes out through the vertical groove that cooperates with the ring frame 21, it can be collected through the water tank 4 to ensure a good processing environment and avoid waste. By setting a through groove 402 on the rectangular frame 44, the grinding fluid can enter the rectangular frame 44 through the through groove 402 and flow out from the bottom of the rectangular frame 44, thereby realizing the collection and recycling. Meanwhile, in this structure, the water tank 4 supports the bracket 32 ​​through the U-shaped plate 42 and the rectangular frame 44, which can ensure the accurate positioning of multiple motors 33, drive wheels 34 and driven wheels 35, so as to ensure the rotational accuracy of the scraper ring 31 and improve the dispersion effect of the grinding fluid.

[0036] like Figure 11 and Figure 12 As shown, the conduit 5 is set on the base plate 41 and corresponds to the gap between the four grinding discs 1, and the inner hole of the conduit 5 penetrates the base plate 41. As described above, the conduit 5 is a through-type structure, which is used for laying pipelines to supply water to the nozzles in multiple functional components 2, thereby realizing centralized management of the pipeline. Specifically, when laying the pipeline, the pipeline is led out through the conduit 5. The nozzles close to the conduit 5 are directly connected to the pipeline, while the nozzles far from the conduit 5 are laid out by connecting the pipeline across the center of the grinding disc 1 to prevent interference with wafer loading.

[0037] The wafer thinning process of the present invention, using the above-mentioned wafer thinning equipment, includes the following steps: S1. Mount the wafer onto the rotary grinding shaft and move it toward the grinding disk 1; S2. Grinding fluid is sprayed through the first grinding fluid nozzle 23 and / or the second grinding fluid nozzle 25, wherein the first grinding fluid nozzle 23 adopts conventional spraying and the second grinding fluid nozzle 25 adopts atomized spraying, thereby initially dispersing the grinding fluid; S3. The grinding disc 1 is driven to rotate by the driving component, and at the same time, the motor 33 drives the scraper ring 31 to rotate through the drive wheel 34 and the driven wheel 35 to disperse the grinding fluid on the grinding disc 1. S4. Then, the rotating grinding shaft drives the wafer to move and fit against the grinding disk 1. The grinding disk 1 is evenly coated with grinding fluid to grind the wafer. S5. As the grinding disc 1 rotates, the grinding disc 1 passes between the baffle 26 and the baffle 27, and the water supply nozzle 24 sprays water to clean the grinding fluid. S6. The part of the grinding disc 1 that has been cleaned by spraying water passes under the baffle 27 so that some of the accumulated water can be scraped off by the baffle 27. S7. Connect an air supply device or a suction device through the air pipe 273 to further remove residual water on the grinding disc 1 by air jet cleaning or suction treatment. S8. The grinding disc 1 continues to rotate and sprays grinding fluid again through the first grinding fluid nozzle 23 and / or the second grinding fluid nozzle 25 to carry out continuous grinding work.

[0038] Specifically, in this step, when the grinding disc 1 rotates, the grinding fluid sprayed by the second grinding fluid nozzle 25 first enters the grinding zone 101 and is dispersed by the scraper ring 31. Since the first grinding fluid nozzle 23 is located in the rotation direction of the grinding disc 1, the amount of grinding fluid sprayed by the first grinding fluid nozzle 23 is larger, so as to avoid the problem that the grinding fluid is completely carried away by the grinding disc 1 and does not have the desired effect. Specifically, depending on the different grinding requirements and the different types of grinding fluid, the first grinding fluid nozzle 23 and the second grinding fluid nozzle 25 can selectively change the spraying method, such as using dripping, atomized spraying and conventional direct spraying to supply grinding fluid.

[0039] Specifically, the grinding disc 1 can be driven to rotate by a motor.

[0040] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer thinning device, characterized in that: It includes a grinding disc (1), a functional component (2), and a leveling component (3), wherein, The grinding disc (1) is provided in multiple ways; The grinding surface of a single grinding disc (1) is provided with two functional components (2), and two grinding zones (101) are formed between the two functional components (2). The functional component (2) is used to clean the grinding area (101) and spray grinding fluid; the functional component (2) includes a ring frame (21), a carrier frame (22), a first grinding fluid nozzle (23), a water supply nozzle (24), a second grinding fluid nozzle (25), a baffle (26), a deflector (27), and bolts (28), wherein the ring frame (21) is concentrically arranged with the grinding disc (1); the carrier frame (22) is arranged inside the ring frame (21) and corresponds to the grinding disc (1); the first grinding fluid nozzle (23), the water supply nozzle (24), and the second grinding fluid nozzle (25) are arranged sequentially on the carrier frame (22), and the first grinding fluid nozzle (23) is arranged in a concentric manner with the grinding disc (1). The first grinding fluid nozzle (23) and the second grinding fluid nozzle (25) are adjacent to the grinding area (101); the baffle (26) is disposed between the first grinding fluid nozzle (23) and the water supply nozzle (24), one end of the baffle (26) is connected to the carrier (22), and the other end is connected to the ring frame (21) by the bolt (28); the lever (27) is disposed between the water supply nozzle (24) and the second grinding fluid nozzle (25), one end of the lever (27) is rotatably connected to the carrier (22), and the other end is connected to the ring frame (21) by the bolt (28), and the ring frame (21) has a groove (201) corresponding to the bolt (28). The leveling component (3) passes through the grinding zone (101) of the plurality of grinding discs (1), and the leveling component (3) is used to disperse the grinding fluid.

2. The wafer thinning equipment as described in claim 1, characterized in that: The dial (27) includes a plate (271), a rotating shaft (272), and an air tube (273), wherein, The plate (271) has a hollow structure, and the side of the plate (271) corresponding to the grinding disc (1) has an open structure; The rotating shaft (272) is disposed on the plate (271), and the rotating shaft (272) is rotatably connected to the carrier (22); The air pipe (273) is disposed on the plate (271) and the air pipe (273) is connected to the plate (271).

3. The wafer thinning equipment as described in claim 2, characterized in that: The leveling assembly (3) includes a scraper ring (31), a bracket (32), a motor (33), a drive wheel (34), and a driven wheel (35), wherein, One side of the scraping ring (31) abuts against the grinding disc (1), and a plurality of grinding discs (1) are arranged in a circular array with the center point of the scraping ring (31) as a reference, and the scraping ring (31) passes through the ring frame (21). The bracket (32) is fixed relative to the grinding disc (1); The motor (33) is mounted on the bracket (32); The drive wheel (34) is mounted on the main shaft of the motor (33), and the drive wheel (34) abuts against the side of the bracket (32); The driven wheel (35) is rotatably mounted on the bracket (32) and is positioned opposite to the drive wheel (34).

4. The wafer thinning equipment as described in claim 3, characterized in that: The ring frame (21) has a slot (202) corresponding to the grinding area (101), and the slot (202) is located on the outside of the scraping ring (31).

5. The wafer thinning equipment as described in claim 3, characterized in that: The grinding discs (1) are provided in four parts, and there is a gap between two adjacent grinding discs (1); The support (32) has a cross structure, and the end of the support (32) is located between two adjacent grinding discs (1); The motor (33), the drive wheel (34) and the driven wheel (35) are located at the end of the bracket (32).

6. The wafer thinning equipment as described in claim 5, characterized in that: It also includes a water tank (4), which includes a base plate (41), a U-shaped plate (42), side plates (43), and a rectangular frame (44), wherein, The base plate (41) has a grid-like structure to form a U-shaped area (401) in four directions, and the motor (33) is located in the U-shaped area (401); The U-shaped plate (42) is provided corresponding to the U-shaped area (401) and fits the edge of the base plate (41); The side plate (43) is disposed between two adjacent U-shaped plates (42) and fits the outer edge of the bottom plate (41); The rectangular frame (44) is located in the middle of the base plate (41), and the rectangular frame (44) has a through groove (402) that passes through the base plate (41). The bracket (32) is attached to the U-shaped plate (42) and the rectangular frame (44).

7. The wafer thinning equipment as described in claim 6, characterized in that: It also includes a conduit (5), which is disposed on the base plate (41) and corresponds to the gap between the four grinding discs (1), and the inner hole of the conduit (5) penetrates the base plate (41).

8. A wafer thinning process, using the wafer thinning equipment as described in any one of claims 3 to 7, characterized in that, Includes the following steps: S1. Mount the wafer onto the rotary grinding shaft and move it toward the grinding disk (1); S2. Grinding fluid is sprayed through the first grinding fluid nozzle (23) and / or the second grinding fluid nozzle (25), wherein the first grinding fluid nozzle (23) adopts conventional spraying and the second grinding fluid nozzle (25) adopts atomized spraying. S3. The grinding disc (1) is driven to rotate by the driving component, and at the same time the motor (33) drives the scraper ring (31) to rotate through the driving wheel (34) and the driven wheel (35) to disperse the grinding fluid on the grinding disc (1); S4. Then, the grinding shaft is rotated to move the wafer to fit the grinding disk (1). The grinding disk (1) is uniformly coated with grinding fluid to grind the wafer. S5. As the grinding disc (1) rotates, the grinding disc (1) passes between the baffle (26) and the lever (27), and the water supply nozzle (24) sprays water to clean the grinding fluid. S6. The part of the grinding disc (1) that has been cleaned by spraying water passes under the baffle (27) so that some of the accumulated water is scraped off by the baffle (27); S7. Connect the air supply device or the air suction device through the air pipe (273) to further remove the residual water on the grinding disc (1) by air jet cleaning or suction treatment. S8. The grinding disc (1) continues to rotate and sprays grinding fluid again through the first grinding fluid nozzle (23) and / or the second grinding fluid nozzle (25) to carry out continuous grinding work.

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